200938642 九、發明說明 【發明所屬之技術領域】 本發明係關於一種成膜用遮罩及遮罩密接方法。 【先前技術】 近年來，例如專利文獻1之揭示，已提出一種所謂4 邊固定輕微張力遮罩，其作爲由具有容許成膜材料通過之 ❹ 開口圖案的遮罩本體、及保持該遮罩本體之保持框體所構 成的成膜用遮罩，將如第1圖圖示之遮罩本體21的4邊 藉框狀框體22加以圍繞，藉由該框狀框體22，一面不會 由4邊施加張力或施加極弱的張力，一面保持遮罩本體21 〇 該4邊固定輕微張力遮罩係具有溫度變化小且輕量的 優點，由於溫度變化小，因此在藉由蒸鍍裝置進行蒸鍍中 ’不易發生圖案偏移，此外，由於較輕，因此可抑制搬送 © 系統的成本。 (專利文獻1)日本特開2007-138256號公報 【發明內容】 (發明所欲解決之課題） 但是，如上所述之4邊固定輕微張力遮罩與基板的密 接性差，在利用例如蒸鏟等進行成膜時，無法按照遮罩本 體的開口圖案進行成膜，而會有基板上的成膜圖案模糊的 問題點。 -5- 200938642 此外，例如第2圖之圖示，以細長狀的遮罩本體31 不會撓曲的方式，在由2邊施加張力（tension )的狀態下 保持在保持框體32的構成亦已被提出，但是在如上所示 之構成中，如第3圖之圖示，因張力而使遮罩本體31的 中央部33變形，與基板的密接性仍差，難以良好地進行 成膜。 本發明係用以解決上述之問題點者，僅將遮罩本體相 對向的2邊在遮罩本體因本身重量而可撓曲的狀態下固定 Q 在保持框體的保持部，藉此解除遮罩本體的撓曲不均而可 與基板良好地密接，而且溫度變化小且輕量的優點，提供 一種與基板良好地密接而可進行成膜圖案精度佳的成膜之 極具優異實用性的成膜用遮罩及遮罩密接方法。 (解決課題之手段） 參照所附圖示，說明本發明之要旨。 係關於一種成膜用遮罩，係由具有容許成膜材料通過 © 之開口圖案的遮罩本體1、及保持該遮罩本體1的保持框 體2所構成，且層積經由前述開口圖案被附著有前述成膜 材料的基板6的成膜用遮罩，其特徵爲：前述保持框體2 係構成爲：具備有沿著前述遮罩本體1之4邊中相對向的 一對邊部3而分別配設，分別保持該一對邊部3的一對保 持部4，僅藉由該一對保持部4來保持前述遮罩本體1, 在藉由前述一對保持部4所保持的前述一對邊部3間，以 前述遮罩本體1因本身重量而撓曲而且前述撓曲量在該一 -6 - 200938642 對邊部3相對向方向產生變化的方式，將該一對邊部3固 定在前述一對保持部4。 此外，如申請專利範圍第1項之成膜用遮罩者，其中 ，將前述遮罩本體1的前述一對邊部3在該遮罩本體1因 本身重量而自然撓曲的狀態下分別固定在前述一對保持部 4 〇 此外，如申請專利範圍第2項之成膜用遮罩者，其中 〇 ，構成爲：將前述一對保持部4形成爲沿著藉由該保持部 4所被保持的前述一對邊部3而具有長度的長邊構件，該 一對邊部3分別得以同樣地固定在前述一對保持部4。 此外，如申請專利範圍第2項之成膜用遮罩者，其中 ’在以前述遮罩本體1而言爲與前述基板6表面相對向的 背面之相反側的表面側，設置補正前述遮罩本體1之撓曲 的撓曲補正體。 此外，如申請專利範圍第3項之成膜用遮罩者，其中 Ο ’在以前述遮罩本體1而言爲與前述基板6表面相對向的 背面之相反側的表面側，設置補正前述遮罩本體i之撓曲 的撓曲補正體。 此外’如申請專利範圍第4項之成膜用遮罩者，其中 ’前述撓曲補正體爲棒體7，將該棒體7設成與被固定在 前述保持部4之一對邊部3大致平行。 此外’如申請專利範圍第5項之成膜用遮罩者，其中 ’前述撓曲補正體爲棒體7，將該棒體7設成與被固定在 前述保持部4之一對邊部3大致平行。 200938642 此外’如申請專利範圍第6項之成膜用遮罩者，其中 ，前述撓曲補正體係設在以前述遮罩本體1而言爲撓曲的 最下點部位置。 此外，如申請專利範圍第7項之成膜用遮罩者，其中 ，前述撓曲補正體係設在以前述遮罩本體1而言爲撓曲的 最下點部位置。 此外，係關於一種遮罩密接方法，係使申請專利範圍 第1項至第9項中任一項之成膜用遮罩密接於基板的遮罩 @ 密接方法，其特徵爲：在前述成膜用遮罩5上層積基板6 ，在該基板6上層積片狀重物構件8，藉由該重物構件8 ，使基板6強制性地撓曲，而使前述成膜用遮罩5密接於 基板表面。 此外，如申請專利範圍第10項之遮罩密接方法者， 其中，採用鎢片作爲前述重物構件8。 此外，如申請專利範圍第11項之遮罩密接方法者， 其中，採用玻璃、塑膠或金屬製者作爲前述基板6。 ◎ (發明之效果） 本發明係構成爲如上所述，因此可解決遮罩本體的撓 曲不均而與基板良好地密接，溫度變化小且爲輕量的優點 ，形成爲與基板良好地密接而可進行成膜圖案精度佳的成 膜之極具優異實用性的成膜用遮罩及遮罩密接方法。 【實施方式】 -8 - 200938642 根據圖示，顯示本發明之作用而簡單說明較佳之本發 明之實施形態（要如何實施發明）。 一對邊部3分別被固定在一對保持部4，被保持在保 持框體2的遮罩本體1因本身重量而撓曲，因此若爲了進 行例如成膜而使基板6(及磁鐵等）層積時，該基板6與 遮罩本體1的撓曲會追隨而使兩者良好地密接。 例如4邊固定輕微張力遮罩由於未施加張力（或非常 © 小），因此乍見會覺得追隨基板撓曲而撓曲彎曲而良好地 密接，但是由於固定4邊而使撓曲量在縱向及橫向之2個 方向發生變化，雙方的撓曲會相干擾而在遮罩本體的撓曲 形成不均，遮罩本體會發生變形，而且該變形較爲複雜， 因此無法獲得良好的密接性。 關於此，本發明係將相對向的一對邊部3 ( 2邊）固 定在一對保持部4的構成，遮罩本體1係在該一對邊部3 間，遮罩本體1因本身重量而撓曲而且前述撓曲量僅在該 〇 一對邊部3相對向的方向（1方向）產生變化，由於不會 干擾撓曲，因此不易形成不均，因此，遮罩本體1的變形 單純且較小，可良好地追隨基板6的撓曲而良好地密接。 亦即，可實現更爲自然的撓曲，因此即使基板6大型 化而使撓曲變得較大，遮罩本體1亦可柔軟地追隨基板6 的撓曲而密接。因此，在與基板6等層積而進行成膜時， 藉由與基板6良好地密接，基板6上的成膜圖案不會模糊 而可按照開口圖案來進行成膜。 此外，與以遮罩本體1不會撓曲的方式維持一定程度 -9- 200938642 的張力的情形相比較，可減小保持部4所需強度，就可將 保持框體2形成爲較薄且爲輕量。因此，搬送等變得較爲 容易，就可提升作業性。 尤其，因遮罩本體1變形以致密接性降低或保持框體 2厚壁化或重量化係隨著遮罩（基板）的大型化而更加明 顯，但是藉由本發明，即使爲大型的遮罩，亦可爲薄壁· 輕量而且可與基板良好地密接。 此外，例如，在以遮罩本體1而言爲與基板6表面相 φ 對向的背面之相反側的表面側，設置與被固定在保持部4 的一對邊部3呈大致平行的棒體7，而補正遮罩本體1之 撓曲時，係使遮罩本體1同樣地撓曲，可解除遮罩本體1 之形成有開口圖案的區域與除此以外的區域之撓曲量的差 ，而更加提升與基板6的密接性。尤其，當將棒體7設在 以遮罩本體1而言爲撓曲的最下點部位置時，可良好地解 除撓曲量的差。 以上所示之成膜用遮罩5係在例如成膜用遮罩5上層 〇 積基板6’在該基板6上層積片狀（sheet)的重物構件8 ，藉由該重物構件8，強制性地使基板6撓曲，藉此可良 好地密接於基板表面。此時，以重物構件8而言，若採用 具柔軟性且爲分量重的鎢片，可更加良好地使基板6撓曲 而與遮罩本體密接。 (實施例） 根據第4至7圖，說明本發明之具體實施例。 -10- 200938642 如第4、5圖之圖示，本實施例係由具有容許成膜材 料通過之開口圖案的遮罩本體1;及保持該遮罩本體1的 保持框體2所構成，且層積經由前述開口圖案被附著有前 述成膜材料的基板6的成膜用遮罩’前述保持框體2係構 成爲具備有：沿著前述遮罩本體1之4邊中相對向的一對 邊部3而分別配設，分別保持該一對邊部3的一對保持部 4，僅藉由該一對保持部4來保持前述遮罩本體1 ’在藉由 0 前述一對保持部4所保持的前述一對邊部3間，以前述遮 罩本體1因本身重量而撓曲而且前述撓曲量在該一對邊部 3相對向方向產生變化的方式，將該一對邊部3固定在前 述一對保持部4者。 具體說明各部。 遮罩本體1係以因鋼材（invar )等金屬材料爲素材之 —般的方形狀金屬遮罩。該遮罩本體1係具有：由開口圖 案（省略圖示）與開口圖案以外的框體部分（省略圖示） 〇 所形成而配設在成膜裝置內之成膜材料之通過區域的成膜 區域；及設在該成膜區域外側（外周）的非成膜區域。 具體而言，在成膜區域的左右分別設有作爲非成膜區 域的耳部9，該耳部9被固定在保持框體2的保持部4。 其中，耳部9亦可連設在遮罩本體1之成膜區域的長邊側 •短邊側的任一側。 保持框體2係由因鋼（invar )材等金屬材料所成之框 體。在本實施例中，將該框體相對向的一對對向邊部10 設定在保持部4。此外’保持部以外之另外—對對向邊部 -11 - 200938642 11係以不與遮罩本體1之（未被保持部4保持之）另外一 對邊部12相接觸的方式作配設。該對向邊部1〇與對向邊 部Π係透過角部而連設。 該保持框體2係構成爲：以不在遮罩本體1之成膜區 域的方式使開口部至少大於遮罩本體1的成膜區域，在作 爲保持部4的一對對向邊部1〇固定有遮罩本體〗的耳部9 〇 在本實施例中’係以不對該遮罩本體1施加張力而且 0 遮罩本體1會因本身重量而自然撓曲的方式將遮罩本體1 的一對邊部3固定在保持框體2的一對保持部4。 具體而言，遮罩本體1尙未被固定在保持部4，以大 致平行的狀態下之自然最大撓曲量B爲基準，在以大致平 行支持遮罩本體1的狀態下，將左右耳部9的其中一側固 定在其中一方保持部4，以另一側的固定位置不會過於接 近其中一側的固定位置而強制性地使其凹彎而且不會被拉 伸地過遠的方式（中央部不會變形的方式），將該另一側 〇 的固定位置適當設定調整而固定在其他保持部4。 該遮罩本體1的一對邊部3 (耳部9)與保持部4 (對 向邊部10)係藉由接著劑而強固地接著。 具體而言，框體的一對對向邊部10係遍及遮罩本體1 之耳部9的全長而作接觸，將該遮罩本體1之耳部9的下 面與框體之對向邊部10的上面遍及長度方向的大致全域 而藉由接著劑大致同樣地予以固定。 