TW201001600A - Boat - Google Patents

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Publication number
TW201001600A
TW201001600A TW098104183A TW98104183A TW201001600A TW 201001600 A TW201001600 A TW 201001600A TW 098104183 A TW098104183 A TW 098104183A TW 98104183 A TW98104183 A TW 98104183A TW 201001600 A TW201001600 A TW 201001600A
Authority
TW
Taiwan
Prior art keywords
substrate
carrier
support
heat treatment
substrates
Prior art date
Application number
TW098104183A
Other languages
Chinese (zh)
Inventor
Byung-Il Lee
Yong-Kun Cho
Original Assignee
Tera Semicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tera Semicon Corp filed Critical Tera Semicon Corp
Publication of TW201001600A publication Critical patent/TW201001600A/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/54—Arrangements for reducing warping-twist

Abstract

To provide a boat for mounting and supporting substrates, which includes first and second supporting loads supporting long sides of the substrates to prevent deformation of the substrates due to their own weight during heat treatment in a batch type heat treatment apparatus. A boat 100 is provided for mounting a plurality of substrates 10 in a chamber providing an execution space for heat treatment process in the batch type heat treatment apparatus and includes: a lower frame 110; an upper frame 120; a plurality of vertical frames 200 connecting the lower frame and the upper frame; a plurality of first supporting loads 210 formed in one side of respective vertical frames in a horizontal direction so as to extend toward the inside of the substrates; and second supporting loads 220 connecting the first supporting loads in the horizontal direction.

Description

201001600 六、發明說明： 【發明所屬技術領域3 發明領域 本發明係有關於一種批次式熱處理裝置，且係有關於 5 承載支撐有基板之承載體者。更詳而言之，本發明係有關 於一種批次式熱處理裝置，且係有關於含有用以支撐基板 之長板側而可防止基板在熱處理之進行途中因自身重量而 變形之第1及第2支撐道之承載體者。 t先前技術：J 10 發明背景 使用於製造平板顯示器時之大面積基板之處理系統分 為蒸氣沉積裝置與退火裝置。 热氣沉積裝置係負責形成構成平板顯示器之核心結構 之透明傳導層、絕緣層、金屬層或矽層階段的裝置，例如： 15 LPCVD(低壓化學氣相沉積）或PECVD(電漿加強化學氣相 沉積）等的化學氣相蒸氣沉積裝置、及濺鍍(spmtering)等的 物理氣相蒸氣沉積裝置。又，退火裝置係負責在蒸氣沉積 製程後提升業經蒸氣沉積之膜之特性階段的裝置，例如， 用以使業經蒸氣沉積之膜固定化或相轉變之熱處理裝置。 2〇 通常，熱處理裝置有對一個基板執行熱處理之單片式 與對多數基板執行熱處理之批次式。單片式具有裝置結構 簡單的優點，但亦具有生產性低的缺點。故，為了大量生 產’批次式便受到注目。 在批次式熱處理裝置中，於提供可同時對多數基板進 201001600 行熱處理之熱處理空間的室内必須具有用以承載支撐多數 基板之承載體。 另一方面，隨著最近平板顯示器之尺寸的增加，也更 增加了可穩定地承載且支撐大面積基板之承載體的必要 5 性。特別是在習知承載體的情況下，因產生如基板在熱處 理途中因自身重量而彎曲等的變形，而有平板顯示器之顯 示特性下降且不平均的問題。 L發明内容3 發明揭示 10 發明欲解決之問題 因此，為了解決前述問題而製成之本發明之目的在於 提供一種承載體，其係在對於承載於批次式熱處理裝置之 多數基板執行熱處理製程時，藉由利用第1及第2道支撐所 承載之基板之長邊側而分散基板之重量，進而防止基板之 15 變形者。 用以欲解決問題之手段 為了達成前述目的，本發明之承載體係配置於提供用 以在批次式熱處理裝置執行熱處理製程之空間的室内並承 載有多數基板者，包含有：下部框體；上部框體；及連結 20 前述下部框體與前述上部框體並形成有多數延伸於前述所 承載之基板之内側方向之第1支撐道的多數垂直框體，且更 包含有：互相連結前述各垂直框體之前述第1支撐道的第2 支撐道。 其中，前述第1支撐道與前述第2支撐道以互相垂直為佳。 201001600 ,v第支撐道與前述第2支撐道以支撐前述基板 之長邊側為佳。 又 ;土反以由前述第1支撐道及前述第2支撐道中 之至少一者接觸迷支撐為佳。 5 述基板以由前述第1支撐道及前述第2支撐道 同時接觸並支撐為佳。 發明效果 根據本發明，由於具有用以支撐承載於批次式熱處理 裝置之承載體之基板之長板側的第1及第2道，因此可在對 10基板進行熱處理製程時分散基板之重量，而具有防止基板 Ή〆的效I X ,根據本發明，由於可在基板不變开）的情 況下對承載於抵次式熱處理裝置之承載體之基板進行熱處 理製程’因此具有可提升形成於基板上之平板顯示器之顯 示特性的效果。 15 【實施方式】 用以實施發明之最佳形態 、下 面參照添附圖式一面詳細地說明本發明之結構。 本發明之承載體可使用於用以同時對多數基板進行熱 >0 之批'"人式熱處理裝置。批次式熱處理裝置可由於内部 &供熱處理办Μ 排出 1間之至；用以加熱基板之加熱器；及供給或 體棑氣體以調節熱處理製程之大氣之氣體供給管及氣 用有t g所構成。由於前述批次式熱處理裝置之結構與使 之技人式熱處理裝置之熱處理製程係在該領域眾所周知 因此省略該部分詳細的說明。 201001600 第1圖係顯示本發明一實施型態之承載體10 0之結構的 透視圖，第2圖係顯示本發明一實施型態之承載體100之第1 及第2支撐道210、220之結構的透視圖，而第3圖係顯示本 發明一實施型態之承载體100承載有基板10之狀態的透視圖。 5 如第1圖所示，承載體100之結構包含有：下部及上部 框體110、120 ;設置成連結框體11〇、ρο之垂直框體200 ; 形成於前述垂直框體200之多數第1道210;及與各第1道210 垂直並互相連結第1道210之多數第2支撐道220。 在批次式熱處理裝置中，可在提供熱處理空間之室之 10 内部設置有承載體1〇〇之狀態下，並在承載基板10後進行熱 處理製程。依照情況’亦可在將基板10承載於設置於室之 外部之承載體1〇〇，並在該狀態下將承載體1〇〇插入室之内 部後進行熱處理製程。 下部框體11〇與上部框體12〇係與後述之垂直框體2〇〇 15 一起構成承載體100之基本骨架者。 下部框體11〇與上部框體12〇以分別呈具有預定尺寸之 長方狀’且互相隔有預定距離，並且平行地配置承載體1〇〇 兩側之同一方向為佳。 此時’下部框體110與上部框體12〇之尺寸通常可考慮 20 承載於平板顯示器製造用批次式熱處理裝置之長方狀基板 10之尺寸再作決定。 