201010587 九、發明說明： 【發明所屬之技術領域】 尤係對電子 元件散 本發明涉及一種散熱裝置， 熱之散熱裝置。 【先前技術】 眾所周知，中央處理器等電子元件在運行過程 中產生大量熱量。為防止該電子元件因熱量之累積 使其溫度升高從而導致其運行不穩定，該電子元件 通常需加裝一散熱裝置以輔助其散熱。 習知之散熱裝置包括與電子元件貼設之一底 座、與底座連接之一散熱片組、套設該散熱片組於 其内之一導風罩及裝設於導風罩一側之一風扇。該 導風草之相對兩側分別設置有卡扣部，該底座上設 置有與導風罩之卡扣部對應之配合部。該導風罩通 i八卡扣部與底座上相應之配合部卡扣從而固定 ❹於底座上。此種散熱裝置需要在其導風罩及底座上 设置特定之卡扣部及配合部，增加了散熱裝置之加 工及褒配工序’從而使散熱裝置之製造成本增加。 【發明内容】 一 種散熱裝置’用於對固定於電路板上之電子 70件散熱’該散熱裝置包括一基板、設置於基板上 2之散熱片組、連接基板及散熱片组之一熱管及 。又置於散熱片組一側之一風扇，該散熱裝置還包括 一成里之一固定架組合，該固定架組合包括與基 6201010587 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a heat dissipating device, a heat dissipating device. [Prior Art] It is known that electronic components such as a central processing unit generate a large amount of heat during operation. In order to prevent the electronic component from being unstable due to the accumulation of heat, the electronic component usually needs to be equipped with a heat sink to assist in heat dissipation. The conventional heat dissipating device comprises a bottom plate attached to the electronic component, a heat sink set connected to the base, a wind deflector in which the heat sink set is disposed, and a fan mounted on one side of the air guide cover. The opposite sides of the guide grass are respectively provided with a buckle portion, and the base is provided with a fitting portion corresponding to the buckle portion of the air guiding cover. The air hood is fastened to the base by the snap-fit portion of the yoke and the corresponding engaging portion on the base. Such a heat dissipating device requires a specific snap portion and a fitting portion to be provided on the air hood and the base, which increases the processing and splicing process of the heat dissipating device, thereby increasing the manufacturing cost of the heat dissipating device. SUMMARY OF THE INVENTION A heat dissipating device is used for dissipating heat from an electronic device 70 fixed to a circuit board. The heat dissipating device includes a substrate, a heat sink group disposed on the substrate 2, a connecting substrate, and a heat pipe of the heat sink group. Also disposed on one of the fans on one side of the heat sink group, the heat sink further includes a one of a plurality of mount assemblies, the mount assembly including the base 6
201010587 板配合之一底座及自底座相對兩側向上 散熱片組夾設其間之二擋止部’該風扇安 止部上。 與習知技術相比，本發明散熱裝置之 合為一體衝壓形成，製造簡單，節省工序 低了散熱裝置之製造成本。 【實施方式】 如圖1及圖2所示，本發明散熱裝置 m 定於電路板（圖未示）上之發熱電子元件I 散熱。該散熱裝置包括與該發熱電子元件 基板20、位於基板20上方之一散熱片組 散熱片組50及基板20之四U形熱管3〇 板20上方且將該散熱片組50圍設其内之 組合10及固定於固定架組合1 〇 —側之一 該固定架組合10 —體衝壓形成，包 11及自底座11相對兩側垂直向上延伸： 1 3。該底座11包括一中部開設有矩形開 矩形底板110、自底板110四角向下、向 四固定臂112及自底板110相對兩側彎折 連接臂114。四鎖設件7〇分別穿過四固 並與電路板配合而將該固定架組合10固 板上°每一連接臂114大致呈L形，包 110 一側垂直向上延伸之一連接板1141 板114 1上端邊緣垂直向外延伸之一延伸 延伸且將 裳於二擋 固定架組 ，從而降 用於對固 〔圖未示） 接觸之一 5(3、連接 、仇於基 一固定架 風屬6 〇。 括一底座 二擋止部 r iioi 之 外延伸之 延伸之二 定臂112 定至電路 括自底板 及自連接 板 1143 ° 201010587 每一擋止部13自相應之延伸板1143之邊緣垂直向 上延伸形成。每一擋止部13包括與連接臂114之 延伸板1143垂直相連之一矩形過渡部131及自過 渡部1 3 1頂端向上延伸之一矩形安裝部1 3 3。該過 渡部131位於安裝部133之下端中部，且面積較安 裝部133小。每一擋止部13之安裝部133 —侧上 下兩端分別設置有一鎖設部 135，用於與風扇 60 配合從而將風扇60固定到固定架組合10上。 ® 該基板20由導熱性能良好之金屬製成，具有 一大致呈矩形之貼設部21及自該貼設部21上表面 中部向上凸伸之一矩形延伸部22。該貼設部21用 於與發熱電子元件貼設。該延伸部22與固定架組 合1 0之底板110之開口 110 1對應，其穿設開口 1101而與熱管30連接。 每一熱管30具有一平直之吸熱段31、自吸熱 @段3 1相對兩端向外彎折延伸之二連接段3 3及自每 一連接段33延伸之豎直之放熱段35。該等熱管30 之吸熱段31與基板20之延伸部22貼設，用以吸 收基板20之熱量。一固定件40用於固定熱管30。 該固定件40具有一縱長之按壓板41及自按壓板 41相對兩端向下、向外垂直延伸之二固定部43。 固定件40跨設熱管30，且其二固定部43分別貼 設於固定架組合10之底板110之開口 110 1之相對 兩侧。二固定件45穿過基板20之貼設部21、固 201010587 定架組合10之底板110並與固定件40之二固定部 43配合而將固定件40固定於固定架組合10上。 熱管30之吸熱段31夾設於固定件40之按壓部41 及基板20之延伸部22間。 請同時參閱圖3及圖4，該散熱片組5 0夾設 於固定架組合10之二擋止部13間，且其長度與擋 止部13之安裝部133之長度相當。該散熱片組50 由複數相互平行且等距離卡扣設置之散熱片 51。 ®每一散熱片之相對兩側分別沖設有四通孔5 3。熱 管30之冷凝段35分別穿設於該等通孔53中，並 支撐該等散熱片51。散熱片組50與熱管30之吸 熱段3 1間隔設置，其上下兩端大致與擋止部13之 安裝部133上下兩端平齊。 該風扇60位於散熱片組50之一側，與固定架 組合10之鎖設部135對應。該風扇60包括二平行 參設置之方形板體61、63，該二板體61、63之四角 分別開設有對應之安裝孔611、631。四長螺釘65 分別穿過風扇60之安裝孔611、631，並與固定架 組合10之鎖設部135配合，從而將風扇60固定於 固定架組合10上。 本發明中，固定架組合10為一體衝壓形成， 製造簡單，節省工序，從而降低了散熱裝置之製造 成本。 