CN215869450U - Deep ultraviolet ray and LED white light integrated packaging device - Google Patents
Deep ultraviolet ray and LED white light integrated packaging device Download PDFInfo
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- CN215869450U CN215869450U CN202220051602.XU CN202220051602U CN215869450U CN 215869450 U CN215869450 U CN 215869450U CN 202220051602 U CN202220051602 U CN 202220051602U CN 215869450 U CN215869450 U CN 215869450U
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Abstract
The utility model discloses a deep ultraviolet light and LED white light integrated packaging device, which relates to the technical field of semiconductor packaging and comprises a substrate, wherein a dam is arranged on the substrate, a circuit layer is arranged on the front surface of the substrate and comprises a first circuit layer and a second circuit layer, a blue light LED chip is connected to the first circuit layer, an ultraviolet LED chip is connected to the second circuit layer, the dam comprises a first dam and a second dam, the height of the first dam is smaller than that of the second dam, the first circuit layer and the blue light LED chip are both positioned in the inner cavity of the first dam, the second circuit layer and the ultraviolet LED chip are both positioned in the inner cavity of the second dam, a fluorescent colloid is arranged in the inner cavity of the first dam, and the blue light emitted by the blue light LED chip can excite the fluorescent colloid to form white light. The utility model realizes the integration of the LED white light device into the deep ultraviolet light emitting diode chip and can ensure the long-term performance of the LED white light fluorescent colloid.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a deep ultraviolet light and LED white light integrated packaging device.
Background
The deep ultraviolet light emitting diode (UVC LED) has the advantages of high reliability, long service life, fast reaction, low power consumption, environmental protection, no pollution, small size and the like, and is widely applied to the fields of water sterilization, air sterilization, surface sterilization and the like. It is worth noting that the currently commonly used LED white light device only has a single white light color and can only achieve the purpose of illumination, and due to the irradiation of the light of the deep ultraviolet rays to the fluorescent colloid in the LED white light device, the fluorescent colloid generates abnormal performance problems such as colloid yellowing and colloid embrittlement, which causes the performance degradation of the LED white light device. Therefore, how to integrate deep ultraviolet light and LED white light to enable the packaging device to have the functions of illumination and sterilization and ensure the long-term performance of the LED white light fluorescent colloid is a problem to be solved at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a deep ultraviolet light and LED white light integrated packaging device, which is used for solving the problems in the prior art, realizing integration of an LED white light device into a deep ultraviolet light emitting diode chip and ensuring the long-term performance of an LED white light fluorescent colloid.
In order to achieve the purpose, the utility model provides the following scheme:
the utility model provides a deep ultraviolet light and LED white light integrated packaging device, which comprises a substrate, the base plate is provided with a box dam, the front surface of the base plate is provided with a circuit layer, the circuit layer comprises a first circuit layer and a second circuit layer, the first circuit layer is connected with a blue light emitting diode chip, the second circuit layer is connected with an ultraviolet light emitting diode chip, the dams include a first dam and a second dam, the height of the first dam is less than the height of the second dam, the first circuit layer and the blue light LED chip are both positioned in the inner cavity of the first box dam, the second circuit layer and the ultraviolet light emitting diode chip are both positioned in the inner cavity of the second box dam, fluorescent colloid is arranged in the inner cavity of the first box dam, the blue light emitted by the blue light emitting diode chip can excite the fluorescent colloid to form white light.
Preferably, the base plate back is equipped with the circuit pad, the circuit pad includes first positive pole pad, first negative pole pad, second positive pole pad and the second negative pole pad that insulate from each other, be equipped with in the base plate with first circuit layer both ends respectively with first positive pole pad with the first metal post that negative pole pad is connected, and will second circuit layer both ends respectively with second positive pole pad with the second metal post that second negative pole pad is connected.
Preferably, a heat dissipation pad is disposed on the back surface of the substrate, and the heat dissipation pad is insulated from the first positive pad, the first negative pad, the second positive pad and the second negative pad.
Preferably, the first and second weirs share a side wall of the second weir.
Preferably, the circuit layer, the circuit pad and the heat dissipation pad are all electroplated copper layers, and the plating thickness of the circuit pad and the heat dissipation pad is greater than that of the circuit layer.
Preferably, a step is arranged at the top of the second box dam, a lens is hermetically bonded on the step through an adhesive, and the lens is used for closing the inner cavity of the second box dam.
Preferably, the fluorescent colloid is filled in the inner cavity of the first box dam.
