TW200941753A - LED light panel structure having a patch bracket - Google Patents

LED light panel structure having a patch bracket Download PDF

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Publication number
TW200941753A
TW200941753A TW097109468A TW97109468A TW200941753A TW 200941753 A TW200941753 A TW 200941753A TW 097109468 A TW097109468 A TW 097109468A TW 97109468 A TW97109468 A TW 97109468A TW 200941753 A TW200941753 A TW 200941753A
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TW
Taiwan
Prior art keywords
led
led lamp
positive
disposed
negative
Prior art date
Application number
TW097109468A
Other languages
Chinese (zh)
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TWI446570B (en
Inventor
ben-zhuang Zou
Original Assignee
Lin Pin Ya
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Priority to TW097109468A priority Critical patent/TW200941753A/en
Publication of TW200941753A publication Critical patent/TW200941753A/en
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Publication of TWI446570B publication Critical patent/TWI446570B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Abstract

Provided is an LED light panel structure having a patch bracket, comprising two electrically independent metallic wires contacted with the positive and negative terminals; wherein a cup-shaped groove is disposed on one of the terminals, and a chip is disposed on said groove and is electrically connected to each terminal. A transparent mask is disposed on the outside of the chip. An LED lamp body coated with fluorescent powder is disposed between the LED chip and the transparent mask. After dispersing light with LED lamp, using SMT automatic plug-in soldering machine to solder the LED lamp onto the positive and negative metallic layers of a substrate PCB board. As a result, LED light panel structure with good heat conductivity, large flux emission, long service life, low production cost, and color temperature consistency can be achieved.

Description

200941753 九、發明說明： - 【發明所屬之技術領域】 本發明係有關於一種LED燈板的結構及其製法，尤指該 LED燈具有貼片式支架，使其可以自動化、批量化快速生 產，並使產品品質優良且穩定者。 【先前技術】 發光一極體（led)是一種半導體固體發光器件，它是 利用固體半導體晶片作為發光材料，當兩端加上正向電 ❹壓，半導體中的載流子發生複合引起光子發射而產生光， 是當今最熱門的光源技術。LED光源的特點是：節能消 耗能量較同光效的白熾燈減少80%;使用低壓電源（在 6。-24V，間）；安全性佳；體積小；可以製成各種形狀的 器件，壽命長；回應時間快，白熾燈的回應時間為毫秒級， LED燈的回應時間為奈秒級；無有害金屬汞對環境的污染 等。隨著大功率LED燈的開發應用，LED燈已從點光源向 ❹功能性照明的方向發展，發展前景無比廣闊。 請參圖1，既有的發光二極體或稱LED燈，是由兩條 腿式的支架1、Γ (或正負極插腳）及設於支架上的碗杯 中的晶片2,覆蓋晶片上的螢光粉4和封裝晶片的環氧樹 脂5組成，晶片藉由其正負極引線3與支架分別連接其 缺點： ~ 1.支架為線材，其導熱性差，在支架上的正負極連接 處’為了焊接品質及導熱佳而設有鑛金層，但是終因支架 的散熱面積有限，使得散熱效果不佳，而且鍍金層亦使/生 200941753 產成本進一步提高。 2. 晶片發出的光和熱使得螢光粉加速老化，導致白光二 ，極體的色溫穩定性變差、產品使用壽命降低。 3. —般的LED燈板都是由多個led燈單體組成，生產 LED燈板時，需要先將LED燈單體的正負極插腳卜】，（兩 根或四根）用手工插入電路板的插孔内，再人工進行焊接， 以致於無法機械化生產。如此，導致產品品質不穩定、成 品率低、生產效率低且生產成本高。 ❹ 本發明人有鑑於既有LED燈如上之缺失，期能提供一 種具有貼片式支架的LED燈板結構及其製法，乃潛心研 思、設計組製，以提供消費大眾使用，為本發明所欲研創 之創作動機者。 【發明内容】 …本發明的主要目的，在提供—種散熱良好、產品品質穩 疋生產成本低、可機械化生產的具有貼片式支架的LED ❿燈板結構及其製法。 為達成上述目的，本發明之貼片式支架的LED燈板，其 支架主要係以兩片互不電連接的金屬板做為LED燈的正負 極接線端子，接線端子的底部設置在同-平面；在其中一 二接線端子上設有碗杯狀凹槽，—LED晶片設置在凹槽之 :LED晶片的正負極分別與接線端子電連接 =片的外側設置-層透明罩，在⑽晶片與透明罩: 置一層螢光粉。將LED燈的咖晶片部分設置在一 的通孔的中心，並將LED燈的正負極接線端子與基板的卿 200941753 線路的正負極金屬層電連接。 ' i述的設有碗杯狀凹槽的接線端子上的凹槽附近及其 ' 另一塊接線端子靠近, 八 晶片的正負極連接在 上=兩片金屬板接線端子可以僅具有一正負 端子，也可以是1φ_ μ ，、 片接線端子具有一對正極接線端 子，另一接線端子具有一對負極接線端子。 β屬杜線端子較佳是用銅材或其他散熱效果佳的金 、，所述的基板是用金屬材質或普通的pvc 料製成的。 上述的透明罩是用透明的塑膠、環氧樹脂、矽膠、玻璃、 陶兗材料之一製造的。 上述的每個凹槽中設置至少一個LED晶片，所述的基板 上的通孔至少有兩個，在基板的每個通孔上的正面或正反 兩面上設置有LED燈形成單面或雙面LED燈板。 ❹ 具有貼片式支架的LED燈板的製法，其特徵在於包括有 如下步驟： 步驟一 ·將LED晶片固定在金屬板上的碗杯狀凹槽（戋 雙碗狀孔）中，並將LED晶片的正負極藉引線分別焊接在 兩片金屬板的凸台上； 步驟二：在led晶片的至少一面塗佈螢光粉，再將步驟 —製作完成的帶有LED晶片的支架設置在一專用模條上， 灌注透明膠以形成一透明罩並製成一 LED燈單體； 步驟三：將步驟二製作完成的LED燈單體利用分光機進 200941753 行分光’並將同一光波或同一顏色的LED燈單體集中放置；200941753 IX. Description of the Invention: - Technical Field of the Invention The present invention relates to a structure of an LED lamp panel and a method of manufacturing the same, and more particularly to the LED lamp having a patch-type bracket, which enables automatic production in batch and batch. And make the product quality and stable. [Prior Art] A light-emitting diode (LED) is a semiconductor solid-state light-emitting device which uses a solid semiconductor wafer as a light-emitting material. When a positive electric current is applied to both ends, carriers in the semiconductor recombine to cause photon emission. Producing light is the most popular light source technology today. The characteristics of the LED light source are: energy consumption consumes 80% less energy than incandescent lamps with light efficiency; use low voltage power supply (between 6 and 24V); good safety; small size; can be made into various shapes of devices, long life The response time is fast, the response time of the incandescent lamp is millisecond, and the response time of the LED lamp is nanosecond; there is no environmental pollution caused by harmful metal mercury. With the development and application of high-power LED lamps, LED lamps have developed from point sources to ❹ functional lighting, and the development prospects are extremely broad. Referring to Figure 1, the existing light-emitting diode or LED lamp is covered by a two-legged bracket 1, a Γ (or positive and negative pin) and a wafer 2 placed in a cup on the support. The phosphor powder 4 and the epoxy resin 5 of the package wafer are composed, and the wafer is connected to the bracket by the positive and negative electrode leads 3 respectively. The disadvantages are as follows: ~ 1. The bracket is a wire, and the thermal conductivity is poor, and the positive and negative connections on the bracket are ' In order to weld quality and good thermal conductivity, there is a gold layer, but the heat dissipation area of the bracket is limited, which makes the heat dissipation effect poor, and the gold plating layer further increases the production cost of the 200941753. 2. The light and heat emitted by the wafer accelerates the aging of the phosphor powder, resulting in white light, poor color temperature stability of the polar body, and reduced product life. 3. The general LED light board is composed of a plurality of LED light units. When producing the LED light board, the positive and negative poles of the LED light unit must be inserted first, and (two or four) are manually inserted into the circuit. In the socket of the board, manual welding is performed, so that it cannot be mechanized. As a result, the product quality is unstable, the yield is low, the production efficiency is low, and the production cost is high. The present inventors have in view of the absence of the above-mentioned LED lamps, and can provide an LED lamp panel structure with a patch bracket and a method for manufacturing the same, which is a research and design system to provide consumer use, which is the present invention. The motivation for the creation of the creation. SUMMARY OF THE INVENTION The main object of the present invention is to provide an LED xenon lamp panel structure having a chip holder and a method for manufacturing the same, which has good heat dissipation, stable product quality, low production cost, and mechano-productive production. In order to achieve the above object, the LED lamp panel of the patch bracket of the present invention mainly comprises two metal plates which are not electrically connected to each other as positive and negative terminals of the LED lamp, and the bottom of the terminal is disposed in the same plane. There is a cup-shaped groove on one or two of the terminals, and the LED chip is disposed in the groove: the positive and negative electrodes of the LED chip are respectively electrically connected to the terminal; the outer side of the piece is set-layer transparent cover, and the (10) wafer is Transparent cover: Place a layer of phosphor powder. The coffee chip portion of the LED lamp is placed in the center of a through hole, and the positive and negative terminals of the LED lamp are electrically connected to the positive and negative metal layers of the substrate of the 200941753 line. 