綜上所述，本發明符合發明專利要件，爰依法 9 201010587 提出專利申請。惟，以上所述者僅為本發明之較佳 實施例》舉凡熟悉本案技藝之人士，在羡依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】201010587 The board is matched with one of the bases and the opposite sides of the base. The heat sink group is sandwiched between the two stops of the fan. Compared with the prior art, the heat dissipating device of the present invention is integrally formed by stamping, which is simple to manufacture, saves the process, and reduces the manufacturing cost of the heat dissipating device. [Embodiment] As shown in Figs. 1 and 2, the heat dissipating device m of the present invention is disposed on a heat-dissipating electronic component I on a circuit board (not shown) to dissipate heat. The heat dissipating device includes the heat generating electronic component substrate 20, the heat sink group fin assembly 50 above the substrate 20, and the U-shaped heat pipe 3 and the top plate 20 of the substrate 20, and the heat sink group 50 is enclosed therein. The combination 10 is fixed to the mounting bracket assembly 1 and the one of the mounting bracket assemblies 10 is formed by body stamping. The bag 11 and the opposite sides of the base 11 extend vertically upwards: 13 . The base 11 includes a rectangular open rectangular bottom plate 110 in the middle thereof, and four corners downward from the bottom plate 110, and the connecting arms 114 are bent toward the four fixed arms 112 and from opposite sides of the bottom plate 110. The four locking members 7 are respectively passed through the four solids and cooperate with the circuit board to form the fixing frame assembly 10 on the fixing plate. Each connecting arm 114 is substantially L-shaped, and one side of the package 110 extends vertically upwards to one of the connecting plates 1141. 114 1 The upper end edge extends vertically and extends one extension and will be placed on the second gear fixing frame group, so as to be used for one of the solid (not shown) contact 5 (3, connection, Qiuji, a fixed frame wind 6 〇. The second fixed arm 112 extending from the outer base of the two base stops r iioi is fixed to the circuit from the bottom plate and the self-connecting plate 1143 ° 201010587. Each of the stops 13 is perpendicular to the edge of the corresponding extension plate 1143 Each of the stopping portions 13 includes a rectangular transition portion 131 perpendicularly connected to the extension plate 1143 of the connecting arm 114 and a rectangular mounting portion 13 3 extending upward from the top end of the transition portion 131. The transition portion 131 It is located at the lower end of the lower end of the mounting portion 133 and has a smaller area than the mounting portion 133. The mounting portion 133 of each of the blocking portions 13 is respectively provided with a locking portion 135 for engaging the fan 60 to fix the fan 60. Go to the mount combination 10. ® The substrate 20 is made of a metal having good thermal conductivity, and has a substantially rectangular attachment portion 21 and a rectangular extension portion 22 projecting upward from a central portion of the upper surface of the attachment portion 21. The attachment portion 21 is used for heating electrons. The extension portion 22 corresponds to the opening 110 1 of the bottom plate 110 of the fixing frame assembly 10, and is connected to the heat pipe 30 through the opening 1101. Each heat pipe 30 has a flat heat absorption section 31 and self-heating@ The connecting portion 3 3 of the segment 3 1 is bent outwardly from the opposite ends, and the vertical heat releasing portion 35 extending from each connecting portion 33. The heat absorbing portion 31 of the heat pipes 30 is attached to the extending portion 22 of the substrate 20. For fixing the heat of the substrate 20. A fixing member 40 is used for fixing the heat pipe 30. The fixing member 40 has a longitudinal pressing