CN215771202U

CN215771202U - Deep ultraviolet packaging device

Info

Publication number: CN215771202U
Application number: CN202123317013.6U
Authority: CN
Inventors: 劳佳俊; 闫志超; 黄小辉; 李大超
Original assignee: Zhishan Times Intelligent Technology Beijing Co ltd; Zhixin Semiconductor Hangzhou Co Ltd
Current assignee: Zhishan Times Intelligent Technology Beijing Co ltd; Zhixin Semiconductor Hangzhou Co Ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-02-08
Anticipated expiration: 2031-12-28

Abstract

The utility model discloses a deep ultraviolet packaging device, which relates to the technical field of semiconductor packaging and comprises a substrate, a light emitting diode, a front bonding pad, a front circuit layer, a back circuit layer and a plurality of connecting elements, wherein the front bonding pad and the front circuit layer are fixed on the upper end surface of the substrate, the back circuit layer is fixed on the lower end surface of the substrate, the front bonding pad and the back circuit layer are conducted through the connecting elements, the light emitting diode is arranged on the front circuit layer, a first mounting hole is arranged on the front bonding pad, a second mounting hole communicated with the first mounting hole is arranged on the substrate, the second mounting hole penetrates through the substrate in the thickness direction of the substrate, and PIN needles are arranged in the first mounting hole and the second mounting hole in a penetrating manner and used for electrifying. The deep ultraviolet packaging device can be simply and quickly replaced and maintained, and the utilization efficiency of the sterilization and disinfection equipment is improved.

Description

Deep ultraviolet packaging device

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a deep ultraviolet packaging device.

Background

The deep ultraviolet light emitting diode (UVC LED) has the advantages of high reliability, long service life, fast reaction, low power consumption, environmental protection, no pollution, small size and the like, and is widely applied to the fields of water sterilization, air sterilization, surface sterilization and the like.

At present, sterilization and disinfection equipment used by a consumer application end is generally used for welding a bonding pad on the back of a single UVC chip device and integrally welding a plurality of UVC packaging devices on a circuit board. When a single deep ultraviolet device is maintained, professional skills and tools are needed, great inconvenience is caused to a consumer application end, professional maintenance cannot be performed rapidly under the condition that maintenance quality is guaranteed, and the purpose of sterilization and disinfection cannot be achieved by disinfection and sterilization equipment.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a deep ultraviolet packaging device, which solves the problems in the prior art, can realize simple and quick replacement and maintenance and improves the utilization efficiency of sterilization and disinfection equipment.

In order to achieve the purpose, the utility model provides the following scheme:

the utility model provides a deep ultraviolet packaging device, which comprises a substrate, a light emitting diode, a front bonding pad, a front circuit layer, a back circuit layer and a plurality of connecting elements, the front surface bonding pad and the front surface circuit layer are fixed on the upper end surface of the substrate, the back surface circuit layer is fixed on the lower end surface of the substrate, and the front surface bonding pad and the back surface circuit layer as well as the back surface circuit layer and the front surface circuit layer are conducted through the connecting elements, the light emitting diode is arranged on the front surface circuit layer, the front surface bonding pad is provided with a first mounting hole, the substrate is provided with a second mounting hole communicated with the first mounting hole, and the second mounting hole penetrates through the substrate in the thickness direction of the substrate, PIN PINs penetrate through the first mounting hole and the second mounting hole, and the PIN PINs are used for electrifying.

Preferably, the number of the front bonding pads is four, the front bonding pads are respectively fixed at four corners close to the upper end face of the substrate, the connecting element mounted in the second mounting hole is a metal ring, the upper end of the metal ring is fixed with the front bonding pad, the metal ring is hollow and communicated with the first mounting hole, and the lower end of the metal ring is fixed with the back circuit layer.

Preferably, the front circuit board is located in an area surrounded by the four front pads, the substrate is further provided with a communication hole, the communication hole penetrates through the substrate in the thickness direction of the substrate, the connection element mounted in the communication hole is a metal column, the upper end of the metal column is fixedly connected with the front circuit layer, and the lower end of the metal column is fixedly connected with the back circuit layer.

Preferably, a dam is further fixed to the upper end of the substrate, the dam is annular, the front circuit layer and the light emitting diodes are located in an area surrounded by the dam, and a lens is fixed to the upper end of the dam and used for refracting light emitted by the light emitting diodes.

Preferably, an annular step is arranged at the upper end of the dam, the upper end of the outer side wall of the dam is higher than the upper end of the inner side wall of the dam, and the upper end of the annular step is used for bearing and fixing the outer edge of the lower end face of the lens.