垂直框體200係連結前述下部框體110及上部框體120 炎構成承载體100之基本骨架者。 垂直框體200之兩端分別連結於下部框體11〇及上部框 201001600 體12〇。此時，垂直框體200係配置於承载於承載體ι〇〇之基 板10之長邊側並連結於下部及上部框體11〇、12〇。 通常，承載體100設有多數垂直框體200,在該情況下， 框體200的形狀及長度以全部相同為佳。如第1圖所示，該 5 圖係舉例說明設置於承載體100之垂直框體200之數量為基 板10之兩長邊側各設置有3個，即，全部設置有6個者，但 並非一定限定於此，亦可依需要進行各式各樣的改變。又， r 垂直框體2〇〇以至少設置4個而可連結配置於承載體丨〇〇之 兩側之下部框體110與上部框體120之四角為佳，以穩定地 10 支撐承載於承載體100之基板10。 第1支撐道210形成於垂直框體200之一側，並具有支撐 氣載於承載體之基板1〇之長邊侧的作用。此時，第1支 樓道210形成延伸於基板1〇之内側方向的樣子。 各垂直框體200以隔相同間隔形成有相同數量之第1支 15 撐道210為佳。形成於各垂直框體200之第1支撐道21〇的數 I 量以與承載體100可承載之基板10的總數量相同為佳。因 此’形成於承載體1〇〇之第i支撐道210之總數量可為基板1〇 之數里的6倍。例如，如第1及第2圖所示，當設想承載體1 〇〇 可承載27個基板時，形成於垂直框體2〇〇之第1支撐道21〇之 20 總數量則為162個。 第1支撐道210之長度與寬度可在可穩定地支撐基板1〇 之長邊側之範圍内進行各式各樣的改變。 第2支撐道220藉由互相連結多數設於各垂直框體2〇〇 之第1支撐道210,而具有與第1支撐道210 —起支撐承載於 201001600 承載體100之基板10之長邊側的作用。此時，第2支撐道220 形成與各第1支撐道210垂直。 第2支撐道220係藉由在其一側面緊貼接觸於各第1支 撐道210之前端後，以熔接等方式與第丨支撐道21〇接合，而 5 可連結第1支撐道210，但並非一定限定於此。例如，亦可 在一體形成位於同一層之多數的第1支撐道2〗0與前述第2 支撐道220之後，將其設置於各垂直框體2〇〇之一側。 如第1圖及第2圖所示，由於1個第2支撐道220連結有3 個第1支撐道210，因此形成於丨個承載體1〇〇之第2支撐道 10 22〇之數量以為承載體100可承載之基板1〇的數量之2倍為 佳。例如，若承載體1〇〇可承載27個基板1〇，第2支撐道220 之總數量則為54個。 第2支撐道220之長度與寬度可在可穩定地支撐基板10 之長邊側之範圍内進行各式各樣的改變。 15 藉此，每個承載於承載體100之基板10對應有用以支撐 該基板10之第1及第2支撐道210、220。在該情況下，第1及 第2支撐道210、220之各上段部實質的排列於同一面上，並 可藉由第1及第2支撐道210、220同時地支撐基板10之長邊 側。然而，本發明並非一定限定於此，依照情況亦可將第2 2〇 支撐道220之上段部支持成較第1支撐道210之上段部高，並 以第2支撐道220支撐基板1〇之長邊側。 又，第1及第2支撐道210、220之抵接於基板1〇之底面 的部分以加工成平面狀而可以第1及第2支撐道210、220之 上面更穩定地支樓基板10為佳。 201001600 垂直框體201001600 VI. Description of the Invention: [Technical Field of the Invention] 3 Field of the Invention The present invention relates to a batch type heat treatment apparatus and is related to a carrier that supports a substrate. More specifically, the present invention relates to a batch type heat treatment apparatus, and relates to a first and a third aspect which comprises a long plate side for supporting a substrate to prevent deformation of the substrate due to its own weight during heat treatment. 2 support the carrier of the track. Prior Art: J 10 Background of the Invention The processing system for a large-area substrate used in the manufacture of a flat panel display is classified into a vapor deposition apparatus and an annealing apparatus. The hot gas deposition device is responsible for forming a transparent conductive layer, insulating layer, metal layer or germanium layer forming the core structure of the flat panel display, for example: 15 LPCVD (low pressure chemical vapor deposition) or PECVD (plasma enhanced chemical vapor phase) A chemical vapor deposition apparatus such as deposition or the like, and a physical vapor deposition apparatus such as sputtering. Further, the annealing means is a means for raising the characteristic phase of the vapor deposited film after the vapor deposition process, for example, a heat treatment means for immobilizing or phase-transforming a vapor deposited film. 2〇 Generally, the heat treatment apparatus has a one-piece type in which heat treatment is performed on one substrate and a batch type in which heat treatment is performed on a plurality of substrates. The monolithic type has the advantage of a simple device structure, but also has the disadvantage of low productivity. Therefore, for a large number of productions, the batch type has attracted attention. In a batch type heat treatment apparatus, a chamber for providing a heat treatment space capable of simultaneously heat-treating a plurality of substrates to 20,100,600 must have a carrier for supporting a plurality of substrates. On the other hand, with the recent increase in the size of flat panel displays, the necessity of a carrier capable of stably supporting and supporting a large-area substrate has been increased. In particular, in the case of a conventional carrier, there