CN101834261B

CN101834261B - Planar high-power LED bracket

Info

Publication number: CN101834261B
Application number: CN201010144718.XA
Authority: CN
Inventors: 卢志荣
Original assignee: Shenzhen Haotian Optoelectronics Co ltd
Current assignee: Xiamen Xinda Haotian Technology Co ltd
Priority date: 2010-04-12
Filing date: 2010-04-12
Publication date: 2014-02-12
Anticipated expiration: 2030-04-12
Also published as: CN101834261A

Abstract

The invention provides a planar high-power LED bracket which comprises an outer shell, a copper post, a positive pin and a negative pin. A positive pin wire and a negative pin wire of the bracket are designed in a thermoelectrical separation mode; the middle position of the bracket is provided with an anti-overflow rubber ring; a low copper post is adopted, namely, the copper post has a large transverse diameter and a small thickness; a die bonding concave cup has a double-groove structure; and the outer shell adopts a planar encapsulated structure. The planar high-power LED bracket has the advantages of high production efficiency, high light emitting angle uniformity, uniform light spot effect, no surrounding yellow circle phenomenon, easy control when matched with a secondary optical lens, capability of passing through a reflow soldering machine and difficulty in causing hazard light phenomenon in a use process.

Description

Planar high-power LED bracket

Technical field

The present invention relates to the fixing and mounting bracket of support, suspension or jockey, light source or the lamp bracket of lighting device, espespecially a kind of planar high-power LED bracket.

Background technology

High-powered LED lamp has good energy-saving and environmental protection effect, has been widely used in lighting field.High-power support on domestic market is all the support of imitative lumen form, and this support includes shell body, pin and copper pedestal three parts and forms, and pin and copper column base are connected, and existing heat conduction function, has again conducting function; There is a recessed cup of die bond at shell body middle part, be used for laying LED luminous tube (luminescent wafer), copper post and positive and negative pin are embedded in shell body, the copper sheet of described positive and negative pin front end is the solder joint position of support, pin stretches out from the recessed cup of die bond opening, and copper post (claiming again heat sink copper post) hot pressing is against on the recessed cup of die bond.Due to the inherent characteristic of imitative lumen support, cause great power LED when producing, production efficiency is low, cannot meet the growing demand to high-powered LED lamp; The high-powered LED lamp that adopts imitative lumen support to produce, conventionally be all with PC lens or with silica gel MOLDING encapsulated moulding (product height is 5.25mm-5.8mm), it is hemispherical that outward appearance is, cause that the consistency of rising angle is poor and hot spot effect is inhomogeneous, surrounding has yellow circle phenomenon, when supporting secondary optical lens, be also difficult to control, affect to a certain extent the application at lighting field; Imitative lumen support normally adopts PC lens or MOLDING silica gel packaging, PC lens cannot be crossed reflow machine, the production efficiency that restriction is applied to a certain extent, MOLDING silica gel packaging, because the characteristic of silica gel is soft, cause being in use easily squeezed bad anomalies such as causing dead lamp etc.

Summary of the invention

For the shortcoming of prior art, the object of the present invention is to provide that a kind of production efficiency is high, the consistency of rising angle better and hot spot effect evenly, surrounding encloses phenomenon, easily controls, can cross reflow machine when the supporting secondary optical lens, is in use difficult for causing the planar high-power LED bracket of dead lamp phenomenon without Huang.

The technical solution adopted for the present invention to solve the technical problems is: this support includes shell body, copper post and just, negative pin, copper post and just, negative pin is embedded in shell body, there is a recessed cup of die bond at shell body middle part, be used for laying LED luminous tube (luminescent wafer), just described, the solder joint position that the copper sheet of negative pin front end is support, pin stretches out from the recessed cup of die bond opening, copper post is pressed against on the recessed cup of die bond, it is characterized in that: described support just, negative lead-foot-line adopts thermoelectric separated design, be just, the terminal pin (two solder joints) of negative pin is separated with copper post, just have respectively, negative two two solder joints, can encapsulate bipolar electrode LED wafer and single electrode wafer.The limitation that solves the design of terminal pin thermoelectricity integral type is used the phenomenon of single electrode wafer; In the middle part of described support, there is an anti-overflow cushion rubber, excessive glue phenomenon when (being that the groove combination that 4.6mm degree of depth 0.1mm is 3.6mm degree of depth 0.3mm with a diameter becomes T-shaped anti-overflow cushion rubber by a diameter) adopts anti-overflow cushion rubber design to solve sealing, operability and production efficiency and the product appearance yield of raising product; Adopt the design of low copper post, i.e. wide the and thinner thickness in the horizontal footpath of copper post, can improve heat radiation and the heat conductivility of product like this; The recessed cup of die bond is that dual-slot structure (is on copper post by diameter, to be that the 2.4mm degree of depth be 0.15mm is that the 2.3mm degree of depth is that two groove combination of 0.3mm become recessed glass of T-shaped dual-cavity die bond with diameter,) can improve dusting efficiency and the uniformity of product, what make product once goes out light effect more excellent (hot spot is even), variegated without yellow circle, be better applied in various lighting fields; Shell body adopts plane formula encapsulating structure, and the thickness of shell body 1 is 1.8mm, makes product have better resistance to pressure and crosses high temperature Reflow Soldering.The generation of the abnormal problems such as dead lamp that solution high-powered LED lamp occurs in use.