Preferably, the heat dissipation device further comprises a heat dissipation disc, the heat dissipation disc is fixed on the lower end face of the substrate, and the thickness of the heat dissipation disc is larger than that of the back circuit layer.

Preferably, the LED module further comprises a protection diode, wherein the protection diode is fixed on the front surface circuit layer and is connected with the LED in parallel.

Preferably, the substrate is a ceramic substrate.

Compared with the prior art, the utility model has the following technical effects:

according to the deep ultraviolet packaging device, the front bonding pad is fixed on the upper end face of the substrate, the bonding pad is transferred from the back face to the front face, maintenance and operation are facilitated, the first mounting hole is formed in the front bonding pad, the second mounting hole communicated with the first mounting hole is formed in the substrate, the second mounting hole penetrates through the substrate in the thickness direction of the substrate, PIN needles are arranged in the first mounting hole and the second mounting hole in a penetrating mode and used for electrifying, and therefore the purpose of electrifying and conducting the deep ultraviolet packaging device is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is an angular structural schematic diagram of a deep ultraviolet packaged device provided by the present invention;

fig. 2 is a schematic structural diagram of another angle of the deep ultraviolet packaged device provided by the present invention;

FIG. 3 is a schematic cross-sectional view of a deep ultraviolet packaged device provided by the present invention;

in the figure: 100-a deep ultraviolet packaging device, 1-a substrate, 2-a box dam, 3-a light-emitting diode, 4-a protective diode, 5-a front surface bonding pad, 6-a first mounting hole, 7-an annular step, 8-a lens, 9-a front surface circuit layer, 10-a heat dissipation disc, 11-a back surface circuit layer, 12-a metal ring and 13-a metal column.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model aims to provide a deep ultraviolet packaging device, which aims to solve the technical problem that the existing deep ultraviolet packaging device is inconvenient to maintain.

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

As shown in fig. 1 to 3, the present invention provides a deep ultraviolet package device 100, which includes a substrate 1, a light emitting diode 3, a front pad 5, a front circuit layer 9, a back circuit layer 11, and a plurality of connecting elements, wherein the front pad 5 and the front circuit layer 9 are fixed on an upper end surface of the substrate 1, the pads are transferred from the back surface to the front surface, which is convenient for maintenance and operation, the back circuit layer 11 is fixed on a lower end surface of the substrate 1, and the front pad 5 and the back circuit layer 11, and the back circuit layer 11 and the front circuit layer 9 are conducted through the connecting elements, the light emitting diode 3 is mounted on the front circuit layer 9, the front pad 5 is provided with a first mounting hole 6, the substrate 1 is provided with a second mounting hole communicated with the first mounting hole 6, and the second mounting hole penetrates through the substrate 1 in a thickness direction of the substrate 1, the second mounting hole is formed by laser drilling on the substrate 1, wear to be equipped with the PIN needle in first mounting hole 6 and the second mounting hole, the PIN needle is used for switching on the circuit with the interconnection of PCB circuit board, and then reach the purpose of switching on and add power to dark ultraviolet packaging device 100, for current through the integrated design that realizes switching on of electricity on welding the circuit board, when handling single dark ultraviolet device, can realize the simplification of operation, installation, maintenance, and need not high temperature welding, greatly reduced the installation maintenance degree of difficulty, and then improve work efficiency.

Specifically, the number of the front pads 5 is four, the front pads are fixed near four corners of the upper end surface of the substrate 1, the connecting elements mounted in the second mounting holes are metal rings 12, the upper ends of the metal rings 12 are fixed to the front pads 5, the metal rings 12 are hollow and communicated with the first mounting holes 6, the lower ends of the metal rings 12 are fixed to the back circuit layer 11, and the metal rings 12 are used for penetrating PIN PINs to achieve power-on. Preferably, the front side pads 5 are formed for direct circuit copper metal on the substrate 1.

The front circuit board is located in an area surrounded by the four front pads 5, the substrate 1 is further provided with a communication hole, the communication hole is formed by laser drilling on the substrate 1, the communication hole penetrates through the substrate 1 in the thickness direction of the substrate 1, a connecting element installed in the communication hole is a metal column 13, the metal column 13 is electroplated copper metal and is filled in the communication hole to form, the upper end of the metal column 13 is fixedly connected with the front circuit layer 9, the lower end of the metal column 13 is fixedly connected with the back circuit layer 11 to achieve conduction of a circuit, preferably, the back circuit layer 11 is four long-strip-shaped circuit layers, and two ends of each long-strip-shaped circuit layer are respectively connected and conducted with the metal ring 12 and the metal column 13.

