TW201001527A - Method and apparatus for removing polymer from a substrate - Google Patents

Method and apparatus for removing polymer from a substrate Download PDF

Info

Publication number
TW201001527A
TW201001527A TW98106595A TW98106595A TW201001527A TW 201001527 A TW201001527 A TW 201001527A TW 98106595 A TW98106595 A TW 98106595A TW 98106595 A TW98106595 A TW 98106595A TW 201001527 A TW201001527 A TW 201001527A
Authority
TW
Taiwan
Prior art keywords
substrate
chamber
support assembly
substrate support
gas
Prior art date
Application number
TW98106595A
Other languages
English (en)
Chinese (zh)
Inventor
Kenneth S Collins
Martin Salinas
Walter Merry
Jie Yuan
Andrew Nguyen
Kartik Ramaswamy
Jennifer Sun
Ren-Guan Duan
Xiao-Ming He
Nancy Fung
Ying Rui
Imad Yousif
Daniel Hoffman
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201001527A publication Critical patent/TW201001527A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW98106595A 2008-02-29 2009-02-27 Method and apparatus for removing polymer from a substrate TW201001527A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3269908P 2008-02-29 2008-02-29
US5199008P 2008-05-09 2008-05-09

Publications (1)

Publication Number Publication Date
TW201001527A true TW201001527A (en) 2010-01-01

Family

ID=41056572

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98106595A TW201001527A (en) 2008-02-29 2009-02-27 Method and apparatus for removing polymer from a substrate

Country Status (5)

Country Link
JP (1) JP2011517368A (ko)
KR (1) KR20100124305A (ko)
CN (1) CN101960567A (ko)
TW (1) TW201001527A (ko)
WO (1) WO2009111344A2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8642448B2 (en) 2010-06-22 2014-02-04 Applied Materials, Inc. Wafer dicing using femtosecond-based laser and plasma etch
US9653327B2 (en) * 2011-05-12 2017-05-16 Applied Materials, Inc. Methods of removing a material layer from a substrate using water vapor treatment
JP2012256501A (ja) * 2011-06-08 2012-12-27 Tokyo Institute Of Technology プラズマ生成用ガスおよびプラズマ生成方法並びにこれにより生成された大気圧プラズマ
US9165783B2 (en) * 2012-11-01 2015-10-20 Applied Materials, Inc. Method of patterning a low-k dielectric film
JP6869024B2 (ja) 2016-12-20 2021-05-12 東京エレクトロン株式会社 パーティクル除去方法及び基板処理方法
WO2018187679A1 (en) * 2017-04-07 2018-10-11 Applied Materials, Inc. Plasma density control on substrate edge
US20200131634A1 (en) * 2018-10-26 2020-04-30 Asm Ip Holding B.V. High temperature coatings for a preclean and etch apparatus and related methods
CN115161613B (zh) * 2021-04-07 2024-04-26 台湾积体电路制造股份有限公司 沉积室的清洁方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3942672B2 (ja) * 1996-04-12 2007-07-11 キヤノンアネルバ株式会社 基板処理方法および基板処理装置
US6450116B1 (en) * 1999-04-22 2002-09-17 Applied Materials, Inc. Apparatus for exposing a substrate to plasma radicals
KR100536140B1 (ko) * 2002-11-26 2005-12-14 한국전자통신연구원 반도체 소자의 제조 장치 및 이를 이용한 반도체 소자의제조 방법

Also Published As

Publication number Publication date
WO2009111344A3 (en) 2009-11-05
KR20100124305A (ko) 2010-11-26
WO2009111344A2 (en) 2009-09-11
CN101960567A (zh) 2011-01-26
JP2011517368A (ja) 2011-06-02

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