TWI446570B - - Google Patents

Info

Publication number
TWI446570B
TWI446570B TW097109468A TW97109468A TWI446570B TW I446570 B TWI446570 B TW I446570B TW 097109468 A TW097109468 A TW 097109468A TW 97109468 A TW97109468 A TW 97109468A TW I446570 B TWI446570 B TW I446570B
Authority
TW
Taiwan
Application number
TW097109468A
Other languages
Chinese (zh)
Other versions
TW200941753A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW097109468A priority Critical patent/TW200941753A/en
Publication of TW200941753A publication Critical patent/TW200941753A/en
Application granted granted Critical
Publication of TWI446570B publication Critical patent/TWI446570B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
TW097109468A 2008-03-18 2008-03-18 LED light panel structure having a patch bracket TW200941753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097109468A TW200941753A (en) 2008-03-18 2008-03-18 LED light panel structure having a patch bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097109468A TW200941753A (en) 2008-03-18 2008-03-18 LED light panel structure having a patch bracket

Publications (2)

Publication Number Publication Date
TW200941753A TW200941753A (en) 2009-10-01
TWI446570B true TWI446570B (en) 2014-07-21

Family

ID=44868402

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097109468A TW200941753A (en) 2008-03-18 2008-03-18 LED light panel structure having a patch bracket

Country Status (1)

Country Link
TW (1) TW200941753A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101834261B (en) * 2010-04-12 2014-02-12 深圳市灏天光电有限公司 Planar high-power LED bracket
TW201350736A (en) * 2012-06-06 2013-12-16 Kabo Tool Co Two-way illumination device

Also Published As

Publication number Publication date
TW200941753A (en) 2009-10-01

Similar Documents

Publication Publication Date Title
BR112016019572A2 (en)
BRPI0917573A2 (en)
BRPI0918697A2 (en)
BRPI0917525A2 (en)
BRPI0920750A2 (en)
BRPI0919470A2 (en)
BRPI0922455A2 (en)
BRPI0917618A8 (en)
BRPI0923734A2 (en)
BRPI0922669A2 (en)
BRPI0915616A2 (en)
BRPI0904541A8 (en)
BRPI0919811A2 (en)
BRPI0920914A2 (en)
BRPI0922550A2 (en)
BRPI0916284A2 (en)
BRPI0914852A2 (en)
CH2352018H2 (en)
AR073287B1 (en)
BRPI0919477A2 (en)
BRPI0923127A (en)
BRPI0923137A2 (en)
BRMU8803485U8 (en)
CN300892211S (zh) 工具箱(p7990a)
CN300884190S (zh) 手套（13）

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees