CN215869384U - Deep ultraviolet light emitting diode packaging structure - Google Patents

Deep ultraviolet light emitting diode packaging structure Download PDF

Info

Publication number
CN215869384U
CN215869384U CN202220102278.XU CN202220102278U CN215869384U CN 215869384 U CN215869384 U CN 215869384U CN 202220102278 U CN202220102278 U CN 202220102278U CN 215869384 U CN215869384 U CN 215869384U
Authority
CN
China
Prior art keywords
deep ultraviolet
emitting diode
conductive
ultraviolet light
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220102278.XU
Other languages
Chinese (zh)
Inventor
白润松
闫志超
黄小辉
李大超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhishan Times Intelligent Technology Beijing Co ltd
Zhixin Semiconductor Hangzhou Co Ltd
Original Assignee
Zhishan Times Intelligent Technology Beijing Co ltd
Zhixin Semiconductor Hangzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhishan Times Intelligent Technology Beijing Co ltd, Zhixin Semiconductor Hangzhou Co Ltd filed Critical Zhishan Times Intelligent Technology Beijing Co ltd
Priority to CN202220102278.XU priority Critical patent/CN215869384U/en
Application granted granted Critical
Publication of CN215869384U publication Critical patent/CN215869384U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses a deep ultraviolet light-emitting diode packaging structure, which relates to the technical field of semiconductor packaging and comprises a shell and a lens; the lens is fixedly connected with the shell to form a cavity, a blue light lamp and a plurality of deep ultraviolet lamps are arranged in the cavity, and the blue light lamp and the deep ultraviolet lamps are electrically connected with a power supply. The deep ultraviolet light emitting diode packaging structure provided by the utility model can be used for observing the irradiation position of a deep ultraviolet lamp.

Description

Deep ultraviolet light emitting diode packaging structure
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a deep ultraviolet light emitting diode packaging structure.
Background
The deep ultraviolet light-emitting diode has the advantages of high reliability, long service life, quick response, low power consumption, environmental protection, no pollution, small size and the like, is widely applied to the field of surface sterilization, is invisible, can not recognize deep ultraviolet light by naked eyes, can not accurately align the deep ultraviolet sterilization module to the sterilization position in the sterilization process, and leads to incomplete sterilization and poor sterilization effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a deep ultraviolet light emitting diode packaging structure, which is used for solving the problems in the prior art and can observe the irradiation position of a deep ultraviolet lamp.
In order to achieve the purpose, the utility model provides the following scheme:
the utility model provides a deep ultraviolet light-emitting diode packaging structure, which comprises a shell and a lens, wherein the shell is provided with a light-emitting diode chip; the lens is fixedly connected with the shell to form a cavity, a blue light lamp and a plurality of deep ultraviolet lamps are arranged in the cavity, and the blue light lamp and the deep ultraviolet lamps are electrically connected with a power supply.
Preferably, the housing includes a substrate and a surrounding plate, one end of the surrounding plate is fixedly connected to the substrate, the other end of the surrounding plate is fixedly connected to the lens, and the lens, the surrounding plate and the substrate form the chamber.
Preferably, a clamping groove is formed in one end, far away from the base plate, of the enclosing plate, and the lens can be clamped in the clamping groove.
Preferably, the substrate is made of ceramic.
Preferably, the deep ultraviolet lamp further comprises a plurality of conductive modules which are fixedly arranged in the chamber and are not in contact with each other, each deep ultraviolet lamp is a deep ultraviolet light-emitting diode, two adjacent deep ultraviolet light-emitting diodes are electrically connected through one conductive module, the blue light lamp is a blue light diode, the positive and negative pins of the blue light diode are electrically connected with one conductive module respectively, and the conductive modules can be electrically connected with a power supply.
Preferably, one side of the substrate, which is far away from the lens, is fixedly provided with four non-contact conductive pads, and the positive conductive module and the negative conductive module in the deep ultraviolet lamp circuit and the positive conductive module and the negative conductive module in the blue light circuit are respectively electrically connected with one of the conductive pads.
Preferably, four through holes are formed in the substrate, a conductive element is fixedly arranged in each through hole, the positive conductive module and the negative conductive module in the deep ultraviolet lamp circuit and the positive conductive module and the negative conductive module in the blue light lamp circuit are respectively abutted against one end of one conductive element, and the other end of each conductive element is respectively abutted against one conductive pad.
Preferably, the conductive element is an electroplated copper pillar.
Preferably, two heat dissipation pads are fixedly arranged on one side of the substrate away from the lens, and the heat dissipation pads and the conductive pads are not in contact with each other.
Compared with the prior art, the utility model has the following technical effects:
according to the deep ultraviolet light emitting diode packaging structure provided by the utility model, the blue light lamp is arranged in the cavity, when the deep ultraviolet lamp is used for disinfection, the blue light lamp can irradiate visible light, and the blue light irradiation position is the deep ultraviolet lamp irradiation position. The deep ultraviolet light emitting diode packaging structure provided by the utility model can be used for observing the irradiation position of a deep ultraviolet lamp.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic view of a substrate according to the present invention;
FIG. 2 is a schematic view of a substrate according to the present invention;
fig. 3 is a cross-sectional view of a deep ultraviolet light emitting diode package structure provided by the present invention;
in the figure: 100-deep ultraviolet light emitting diode packaging structure; 1-a shell; 11-a substrate; 12-enclosing plates; 121-a clamping groove; 2-a lens; 3-deep ultraviolet light emitting diode; 4-a blue light diode; 5-a conductive module; 6-conductive pads; 7-heat dissipation pads; 8-electroplating copper columns.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model aims to provide a deep ultraviolet light emitting diode packaging structure, which is used for solving the problems in the prior art and can observe the irradiation position of a deep ultraviolet lamp.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The present invention provides a deep ultraviolet led package structure 100, as shown in fig. 1, including a housing 1 and a lens 2; the lens 2 is fixedly connected with the shell 1 and forms a cavity, a blue light lamp and a plurality of deep ultraviolet lamps are arranged in the cavity, and the blue light lamp and the deep ultraviolet lamps are electrically connected with a power supply.
Through setting up the blue light lamp in the cavity, when using dark ultraviolet lamp to disinfect, the blue light lamp can shine out the visible light, and the position is shone for dark ultraviolet lamp promptly to the blue light, consequently can observe the position of shining of dark ultraviolet lamp.
The shell 1 comprises a substrate 11 and a surrounding plate 12, one end of the surrounding plate 12 is bonded with the substrate 11 through a bonding agent, the other end of the surrounding plate 12 is bonded with the lens 2 through the bonding agent, and the lens 2, the surrounding plate 12 and the substrate 11 form a closed chamber.
The one end that base plate 11 was kept away from to bounding wall 12 has seted up joint groove 121, and lens 2 can joint in joint groove 121, and lens 2 can bond with joint groove 121 through the binder, further improves lens 2's fixed effect, and sapphire and quartzy material can be chooseed for use to lens 2, can guarantee the stability of deep ultraviolet emitting diode 3 long-time back light-emitting.
The substrate 11 is made of ceramic material, so that the use cost is low, and the insulation and heat dissipation effects are good.
The deep ultraviolet light emitting diode packaging structure 100 provided by the utility model also comprises a plurality of conducting modules 5 which are fixedly arranged in the cavity and are not in contact with each other, each deep ultraviolet lamp is a deep ultraviolet light emitting diode 3, two adjacent deep ultraviolet light emitting diodes 3 are electrically connected through one conducting module 5, the deep ultraviolet light emitting diodes 3 and the conducting modules 5 are sequentially connected to form a ring shape and form a deep ultraviolet lamp parallel circuit, the conducting module used for being connected with the positive pole of a power supply in the deep ultraviolet lamp parallel circuit is the positive pole conducting module of the deep ultraviolet lamp circuit, the conducting module used for being connected with the negative pole of the power supply in the deep ultraviolet lamp parallel circuit is the negative pole conducting module of the deep ultraviolet lamp circuit, the blue light lamp is the blue light diode 4, the positive and negative pole pins of the blue light diode 4 are respectively electrically connected with one conducting module 5, the conducting module connected with the positive pole pin of the blue light diode 4 is the positive pole conducting module of the blue light circuit, the conductive module connected with the negative pin of the blue light diode 4 is a negative conductive module of a blue light circuit, the conductive module 5 can be electrically connected with a power supply, and the conductive module 5 enables the circuit to be communicated and enables each deep ultraviolet lamp and each blue light lamp to normally work.
One side of the substrate 11, which is far away from the lens 2, is fixedly provided with four mutually non-contact conductive bonding pads 6, the conductive bonding pads 6 are formed through an electro-coppering process, and a positive conductive module and a negative conductive module in a deep ultraviolet lamp circuit and a positive conductive module and a negative conductive module in a blue light lamp circuit are respectively and electrically connected with one conductive bonding pad 6, and the arrival bonding pads are used for being electrically connected with an external circuit.
Four through holes are formed in the substrate 11, a conductive element is fixedly arranged in each through hole, the positive conductive module and the negative conductive module in the deep ultraviolet lamp circuit and the positive conductive module and the negative conductive module in the blue light lamp circuit are respectively abutted against one end of one conductive element, the other end of each conductive element is respectively abutted against one conductive bonding pad 6, and the conduction is carried out through the conductive elements.
The conductive elements are plated copper posts 8.
Two radiating pads 7 for radiating heat are fixedly arranged on one side of the substrate 11 away from the lens 2, and each radiating pad 7 is not in contact with each conductive pad 6.
The principle and the implementation mode of the utility model are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the utility model; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the utility model.