Base plate 1's upper end still is fixed with box dam 2, and box dam 2 is the annular, and just positive circuit layer 9 and emitting diode 3 all are located the region that box dam 2 encloses, and box dam 2 upper end is fixed with lens 8, and lens 8 bonds in box dam 2 upper end through the adhesive, and lens 8 are used for the light refraction that sends emitting diode 3, improves light-emitting efficiency, and box dam 2 is made for the copper electroplating metal.

The upper end of box dam 2 is equipped with annular step 7, and the lateral wall upper end of box dam 2 is higher than the inside wall upper end of box dam 2, and annular step 7 sets up on the inner wall of box dam 2 promptly, and the outer fringe of terminal surface under the upper end of annular step 7 is used for accepting and fixing lens 8, and then makes and forms a sealed cavity between box dam 2, base plate 1 and the lens 8 for install emitting diode 3.

The deep ultraviolet packaging device 100 provided by the utility model further comprises a heat dissipation disc 10, the heat dissipation disc 10 is fixed on the lower end face of the substrate 1, the thickness of the heat dissipation disc 10 is larger than that of the back circuit layer 11, when the heat dissipation disc 10 is in contact with the heat dissipation fins, the back circuit layer 11 and the heat dissipation fins are insulated at a certain interval, the heat dissipation disc 10 is arranged to avoid the back circuit layer 11, and a gap is formed between the heat dissipation disc 10 and the back circuit layer 11.

The deep ultraviolet packaging device 100 further comprises a protection diode 4, wherein the protection diode 4 is fixed on the front surface circuit layer 9 and is positioned on one side of the light emitting diode 3, and the protection diode 4 is connected with the light emitting diode 3 in parallel.

The substrate 1 is a ceramic substrate.

The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In summary, this summary should not be construed to limit the present invention.

Claims

1. A deep ultraviolet packaged device, comprising: including base plate, emitting diode, front pad, front line layer, back line layer and a plurality of connecting element, front pad with front line layer all is fixed in the up end of base plate, back line layer is fixed in the lower terminal surface of base plate, just front pad with between the back line layer and back line layer with all pass through between the front line layer connecting element switches on, emitting diode install in on the front line layer, be equipped with first mounting hole on the front pad, be equipped with on the base plate with the second mounting hole of first mounting hole intercommunication, just the second mounting hole is in link up in the thickness direction of base plate the base plate, first mounting hole with wear to be equipped with the PIN needle in the second mounting hole, the PIN needle is used for the circular telegram.

2. The deep ultraviolet packaged device of claim 1, wherein: the front bonding pads are four and are respectively fixed near four corners of the upper end face of the substrate, the connecting elements mounted in the second mounting holes are metal rings, the upper ends of the metal rings are fixed with the front bonding pads, the metal rings are hollow and communicated with the first mounting holes, and the lower ends of the metal rings are fixed with the back circuit layer.

3. The deep ultraviolet packaged device of claim 2, wherein: the front circuit board is positioned in an area surrounded by the four front bonding pads, the substrate is further provided with communicating holes, the communicating holes penetrate through the substrate in the thickness direction of the substrate, the connecting elements arranged in the communicating holes are metal columns, the upper ends of the metal columns are fixedly connected with the front circuit layer, and the lower ends of the metal columns are fixedly connected with the back circuit layer.

4. The deep ultraviolet packaged device of claim 2, wherein: the LED packaging structure is characterized in that a surrounding dam is further fixed to the upper end of the substrate, the surrounding dam is annular, the front circuit layer and the LEDs are located in an area surrounded by the surrounding dam, a lens is fixed to the upper end of the surrounding dam, and the lens is used for refracting light rays emitted by the LEDs.

5. The deep ultraviolet packaged device of claim 4, wherein: the upper end of box dam is equipped with annular step, just the lateral wall upper end of box dam is higher than the inside wall upper end of box dam, the upper end of annular step is used for accepting and fixing the outward flange of terminal surface under the lens.

6. The deep ultraviolet packaged device of claim 1, wherein: the heat dissipation plate is fixed to the lower end face of the substrate, and the thickness of the heat dissipation plate is larger than that of the back face circuit layer.

7. The deep ultraviolet packaged device of claim 1, wherein: the LED module further comprises a protection diode, wherein the protection diode is fixed on the front surface circuit layer and is connected with the light emitting diode in parallel.

8. The deep ultraviolet packaged device of claim 1, wherein: the substrate is a ceramic substrate.