TW200938846A - Probing testing device - Google Patents
Probing testing device Download PDFInfo
- Publication number
- TW200938846A TW200938846A TW97108934A TW97108934A TW200938846A TW 200938846 A TW200938846 A TW 200938846A TW 97108934 A TW97108934 A TW 97108934A TW 97108934 A TW97108934 A TW 97108934A TW 200938846 A TW200938846 A TW 200938846A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- test
- circuit layer
- electrically connected
- testing device
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 167
- 239000000523 sample Substances 0.000 claims abstract description 236
- 239000000463 material Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 101100008048 Caenorhabditis elegans cut-4 gene Proteins 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010079 rubber tapping Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 64
- 230000005540 biological transmission Effects 0.000 description 20
- 230000008054 signal transmission Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 4
- 238000005265 energy consumption Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97108934A TW200938846A (en) | 2008-03-13 | 2008-03-13 | Probing testing device |
| US12/133,249 US7782070B2 (en) | 2007-06-05 | 2008-06-04 | Probing device |
| KR1020080052519A KR100965923B1 (ko) | 2007-06-05 | 2008-06-04 | 프로브 테스트 장치 |
| DE102008045726.4A DE102008045726B4 (de) | 2007-09-19 | 2008-09-04 | Prüfvorrichtung |
| SG200806872-8A SG151211A1 (en) | 2007-09-19 | 2008-09-17 | Probing device |
| FR0856318A FR2924816B1 (fr) | 2007-09-19 | 2008-09-19 | Dispositif de controle sous pointes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97108934A TW200938846A (en) | 2008-03-13 | 2008-03-13 | Probing testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200938846A true TW200938846A (en) | 2009-09-16 |
| TWI360658B TWI360658B (enExample) | 2012-03-21 |
Family
ID=44867471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97108934A TW200938846A (en) | 2007-06-05 | 2008-03-13 | Probing testing device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200938846A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI763692B (zh) * | 2017-07-28 | 2022-05-11 | 薩摩亞商頂勝世界股份有限公司 | 針座 |
-
2008
- 2008-03-13 TW TW97108934A patent/TW200938846A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI360658B (enExample) | 2012-03-21 |
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