is a problem that the display characteristics of the flat panel display are degraded and uneven due to deformation such as bending of the substrate due to its own weight during heat treatment. Disclosure of the Invention 3 DISCLOSURE OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION Accordingly, an object of the present invention to solve the aforementioned problems is to provide a carrier which is subjected to a heat treatment process for a plurality of substrates carried on a batch type heat treatment apparatus. By using the long sides of the substrate carried by the first and second tracks to disperse the weight of the substrate, the substrate 15 is prevented from being deformed. Means for Solving the Problem In order to achieve the foregoing object, the carrier system of the present invention is disposed in a room for providing a space for performing a heat treatment process in a batch type heat treatment apparatus and carrying a plurality of substrates, including: a lower frame; an upper portion a frame body; and a connection frame 20, wherein the lower frame body and the upper frame body are formed with a plurality of vertical frames extending over a first support path extending inward of the substrate carried by the substrate, and further comprising: interconnecting the respective vertical lines The second support track of the first support track of the frame. Preferably, the first support track and the second support track are perpendicular to each other. 201001600, the vth support track and the second support track preferably support the long side of the substrate. Further, it is preferable that the soil is supported by at least one of the first support passage and the second support passage. It is preferable that the substrate is simultaneously contacted and supported by the first support path and the second support path. Advantageous Effects of Invention According to the present invention, since the first and second tracks for supporting the long plate side of the substrate carried by the carrier of the batch type heat treatment device are provided, the weight of the substrate can be dispersed during the heat treatment process for the 10 substrates. In addition, according to the present invention, the substrate carried on the carrier of the heat treatment device can be heat-treated according to the present invention, so that the substrate can be lifted on the substrate. The effect of the display characteristics of the flat panel display. [Embodiment] The best mode for carrying out the invention will be described in detail below with reference to the accompanying drawings. The carrier of the present invention can be used in a batch '" human heat treatment apparatus for performing heat >0 on a plurality of substrates at the same time. The batch type heat treatment device may be discharged from the interior & for the heat treatment; the heater for heating the substrate; and the gas supply tube for supplying the atmosphere or the gas to adjust the heat treatment process, and the gas supply tube has a tg Composition. Since the structure of the above-described batch type heat treatment apparatus and the heat treatment process of the technician type heat treatment apparatus are well known in the art, a detailed description of this part will be omitted. 201001600 Fig. 1 is a perspective view showing the structure of a carrier 10 according to an embodiment of the present invention, and Fig. 2 is a view showing first and second support paths 210 and 220 of a carrier 100 according to an embodiment of the present invention. A perspective view of the structure, and FIG. 3 is a perspective view showing a state in which the carrier 100 of the embodiment of the present invention carries the substrate 10. 