'Is the vicinity of the groove on the terminal block with the cup-shaped groove and its 'the other terminal is close, the positive and negative terminals of the eight chips are connected to the upper=two metal plate terminals can have only one positive and negative terminal, It may also be 1φ_μ, the chip terminal has a pair of positive terminals, and the other terminal has a pair of negative terminals. Preferably, the β-wire terminal is made of copper or other gold having good heat dissipation effect, and the substrate is made of metal material or ordinary pvc material. The transparent cover described above is made of one of transparent plastic, epoxy, silicone, glass, and ceramic materials. At least one LED chip is disposed in each of the above-mentioned grooves, and at least two through holes are formed in the substrate, and LED lamps are disposed on the front side or the front and back sides of each of the through holes of the substrate to form a single side or a double LED light board.制 The method for manufacturing the LED light board with the patch bracket comprises the following steps: Step 1. Fix the LED wafer in a cup-shaped groove (戋 double bowl hole) on the metal plate, and the LED The positive and negative electrodes of the wafer are respectively soldered on the bumps of the two metal plates; Step 2: The phosphor powder is coated on at least one side of the LED wafer, and the step-made LED wafer holder is set in a dedicated On the mold strip, the transparent adhesive is poured to form a transparent cover and made into a single LED light unit; Step 3: The LED light unit produced in the second step is split into the 200941753 line by the splitter and the same light wave or the same color LED light is used. Monomer placement;

步驟四：利用SMT自動插件機將步驟三分揀出的LED 燈單體分別置入一基板的複數個通孔中，及Led燈單體的 正負極焊接在基板的線路的正負極金屬層上以形成LED燈 板。 本發明較既有技術突出的優點是： 1、 本發明將兩片金屬板做為led的正負極接線端子， 由於接線端子的焊接面積大，led晶片的熱量可迅速導入 ❹PCB線路板直接散熱，其散熱效果佳，可大幅度降低晶片 熱量及增加LED燈的光通量及使用壽命。 2、 本發明的貼片式LED支架可焊接於雙面線路上使其 ，基板的雙面發光，也可焊接於單面線路上使其在基板的 單面發光。 3、 將支架上的碗杯狀凹槽改變為貫通的雙碗狀孔，並 將LED晶片封裝於該雙碗狀孔的中心位置，可使其在基板 p的雙面發光。 、4、在將LED燈單體焊接到線路板上之前，可用分光機 =订分光，將接近同一光波或同一顏色的lED燈單體根據 而要烊接在PCB線路上，使LED燈板的色溫維持一致性。 5、本發明的支架的接線端子的底部因設置在同一平 面，故該支架形成一種可貼於印刷電路基板平面的貼片式 支架。用該貼片式支架製作的^肋燈單體可用自動插件機 ，自動焊接機製作LED燈板，可使LED燈板以自動化、批 量化快速生產，並使產品品質優良且穩定。 200941753 上’也可以7可做為新—代LED光源應用在各種發光燈具 【實^方式成】各種光源模組* L C D液晶顯示器之背光源。 下面以具體實施例對本發明 實施例1 社谌，2 5、圖14—15。具有貼片式支架的LED燈板 柊沾架1〇 ’係將兩片互不電性連接的金屬板做為LED =、正、極接線端子2Q、3()、該端子的底部因設置在同一 ，，故該支架1G形成—種可貼於印刷電路基板平面的貼 片，支架。在該支架的其中一片接線端子2〇上設有一非貫 通的，杯狀凹槽201，而—LED晶片5〇設置在凹槽2〇1甲， LED曰曰片50的正負極分別透過引線51與接線端子20、30 電性連接，在LED晶月50的外側設置一層實心或中空的透 明罩40 ’以形成一 led燈單體70。 上述的LED晶片50與透明罩40之間可以設或不設一層 ❹螢光粉，若設有螢光粉則可成為發白光的LED燈；若未具 有螢光粉則可視電流的大小成為不同顏色的led燈。 上述的設有碗杯狀凹槽的接線端子上的凹槽附近及其 另一接線端子靠近凹槽的部分，可向上設置為凸台2〇3、 301，而LED晶片50的正負極接線端子2〇、3〇的引線51 可連接在凸台上，如圖5。 實施例2 參見圖6— 9、圖16— 17。實施例2的基本結構與實施 例1相同’不同點在於實施例1的支架為僅具有單的正負 200941753 極接線端子20、30;而實施例2的支架100的其中一片為 具有左右一對正極接線端子200，另一片為具有一對負極 接線端子300。實施例2與實施例丄相同的，在其中的一 片接線端子200上設有碗杯狀凹槽2〇〇1，而led晶片5〇 設置在凹槽2001中，LED晶片50的正負極分別透過引線 51與接線端子200、300電性連接，在LEd晶片5〇的外侧 設置一層實心或中空的透明罩4〇〇，以形成一 LED燈單體 700。實施例2由於一對正極接線端子和一對負極接線端子 與基板焊接後，可將更大量的LED晶片工作時所發出的熱 量快速散去，故適用於製造中功率或大功率LED燈單體及 燈板’而具有產品穩定且可長效工作的特性。 實施例3 參見圖10—13。實施例3基本結構舆實施例丨相同， 不同點在於實施例1的該碗杯狀凹槽為非貫通者，而實施 =3係在接線端子2〇的上下表面設凹槽，並使雙凹槽互成 ❹貝通的雙碗狀孔202 ’如此，將LED晶片50封裝在雙碗狀 孔202的中間部位，LED晶片5〇的正負極分別透過引線η 與接線端子2G、3G的其中-面電性連接。