其中，耳部9的下面與對向邊部10的上面係可全面 -12- 200938642 接著，亦可僅接著一部分。此外，在本實施例中，耳部9 與保持部4係遍及長度方向的大致全域而大致一樣地接著 ，但是亦可隔著預定間隔作接著（亦可隔著間隔設置多數 接著部分）。此外，不限於藉由接著劑所進行的接著，亦 可藉由熔接等其他方法來將遮罩本體1的邊部3固定在保 持部4。 此外，以對遮罩本體1不作用張力（拉伸力及按壓力 〇 )的方式，亦即在不施加張力的狀態下，將前述一對邊部 3固定在保持部4，因此遮罩本體1係在前述一對邊部3( 耳部9)間會因本身重量而自然地撓曲成彎曲圓弧狀，撓 曲量會在一對邊部3的相對向方向產生變化。因此，在本 實施例中，係距離一對邊部3分別爲等距離的位置會成爲 撓曲最下點位置而使撓曲量成爲最大。 其中，撓曲量B在圖示中爲說明起見而誇大描繪，但 其實際上非常小，相對於厚度數mm的遮罩本體1，一般 ❹ 爲數十至數百μηι程度。此外，保持框體2的厚度亦依據 撓曲量Β而誇大描繪，但實際上爲數mm程度。 此外，在本實施例中，在以遮罩本體1而言爲與前述 基板表面密接的背面的相反側的表面側，設置與被固定在 前述保持部4的一對邊部3呈大致平行的棒體7，而補正 遮罩本體1之撓曲。 具體而言，前述棒體7係與保持框體2相同爲因鋼材 等金屬材料製，設置1支在以前述遮罩本體1而言爲撓曲 的最下點部位置（撓曲量爲最大的位置）。 -13- 200938642 此係在遮罩本體1之中，與該遮罩本體1的耳部9呈 平行的方向中，會在遮罩本體1的撓曲形成不均，因此藉 由在不會阻礙自然撓曲之範圍之程度的重量物，來拉伸撓 曲量較小的部分而補正撓曲不均之故。藉由該棒體7，遮 罩本體1與基板表面的密接性變得更加良好。亦即，本實 施例係構成爲：撓曲量僅在一對邊部3的相對向方向產生 變化，撓曲量在平行方向並不會產生變化。 其中，在本實施例中係在遮罩本體1的撓曲最下點部 Q 位置配設1支棒體7，但是並不限於最下點部，可配設在 其他部位，亦可配設複數支。此外，亦可藉由棒體7，使 遮罩本體1的撓曲形狀變形爲波狀等其他形狀，而非爲彎 曲圓弧形狀。此外，棒體7亦可設置在被固定在前述保持 部4之一對邊部3的相對向方向。此外，在上述實施例中 ，列舉棒體7作爲撓曲補正體的具體例，但是並非侷限於 此，亦可爲板狀或網目狀。但是，爲了不會阻礙成膜，必 須以至少不會閉塞開口圖案的方式而設在框體部分。 〇 此外，在本實施例中，係未施加張’力而將遮罩本體1 固定在保持部4，但是亦可稍微施加張力加以固定（亦可 形成爲所謂輕微張力遮罩）。 本實施例之成膜用遮罩5係例如設置在成膜裝置的遮 罩保持具13上，在該成膜用遮罩5上層積玻璃基板6，在 該玻璃基板6上層積具柔軟性之片狀的重物構件8，藉由 該重物構件8，使玻璃基板6強制性地撓曲而使前述成膜 用遮罩5密接於基板表面，此外，層積可使遮罩本體1以 -14- 200938642 磁性吸引靠近基板側的磁鐵14，藉由該磁鐵14，另外使 成膜用遮罩5與玻璃基板6密接（參照第6圖），由下方 藉由蒸鍍、CVD或濺鍍等成膜手段使成膜材料飛濺，而在 玻璃基板6上進行成膜時使用。 以重物構件8而言，以具柔軟性而且具有一定程度重 量的構件爲佳。具體而言，以由鎢與彈性體所成的鎢片較 爲合適。若使用鎢片，藉由該鎢片，使基板6隨著該鎢片 〇 的彎曲而彎曲，被按壓在遮罩本體1而與該遮罩本體1良 好地密接（參照第7圖（b))。 關於此點，即使將例如鋁或玻璃等堅硬物質作爲重物 構件8’，如第7圖（a)之圖示，未良好地撓曲而無法使基 板6’撓曲，基板6’與成膜用遮罩5’的密接性會變得不良 。其中，以重物構件8而言，不限於鎢片，亦可使用氟橡 膠或砍片。 此外，若使用膠磁（rubber magnet)作爲磁鐵14，則 © 成膜用遮罩5、基板6、重物構件8、磁鐵14會分別良好 地撓曲而密接，故較爲合適。 此外，以基板6而言，並不限於玻璃基板6，即使爲 塑膠或金屬（箔）等其他基板，亦可同樣良好地進行成膜 〇 本實施例係構成爲如上所述，因此一對邊部3分別被 固定在一對保持部4,被保持在保持框體2的遮罩本體1 係因本身重量而撓曲，因此爲了進行例如成膜而使基板6 (及磁鐵等）層積時，該基板6與遮罩本體1的撓曲會追 -15- 200938642 隨而使兩者良好地密接。 例如4邊固定輕微張力遮罩並未施加張力（或非常小 )，因此乍見會覺得追隨基板的撓曲而撓曲彎曲而良好地 密接，但是由於固定4邊而使撓曲量在縱向及橫向之2個 方向發生變化，雙方的撓曲會相干擾而使遮罩本體的撓曲 形成不均，遮罩本體會發生變形，而且該變形較爲複雜， 因此無法獲得良好的密接性。 關於此，本實施例係將相對向的一對邊部3(2邊） @ 固定在一對保持部4的構成，遮罩本體1係在該一對邊部 3間，遮罩本體1因本身重量而撓曲成圓弧狀，而且前述 撓曲量僅在該一對邊部3相對向的方向（1方向）產生變 化，由於不會干擾撓曲，因此不易形成不均，因此，遮罩 本體1的變形較爲單純而且較小，可良好地追隨基板6的 撓曲而良好地密接。 亦即，可實現更爲自然的撓曲，因此即使基板6大型 化而使撓曲變得較大，遮罩本體1亦可柔軟地追隨基板6 〇 的撓曲而密接。因此，在與基板6等層積而進行成膜時， 藉由與基板6良好地密接，基板6上的成膜圖案不會模糊 而可按照開口圖案來進行成膜。 此外，與以遮罩本體1不會撓曲的方式維持一定程度 的張力的情形相比較，可減小保持部4所需強度，就可將 保持框體2形成爲較薄且爲輕量。因此，搬送等變得較爲 容易，就可提升作業性。 尤其，因遮罩本體1變形以致密接性降低或保持框體 -16- 200938642 2厚壁化或重量化係隨著遮罩（基板）的大型化而更加明 顯，但是藉由本實施例，即使爲大型的遮罩，亦可爲薄壁 •輕量而且可與基板良好地密接。 此外，以遮罩本體1而言在與基板表面密接之背面之 相反側的表面側，設置與被固定在保持部4之一對邊部3 呈大致平行的棒體7而補正遮罩本體1的撓曲，因此使遮 罩本體1同樣地撓曲，可解除遮罩本體1之形成有開口圖 φ 案的區域與除此以外之區域之撓曲量的差，而更加提升與 基板6的密接性。尤其，將棒體7設在以遮罩本體1而言 爲撓曲的最下點部位置，因此可更加良好地解除撓曲量的 差。 因此，本實施例係可解決遮罩本體的撓曲不均而與基 板良好地密接，溫度變化小且爲輕量的優點，形成爲與基 板良好地密接而使基板上的蒸鍍圖案不會模糊而可按照開 口圖案良好地進行成膜之極具優異實用性者。 〇 本發明並不限於本實施例，各構成要件之具體構成可 作適當設計。 【圖式簡單說明】 第1圖係習知例的槪略說明圖。 第2圖係習知例的槪略說明圖。 第3圖係第2圖之主要部位的放大槪略說明剖面圖。 第4圖係本實施例之遮罩本體的槪略說明斜視圖。 第5圖係本實施例的槪略說明斜視圖。 -17- 200938642 第6圖係顯示本實施例之使用狀態的槪略說明剖面圖 〇 第7圖係說明因重物構件的不同以致層積狀態不同的 槪略說明剖面圖。 【主要元件符號說明】 1 :遮罩本體 2 :保持框體 3、12 :(—對）邊部 4 :保持部 5、 5’ ：成膜用遮罩 6、 6’ ：基板 7 :棒體 8、8 ’ ：重物構件 9 :耳部 10、11:( 一對）對向邊部 13 :遮罩保持具 14 :磁鐵 21、 31 :遮罩本體 22、 32 :框狀框體 B:自然最大撓曲量 -18-200938642 IX. Description of the Invention [Technical Field] The present invention relates to a film forming mask and a mask adhesion method. [Prior Art] In recent years, for example, as disclosed in Patent Document 1, a so-called 4-sided fixed slight tension mask has been proposed as a mask body having a meandering opening pattern allowing a film forming material to pass therethrough, and holding the mask body The film-forming mask formed by the frame body surrounds the four sides of the mask body 21 illustrated in FIG. 1 by the frame-shaped frame 22, and the frame-shaped frame 22 does not 4 applies tension or applies extremely weak tension while maintaining the mask body 21. The four sides are fixed with a slight tension. The mask has the advantage of small temperature change and light weight. Since the temperature changes little, it is performed by the vapor deposition device. In the vapor deposition, pattern shift is less likely to occur, and since it is lighter, the cost of the transport© system can be suppressed. (Problems to be Solved by the Invention) However, as