CN101834261A - Planar high-power LED bracket - Google Patents
Planar high-power LED bracket Download PDFInfo
- Publication number
- CN101834261A CN101834261A CN201010144718A CN201010144718A CN101834261A CN 101834261 A CN101834261 A CN 101834261A CN 201010144718 A CN201010144718 A CN 201010144718A CN 201010144718 A CN201010144718 A CN 201010144718A CN 101834261 A CN101834261 A CN 101834261A
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- copper post
- power led
- bracket
- shell body
- recessed cup
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention provides a planar high-power LED bracket which comprises an outer shell, a copper post, a positive pin and a negative pin. A positive pin wire and a negative pin wire of the bracket are designed in a thermoelectrical separation mode; the middle position of the bracket is provided with an anti-overflow rubber ring; a low copper post is adopted, namely, the copper post has a large transverse diameter and a small thickness; a die bonding concave cup has a double-groove structure; and the outer shell adopts a planar encapsulated structure. The planar high-power LED bracket has the advantages of high production efficiency, high light emitting angle uniformity, uniform light spot effect, no surrounding yellow circle phenomenon, easy control when matched with a secondary optical lens, capability of passing through a reflow soldering machine and difficulty in causing hazard light phenomenon in a use process.
Description
[technical field]
The present invention relates to the fixing and mounting bracket of support, suspension or jockey, light source or the lamp bracket of lighting device, refer to a kind of planar high-power LED bracket especially.
[background technology]
High-powered LED lamp has good energy-saving and environmental protection effect, has been widely used in lighting field.High-power support on the domestic market all is the support of imitative lumen form at present, and this support includes shell body, pin and copper pedestal three parts to be formed, and pin and copper column base fuse, and existing heat conduction function has conducting function again; There is a solid brilliant recessed cup at the shell body middle part, be used to lay LED luminous tube (luminescent wafer), copper post and positive and negative pin are embedded in the shell body, the copper sheet of described positive and negative pin front end is the solder joint position of support, pin stretches out from solid brilliant recessed cup opening, and copper post (claiming heat sink copper post again) hot pressing is against on the recessed cup of solid crystalline substance.Because the inherent characteristic of imitative lumen support causes great power LED when producing, production efficiency is low, can't satisfy the growing demand to high-powered LED lamp; The high-powered LED lamp that adopts imitative lumen support to produce, usually all be with the PC lens or with silica gel MOLDING encapsulated moulding (the product height is 5.25mm-5.8mm), it is hemispherical that outward appearance is, cause the consistency of rising angle relatively poor and the hot spot effect is inhomogeneous, yellow circle phenomenon is arranged all around, when supporting secondary optical lens, also be difficult to control, influence application to a certain extent at lighting field; Imitative lumen support normally adopts PC lens or the encapsulation of MOLDING silica gel, the PC lens can't be crossed reflow machine, restrict the production efficiency of using to a certain extent, the encapsulation of MOLDING silica gel, because the characteristic of silica gel is soft, causes in use being squeezed easily bad anomalies such as causing dead lamp or the like.
[summary of the invention]
At the shortcoming of prior art, the consistency that the object of the present invention is to provide a kind of production efficiency height, rising angle better and the hot spot effect does not have evenly, all around and yellowly encloses phenomenon, when supporting secondary optical lens, controls, can cross reflow machine easily, in use is difficult for causing the planar high-power LED bracket of dead lamp phenomenon.