在實施例3中， 由於LED晶片50位於貫通的雙碗狀孔2〇2中而得以在支架 10’的雙面發光，故須於LED晶片50的兩外侧設置一層實 匕或中空的透明罩40,以形成-可雙面發光的LED燈單體 70 ° 製造流程 參見圖18，奋以實施例3的結構說明本發明之具有貼 200941753 片式支架的LED燈板的製法，包括有如下步驟： 步驟一：將LED晶片50固定在支架1〇的接線端子2〇 上的雙碗狀孔202中，並將LED晶片50的正負極藉引線 Η分別焊接在兩片接線端子20、3〇的凸台2〇3、3〇ι上； 步驟二：在LED晶片50的至少一面（圖中係於晶片雙面） 塗佈螢光粉（圖中未示），將步驟一製作完成的帶有⑽晶 片50的支架置在專用模條（圖中未示）上並灌注透明膠以 形成一透明罩41，並製成一 LED燈單體7〇 ”；圖中因為採 用雙面發光之晶片，故循上述步驟再灌注另一透明罩42， 透月罩可77-人成型或一次成型；且該透明罩除如圖中的膠 囊型體外’亦可採用如上述實施例卜3中的透明罩4◦、彻。 、步驟三：將步驟二製作完成的LED燈單體7〇，，利用分 光機進仃分光，並將同一光波或同一顏色的LED燈單體 中放置； 步驟四.利用SMT自動插件機將步驟三分揀出的led ⑩燈單體分別置入一基板60的複數個通孔61中，及LED燈 單體的正負極接線端子2G、3G焊接在基板6〇上的線路的 正負極金屬層（圖中未示）上以形成一 LE請板80”。 _上^!的接線端子較佳是用導電性及散熱效果佳的銅材 製成；、當然，也可以用其他散熱性佳的金屬材質製作。 上述的基板較佳是用鋁材製成的；當然，也可以用其他 金屬材料或普通的PVC材料製作。 上述的透明罩是用透明的塑膠、環氧樹脂、矽膠、玻璃、 陶竟材料之一製造的。 11 200941753 上述製法係於基板6〇上設複數個貫穿的通孔6i，在每 個通孔中設置可雙面發光的LED燈單體，以形成如圖19的 LED液晶顯示器背光板9〇，及圖21的雙面發光LED燈板 80 。上述製法亦可在基板的至少一面上具有複數個非貫 穿的凹孔（圖中未示），在每個凹孔中設僅單面發光的lED 燈單體’以形成如圖20的單面發光的led燈板80。因此， 本發明如上述具有貼片式支架的LED燈板，可用於製作如 光源模組等發光燈具。 © 以上所述者’僅為本發明之較佳實施例而已，舉凡依本 發明申請專利範圍所做之均等設計變化，均應為本案之技 術所涵蓋。 【圖式簡單說明】 圖1是既有技術的結構剖視圖； 圖2是本發明之實施例1的支架結構俯視立體圖； 圖3是圖2的底部立體圖； ❹ 圖4是本發明之實施例1的LED燈單體的俯視圖； 圖5是圖4的A —A剖視圖； 圖6是本發明之實施例2的支架結構俯視立體圖； 圖7是圖6的底部立體圖； 圖8是本發明之實施例2的LED燈單體的俯視圖； 圖9疋圖8的B—B剖視圖； 圖10是本發明之實施例3的支架結構俯視立體圖； 圖11是圖10的底部立體圖； 圖12是本發明之實施例3的LED燈單體的俯視圖； 12 200941753 圖13是圖12的c—c剖視圖； 圖14、15是本發明之實施例1的LED燈單體的不同視 角立體示意圖； 圖16、17是本發明之實施例2的LED燈單體的不同視 角立體示意圖； 圖18是本發明的製造流程示意圖； 圖19是依本發明所製作的背光板的立體示意圖；Step 4: The SMT automatic plug-in machine is used to place the LED light units in the third step into a plurality of through holes of a substrate, and the positive and negative electrodes of the Led lamp unit are soldered on the positive and negative metal layers of the circuit of the substrate. To form an LED light panel. The advantages of the present invention over the prior art are as follows: 1. The invention uses two metal plates as the positive and negative terminals of the LED. Since the welding area of the terminal is large, the heat of the LED chip can be quickly introduced into the circuit board to directly dissipate heat. Its heat dissipation effect is good, which can greatly reduce the heat of the chip and increase the luminous flux and service life of the LED lamp. 2. The SMD LED holder of the present invention can be soldered to a double-sided line so that the substrate can be illuminated on both sides, or can be soldered on a single-sided line to emit light on one side of the substrate. 3. The bowl-shaped groove on the bracket is changed into a through-double bowl-shaped hole, and the LED chip is packaged in the center position of the double bowl-shaped hole, so that it can emit light on both sides of the substrate p. 4, before soldering the LED lamp unit to the circuit board, the splitter can be used to set the split light, and the lED lamp unit close to the same light wave or the same color can be connected to the PCB line according to the LED light board. The color temperature remains consistent. 5. Since the bottom of the terminal of the bracket of the present invention is disposed on the same plane, the bracket forms a patch bracket that can be attached to the plane of the printed circuit board. The rib lamp unit made of the patch bracket can be used to manufacture an LED lamp board by an automatic plug-in machine and an automatic welding machine, so that the LED lamp board can be automated, batch-produced and quickly produced, and the product quality is excellent and stable. 200941753 can also be used as a new-generation LED light source in a variety of lighting fixtures [real ^ way into a variety of light source modules * L C D liquid crystal display backlight. