TW200936665A - Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions - Google Patents

Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions Download PDF

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Publication number
TW200936665A
TW200936665A TW097140958A TW97140958A TW200936665A TW 200936665 A TW200936665 A TW 200936665A TW 097140958 A TW097140958 A TW 097140958A TW 97140958 A TW97140958 A TW 97140958A TW 200936665 A TW200936665 A TW 200936665A
Authority
TW
Taiwan
Prior art keywords
organic clay
copolymer
polymer resin
ethylene
article
Prior art date
Application number
TW097140958A
Other languages
English (en)
Chinese (zh)
Inventor
Timothy J Person
Robert F Eaton
Original Assignee
Union Carbide Chemicals & Plastics Technology Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40429787&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200936665(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Union Carbide Chemicals & Plastics Technology Llc filed Critical Union Carbide Chemicals & Plastics Technology Llc
Publication of TW200936665A publication Critical patent/TW200936665A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
TW097140958A 2007-11-02 2008-10-24 Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions TW200936665A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US98481307P 2007-11-02 2007-11-02

Publications (1)

Publication Number Publication Date
TW200936665A true TW200936665A (en) 2009-09-01

Family

ID=40429787

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097140958A TW200936665A (en) 2007-11-02 2008-10-24 Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions

Country Status (11)

Country Link
US (2) US9959951B2 (enExample)
EP (1) EP2215158B1 (enExample)
JP (1) JP5473926B2 (enExample)
KR (1) KR101461700B1 (enExample)
CN (1) CN101918486B (enExample)
AT (1) ATE541890T1 (enExample)
BR (1) BRPI0817164A2 (enExample)
CA (1) CA2703974C (enExample)
MX (1) MX2010004829A (enExample)
TW (1) TW200936665A (enExample)
WO (1) WO2009058560A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2791190B1 (en) 2011-12-13 2016-07-06 Dow Global Technologies LLC Ethylene-propylene-diene interpolymer composition
AU2015306161B2 (en) 2014-08-19 2018-07-05 Borealis Ag A new crosslinked polymer composition, structured layer and cable
US20160104555A1 (en) * 2014-10-10 2016-04-14 General Electric Company Method for improving the electric field distribution in a high voltage direct current cable
EP3985060B8 (en) 2015-06-17 2025-08-20 Dow Global Technologies LLC Process for making crosslinked cable insulation using high melt strength ethylene-based polymer made in a tubular reactor and optionally modified with a branching agent
KR102987041B1 (ko) 2020-08-21 2026-07-06 다우 글로벌 테크놀로지스 엘엘씨 높은 체적 저항률을 갖는 멜트블로운 부직포 및 이의 물품
EP4413070A1 (en) 2021-10-05 2024-08-14 Borealis AG Cable

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627194B2 (ja) * 1989-07-31 1997-07-02 株式会社豊田中央研究所 ポリエステル複合材料及びその製造方法
JPH0652728A (ja) * 1992-07-31 1994-02-25 Showa Electric Wire & Cable Co Ltd 電力ケーブル
JP3349747B2 (ja) * 1993-02-26 2002-11-25 株式会社フジクラ 絶縁組成物および電力ケーブル
US5780376A (en) * 1996-02-23 1998-07-14 Southern Clay Products, Inc. Organoclay compositions
JP2000508021A (ja) 1996-12-31 2000-06-27 ザ ダウ ケミカル カンパニー ポリマー―オルガノクレー複合材料およびそれらの調製
FR2793592B1 (fr) 1999-03-04 2001-06-08 Cit Alcatel Cable d'energie ayant des caracteristiques mecaniques, thermiques, electriques, et de tenue au feu sensiblement ameliorees
US6524702B1 (en) 1999-08-12 2003-02-25 Dow Global Technologies Inc. Electrical devices having polymeric members
US6737464B1 (en) * 2000-05-30 2004-05-18 University Of South Carolina Research Foundation Polymer nanocomposite comprising a matrix polymer and a layered clay material having a low quartz content
US6740396B2 (en) * 2001-02-26 2004-05-25 Pirelli Cavi E Sistemi S.P.A. Cable with coating of a composite material
JP2003022710A (ja) * 2001-07-06 2003-01-24 Toshiba Corp 低誘電型絶縁材料とその製造方法
US6825253B2 (en) 2002-07-22 2004-11-30 General Cable Technologies Corporation Insulation compositions containing metallocene polymers
AU2003273316A1 (en) * 2002-09-10 2004-04-30 Union Carbide Chemicals And Plastics Technology Corporation Polypropylene cable jacket compositions with enhanced melt strength and physical properties
US7226422B2 (en) * 2002-10-09 2007-06-05 Cardiac Pacemakers, Inc. Detection of congestion from monitoring patient response to a recumbent position
US7144934B2 (en) 2002-10-24 2006-12-05 Dow Global Technologies Inc. Charge dissipation modifiers for olefinic interpolymer compositions
EP3498768A1 (en) 2003-06-09 2019-06-19 Union Carbide Chemicals & Plastics Technology LLC Strippable semi-conductive insulation shield
CN1856844B (zh) * 2003-09-25 2011-06-01 陶氏环球技术公司 绝缘屏蔽组合物、包含该组合物的电力电缆及其制造方法
JP2006028208A (ja) * 2004-07-12 2006-02-02 Fujikura Ltd 低誘電性・耐熱性樹脂組成物、これを用いた成形品及びプリント回路基板

Also Published As

Publication number Publication date
KR101461700B1 (ko) 2014-11-17
EP2215158B1 (en) 2012-01-18
CA2703974A1 (en) 2009-05-07
KR20100099688A (ko) 2010-09-13
JP5473926B2 (ja) 2014-04-16
US9959951B2 (en) 2018-05-01
EP2215158A1 (en) 2010-08-11
CA2703974C (en) 2017-03-07
CN101918486B (zh) 2016-05-11
BRPI0817164A2 (pt) 2016-08-09
US20110100675A1 (en) 2011-05-05
CN101918486A (zh) 2010-12-15
WO2009058560A1 (en) 2009-05-07
US20180211742A1 (en) 2018-07-26
JP2011503784A (ja) 2011-01-27
ATE541890T1 (de) 2012-02-15
MX2010004829A (es) 2010-07-28
US10354775B2 (en) 2019-07-16

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