TW200940652A - Resin composition for lens and cured product thereof - Google Patents
Resin composition for lens and cured product thereof Download PDFInfo
- Publication number
- TW200940652A TW200940652A TW097148249A TW97148249A TW200940652A TW 200940652 A TW200940652 A TW 200940652A TW 097148249 A TW097148249 A TW 097148249A TW 97148249 A TW97148249 A TW 97148249A TW 200940652 A TW200940652 A TW 200940652A
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- resin composition
- lens
- molecule
- resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/064—Copolymers with monomers not covered by C08L33/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007334601A JP2009155442A (ja) | 2007-12-26 | 2007-12-26 | レンズ用樹脂組成物及びその硬化物 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200940652A true TW200940652A (en) | 2009-10-01 |
Family
ID=40826948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097148249A TW200940652A (en) | 2007-12-26 | 2008-12-11 | Resin composition for lens and cured product thereof |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2009155442A (zh) |
KR (1) | KR20090071394A (zh) |
CN (1) | CN101469135B (zh) |
TW (1) | TW200940652A (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2479209A1 (en) | 2009-09-18 | 2012-07-25 | Nippon Shokubai Co., Ltd. | Process for production of cured molded article, and cured molded article |
CN102971383B (zh) * | 2010-06-11 | 2014-11-12 | 株式会社艾迪科 | 含硅固化性组合物、该含硅固化性组合物的固化物及由该含硅固化性组合物形成的引线框基板 |
CN104136943A (zh) * | 2012-02-24 | 2014-11-05 | 松下电器产业株式会社 | 透镜、复合透镜、更换镜头以及摄像装置 |
US9346954B2 (en) | 2012-09-14 | 2016-05-24 | The Yokohama Rubber Co., Ltd. | Curable resin composition |
CN105814155A (zh) * | 2013-12-09 | 2016-07-27 | 3M创新有限公司 | 可固化倍半硅氧烷聚合物、组合物、制品和方法 |
CN105646458A (zh) * | 2014-11-13 | 2016-06-08 | 上海和辉光电有限公司 | 一种化合物及其制备方法和应用 |
JP6622171B2 (ja) * | 2016-11-08 | 2019-12-18 | 信越化学工業株式会社 | 加熱硬化型シリコーン組成物、ダイボンド材及び光半導体装置 |
WO2021261133A1 (ja) * | 2020-06-22 | 2021-12-30 | 東亞合成株式会社 | 光硬化性組成物、その硬化物、及び硬化物の製造方法 |
EP4251402B1 (en) * | 2020-11-30 | 2024-06-19 | Dow Silicones Corporation | Hydrosilylation cure inhibitors and use thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1196499B1 (en) * | 1999-07-27 | 2003-08-27 | Bausch & Lomb Incorporated | Contact lens material |
US6730767B2 (en) * | 2001-11-02 | 2004-05-04 | Bausch & Lomb Incorporated | High refractive index aromatic-based siloxane monofunctional macromonomers |
JP4801320B2 (ja) * | 2003-12-19 | 2011-10-26 | 東レ・ダウコーニング株式会社 | 付加反応硬化型オルガノポリシロキサン樹脂組成物 |
-
2007
- 2007-12-26 JP JP2007334601A patent/JP2009155442A/ja not_active Withdrawn
-
2008
- 2008-12-11 TW TW097148249A patent/TW200940652A/zh unknown
- 2008-12-16 KR KR1020080127736A patent/KR20090071394A/ko not_active Application Discontinuation
- 2008-12-24 CN CN2008101852376A patent/CN101469135B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009155442A (ja) | 2009-07-16 |
CN101469135A (zh) | 2009-07-01 |
CN101469135B (zh) | 2011-11-16 |
KR20090071394A (ko) | 2009-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200940652A (en) | Resin composition for lens and cured product thereof | |
ATE412706T1 (de) | Härtbare organopolysiloxanzusammensetzung | |
TW200643099A (en) | Epoxy resin composition and semiconductor device | |
EP2161305A3 (en) | Resin composition | |
CN1436215A (zh) | 低温快速固化的硅氧烷组合物 | |
CN102863799B (zh) | 一种用于led封装的高折射率有机硅材料及其制备方法 | |
JP2012180522A5 (zh) | ||
CN103342816A (zh) | 一种有机硅树脂及可固化有机聚硅氧烷组合物与应用 | |
TW200728388A (en) | Highly processible compounds of high MW conventional block copolymers and controlled distribution block copolymers | |
JP2011219597A (ja) | シリコーン樹脂シート | |
WO2010123314A3 (ko) | 새로운 에폭시 수지 및 이를 포함하는 에폭시 수지 조성물 | |
SG151268A1 (en) | Epoxy resin composition and semiconductor device | |
ATE451426T1 (de) | Härtbare organopolysiloxan-zusammensetzung und halbleiterbauelement | |
CN103865476B (zh) | 一种smt封装小功率led用有机硅固晶绝缘胶 | |
ATE522577T1 (de) | Thermoplastische polyamide mit polyetheraminen | |
TW200641048A (en) | Flame retardant polyamide composition | |
TW200626570A (en) | Intraoral pungent substance | |
MY144047A (en) | Epoxy resin composition, process for providing latency to the composition and a semiconductor device | |
ATE552292T1 (de) | Formkörper und herstellungsverfahren dafür | |
EP2565949A3 (en) | Optical semiconductor device | |
MY161328A (en) | Curable resin composition and cured article | |
JP5377401B2 (ja) | 硬化性オルガノポリシロキサン組成物 | |
TWI534181B (zh) | 可固化矽氧樹脂之發光二極體封裝 | |
TW201612251A (en) | Organosiloxane compositions and uses thereof | |
WO2014104389A3 (en) | Curable silicone composition, cured product thereof, and optical semiconductor device |