5, as shown in FIG. 1, the structure of the carrier 100 includes: a lower and upper frame 110, 120; a vertical frame 200 that is connected to the frame 11〇, ρο; and a majority of the vertical frame 200 One lane 210; and a plurality of second support lanes 220 perpendicular to each of the first lanes 210 and interconnecting the first lane 210. In the batch type heat treatment apparatus, a heat treatment process may be performed after the substrate 10 is placed in a state in which the carrier 1 is disposed inside the chamber 10 which provides the heat treatment space. According to the case, the substrate 10 may be carried on the carrier 1 provided outside the chamber, and in this state, the carrier 1 is inserted into the inside of the chamber and then subjected to a heat treatment process. The lower casing 11A and the upper casing 12 are combined with the vertical casing 2〇〇15 described later to constitute a basic skeleton of the carrier 100. The lower casing 11 and the upper casing 12 are each formed in a rectangular shape having a predetermined size and spaced apart from each other by a predetermined distance, and the same direction on both sides of the carrier 1 is preferably arranged in parallel. At this time, the size of the lower casing 110 and the upper casing 12 is generally determined in consideration of the size of the rectangular substrate 10 carried by the batch type heat treatment apparatus for flat panel display manufacturing. The vertical frame 200 is connected to the lower frame 110 and the upper frame 120 to form a basic skeleton of the carrier 100. Both ends of the vertical frame 200 are coupled to the lower frame 11 〇 and the upper frame 201001600 body 12 分别, respectively. At this time, the vertical housing 200 is disposed on the long side of the substrate 10 carried by the carrier ι and is coupled to the lower and upper housings 11A and 12B. Generally, the carrier 100 is provided with a plurality of vertical frames 200. In this case, the shape and length of the frame 200 are preferably the same. As shown in FIG. 1, the figure 5 illustrates that the number of the vertical frames 200 provided on the carrier 100 is three on each of the two long sides of the substrate 10, that is, all six are provided, but not It is limited to this, and various changes can be made as needed. Further, it is preferable that at least four vertical frame bodies 2 are connected to the four corners of the lower frame 1 and the upper frame 120 on both sides of the carrier, so as to stably support the carrier. The substrate 10 of the body 100. The first support path 210 is formed on one side of the vertical frame 200 and has a function of supporting the air on the long side of the substrate 1 of the carrier. At this time, the first corridor 210 is formed to extend in the direction of the inner side of the substrate 1A. Preferably, each of the vertical frames 200 is formed with the same number of first branches 15 at the same intervals. The number of the first support tracks 21A formed in each of the vertical frames 200 is preferably the same as the total number of the substrates 10 that can be carried by the carrier 100. Therefore, the total number of the i-th support tracks 210 formed on the carrier 1 can be six times that of the substrate 1〇. For example, as shown in Figs. 1 and 2, when it is assumed that the carrier 1 〇〇 can carry 27 substrates, the total number of the first support tracks 21 形成 formed in the vertical frame 2 20 20 is 162. The length and width of the first support path 210 can be variously changed within a range in which the long side of the substrate 1A can be stably supported. The second support path 220 has a plurality of first support channels 210 disposed on each of the vertical