described above, the adhesion between the four-side fixed light tension mask and the substrate is poor, and for example, a steam shovel or the like is used. When film formation is performed, film formation cannot be performed in accordance with the opening pattern of the mask body, and there is a problem that the film formation pattern on the substrate is blurred. In addition, for example, in the illustration of Fig. 2, the structure in which the holding frame 32 is held in a state in which tension is applied by the two sides so that the elongated mask body 31 does not bend is also applied. In the above-described configuration, as shown in FIG. 3, the central portion 33 of the mask body 31 is deformed by the tension, and the adhesion to the substrate is still poor, and it is difficult to form the film satisfactorily. The present invention solves the above problems, and only fixes the two sides of the mask body in a state in which the mask body is deflectable by its own weight, and holds the frame in the holding portion of the frame body, thereby releasing the cover. The cover body is unevenly deflected and can be in close contact with the substrate, and has a small temperature change and a light weight. It provides excellent film-forming performance with good adhesion to the substrate and excellent film formation pattern. Masking and masking method for film formation. (Means for Solving the Problem) The gist of the present invention will be described with reference to the accompanying drawings. A mask for film formation is composed of a mask body 1 having an opening pattern for allowing a film forming material to pass through, and a holding frame 2 for holding the mask body 1, and the layer is laminated via the opening pattern. The film formation mask of the substrate 6 to which the film formation material is adhered is characterized in that the holding frame 2 is configured to include a pair of side portions 3 that face each other along the four sides of the mask body 1. Each of the pair of holding portions 4 of the pair of side portions 3 is separately provided, and the mask body 1 is held by only the pair of holding portions 4, and the aforementioned holding by the pair of holding portions 4 Between the pair of side portions 3, the pair of side portions 3 are changed in such a manner that the mask body 1 is deflected by its own weight and the amount of deflection is changed in the direction in which the side portions 3 are opposed to each other in the range of -6 - 200938642. It is fixed to the pair of holding portions 4 described above. Further, in the film-forming mask according to the first aspect of the invention, the pair of side portions 3 of the mask body 1 are respectively fixed in a state in which the mask body 1 is naturally deflected by its own weight. Further, in the pair of holding portions 4 of the second aspect of the invention, the film forming mask is configured such that the pair of holding portions 4 are formed along the holding portion 4 The long side members having the length of the pair of side portions 3 are held, and the pair of side portions 3 are similarly fixed to the pair of holding portions 4, respectively. Further, in the film-forming mask according to the second aspect of the invention, the mask is provided on the surface side opposite to the back surface of the mask body 1 facing the surface of the substrate 6, and the mask is provided. The flexural correction body of the deflection of the body 1. Further, in the film-forming mask of the third aspect of the invention, the Ο' is provided on the surface side opposite to the back surface of the mask body 1 facing the surface of the substrate 6, and the correction is provided. The deflection correction body of the cover body i is deflected. Further, in the case of the film-forming mask of the fourth aspect of the patent application, wherein the aforementioned flexure correcting body is the rod body 7, the rod body 7 is provided and fixed to one of the side portions 3 of the holding portion 4. Roughly parallel. Further, in the film-forming mask of the fifth aspect of the invention, wherein the 'flexure correction body is the rod body 7, the rod body 7 is provided and fixed to one of the side portions 3 of the holding portion 4. Roughly parallel. In the case of the film formation mask of the sixth aspect of the invention, the deflection correction system is provided at a position of the lowest point of the deflection of the mask body 1. Further, in the film-forming mask according to the seventh aspect of the invention, the deflection correction system is provided at a position of a lowermost portion which is deflected by the mask body 1. In addition, a masking method for adhering a film-forming mask according to any one of the first to ninth aspects of the present invention to a substrate is characterized in that: The laminated substrate 6 is stacked on the substrate 5, and the sheet-like weight member 8 is laminated on the substrate 6. The substrate 6 is forcibly bent by the weight member 8, and the film-forming mask 5 is adhered to the substrate. The surface of the substrate. Further, as in the mask adhesion method of claim 10, a tungsten sheet is used as the weight member 8 as described above. Further, in the method of the mask adhesion method of claim 11, wherein the substrate 6 is made of glass, plastic or metal. ◎ (Effect of the Invention) The present invention is configured as described above. Therefore, it is possible to solve the problem of uneven deflection of the mask body and to be in close contact with the substrate, and the temperature change is small and lightweight, and is formed to be in close contact with the substrate. Further, it is possible to form a film-forming mask and a mask adhesion method which are excellent in film formation pattern and excellent in practical film formation. [Embodiment] -8 - 200938642 The embodiment of the present invention (how to implement the invention) will be briefly described based on the function of the present invention. The pair of side portions 3 are respectively fixed to the pair of holding portions 4, and the mask main body 1 held by the holding frame 2 is bent by its own weight. Therefore, the substrate 6 (and a magnet or the like) is formed for film formation, for example. At the time of lamination, the deflection of the substrate 6 and the mask body 1 follows, and the two are well adhered. For example, if a slight tension mask is fixed on the four sides, since no tension is applied (or very small), it is felt that the deflection of the substrate follows the deflection of the substrate and is well adhered, but the amount of deflection is fixed in the longitudinal direction due to the fixation of the four sides. The two directions of the transverse direction change, and the deflection of both sides interferes, and the deflection of the mask body is uneven, and the mask body is deformed, and the deformation is complicated, so that good adhesion cannot be obtained. In the present invention, the pair of side portions 3 (two sides) facing each other are fixed to the pair of holding portions 4, and the mask body 1 is interposed between the pair of side portions 3, and the mask body 1 is weighted by itself. Further, the deflection and the amount of deflection change only in the direction (1 direction) in which the pair of side portions 3 face each other, and since the deflection is not disturbed, unevenness is less likely to occur, and therefore the deformation of the mask body 1 is simple. Further, it is small and can be closely adhered to the substrate 6 in a good manner. In other words, since the deflection can be more naturally performed, even if the substrate 6 is increased in size and the deflection is large, the mask body 1 can be flexibly followed by the deflection of the substrate 6 to be in close contact with each other. Therefore, when the film is formed by lamination with the substrate 6 or the like, the film formation pattern on the substrate 6 is not blurred by the good adhesion to the substrate 6, and the film formation can be performed in accordance with the opening pattern. Further, the holding frame 2 can be formed thinner and the strength required for the holding portion 4 can be reduced as compared with the case where the tension of the mask body 1 is not flexed to maintain a certain degree of -9-200938642. It is lightweight. Therefore, it becomes easier to transfer, and the workability can be improved. In particular, since the mask body 1 is deformed so that the adhesion is lowered or the frame 2 is thickened or the weight is made larger as the size of the mask (substrate) is increased, by the present invention, even if it is a large mask, It can also be thin-walled, lightweight, and well-bonded to the substrate. Further, for example, a rod body that is substantially parallel to the pair of side portions 3 fixed to the holding portion 4 is provided on the surface side of the mask body 1 opposite to the back surface opposite to the surface φ of the substrate 6. 