plate 41 and two fixing portions extending downward from the opposite ends of the pressing plate 41 43. The fixing member 40 straddles the heat pipe 30, and the two fixing portions 43 are respectively attached to opposite sides of the opening 110 1 of the bottom plate 110 of the fixing frame assembly 10. The two fixing members 45 pass through the mounting portion 21 of the substrate 20, Solid 201010587 The bottom plate 110 of the fixed frame assembly 10 is matched with the two fixing portions 43 of the fixing member 40 The fixing member 40 is fixed to the fixing frame assembly 10. The heat absorption portion 31 of the heat pipe 30 is interposed between the pressing portion 41 of the fixing member 40 and the extending portion 22 of the substrate 20. Please refer to FIG. 3 and FIG. The sheet set 50 is interposed between the two stopper portions 13 of the holder assembly 10, and has a length corresponding to the length of the mounting portion 133 of the stopper portion 13. The fin group 50 is arranged in parallel with each other and equidistantly buckled. The heat sink 51. The opposite sides of each heat sink are respectively punched with four through holes 53. The condensation sections 35 of the heat pipes 30 are respectively bored in the through holes 53 and support the fins 51. The fin group 50 is spaced apart from the heat absorption section 31 of the heat pipe 30, and the upper and lower ends thereof are substantially flush with the upper and lower ends of the mounting portion 133 of the stopper portion 13. The fan 60 is located on one side of the heat sink group 50 and corresponds to the lock portion 135 of the mount assembly 10. The fan 60 includes two parallel plate-shaped square plates 61 and 63. The four corners of the two plates 61 and 63 are respectively provided with corresponding mounting holes 611 and 631. The four long screws 65 pass through the mounting holes 611, 631 of the fan 60, respectively, and cooperate with the locking portions 135 of the holder assembly 10 to fix the fan 60 to the holder assembly 10. In the present invention, the holder assembly 10 is integrally formed by stamping, which is simple to manufacture and saves the process, thereby reducing the manufacturing cost of the heat sink. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law 9 201010587. However, the above description is only the preferred embodiment of the present invention. Those skilled in the art will be able to devise equivalent modifications or variations in the spirit of the present invention. [Simple description of the map]
圖 1 係 本 發 明 散熱 裝置 :之 立 體 分 解 圖 〇 圖 2 係 圖 1 中 散熱 裝置 :之 倒 置 圖 〇 圖 3 係 圖 1 中 散熱 裝置 :之 立 體 組 裝 圖 0 圖 4 係 圖 3 中 散熱 裝置 :之 倒 置 圖 〇 主 要元件符號說明】 1 固 定 架 組 合 10 底 座 11 擋 止 部 13 基 板 20 貼 設 部 21 延 伸 部 22 熱 管 30 吸 熱 段 31 連 接 段 33 放 熱 段 35 固 定 件 40、 45 按 壓 板 41 固 定 部 43 散 熱 片 組 50 散 執 ”、、 片 51 通 孔 53 板 體 61、 63 風 扇 60 長 螺 釘 65 鎖 設 件 70 底 板 110 固 定 臂 112 連 接 臂 114 過 渡 部 131 安 裝 部 133 鎖 設 部 135 201010587 安裝孔 611、631開口 連接板 1141 延伸板 1101 11431 is a perspective view of the heat dissipating device of the present invention: FIG. 2 is a heat dissipating device in FIG. 1 : an inverted view FIG. 3 is a heat dissipating device in FIG. 1 : an assembled view of FIG. 0 FIG. 4 is a heat dissipating device in FIG. 3 : Inverted drawing 〇 Main component symbol description] 1 Fixing frame combination 10 Base 11 Stopping portion 13 Substrate 20 Attaching portion 21 Extension portion 22 Heat pipe 30 Heat absorbing section 31 Connecting section 33 Heat releasing section 35 Fixing member 40, 45 Pressing plate 41 Fixing portion 43 Heat sink set 50 Dissipative", sheet 51 through hole 53 plate 61, 63 fan 60 long screw 65 lock 70 bottom plate 110 fixed arm 112 connecting arm 114 transition portion 131 mounting portion 133 locking portion 135 201010587 mounting hole 611 , 631 open connection board 1141 extension board 1101 1143
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