TW200940705A - Copper CMP polishing pad cleaning composition comprising of amidoxime compounds - Google Patents

Copper CMP polishing pad cleaning composition comprising of amidoxime compounds Download PDF

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Publication number
TW200940705A
TW200940705A TW097141618A TW97141618A TW200940705A TW 200940705 A TW200940705 A TW 200940705A TW 097141618 A TW097141618 A TW 097141618A TW 97141618 A TW97141618 A TW 97141618A TW 200940705 A TW200940705 A TW 200940705A
Authority
TW
Taiwan
Prior art keywords
polishing pad
cleaning composition
cmp polishing
copper cmp
pad cleaning
Prior art date
Application number
TW097141618A
Other languages
English (en)
Inventor
Wai Mun Lee
Original Assignee
Ekc Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekc Technology Inc filed Critical Ekc Technology Inc
Publication of TW200940705A publication Critical patent/TW200940705A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/50—Cleaning by methods involving the use of tools involving cleaning of the cleaning members
    • B08B1/52—Cleaning by methods involving the use of tools involving cleaning of the cleaning members using fluids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/32—Amides; Substituted amides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/20—Industrial or commercial equipment, e.g. reactors, tubes or engines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097141618A 2007-10-29 2008-10-29 Copper CMP polishing pad cleaning composition comprising of amidoxime compounds TW200940705A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72707P 2007-10-29 2007-10-29
US622707P 2007-12-31 2007-12-31

Publications (1)

Publication Number Publication Date
TW200940705A true TW200940705A (en) 2009-10-01

Family

ID=40257334

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097141618A TW200940705A (en) 2007-10-29 2008-10-29 Copper CMP polishing pad cleaning composition comprising of amidoxime compounds

Country Status (3)

Country Link
US (1) US20090137191A1 (zh)
TW (1) TW200940705A (zh)
WO (1) WO2009058272A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN110088881A (zh) * 2016-12-14 2019-08-02 嘉柏微电子材料股份公司 自化学机械平坦化基板移除残留物的组合物及方法

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TWI460557B (zh) * 2008-03-07 2014-11-11 Wako Pure Chem Ind Ltd 半導體表面用處理劑組成物及使用半導體表面用處理劑組成物之半導體表面處理方法
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US20100105595A1 (en) * 2008-10-29 2010-04-29 Wai Mun Lee Composition comprising chelating agents containing amidoxime compounds
US7838483B2 (en) * 2008-10-29 2010-11-23 Ekc Technology, Inc. Process of purification of amidoxime containing cleaning solutions and their use
JP2010226089A (ja) * 2009-01-14 2010-10-07 Rohm & Haas Electronic Materials Llc 半導体ウェハをクリーニングする方法
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CN101908503A (zh) * 2010-07-21 2010-12-08 河北工业大学 超大规模集成电路多层铜布线化学机械抛光后的洁净方法
CN102554783B (zh) * 2010-12-23 2014-12-03 中芯国际集成电路制造(上海)有限公司 研磨垫清洗方法
KR101532990B1 (ko) * 2011-09-22 2015-07-01 도요 고무 고교 가부시키가이샤 연마 패드
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US9058976B2 (en) * 2012-11-06 2015-06-16 International Business Machines Corporation Cleaning composition and process for cleaning semiconductor devices and/or tooling during manufacturing thereof
JP6110814B2 (ja) * 2013-06-04 2017-04-05 富士フイルム株式会社 エッチング液およびそのキット、これらを用いたエッチング方法、半導体基板製品の製造方法および半導体素子の製造方法
JP6065802B2 (ja) * 2013-10-03 2017-01-25 信越半導体株式会社 研磨布の洗浄方法及びウェーハの研磨方法
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KR20170134963A (ko) * 2015-03-30 2017-12-07 제이에스알 가부시끼가이샤 화학 기계 연마용 처리 조성물, 화학 기계 연마 방법 및 세정 방법
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CN113195657A (zh) * 2018-12-12 2021-07-30 巴斯夫欧洲公司 含有铜和钌的基材的化学机械抛光
CN110479213A (zh) * 2019-08-29 2019-11-22 西南科技大学 偕胺肟基修饰mof材料及其制备方法
CN115870867A (zh) * 2022-12-26 2023-03-31 西安奕斯伟材料科技有限公司 抛光装置及抛光方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110088881A (zh) * 2016-12-14 2019-08-02 嘉柏微电子材料股份公司 自化学机械平坦化基板移除残留物的组合物及方法
CN110088881B (zh) * 2016-12-14 2023-09-26 Cmc材料股份有限公司 自化学机械平坦化基板移除残留物的组合物及方法

Also Published As

Publication number Publication date
WO2009058272A1 (en) 2009-05-07
US20090137191A1 (en) 2009-05-28

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