7. When the deflection of the mask body 1 is corrected, the mask body 1 is similarly deflected, and the difference in the amount of deflection of the region in which the opening pattern of the mask body 1 is formed and the other regions can be removed. Further, the adhesion to the substrate 6 is further improved. In particular, when the rod body 7 is provided at the position of the lowermost point portion which is deflected by the mask body 1, the difference in the amount of deflection can be satisfactorily removed. The film formation mask 5 shown above is, for example, a layered substrate 6' on the upper surface of the film formation mask 5, and a sheet-shaped weight member 8 is laminated on the substrate 6, and the weight member 8 is The substrate 6 is forcibly bent, whereby the substrate surface can be adhered well. At this time, in the weight member 8, by using a tungsten sheet having flexibility and a heavy component, the substrate 6 can be more flexibly bent and adhered to the mask body. (Embodiment) A specific embodiment of the present invention will be described based on Figs. 4 to 7. -10- 200938642 As shown in FIGS. 4 and 5, the present embodiment is constituted by a mask body 1 having an opening pattern allowing a film forming material to pass therethrough; and a holding frame 2 holding the mask body 1 and The film formation mask 2 that laminates the substrate 6 to which the film formation material is adhered via the opening pattern is configured to include a pair of opposing sides along the four sides of the mask body 1 Each of the side portions 3 is disposed to hold the pair of holding portions 4 of the pair of side portions 3, and the pair of holding portions 4 are held by the pair of holding portions 4, and the pair of holding portions 4 are held by 0. Between the pair of side portions 3 held, the pair of side portions 3 are formed such that the mask body 1 is deflected by its own weight and the amount of deflection changes in the direction in which the pair of side portions 3 face each other. It is fixed to the pair of holding portions 4 described above. Explain the various sections. The mask body 1 is a square-shaped metal mask made of a metal material such as steel (invar). The mask body 1 has a film formation region in which a film formation material is disposed in a film formation apparatus by an opening pattern (not shown) and a frame portion (not shown) other than the opening pattern. a region; and a non-film formation region disposed outside (outer periphery) of the film formation region. Specifically, an ear portion 9 as a non-film formation region is provided on the right and left sides of the film formation region, and the ear portion 9 is fixed to the holding portion 4 of the holding frame 2. The ear portion 9 may be connected to either the long side or the short side of the film formation region of the mask body 1. The holding frame 2 is a frame made of a metal material such as steel (invar). In the present embodiment, the pair of opposing side portions 10 facing the frame body are set in the holding portion 4. Further, the other side of the holding portion is disposed so as not to be in contact with the other pair of side portions 12 of the mask body 1 (which is not held by the holding portion 4). The opposite side portion 1〇 and the opposite side portion are connected to each other through the corner portion. The holding frame 2 is configured such that the opening portion is at least larger than the film formation region of the mask body 1 so as not to be formed in the film formation region of the mask body 1, and is fixed to the pair of opposite side portions 1 as the holding portion 4. The ear portion 9 having the mask body ' in the present embodiment is a pair of the mask body 1 in such a manner that no tension is applied to the mask body 1 and the mask body 1 is naturally deflected by its own weight. The side portion 3 is fixed to the pair of holding portions 4 of the holding frame 2 . Specifically, the mask body 1 is not fixed to the holding portion 4, and the right and left ears are supported in a state where the mask body 1 is supported substantially in parallel with respect to the natural maximum deflection amount B in a substantially parallel state. One of the sides 9 is fixed to one of the holding portions 4, and the fixed position on the other side is not too close to the fixed position of one of the sides, and is forcibly bent and not stretched too far ( The central portion is not deformed. The fixed position of the other side is appropriately set and adjusted, and is fixed to the other holding portion 4. The pair of side portions 3 (ear portions 9) and the holding portion 4 (opposing side portions 10) of the mask body 1 are strongly adhered by an adhesive. Specifically, the pair of opposing side portions 10 of the frame body are in contact with the entire length of the ear portion 9 of the mask body 1, and the lower surface of the ear portion 9 of the mask body 1 is opposed to the side of the frame body. The upper surface of 10 is substantially the same in the longitudinal direction and is fixed substantially in the same manner by the adhesive. Wherein, the lower surface of the ear portion 9 and the upper surface of the opposite side portion 10 can be comprehensively -12-200938642. Next, only a part of it can be followed. Further, in the present embodiment, the ear portion 9 and the holding portion 4 are substantially identical to each other over substantially the entire length direction, but may be followed by a predetermined interval (may be provided at a plurality of intervals). Further, the side portion 3 of the mask body 1 may be fixed to the holding portion 4 by other methods such as welding, without being limited to being carried out by the adhesive. Further, the pair of side portions 3 are fixed to the holding portion 4 in such a manner that no tension (tensile force and pressing force) is applied to the mask main body 1, that is, in a state where no tension is applied, the mask body is fixed. 1 is naturally bent in a curved arc shape by the weight of the pair of side portions 3 (the ear portions 9), and the amount of deflection changes in the direction in which the pair of side portions 3 face each other. Therefore, in the present embodiment, the position at which the distance from the pair of side portions 3 is equidistant is the position at the lowest point of the deflection, and the amount of deflection is maximized. Here, the amount of deflection B is exaggerated for the sake of explanation in the drawings, but it is actually very small, and is generally about tens to hundreds of μm with respect to the mask body 1 having a thickness of several mm. Further, the thickness of the holding frame 2 is also exaggerated in accordance with the amount of deflection ,, but is actually about several mm. Further, in the present embodiment, the surface side of the mask body 1 opposite to the back surface which is in close contact with the surface of the substrate is provided substantially in parallel with the pair of side portions 3 fixed to the holding portion 4. The rod 7 corrects the deflection of the mask body 1. Specifically, the rod body 7 is made of a metal material such as a steel material in the same manner as the holding frame body 2, and is provided at the lowest point position at which the mask body 1 is deflected (the maximum amount of deflection is large). s position). -13- 200938642 This is in the direction in which the mask body 1 is parallel to the ear portion 9 of the mask body 1, and the deflection of the mask body 1 is uneven, so that it is not hindered. The weight of the extent of the natural deflection is used to stretch the portion having a small amount of deflection to correct the unevenness of the deflection. With the rod 7, the adhesion between the mask