The technical solution adopted for the present invention to solve the technical problems is: this support includes shell body, copper post and just, negative pin, copper post and just, negative pin is embedded in the shell body, there is a solid brilliant recessed cup at the shell body middle part, be used to lay LED luminous tube (luminescent wafer), just described, the copper sheet of negative pin front end is the solder joint position of support, pin stretches out from solid brilliant recessed cup opening, the copper post is pressed against on the recessed cup of solid crystalline substance, it is characterized in that: described support just, negative lead-foot-line adopts thermoelectric separate type design, just promptly be, the terminal pin (two solder joints) of negative pin separates with the copper post, just have respectively, negative two two solder joints can encapsulate bipolar electrode LED wafer and single electrode wafer.The limitation that solves the thermoelectric integral type design of terminal pin is used the phenomenon of single electrode wafer; An anti-overflow cushion rubber is arranged in the middle part of described support, (be 4.6mm degree of depth 0.1mm with a diameter by a diameter be the anti-overflow cushion rubber that the groove combination of 3.6mm degree of depth 0.3mm becomes the T type) excessive glue phenomenon when adopting the design of anti-overflow cushion rubber to solve sealing improves operability and the production efficiency and the product appearance yield of product; Adopt low copper post design, i.e. horizontal wide the and thinner thickness in footpath of copper post can improve the heat radiation and the heat conductivility of product like this; Gu brilliant recessed cup is a dual-slot structure (promptly is to be dual-cavity solid brilliant recessed glass that two groove combination of 0.3mm become T type for the 2.4mm degree of depth is 0.15m with diameter for the 2.3mm degree of depth by diameter on the copper post,) can improve the dusting efficient and the uniformity of product, what make product once goes out light effect more excellent (hot spot is even), it is variegated not have yellow circle, and better application is at various lighting fields; Shell body adopts the plane formula encapsulating structure, and promptly the thickness of shell body 1 is 1.8mm, makes product have better resistance to pressure and high temperature Reflow Soldering excessively.The generation of the abnormal problems such as dead lamp that the solution high-powered LED lamp occurs in use.
The invention has the beneficial effects as follows: the production efficiency height, the consistency of rising angle is better and the hot spot effect is even, there is not yellow circle phenomenon all around, when supporting secondary optical lens, control easily, can cross reflow machine, in use be difficult for causing dead lamp phenomenon, and the limitation of solution terminal pin thermoelectricity integral type design is used phenomenon, the excessive glue phenomenon when solving sealing of single electrode wafer, the heat radiation and the heat conductivility of the operability of raising product and production efficiency and product appearance yield, raising product; , improve the dusting efficient and the uniformity of product, what make product once goes out light effect more excellent (hot spot is even) better application at various lighting fields; Employing plane formula package design makes product have better resistance to pressure and crosses the high temperature Reflow Soldering.The generation of the abnormal problems such as dead lamp that the solution high-powered LED lamp occurs in use.
[description of drawings]
The invention will be further described below in conjunction with accompanying drawing.
Accompanying drawing is a structural representation of the present invention.
Among the figure: 1 is that shell body, 2 is that solid brilliant recessed cup, 3 is that copper post, 41,42 is that positive and negative pin, 41a, 42a are that solder joint, 5 is the anti-overflow cushion rubber.
[embodiment]
Referring to accompanying drawing, the present invention includes shell body 1, copper post 3 and just, negative pin 41,42, copper post and just, negative pin is embedded in the shell body, there is the recessed cup 2 of solid crystalline substance the centre of shell body 1, put the LED luminous tube Gu have two draw-in grooves to be used for card in the brilliant recessed cup, it is characterized in that: just described, negative pin 41,42 separate with copper post 3, just, negative pin 41,42 are just having respectively at the middle part of outer housing, negative two two solder joint 41a, 42a, and an anti-overflow cushion rubber 5 is arranged in the middle part of described shell body 1, the external diameter of anti-overflow cushion rubber lower end is suitable with recessed glass 2 in solid crystalline substance, the external diameter of upper end covers on solid brilliant recessed cup 2, seal, copper post 3 is thin body structure, described solid brilliant recessed cup 2 is double recess, be to be dual-cavity solid brilliant recessed cup that two groove combination of 0.3mm become T type for the 2.4mm degree of depth is 0.15m with diameter for the 2.3mm degree of depth by diameter on the copper post, shell 1 is the plane formula encapsulating structure.
In most preferred embodiment of the present invention, described shell body 1 adopts the manufacturing of PPA plastic cement.