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the embodiment of the present invention will be described, with reference to the embodiment of the present invention, 25, and 14-15. The LED light board with the chip holder is 1", and the two metal plates that are not electrically connected to each other are used as LED =, positive and negative terminals 2Q, 3 (), and the bottom of the terminal is set at In the same manner, the bracket 1G forms a patch and a bracket that can be attached to the plane of the printed circuit board. A non-penetrating, cup-shaped recess 201 is disposed on one of the terminals 2 of the bracket, and the LED chip 5 is disposed in the recess 2 〇 1A, and the positive and negative poles of the LED cymbal 50 are respectively transmitted through the lead 51. Electrically connected to the terminals 20, 30, a solid or hollow transparent cover 40' is disposed on the outside of the LED crystal 50 to form a led lamp unit 70. The above-mentioned LED chip 50 and the transparent cover 40 may or may not be provided with a layer of phosphor powder, and if fluorescent powder is provided, it may become a white light-emitting LED lamp; if there is no phosphor powder, the visible current will be different. Color led lights. The portion of the above-mentioned groove on the terminal provided with the cup-shaped groove and the portion of the other terminal adjacent to the groove may be arranged upward as the boss 2〇3, 301, and the positive and negative terminals of the LED chip 50 2〇, 3〇 leads 51 can be attached to the boss, as shown in Figure 5. Embodiment 2 See Figures 6-9 and 16-17. The basic structure of Embodiment 2 is the same as that of Embodiment 1 'the difference is that the bracket of Embodiment 1 has only a single positive and negative 200941753 pole terminal 20, 30; and one of the bracket 100 of Embodiment 2 has a pair of right and left anodes. The terminal 200 has another pair of negative terminal blocks 300. Embodiment 2 is the same as the embodiment, in which one of the terminals 200 is provided with a cup-shaped recess 2〇〇1, and the led wafer 5 is disposed in the recess 2001, and the positive and negative electrodes of the LED wafer 50 are respectively transmitted through The lead wires 51 are electrically connected to the terminals 200 and 300, and a solid or hollow transparent cover 4 is disposed on the outer side of the LEd wafer 5A to form an LED lamp unit 700. Embodiment 2 Since a pair of positive electrode terminals and a pair of negative electrode terminals are soldered to the substrate, heat generated by a larger amount of LED chips can be quickly dissipated, so that it is suitable for manufacturing medium power or high power LED lamp cells. And the light board' has the characteristics of stable product and long-term work. Example 3 See Figure 10-13. The basic structure of the embodiment 3 is the same as that of the embodiment, except that the cup-shaped groove of the embodiment 1 is non-through, and the implementation=3 is provided with a groove on the upper and lower surfaces of the terminal 2〇, and the double concave The double-bowl holes 202 of the scallops are mutually encapsulated. Thus, the LED chip 50 is encapsulated in the middle portion of the double bowl-shaped hole 202, and the positive and negative electrodes of the LED chip 5 透过 pass through the lead η and the terminals 2G and 3G, respectively. Surface electrical connection. In the third embodiment, since the LED chip 50 is located on the double-sided hole 2〇2 of the through-hole, the double-sided light is emitted on the double-bowl hole 2', so that a transparent or hollow transparent cover is provided on both outer sides of the LED chip 50. 