The invention has the beneficial effects as follows: production efficiency is high, the consistency of rising angle better and hot spot effect even, surrounding is enclosed phenomenon without Huang, when supporting secondary optical lens, easily control, can cross reflow machine, in use be difficult for causing dead lamp phenomenon, and the excessive glue phenomenon when phenomenon of the limitation use single electrode wafer of solution terminal pin thermoelectricity integral type design, solution sealing, heat radiation and the heat conductivility of the operability of raising product and production efficiency and product appearance yield, raising product; , improve dusting efficiency and the uniformity of product, make the light effect more excellent (hot spot is even) that once goes out of product better be applied in various lighting fields; Adopt plane formula package design make product there is better resistance to pressure and cross high temperature Reflow Soldering.The generation of the abnormal problems such as dead lamp that solution high-powered LED lamp occurs in use.

[accompanying drawing explanation]

Below in conjunction with accompanying drawing, the invention will be further described.

Accompanying drawing is structural representation of the present invention.

In figure: 1 is that shell body, 2 is that the recessed cup of die bond, 3 is that copper post, 41,42 is that positive and negative pin, 41a, 42a are that solder joint, 5 is anti-overflow cushion rubber.

[embodiment]

Referring to accompanying drawing, the present invention includes shell body 1, copper post 3 and just,

negative pin

41, 42, copper post and just, negative pin is embedded in shell body, there is the recessed cup 2 of die bond the centre of shell body 1, in the recessed cup of die bond, there are two draw-in grooves to put LED luminous tube for card, it is characterized in that: just described,

negative pin

41, 42 is separated with copper post 3, just,

negative pin

41, 42 middle parts at outer housing are just having respectively, negative two two

solder joint

41a, 42a, and in the middle part of described shell body 1, there is an anti-overflow cushion rubber 5, the recessed cup 2 of the external diameter of anti-overflow cushion rubber lower end and die bond is suitable, the external diameter of upper end covers on the recessed cup 2 of die bond, seal, copper post 3 is thin body structure, the recessed cup 2 of described die bond is double recess, be by diameter, to be that the 2.4mm degree of depth be 0.15mm is that the 2.3mm degree of depth is that two groove combination of 0.3mm become the T-shaped recessed cup of dual-cavity die bond with diameter on copper post, shell 1 is plane formula encapsulating structure.

In most preferred embodiment of the present invention, described shell body 1 adopts the manufacture of PPA plastic cement.

On power-type LED.Backing thickness is quite thin, and corresponding LED can meet for to the very strict place of volume requirement.Support is provided with two independent solder joints, can make two electrodes separated with heat sink copper post.

LED support of the present invention is SMD metallo-plastic support, can be used for the power-type LED of power more than 0.5W.

In the most preferred embodiment of invention, the height of copper post 3 (1mm) is quite thin lower than imitative lumen structure (2.25-3.2mm) backing thickness, and accordingly LED can meet for to the very strict place of volume requirement.Support is provided with two independent solder joints, can make two electrodes separated with heat sink copper post (being " thermoelectricity is separated " often said), because there are two solder joints, just do not need wire bonding on heat sink, also just do not need the support of the recessed cup of large die bond, chip can be placed on die bond Ao Bei center, and the gold thread of welding is symmetrical, therefore less than the volume of the LED of single solder joint support, lighting angle good, efficiency is high, and easy to operate, appearance looks elegant; And due to the relation of thermoelectricity separation, make LED bottom after energising not charged, facilitate a plurality of LED to be applied to circuit combination is installed.

Claims

1. a planar high-power LED bracket, includes shell body (1), copper post (3) and just, negative pin (41, 42), copper post and just, negative pin is embedded in shell body, and there is the recessed cup of die bond (2) centre of shell body (1), in the recessed cup of die bond, has two draw-in grooves to put LED luminous tube for card, it is characterized in that: just described, negative pin (41, 42) separated with copper post (3), just, negative pin (41, 42) at the middle part of outer housing, just having respectively, negative two two solder joint (41a, 42a), and have an anti-overflow cushion rubber (5) in the middle part of described shell body (1), the recessed cup of the external diameter of anti-overflow cushion rubber lower end and die bond (2) is suitable, the external diameter on anti-overflow cushion rubber (5) top covers at the recessed cup of die bond (2) upper, and described anti-overflow cushion rubber is 4.6mm by a upper diameter, degree of depth 0.1mm becomes T font with the groove combination that one of bottom diameter is 3.6mm degree of depth 0.3mm, the recessed cup of die bond (2) is double recess, on copper post, by diameter, is that the 2.4mm degree of depth be 0.15mm is that the 2.3mm degree of depth is that two groove combination of 0.3mm become recessed glass of T-shaped dual-cavity die bond with diameter.

2. according to the planar high-power LED bracket of claim 1, it is characterized in that: the height of copper post (3) is 1mm.

3. according to the planar high-power LED bracket of claim 1 or 2, it is characterized in that: described shell body (1) adopts the manufacture of PPA plastic cement.