frames 2, and has a long side of the substrate 10 supported by the first support path 210 on the 201001600 carrier 100. The role. At this time, the second support path 220 is formed perpendicular to each of the first support paths 210. The second support path 220 is joined to the second support path 21 by fusion or the like after being in contact with the front end of each of the first support paths 210 on one side thereof, and the first support path 210 can be connected by 5, but It is not necessarily limited to this. For example, the first support path 2 0 and the second support path 220 in the same layer may be integrally formed, and then placed on one side of each of the vertical frames 2 . As shown in FIG. 1 and FIG. 2, since the first support passages 210 are connected to one second support passage 220, the number of the second support passages 10 22 that are formed on the one support carrier 1 is considered to be Preferably, the number of substrates 1 可 that the carrier 100 can carry is preferably twice. For example, if the carrier 1 〇〇 can carry 27 substrates 1 , the total number of the second support tracks 220 is 54 . The length and width of the second support path 220 can be variously changed within a range in which the long side of the substrate 10 can be stably supported. Thereby, each of the substrates 10 carried on the carrier 100 corresponds to the first and second support tracks 210, 220 for supporting the substrate 10. In this case, the upper portions of the first and second support paths 210 and 220 are substantially aligned on the same surface, and the long sides of the substrate 10 can be simultaneously supported by the first and second support paths 210 and 220. . However, the present invention is not limited thereto, and the upper portion of the second support rail 220 may be supported higher than the upper portion of the first support passage 210, and the substrate 1 may be supported by the second support passage 220. Long side. Further, it is preferable that the portions of the first and second support paths 210 and 220 that are in contact with the bottom surface of the substrate 1 are formed into a planar shape, and the upper substrate 1 can be more stably supported on the upper surfaces of the first and second support paths 210 and 220. . 201001600 vertical frame

結設置下部及上部框體1〇〇、120與垂直框體200 , 但亦可依 構成承載體100之下部及上部框體110、12〇、 20< 5 情況以熔接方式連接設置。 如第3圖所示，具有前述結構之本發明一實施型態之承 載體100係藉由第1及第2支撐道210、220支撐基板1〇之長邊 側，而可分散基板之重量。故，可防止基板1〇在熱處理途 中因自身重量而變形，這樣一來則具有可控制平板顯示器 10 之顯示特性下降的優點。 特別地，由於本發明之承載體100在基板10與第丨及第2 支轉道210、220間為線接觸，因此在基板1〇之熱處理製程 中預定之應力（或熱應力）會集中於承載體1〇〇與基板1〇之間 的镇觸部分，而可防止對於基板1〇造成損害（損傷），這樣一 15 來則具有可控制平板顯示器之顯示特性下降的優點。 如上所述，根據本發明，藉由具有可支撐承載於批次 式熱處理裝置之承載體之基板之長邊側的第1及第2支撐 道， 可在對於基板進行熱處理製程時分散基板之重量，而 可防止基板變形。又，由於可在基板不變形的情況下對承 戟於抵次式熱處理裝置之承載體之基板進行熱處理製程， 此具有可提升形成於基板上之平板顯示器之顯示特性的 文果。故，本發明之產業利用性可說是非常高。 以上，關於本發明之詳細說明已針對具體的實施型態 進仃6兒明，但亦可在不脫離本發明要旨之範圍内進行各式 201001600 各樣的改變。因此，本發明之權利範圍並非限定於前述實 施型態，應當根據申請專利範圍之記載及與其均等者而決定。 L圖式簡單說明3 第1圖係顯示本發明一實施型態之承載體之結構的立 5 體圖。 第2圖係顯示本發明一實施型態之承載體之第1及第2 支撐道之結構的立體圖。 第3圖係顯示本發明一實施型態之承載體承載有基板 之狀態的立體圖。 10 【主要元件符號說明】 10…基板 200...垂直框體 100…承載體 210…第1支樓道 110.. .下部框體 220…第2支樓道 120.. .上部框體 10The lower and upper frames 1 and 120 and the vertical frame 200 are provided in the knot, but may be connected in a welded manner depending on the lower portion of the carrier 100 and the upper frames 110, 12, 20 < As shown in Fig. 3, the carrier 100 according to an embodiment of the present invention having the above-described configuration supports the long sides of the substrate 1 by the first and second support paths 210 and 220, and the weight of the substrate can be dispersed. Therefore, it is possible to prevent the substrate 1 from being deformed by its own weight during the heat