Claims (9)

1. A deep ultraviolet LED packaging structure is characterized in that: the method comprises the following steps:
a housing;
and the lens is fixedly connected with the shell to form a cavity, a blue light lamp and a plurality of deep ultraviolet lamps are arranged in the cavity, and the blue light lamp and the deep ultraviolet lamps are electrically connected with a power supply.
2. The deep ultraviolet light emitting diode package structure of claim 1, wherein: the shell comprises a substrate and a surrounding plate, one end of the surrounding plate is fixedly connected with the substrate, the other end of the surrounding plate is fixedly connected with the lens, and the lens, the surrounding plate and the substrate form the cavity.
3. The deep ultraviolet light emitting diode package structure of claim 2, wherein: a clamping groove is formed in one end, far away from the base plate, of the enclosing plate, and the lens can be clamped in the clamping groove.
4. The deep ultraviolet light emitting diode package structure of claim 2, wherein: the substrate is made of ceramic materials.
5. The deep ultraviolet light emitting diode package structure of claim 4, wherein: the deep ultraviolet lamps are deep ultraviolet light-emitting diodes, two adjacent deep ultraviolet light-emitting diodes are electrically connected through one conductive module, the blue light lamps are blue light diodes, positive and negative pins of the blue light diodes are electrically connected with one conductive module respectively, and the conductive modules can be electrically connected with a power supply.
6. The deep ultraviolet light emitting diode package structure of claim 5, wherein: one side of the substrate, which is far away from the lens, is fixedly provided with four mutually non-contact conductive pads, and the positive conductive module and the negative conductive module in the deep ultraviolet lamp circuit and the positive conductive module and the negative conductive module in the blue light circuit are respectively and electrically connected with one conductive pad.
7. The deep ultraviolet light emitting diode package structure of claim 6, wherein: four through holes are formed in the substrate, a conductive element is fixedly arranged in each through hole, a positive conductive module and a negative conductive module in the deep ultraviolet lamp circuit and a positive conductive module and a negative conductive module of the blue light lamp circuit are respectively abutted against one end of one conductive element, and the other end of each conductive element is respectively abutted against one conductive bonding pad.
8. The deep ultraviolet light emitting diode package structure of claim 7, wherein: the conductive element is an electroplated copper pillar.
9. The deep ultraviolet light emitting diode package structure of claim 6, wherein: two radiating pads are fixedly arranged on one side, far away from the lens, of the substrate, and the radiating pads are not in contact with the conducting pads.
CN202220102278.XU 2022-01-17 2022-01-17 Deep ultraviolet light emitting diode packaging structure Active CN215869384U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220102278.XU CN215869384U (en) 2022-01-17 2022-01-17 Deep ultraviolet light emitting diode packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220102278.XU CN215869384U (en) 2022-01-17 2022-01-17 Deep ultraviolet light emitting diode packaging structure

Publications (1)

Publication Number Publication Date
CN215869384U true CN215869384U (en) 2022-02-18

Family

ID=80263404

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220102278.XU Active CN215869384U (en) 2022-01-17 2022-01-17 Deep ultraviolet light emitting diode packaging structure

Country Status (1)

Country Link
CN (1) CN215869384U (en)

Similar Documents

Publication Publication Date Title
CN101187458A (en) LED lamp plate structure with patch type bracket and its production process
EP3182471B1 (en) Light source module
US20080266869A1 (en) LED module
JP2011146709A (en) Light-emitting device and illumination system
CN104517947A (en) Light emitting diode assembly and manufacturing method thereof
TWM498387U (en) Light emitting diode module package structure having thermal-electric separated function and electrical connection module
CN111162070A (en) Deep ultraviolet LED device and preparation method thereof
CN201129679Y (en) LED lamp panel structure with patch type bracket
CN103078049A (en) COB (Chip On Board) packaged LED (Light Emitting Diode) light source and manufacturing method
JP2012191175A (en) Led module, manufacturing method of the led module, and led channel letter including the led module
CN215869384U (en) Deep ultraviolet light emitting diode packaging structure
CN215451410U (en) Deep ultraviolet light emitting diode packaging structure
KR101448165B1 (en) COM or COB type LED module with individual metal bonding circuit pattern and array to compose series-parallel connection structure
CN215815932U (en) Deep ultraviolet packaging device
CN203179952U (en) COB packaging LED light source
CN202473912U (en) LED array light source without circuit substrate
KR100742225B1 (en) A high brightness light emitting diode and its method of making
CN202678310U (en) A large-power LED integrated array lighting source based on COB technology
CN208566229U (en) A kind of LED light source module
CN208794073U (en) LED filament and lamps and lanterns
KR101278835B1 (en) Led pcb substrate, pcb, led unit, lighting and its manufacture
TW201316569A (en) LED lightbar and method for manufacturing the same
KR20120014420A (en) Light emitting device package and method for manufacutring body of light emitting device pacakge
EP3410501B1 (en) Light-emitting diode module and light apparatus
JP2011114342A (en) Light emitting element package

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant