TW200938012A - Wiring board and method of manufacturing the same - Google Patents
Wiring board and method of manufacturing the same Download PDFInfo
- Publication number
- TW200938012A TW200938012A TW097149133A TW97149133A TW200938012A TW 200938012 A TW200938012 A TW 200938012A TW 097149133 A TW097149133 A TW 097149133A TW 97149133 A TW97149133 A TW 97149133A TW 200938012 A TW200938012 A TW 200938012A
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- layer
- core substrate
- wiring
- conductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000004020 conductor Substances 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 85
- 230000003014 reinforcing effect Effects 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 2
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 117
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 38
- 229910052802 copper Inorganic materials 0.000 description 38
- 239000010949 copper Substances 0.000 description 38
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 238000005530 etching Methods 0.000 description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 229910052804 chromium Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007325747A JP2009147263A (ja) | 2007-12-18 | 2007-12-18 | 配線基板およびその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200938012A true TW200938012A (en) | 2009-09-01 |
Family
ID=40796730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097149133A TW200938012A (en) | 2007-12-18 | 2008-12-17 | Wiring board and method of manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20090166077A1 (enrdf_load_stackoverflow) |
| JP (1) | JP2009147263A (enrdf_load_stackoverflow) |
| TW (1) | TW200938012A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8921705B2 (en) * | 2008-11-28 | 2014-12-30 | Ibiden Co., Ltd. | Wiring board and fabrication method therefor |
| US20100139967A1 (en) * | 2008-12-08 | 2010-06-10 | Ibiden Co., Ltd. | Wiring board and fabrication method therefor |
| TW201110839A (en) * | 2009-09-04 | 2011-03-16 | Advanced Semiconductor Eng | Substrate structure and method for manufacturing the same |
| JP2013214568A (ja) * | 2012-03-30 | 2013-10-17 | Fujitsu Ltd | 配線基板及び配線基板の製造方法 |
| KR101548816B1 (ko) * | 2013-11-11 | 2015-08-31 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| JP6306865B2 (ja) * | 2013-12-05 | 2018-04-04 | Ｊｘ金属株式会社 | 樹脂基板を互いに剥離可能に密着させた積層体 |
| KR102436226B1 (ko) * | 2015-08-19 | 2022-08-25 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04279097A (ja) * | 1991-03-07 | 1992-10-05 | Sony Corp | プリント配線板の放熱構造 |
| JPH07109943B2 (ja) * | 1992-12-09 | 1995-11-22 | 日本電気株式会社 | 多層配線基板 |
| DE4334127C1 (de) * | 1993-10-07 | 1995-03-23 | Mtu Muenchen Gmbh | Metallkernleiterplatte zum Einschieben in das Gehäuse eines Elektronikgerätes |
| JP2003347727A (ja) * | 2002-05-30 | 2003-12-05 | Hitachi Ltd | 配線基板および両面実装半導体製品 |
| EP1850648A4 (en) * | 2005-11-02 | 2011-03-30 | Ibiden Co Ltd | Multilayer printed circuit board for a semiconductor device and manufacturing method therefor |
| US7714453B2 (en) * | 2006-05-12 | 2010-05-11 | Broadcom Corporation | Interconnect structure and formation for package stacking of molded plastic area array package |
-
2007
- 2007-12-18 JP JP2007325747A patent/JP2009147263A/ja active Pending
-
2008
- 2008-12-16 US US12/335,907 patent/US20090166077A1/en not_active Abandoned
- 2008-12-17 TW TW097149133A patent/TW200938012A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20090166077A1 (en) | 2009-07-02 |
| JP2009147263A (ja) | 2009-07-02 |
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