Preferably, the first circuit layer comprises a first polar plate, a second polar plate and a heat conducting plate located between the first polar plate and the second polar plate, the first polar plate, the second polar plate and the heat conducting plate are insulated from each other, the blue light emitting diode chip is connected to the heat conducting plate, and the anode and the cathode of the blue light emitting diode chip are respectively connected with the first polar plate and the second polar plate in a welding manner through gold wires.
Preferably, the second circuit layer includes a third polar plate and a fourth polar plate insulated from each other, and the positive and negative electrodes of the ultraviolet light emitting diode chip are respectively connected to the third polar plate and the fourth polar plate by welding.
Preferably, the first dam and the second dam are both electroplated copper dams, and an insulation gap exists between the first dam and the first circuit layer and between the second dam and the second circuit layer.
Compared with the prior art, the utility model has the following technical effects:
the utility model provides a packaging device integrating deep ultraviolet light and LED white light, which realizes the purpose that the LED white light and the ultraviolet light emitting diode chip are on the same packaging device by arranging a first dam and a second dam, arranging a blue light emitting diode chip and a fluorescent colloid in the inner cavity of the first dam and arranging the ultraviolet light emitting diode chip in the inner cavity of the second dam.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic perspective view of a deep ultraviolet light and LED white light integrated package device provided by the present invention;
fig. 2 is a schematic view of another perspective structure of the deep ultraviolet light and LED white light integrated package device provided by the present invention;
FIG. 3 is a schematic cross-sectional view of an LED white light part of the deep ultraviolet light and LED white light integrated package device provided by the present invention;
FIG. 4 is a schematic cross-sectional view of a deep ultraviolet light part of a deep ultraviolet light integrated package device of the utility model;
in the figure: 100-a deep ultraviolet light and LED white light integrated packaging device, 1-a substrate, 2-a dam, 3-a first circuit layer, 4-a second circuit layer, 5-a blue light LED chip, 6-an ultraviolet LED chip, 7-a first dam, 8-a second dam, 9-a fluorescent colloid, 10-a circuit pad, 11-a first anode pad, 12-a first cathode pad, 13-second positive electrode pad, 14-second negative electrode pad, 15-first metal column, 16-second metal column, 17-heat dissipation pad, 18-step, 19-lens, 20-first polar plate, 21-second polar plate, 22-heat conduction plate, 23-gold wire, 24-third polar plate and 25-fourth polar plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model aims to provide a deep ultraviolet light and LED white light integrated packaging device, which is used for solving the problems in the prior art, realizing the integration of a deep ultraviolet light emitting diode chip on the LED white light device and ensuring the long-term performance of LED white light fluorescent colloid.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1-4, the present embodiment provides a deep ultraviolet light and LED white light integrated package device 100, which includes a substrate 1, a dam 2 is disposed on the substrate 1, a circuit layer is disposed on the front surface of the substrate 1, the circuit layer includes a first circuit layer 3 and a second circuit layer 4, a blue light emitting diode chip 5 is connected to the first circuit layer 3, an ultraviolet light emitting diode chip 6 is connected to the second circuit layer 4, the dam 2 includes a first dam 7 and a second dam 8, the height of the first dam 7 is smaller than the height of the second dam 8, the first circuit layer 3 and the blue light emitting diode chip 5 are both located in the inner cavity of the first dam 7, the second circuit layer 4 and the ultraviolet light emitting diode chip 6 are both positioned in the inner cavity of the second dam 8, the inner cavity of the first dam 7 is provided with fluorescent colloid 9, the blue light emitted by the blue light emitting diode chip 5 can excite the fluorescent colloid 9 to form white light.
The substrate 1 may be a ceramic substrate, and by providing the first dam 7 and the second dam 8 on the substrate 1, the blue light-emitting diode chip 5 and the fluorescent colloid 9 are arranged in the inner cavity of the first dam 7, the fluorescent colloid 9 can be excited by the blue light emitted by the blue light-emitting diode chip 5 to form white light, the ultraviolet light-emitting diode chip 6 is arranged in the inner cavity of the second dam 8, can emit deep ultraviolet light, realizes the purpose that the LED white light and the ultraviolet light-emitting diode chip are on the same packaging device, realizes the structure of coexistence of white light and sterilization, because the height of the first dam 7 is smaller than that of the second dam 8, the light-emitting cup mouth where the ultraviolet light-emitting diode chip 6 is located is higher than that of the LED white light, the deep ultraviolet light cannot irradiate the LED white light fluorescent colloid 9, and the long-term performance of the LED white light fluorescent colloid 9 is guaranteed.
In this embodiment, a circuit pad 10 is disposed on the back surface of the substrate 1, the circuit pad 10 includes a first positive electrode pad 11, a first negative electrode pad 12, a second positive electrode pad 13, and a second negative electrode pad 14 that are insulated from each other, a first metal pillar 15 that connects two ends of the first circuit layer 3 with the first positive electrode pad 11 and the first negative electrode pad 12, respectively, and a second metal pillar 16 that connects two ends of the second circuit layer 4 with the second positive electrode pad 13 and the second negative electrode pad 14, respectively, are disposed in the substrate 1, wherein the first metal pillar 15 and the second metal pillar 16 are both formed by laser drilling on the substrate 1, and are formed by filling each through hole with electroplated metal copper, and the front surface circuit and the back surface circuit of the substrate 1 are conducted through the first metal pillar 15 and the second metal pillar 16, so as to facilitate wiring through the circuit pad 10 on the back surface.
In this embodiment, the heat dissipation pad 17 is disposed on the back surface of the substrate 1, the heat dissipation pad 17 is insulated from the first positive electrode pad 11, the first negative electrode pad 12, the second positive electrode pad 13, and the second negative electrode pad 14, and an insulating gap is disposed therebetween, so that the heat dissipation pad 17 dissipates heat to the entire device.
In this embodiment, the first box dam 7 and the second box dam 8 share one side wall of the second box dam 8, so that the space is saved, and the production cost is reduced.
In this embodiment, the circuit layer, the circuit pad 10 and the heat dissipation pad 17 are all electroplated copper layers, the plating thickness of the circuit pad 10 and the heat dissipation pad 17 is greater than that of the circuit layer, and the thermal capacity of the pad is increased by increasing the thickness, so that the whole device is convenient to dissipate heat.
In this embodiment, a step 18 is disposed on the top of the second dam 8, a lens 19 is hermetically bonded on the step 18 through an adhesive, the lens 19 is used to close the inner cavity of the second dam 8, a layer of adhesive is coated on the step 18, the lens 19 is placed on the adhesive, the lens 19 is uniformly applied with force, the adhesive is cured at a high temperature, and the lens 19 and the step 18 are combined and fixed together to form a sealed cavity for protecting the ultraviolet light emitting diode chip 6.
In this embodiment, the fluorescent colloid 9 is filled in the inner cavity of the first dam 7, the fluorescent colloid is sprayed in the cavity of the first dam 7 connected with the blue light emitting diode chip 5, the cavity of the first dam 7 is filled, the fluorescent colloid is cured by temperature control, a solid fluorescent colloid is formed in the cavity of the first dam 7 and around the blue light emitting diode chip 5, and the blue light emitted by the blue light emitting diode chip 5 excites the surrounding fluorescent colloid to form white light.
In this embodiment, the first circuit layer 3 includes a first polar plate 20, a second polar plate 21 and a heat conducting plate 22 located between the first polar plate 20 and the second polar plate 21, the first polar plate 20, the second polar plate 21 and the heat conducting plate 22 are insulated from each other, the blue light emitting diode chip 5 is connected to the heat conducting plate 22, and the positive and negative electrodes of the blue light emitting diode chip 5 are respectively connected to the first polar plate 20 and the second polar plate 21 by gold wires 23 in a welding manner. The anode and the cathode of the blue light emitting diode chip 5 can also be connected with the first polar plate 20 and the second polar plate 21 by welding through leads (silver, copper, aluminum or metal alloy, etc.) made of other materials, an insulation gap is arranged among the first polar plate 20, the second polar plate 21 and the heat conducting plate 22, a chip fixing glue is smeared at the central position of the heat conducting plate 22, the blue light emitting diode chip 5 is placed on the smeared chip fixing glue, the chip fixing glue is solidified through temperature control, so that the blue light emitting diode chip 5 is fixed on the heat conducting plate 22, the heat conducting plate 22 can transmit heat to the heat dissipation welding disc 17 more quickly, and the heat dissipation effect is improved.
In this embodiment, the second circuit layer 4 includes a third polar plate 24 and a fourth polar plate 25 that are insulated from each other, the positive and negative electrodes of the ultraviolet light emitting diode chip 6 are respectively connected to the third polar plate 24 and the fourth polar plate 25 by welding, and an insulation gap is provided between the third polar plate 24 and the fourth polar plate 25, so that the structure is simple and the manufacturing is convenient.