body 1 and the surface of the substrate is further improved. That is, the present embodiment is configured such that the amount of deflection changes only in the opposing direction of the pair of side portions 3, and the amount of deflection does not change in the parallel direction. In the present embodiment, one rod body 7 is disposed at the position of the lowest point Q of the mask body 1 at the lowermost point of the deflection. However, the present invention is not limited to the lowest point portion, and may be disposed at other portions. Multiple branches. Further, the deflection shape of the mask body 1 may be deformed into other shapes such as a wave shape by the rod 7, instead of the curved arc shape. Further, the rod 7 may be provided in a direction opposite to the one side portion 3 of the holding portion 4. Further, in the above embodiment, a specific example of the rod body 7 as the deflection correcting body is exemplified, but the invention is not limited thereto, and may be in the form of a plate or a mesh. However, in order not to hinder the film formation, it is necessary to provide the frame portion so as not to occlude at least the opening pattern. Further, in the present embodiment, the mask body 1 is fixed to the holding portion 4 without applying a tensile force, but it may be fixed by applying a slight tension (may also be formed as a so-called slight tension mask). The film formation mask 5 of the present embodiment is provided, for example, on the mask holder 13 of the film formation apparatus, and the glass substrate 6 is laminated on the film formation mask 5, and the glass substrate 6 is laminated on the glass substrate 6 to have flexibility. In the sheet-shaped weight member 8, the glass substrate 6 is forcibly bent by the weight member 8, and the film formation mask 5 is adhered to the surface of the substrate, and the mask body 1 can be laminated. -14- 200938642 Magnetically attracts the magnet 14 near the substrate side, and the film mask 5 is adhered to the glass substrate 6 by the magnet 14 (see Fig. 6), and vapor deposition, CVD or sputtering is performed from below. The film forming means is used to form a film on the glass substrate 6 when the film forming material is spattered. In the case of the weight member 8, it is preferable to use a member having flexibility and a certain degree of weight. Specifically, a tungsten sheet made of tungsten and an elastomer is suitable. When a tungsten sheet is used, the substrate 6 is bent in accordance with the bending of the tungsten sheet, and is pressed against the mask body 1 to be in close contact with the mask body 1 (refer to Fig. 7(b) ). In this regard, even if a hard substance such as aluminum or glass is used as the weight member 8', as shown in Fig. 7(a), the substrate 6' cannot be flexed without being deflected well, and the substrate 6' is formed. The adhesion of the film mask 5' may become poor. Among them, the weight member 8 is not limited to a tungsten sheet, and a fluororubber or a chopped sheet may be used. Further, when a rubber magnet is used as the magnet 14, the film forming mask 5, the substrate 6, the weight member 8, and the magnet 14 are preferably flexed and adhered to each other, which is preferable. Further, the substrate 6 is not limited to the glass substrate 6, and even if it is another substrate such as plastic or metal (foil), the film formation can be performed similarly. The present embodiment is configured as described above, so that a pair of sides Each of the portions 3 is fixed to the pair of holding portions 4, and the mask main body 1 held by the holding frame 2 is bent by its own weight. Therefore, when the substrate 6 (and a magnet or the like) is laminated, for example, film formation is performed. The deflection of the substrate 6 and the mask body 1 will follow -15-200938642, and the two will be in good close contact. For example, if a slight tension mask is fixed on the four sides, no tension is applied (or very small), so that the smear will feel that the deflection of the substrate follows the deflection and bends well, but the amount of deflection is in the longitudinal direction due to the fixation of the four sides. The two