40, in order to form a double-sided LED lamp unit 70 ° manufacturing process, see FIG. 18, the structure of the embodiment 3 is used to illustrate the method for manufacturing the LED lamp board with the 200941753 chip holder of the present invention, including the following steps Step 1: Fix the LED chip 50 in the double bowl hole 202 on the terminal 2 of the bracket 1 , and solder the positive and negative poles of the LED chip 50 to the two terminals 20 and 3 respectively. The bumps are 2〇3, 3〇ι; Step 2: Applying phosphor powder (not shown) on at least one side of the LED chip 50 (on both sides of the wafer), and the step 1 is completed. (10) The holder of the wafer 50 is placed on a special mold strip (not shown) and filled with a transparent glue to form a transparent cover 41, and is made into an LED lamp unit 7"; because the double-sided light-emitting chip is used in the figure, The above steps are refilled with another transparent cover 42 which can be formed by a person or a person once. And the transparent cover can be used as the transparent outer cover of the above-mentioned embodiment 3 in addition to the capsule type in the figure. Step 3: The LED lamp unit 7 completed in the second step is The spectrometer is used to split the light, and the same light wave or the LED light of the same color is placed in the unit; Step 4. The SMT automatic plug-in machine is used to place the led 10 lamp units sorted out in the step into a substrate 60 respectively. The plurality of through holes 61, and the positive and negative terminals 2G, 3G of the LED lamp unit are soldered to the positive and negative metal layers (not shown) of the line on the substrate 6A to form an LE request plate 80". The terminal of _up ^! is preferably made of copper with good electrical conductivity and heat dissipation effect; of course, it can also be made of other metal materials with good heat dissipation. The above substrate is preferably made of aluminum; of course, it may be made of other metal materials or ordinary PVC materials. The transparent cover described above is made of one of transparent plastic, epoxy, silicone, glass, and ceramic materials. 11 200941753 The above method is to provide a plurality of through-holes 6i through the substrate 6〇, and a double-sided LED lamp unit is disposed in each of the through holes to form the LED liquid crystal display backlight 9 of FIG. And the double-sided LED panel 80 of FIG. The above method may also have a plurality of non-penetrating recessed holes (not shown) on at least one side of the substrate, and a single-sided illuminating lED lamp unit 'in each of the recessed holes is formed to form a single side as shown in FIG. Illuminated led light board 80. Therefore, the present invention, as described above, has an LED lamp panel having a patch mount, which can be used to fabricate a light fixture such as a light source module. The above-mentioned embodiments are merely preferred embodiments of the present invention, and all equivalent design changes made in accordance with the scope of the present invention should be covered by the technology of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a structure of a prior art; Fig. 2 is a top perspective view of a stent structure according to a first embodiment of the present invention; Fig. 3 is a bottom perspective view of Fig. 2; FIG. 5 is a cross-sectional view of the bracket structure of Embodiment 2 of the present invention; FIG. 7 is a bottom perspective view of FIG. 6; FIG. FIG. 10 is a cross-sectional view of the support structure of the third embodiment of the present invention; FIG. 11 is a bottom perspective view of the support structure of the third embodiment of the present invention; FIG. FIG. 13 is a cross-sectional view taken along line c-c of FIG. 12; and FIGS. 14 and 15 are perspective views of different angles of the LED lamp unit according to Embodiment 1 of the present invention; 17 is a perspective view of a different perspective of the LED lamp unit according to Embodiment 2 of the present invention; FIG. 18 is a schematic view showing the manufacturing process of the present invention; FIG.