In this embodiment, the first box dam 7 and the second box dam 8 are electroplated copper box dams, an insulation gap exists between the first box dam 7 and the first circuit layer 3, an insulation gap exists between the second box dam 8 and the second circuit layer 4, a box dam three-dimensional cavity structure with a certain height is formed by electroplating copper metal layer by layer, the manufacturing is convenient, and the height of the box dam is easy to control.
The principle and the implementation mode of the utility model are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the utility model; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the utility model.
Claims (10)
1. The utility model provides a dark ultraviolet ray and LED white light integrated packaging hardware, includes the base plate, be equipped with box dam on the base plate, its characterized in that: the LED packaging structure is characterized in that a circuit layer is arranged on the front face of the substrate and comprises a first circuit layer and a second circuit layer, blue light LED chips are connected onto the first circuit layer, ultraviolet LED chips are connected onto the second circuit layer, the dam comprises a first dam and a second dam, the height of the first dam is smaller than that of the second dam, the first circuit layer and the blue light LED chips are located in an inner cavity of the first dam, the second circuit layer and the ultraviolet LED chips are located in an inner cavity of the second dam, fluorescent colloid is arranged in the inner cavity of the first dam, and the blue light emitted by the blue light LED chips can excite the fluorescent colloid to form white light.
2. The deep ultraviolet light and LED white light integrated packaging device of claim 1, wherein: the circuit pad is arranged on the back face of the substrate and comprises a first positive electrode pad, a first negative electrode pad, a second positive electrode pad and a second negative electrode pad which are insulated from each other, the first circuit layer and the second negative electrode pad are arranged on the substrate, the first circuit layer and the second circuit layer are arranged on the first positive electrode pad, the second circuit layer and the second negative electrode pad, the first circuit layer and the second circuit layer are arranged on the second positive electrode pad, the second circuit layer and the second circuit layer are arranged on the second negative electrode pad, and the first circuit layer and the second circuit layer are connected through the first positive electrode pad and the second negative electrode pad.
3. The deep ultraviolet light and LED white light integrated packaging device of claim 2, wherein: the back of the substrate is provided with a heat dissipation welding disc, and the heat dissipation welding disc is insulated from the first positive welding disc, the first negative welding disc, the second positive welding disc and the second negative welding disc.
4. The deep ultraviolet light and LED white light integrated packaging device of claim 1, wherein: the first box dam and the second box dam share one side wall of the second box dam.
5. A deep ultraviolet light and LED white light integrated package device as recited in claim 3, wherein: the circuit layer, the circuit bonding pad and the heat dissipation bonding pad are all electroplated copper layers, and the plating thickness of the circuit bonding pad and the heat dissipation bonding pad is larger than that of the circuit layer.
6. The deep ultraviolet light and LED white light integrated packaging device of claim 1, wherein: the top of the second box dam is provided with a step, the step is hermetically bonded with a lens through an adhesive, and the lens is used for sealing the inner cavity of the second box dam.
7. The deep ultraviolet light and LED white light integrated packaging device of claim 1, wherein: the fluorescent colloid is filled in the inner cavity of the first box dam.
8. The deep ultraviolet light and LED white light integrated packaging device of claim 1, wherein: the first circuit layer comprises a first polar plate, a second polar plate and a heat conducting plate positioned between the first polar plate and the second polar plate, the first polar plate, the second polar plate and the heat conducting plate are mutually insulated, the blue light LED chip is connected on the heat conducting plate, and the anode and the cathode of the blue light LED chip are respectively connected with the first polar plate and the second polar plate in a welding mode through gold wires.
9. The deep ultraviolet light and LED white light integrated packaging device of claim 1, wherein: the second circuit layer comprises a third polar plate and a fourth polar plate which are insulated from each other, and the positive electrode and the negative electrode of the ultraviolet light emitting diode chip are respectively connected with the third polar plate and the fourth polar plate in a welding mode.
10. The deep ultraviolet light and LED white light integrated packaging device of claim 1, wherein: the first box dam and the second box dam are both electroplated copper box dams, an insulation gap exists between the first box dam and the first circuit layer, and an insulation gap exists between the second box dam and the second circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220051602.XU CN215869450U (en) | 2022-01-11 | 2022-01-11 | Deep ultraviolet ray and LED white light integrated packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220051602.XU CN215869450U (en) | 2022-01-11 | 2022-01-11 | Deep ultraviolet ray and LED white light integrated packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215869450U true CN215869450U (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220051602.XU Active CN215869450U (en) | 2022-01-11 | 2022-01-11 | Deep ultraviolet ray and LED white light integrated packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215869450U (en) |
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2022
- 2022-01-11 CN CN202220051602.XU patent/CN215869450U/en active Active
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