On power-type LED.Backing thickness is quite thin, and corresponding LED can satisfy and is used for the very strict place of volume requirement.Support is provided with two independent solder joints, and two electrodes are separated with heat sink copper post.
Led support of the present invention is SMD metallo-plastic support, can be used for the power-type LED of power more than 0.5W.
In the most preferred embodiment of invention, it is quite thin that the height of copper post 3 (1mm) is lower than imitative lumen structure (2.25-3.2mm) backing thickness, and corresponding LED can satisfy and is used for the very strict place of volume requirement.Support is provided with two independent solder joints, can make two electrodes separate (promptly being " the thermoelectric separation " often said) with heat sink copper post, because two solder joints are arranged, just do not need line be welded in heat sink on, the support that does not also just need the recessed cup of big solid crystalline substance, chip can be placed on the recessed cup of solid crystalline substance center, the gold thread symmetry of welding, therefore the volume than the LED of single solder joint support is little, lighting angle good, efficient is high, and easy to operate, appearance looks elegant; And because thermoelectric relation of separating makes LED bottom after energising not charged, convenient a plurality of LED are applied to circuit combination are installed.
Claims (5)
1. planar high-power LED bracket, include shell body (1), copper post (3) and just, negative pin (41,42), copper post and just, negative pin is embedded in the shell body, there is the recessed cup of solid crystalline substance (2) centre of shell body (1), put the LED luminous tube Gu have two draw-in grooves to be used for card in the brilliant recessed cup, it is characterized in that: just described, negative pin (41,42) separate with copper post (3), just, negative pin (41,42) just having respectively at the middle part of outer housing, negative two two solder joint (41a, 42a), and in the middle part of described shell body (1) an anti-overflow cushion rubber (5) is arranged, the external diameter of anti-overflow cushion rubber lower end is suitable with solid brilliant recessed cup (2), the external diameter on anti-overflow cushion rubber (5) top covers on solid brilliant recessed cup (2).
2. according to the planar high-power LED bracket of claim 1, it is characterized in that: the height of copper post (3) is 1mm.
3. according to the planar high-power LED bracket of claim 1 or 2, it is characterized in that: described anti-overflow cushion rubber is that diameter of 4.6mm, degree of depth 0.1mm and bottom is that the groove combination of 3.6mm degree of depth 0.3mm becomes the T font by a upper diameter.
4. according to the planar high-power LED bracket of claim 1 or 2, it is characterized in that: Gu brilliant recessed cup (2) is a double recess, be to be dual-cavity solid brilliant recessed cup that two groove combination of 0.3mm become T type for the 2.4mm degree of depth is 0.15m with diameter for the 2.3mm degree of depth by diameter on the copper post.
5. according to the planar high-power LED bracket of claim 1 or 2, it is characterized in that: described shell body (1) adopts the manufacturing of PPA plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010144718.XA CN101834261B (en) | 2010-04-12 | 2010-04-12 | Planar high-power LED bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010144718.XA CN101834261B (en) | 2010-04-12 | 2010-04-12 | Planar high-power LED bracket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101834261A true CN101834261A (en) | 2010-09-15 |
| CN101834261B CN101834261B (en) | 2014-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010144718.XA Active CN101834261B (en) | 2010-04-12 | 2010-04-12 | Planar high-power LED bracket |