圖20疋依本發明所製作的單面發光的⑽|板的立 示意圖； _立圖国21是依本發明所製作的雙面發光的LED燈板的立體 【主要元件符號說明】 既有技術 1、1’支架 2晶片 4螢光粉 5壤氧樹脂 本發明技術 10、10’ 支架 20 ' 200 正極接線端子 201、2001 碗杯狀凹槽 202雙碗狀孔 203、301 凸台 13 200941753 30、300負極接線端子 40、41、42、400 透明罩 5 0晶片 51引線 60基板 61通孔 70、70’ 、70” 、700 LED 燈單體 80、80’ 、80” LED 燈板 90 LED液晶顯示器背光板Figure 20 is a vertical schematic view of a single-sided light-emitting (10) plate made in accordance with the present invention; _ Litu State 21 is a three-dimensional light-emitting LED light panel produced according to the present invention. [Main component symbol description] Existing technology 1, 1 'bracket 2 wafer 4 fluorescent powder 5 soil oxygen resin The present invention 10, 10' bracket 20 '200 positive terminal 201, 2001 bowl cup groove 202 double bowl hole 203, 301 boss 13 200941753 30 300 negative terminal 40, 41, 42, 400 transparent cover 50 wafer 51 lead 60 substrate 61 through hole 70, 70', 70", 700 LED lamp unit 80, 80', 80" LED panel 90 LED liquid crystal Display backlight

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Claims (1)

200941753 十、申請專利範圍： 1、一種具有貼片式支架的led燈板結構，包括： 複數個LED燈單體’每一單體包括一支架，係由兩 片互不電性連接的金屬板形成正負極接線端子，其中一 片接線端子的至少一面設有一凹槽，而一 Led晶片設置 在凹槽中，led晶片的正負極分別以引線與二接線端子 電性連接，及LED晶片的外侧設置一層透明罩； ❹ 一基板，其中至少一板面設有複數個通孔，每一通 孔中承置該每一個LED燈單體，及該每一個LED燈單體 的正負極接線端子焊接在基板板面上的線路的正負極 金屬層上。 、 2、 如申請專利第丨項所述具有貼片式支㈣LED燈板 結構，其中凹槽為設在接線端子的其中一面 槽，而LED晶片設置在凹槽中。 穿 ❹ 3、 如申請專利範圍第i項所述具有貼片式支架的led燈板 結構，其中凹槽為設在接線端子的雙面且互相貫穿的雙 凹孔，而LED晶片設置在凹孔中段部位。 1 =士申清專利範圍第1項所述具有貼片式支架的⑽燈板 二構，其中LED晶片與透明罩之間設一層螢光粉。 專利範圍第1項所述具有貼片式支架的燈板 …構，其中透明罩為實心或空心任一種。 社Hr·帛1項所述具有貼片式支架的led燈板 :構，其中金屬板具有一正極接線端子及一負極接線端 15 200941753 社类月I範圍第1項所述具有貼片式支架的LED燈板 ，其中金屬板之一具有一對正極接線端子，另一金 屬板具有一對負極接線端子。 &申叫專利範圍第i項所述具有貼片式支架的l仙燈板 、、冓其中基板的—板面均設有複數個承置led燈單體 的通孔。 申明專利範圍第1項所述具有貼片式支架的LED燈板 結構，其中該接線端子的底部設置在同一平面。 10、一種具有貼片式支架的LED燈板製法，包括： 步驟一：將-LED晶片岐在-支架的其中—接線端子 上所設的凹槽中，並將LED晶片的正負極藉一引線分別 焊接在兩片接線端子上； 步驟二：在LED晶片的至少一面塗佈螢光粉，將步驟一 製作完成的帶有LED晶片的支架置在一專用模條上並 灌注透明膠以形成一透明罩，並製成一 LED燈單體； e 步驟三：將步驟二製作完成的led燈單體利用分光機進 行刀光，並將同一光波或同一顏色的LED燈單體集中放 置； ’、 步驟四：利用一 SMT自動插件機將步驟三分楝出的 燈單體分別置入一基板的複數個通孔中，及LED燈單體 的正負極接線端子焊接在基板上的線路的正負極 層上以形成一 LED燈板。 、’ 16200941753 X. Patent application scope: 1. A LED lamp panel structure with a patch bracket, comprising: a plurality of LED lamp cells 'each cell comprises a bracket, which is composed of two metal plates which are not electrically connected to each other. Forming positive and negative terminals, wherein one of the terminals is provided with a recess on at least one side, and a Led wafer is disposed in the recess, and the positive and negative poles of the led wafer are electrically connected by the lead and the two terminals, respectively, and the outer side of the LED chip is disposed. a transparent cover; ❹ a substrate, wherein at least one of the plate faces is provided with a plurality of through holes, each of the through holes is received in each of the LED lamps, and the positive and negative terminals of each of the LED lamps are soldered to the substrate On the positive and negative metal layers of the circuit on the board. 2. The patch (4) LED lamp panel structure as described in claim 3, wherein the recess is provided in one of the slots of the terminal, and the LED chip is disposed in the recess. 