treatment, and thus it is advantageous in that the display characteristics of the flat panel display 10 can be controlled to be lowered. In particular, since the carrier 100 of the present invention is in line contact between the substrate 10 and the second and second branches 210, 220, the predetermined stress (or thermal stress) in the heat treatment process of the substrate 1 is concentrated on The contact portion between the carrier 1 〇〇 and the substrate 1 , can prevent damage (damage) to the substrate 1 , and thus has an advantage of controlling the display characteristics of the flat panel display. As described above, according to the present invention, the weight of the substrate can be dispersed during the heat treatment process for the substrate by having the first and second support tracks on the long side of the substrate supporting the carrier of the batch type heat treatment apparatus. To prevent deformation of the substrate. Further, since the substrate subjected to the carrier of the secondary heat treatment apparatus can be subjected to a heat treatment process without deforming the substrate, the display characteristics of the flat panel display formed on the substrate can be improved. Therefore, the industrial utilization of the present invention can be said to be very high. The detailed description of the present invention has been described with respect to the specific embodiments of the present invention. However, various modifications of the various types of 201001600 can be made without departing from the scope of the invention. Therefore, the scope of the present invention is not limited to the embodiments described above, and should be determined according to the description of the claims and the equivalents thereof. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of a carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the structure of the first and second support paths of the carrier of one embodiment of the present invention. Fig. 3 is a perspective view showing a state in which a carrier of an embodiment of the present invention carries a substrate. 10 [Description of main component symbols] 10...Substrate 200...Vertical frame 100...Carrier 210...1st corridor 110...Lower frame 220...2nd corridor 120.. .Upper frame 10

Claims (1)

201001600 七、申請專利範圍： 1. 10 種氣载體’係配置於提供用 置執 包含 Λ在抵次式熱處理; 订…、處理I程之空間的室内 有. 儿承载有多數基板者 下部框體； 上部框體；及 體係連結有述下部框體及前述上部框 數延伸於前—基板之_向 且更包含有： 之前述第1支撐道的第2 互相連結前述各垂直框體 支標道。 2.如申請專利範圍第i項之承载體，其中前述第A撐道盘 前述第2支撐道互相垂直。 15 3. Μ請專利範圍第1項之承載體，其中前述第丨支撐道與 前述第2支撐道支撐前述基板之長邊側。 4. 如申請專職圍第丨項之承細，其中前絲板由前述 第！支撐道及前述第2支撐道中之至少—者機並支撐。 5. 如申請專利範圍第1項之承載體，其中前述基板由前述 20 第1支撐道及第2支撐道同時接觸並支撐。201001600 VII. Scope of application for patents: 1. 10 kinds of gas carriers are configured in the room where the supply is provided with the Λ 抵 抵 热处理 ; ; ; ; 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The upper frame and the system are connected to the lower frame and the upper frame number extends in the front-substrate direction, and further includes: the second support of the first support track is connected to each of the vertical frame supports Road. 2. The carrier of claim i, wherein the aforementioned second support track is perpendicular to the second support track. The carrier of claim 1, wherein the second support track and the second support track support the long side of the substrate. 4. If you apply for the full-scale circumference of the item, the front wire board is from the above! At least one of the support track and the aforementioned second support track is supported. 5. The carrier of claim 1, wherein the substrate is simultaneously contacted and supported by the 20th first support track and the second support track.
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