Country Status (1)
| Country | Link |
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| CN (1) | CN101834261B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102034920A (en) * | 2010-10-08 | 2011-04-27 | 上海衡世光电科技有限公司 | Novel thermoelectric separation bracket for light-emitting diode (LED) surface mounted device (SMD) |
| CN102122697A (en) * | 2011-01-05 | 2011-07-13 | 深圳市天电光电科技有限公司 | Bracket for encapsulating LED |
| CN102163654A (en) * | 2010-12-31 | 2011-08-24 | 东莞市万丰纳米材料有限公司 | Die bonding method |
| WO2016078011A1 (en) * | 2014-11-19 | 2016-05-26 | 史伯梅 | Led support frame and led light-emitting unit |
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| CN201149874Y (en) * | 2008-01-15 | 2008-11-12 | 东莞市宏磊达电子塑胶有限公司 | High-power LED support |
| CN101359708A (en) * | 2008-09-04 | 2009-02-04 | 王海军 | Encapsulation method for reducing silica gel of high power LED |
| TW200941753A (en) * | 2008-03-18 | 2009-10-01 | Lin Pin Ya | LED light panel structure having a patch bracket |
| CN201327841Y (en) * | 2008-11-21 | 2009-10-14 | 东莞市宏磊达电子塑胶有限公司 | High-power LED bracket |
| CN201430162Y (en) * | 2009-07-13 | 2010-03-24 | 福建中科万邦光电股份有限公司 | Novel LED packaging base |
| CN201436686U (en) * | 2009-03-25 | 2010-04-07 | 博罗冲压精密工业有限公司 | a high-power led bracket |
| CN201820782U (en) * | 2010-04-12 | 2011-05-04 | 深圳市灏天光电有限公司 | Planar high-power light-emitting diode (LED) bracket |
-
2010
- 2010-04-12 CN CN201010144718.XA patent/CN101834261B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201149874Y (en) * | 2008-01-15 | 2008-11-12 | 东莞市宏磊达电子塑胶有限公司 | High-power LED support |
| TW200941753A (en) * | 2008-03-18 | 2009-10-01 | Lin Pin Ya | LED light panel structure having a patch bracket |
| CN101359708A (en) * | 2008-09-04 | 2009-02-04 | 王海军 | Encapsulation method for reducing silica gel of high power LED |
| CN201327841Y (en) * | 2008-11-21 | 2009-10-14 | 东莞市宏磊达电子塑胶有限公司 | High-power LED bracket |
| CN201436686U (en) * | 2009-03-25 | 2010-04-07 | 博罗冲压精密工业有限公司 | a high-power led bracket |
| CN201430162Y (en) * | 2009-07-13 | 2010-03-24 | 福建中科万邦光电股份有限公司 | Novel LED packaging base |
| CN201820782U (en) * | 2010-04-12 | 2011-05-04 | 深圳市灏天光电有限公司 | Planar high-power light-emitting diode (LED) bracket |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102034920A (en) * | 2010-10-08 | 2011-04-27 | 上海衡世光电科技有限公司 | Novel thermoelectric separation bracket for light-emitting diode (LED) surface mounted device (SMD) |
| CN102034920B (en) * | 2010-10-08 | 2013-08-14 | 上海衡世光电科技有限公司 | Thermoelectric separation bracket for light-emitting diode (LED) surface mounted device (SMD) |
| CN102163654A (en) * | 2010-12-31 | 2011-08-24 | 东莞市万丰纳米材料有限公司 | Die bonding method |
| CN102163654B (en) * | 2010-12-31 | 2012-11-21 | 东莞市万丰纳米材料有限公司 | Die bonding method |
| CN102122697A (en) * | 2011-01-05 | 2011-07-13 | 深圳市天电光电科技有限公司 | Bracket for encapsulating LED |
| CN102122697B (en) * | 2011-01-05 | 2012-11-07 | 深圳市天电光电科技有限公司 | Bracket for encapsulating LED |
| WO2016078011A1 (en) * | 2014-11-19 | 2016-05-26 | 史伯梅 | Led support frame and led light-emitting unit |
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| Publication number | Publication date |
|---|---|
| CN101834261B (en) | 2014-02-12 |
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Address after: No. 4, Hongxi South Road, Xiamen Torch High tech Zone (Xiang'an) Industrial Zone, Xiamen, Fujian Patentee after: Xiamen Xinda Haotian Technology Co.,Ltd. Address before: 518000 Haotian optoelectronics, floor 3, building 10, Longhua Guangxi Industrial Zone, Bao'an District, Shenzhen, Guangdong Patentee before: Shenzhen Glory Sky Optoelectronic Co.,Ltd. |
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| CP03 | Change of name, title or address |