3. The LED lamp board structure with a patch bracket according to the invention of claim i, wherein the recess is a double recessed hole provided on both sides of the terminal and penetrating through the same, and the LED chip is disposed in the recessed hole Mid section. 1 = (10) A light board having a patch bracket according to the first aspect of the patent application, wherein a layer of phosphor powder is disposed between the LED chip and the transparent cover. The invention relates to a lamp board structure with a patch bracket according to Item 1, wherein the transparent cover is solid or hollow. The LED lamp panel having a patch bracket according to the above-mentioned item, wherein the metal plate has a positive terminal and a negative terminal 15 200941753, and the patch holder is described in the first item of the category I. The LED light panel, wherein one of the metal plates has a pair of positive terminal blocks, and the other metal plate has a pair of negative terminal blocks. & claiming the patent range of the i-th item with a patch-type bracket, and the board surface of the substrate is provided with a plurality of through holes for receiving the LED lamp unit. The invention relates to an LED lamp panel structure with a patch bracket according to the first aspect of the patent, wherein the bottom of the terminal is disposed on the same plane. 10. A method for manufacturing an LED lamp panel with a patch bracket, comprising: Step 1:: immersing an LED chip in a recess provided in a terminal of the bracket, and borrowing a lead from the anode and the cathode of the LED chip Soldering on two terminals respectively; Step 2: Applying phosphor powder on at least one side of the LED chip, and placing the completed LED chip holder on a special mold strip and pouring the transparent glue to form a Transparent cover, and made into a single LED lamp unit; e Step 3: The LED lamp unit completed in step 2 is used to perform knife light by using a beam splitter, and the same light wave or the same color LED lamp unit is placed in a centralized manner; ', step four : Using an SMT automatic plug-in machine, the lamp units that are separated in the third step are respectively placed in a plurality of through holes of a substrate, and the positive and negative terminals of the LED lamp unit are soldered on the positive and negative layers of the circuit on the substrate. To form an LED light panel. ,’ 16
TW097109468A 2008-03-18 2008-03-18 LED light panel structure having a patch bracket TW200941753A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101834261A (en) * 2010-04-12 2010-09-15 深圳市灏天光电有限公司 Planar high-power LED bracket
TWI464342B (en) * 2012-06-06 2014-12-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101834261A (en) * 2010-04-12 2010-09-15 深圳市灏天光电有限公司 Planar high-power LED bracket
CN101834261B (en) * 2010-04-12 2014-02-12 深圳市灏天光电有限公司 Planar high-power LED bracket
TWI464342B (en) * 2012-06-06 2014-12-11

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