WO2009111344A3 - Method and apparatus for removing polymer from a substrate - Google Patents

Method and apparatus for removing polymer from a substrate Download PDF

Info

Publication number
WO2009111344A3
WO2009111344A3 PCT/US2009/035572 US2009035572W WO2009111344A3 WO 2009111344 A3 WO2009111344 A3 WO 2009111344A3 US 2009035572 W US2009035572 W US 2009035572W WO 2009111344 A3 WO2009111344 A3 WO 2009111344A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
chamber
processing chamber
outlet port
support assembly
Prior art date
Application number
PCT/US2009/035572
Other languages
French (fr)
Other versions
WO2009111344A2 (en
Inventor
Kenneth Collins
Martin Salinas
Walter Merry
Jie Yuan
Andrew Nguyen
Kartik Ramaswamy
Jennifer Sun
Ren-Guan Duan
Xiaoming He
Nancy Fung
Ying Rui
Imad Yousif
Daniel J. Hoffman
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to CN2009801069938A priority Critical patent/CN101960567A/en
Priority to JP2010548923A priority patent/JP2011517368A/en
Publication of WO2009111344A2 publication Critical patent/WO2009111344A2/en
Publication of WO2009111344A3 publication Critical patent/WO2009111344A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A method and an apparatus for removing polymer from a substrate are provided. In one embodiment, an apparatus utilized to remove polymer from a substrate includes a processing chamber having a chamber wall and a chamber lid defining a process volume, a substrate support assembly disposed in the processing chamber, and a remote plasma source coupled to the processing chamber through an outlet port formed within the chamber wall, the outlet port having an opening pointing toward an periphery region of a substrate disposed on the substrate support assembly, wherein the remote plasma source is fabricated from a material resistant to hydrogen species.
PCT/US2009/035572 2008-02-29 2009-02-27 Method and apparatus for removing polymer from a substrate WO2009111344A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801069938A CN101960567A (en) 2008-02-29 2009-02-27 Be used for from the method and apparatus of substrate removal polymer
JP2010548923A JP2011517368A (en) 2008-02-29 2009-02-27 Method and apparatus for removing polymer from a substrate

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US3269908P 2008-02-29 2008-02-29
US61/032,699 2008-02-29
US5199008P 2008-05-09 2008-05-09
US61/051,990 2008-05-09

Publications (2)

Publication Number Publication Date
WO2009111344A2 WO2009111344A2 (en) 2009-09-11
WO2009111344A3 true WO2009111344A3 (en) 2009-11-05

Family

ID=41056572

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/035572 WO2009111344A2 (en) 2008-02-29 2009-02-27 Method and apparatus for removing polymer from a substrate

Country Status (5)

Country Link
JP (1) JP2011517368A (en)
KR (1) KR20100124305A (en)
CN (1) CN101960567A (en)
TW (1) TW201001527A (en)
WO (1) WO2009111344A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8642448B2 (en) * 2010-06-22 2014-02-04 Applied Materials, Inc. Wafer dicing using femtosecond-based laser and plasma etch
US9653327B2 (en) * 2011-05-12 2017-05-16 Applied Materials, Inc. Methods of removing a material layer from a substrate using water vapor treatment
JP2012256501A (en) * 2011-06-08 2012-12-27 Tokyo Institute Of Technology Plasma generation gas, method for generating plasma, and atmospheric pressure plasma generated by the method
US9165783B2 (en) * 2012-11-01 2015-10-20 Applied Materials, Inc. Method of patterning a low-k dielectric film
JP6869024B2 (en) * 2016-12-20 2021-05-12 東京エレクトロン株式会社 Particle removal method and substrate processing method
US10790121B2 (en) * 2017-04-07 2020-09-29 Applied Materials, Inc. Plasma density control on substrate edge
CN115161613B (en) * 2021-04-07 2024-04-26 台湾积体电路制造股份有限公司 Method for cleaning deposition chamber

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059985A (en) * 1996-04-12 2000-05-09 Anelva Corporation Method of processing a substrate and apparatus for the method
US6450116B1 (en) * 1999-04-22 2002-09-17 Applied Materials, Inc. Apparatus for exposing a substrate to plasma radicals
KR20040046176A (en) * 2002-11-26 2004-06-05 한국전자통신연구원 Equipment of semiconductor device fabrication and method of manufacturing a semiconductor device using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059985A (en) * 1996-04-12 2000-05-09 Anelva Corporation Method of processing a substrate and apparatus for the method
US6450116B1 (en) * 1999-04-22 2002-09-17 Applied Materials, Inc. Apparatus for exposing a substrate to plasma radicals
KR20040046176A (en) * 2002-11-26 2004-06-05 한국전자통신연구원 Equipment of semiconductor device fabrication and method of manufacturing a semiconductor device using the same

Also Published As

Publication number Publication date
JP2011517368A (en) 2011-06-02
WO2009111344A2 (en) 2009-09-11
KR20100124305A (en) 2010-11-26
CN101960567A (en) 2011-01-26
TW201001527A (en) 2010-01-01

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