directions of the transverse direction change, and the deflection of the two sides interferes with each other to cause uneven deflection of the mask body, and the mask body is deformed, and the deformation is complicated, so that good adhesion cannot be obtained. In this embodiment, the pair of side portions 3 (two sides) @ are fixed to the pair of holding portions 4, and the mask body 1 is interposed between the pair of side portions 3, and the mask body 1 is The weight is bent into an arc shape, and the amount of deflection is changed only in the direction (1 direction) in which the pair of side portions 3 face each other, and since the deflection is not disturbed, unevenness is less likely to occur, so that the amount of deflection is not easily formed. The cover body 1 is simple and small in deformation, and can be closely adhered to the substrate 6 in a good manner. In other words, since the deflection can be more naturally performed, even if the substrate 6 is increased in size and the deflection is large, the mask body 1 can be flexibly followed by the deflection of the substrate 6 而. Therefore, when the film is formed by lamination with the substrate 6 or the like, the film formation pattern on the substrate 6 is not blurred by the good adhesion to the substrate 6, and the film formation can be performed in accordance with the opening pattern. Further, the holding frame 2 can be made thinner and lighter than the case where the tension of the holding body 4 is maintained so that the mask body 1 does not flex. Therefore, it becomes easier to transfer, and the workability can be improved. In particular, since the mask body 1 is deformed so that the adhesion is lowered or the frame 16-200938642 2 is thickened or the weight is more pronounced as the size of the mask (substrate) is increased, by this embodiment, even The large mask can also be thin-walled, lightweight, and well-bonded to the substrate. Further, the mask body 1 is provided with a rod body 7 that is fixed substantially parallel to one of the side portions 3 of the holding portion 4 on the surface side opposite to the back surface that is in close contact with the surface of the substrate to correct the mask body 1 Therefore, the mask body 1 is flexed in the same manner, and the difference in the amount of deflection of the region of the mask body 1 in which the opening pattern φ is formed and the other regions can be removed, and the substrate 6 is further improved. Adhesion. In particular, since the rod body 7 is provided at the lowest point position which is deflected by the mask body 1, the difference in the amount of deflection can be more satisfactorily released. Therefore, the present embodiment can solve the problem that the deflection of the mask body is uneven and is in good contact with the substrate, and the temperature change is small and lightweight, and is formed so as to be in close contact with the substrate so that the vapor deposition pattern on the substrate does not It is blushing and can be excellently formed into a film in accordance with the opening pattern. 〇 The present invention is not limited to the embodiment, and the specific constitution of each constituent element can be appropriately designed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic explanatory diagram of a conventional example. Fig. 2 is a schematic explanatory diagram of a conventional example. Fig. 3 is a cross-sectional view showing a magnified outline of a main part of Fig. 2; Fig. 4 is a schematic perspective view showing the mask body of the embodiment. Fig. 5 is a schematic perspective view showing the present embodiment. -17- 200938642 Fig. 6 is a schematic cross-sectional view showing the state of use of the present embodiment. Fig. 7 is a schematic cross-sectional view showing the different laminated states due to the difference in weight members. [Description of main component symbols] 1 : Mask main body 2 : Holding frame 3 , 12 : (-) side portion 4 : Holding portions 5 , 5 ' : Film forming masks 6 , 6 ' : Substrate 7 : Rod body 8, 8 ': weight member 9: ears 10, 11: (pair) opposite side 13: mask holder 14: magnets 21, 31: mask body 22, 32: frame-like frame B: Natural maximum deflection -18-