TW200930532A - Cutting method for layer laminated body and the cutting blade used in the method - Google Patents

Abstract

The present invention provides a cutting method for a layer-laminated body and a cutting blade used in the said method. It will not produce the discarded materials, such as stripped slices or broken slices, during the cutting process for the layer-laminated brittle material substrate and the layer-laminated body of a resin membrane. The surface of the brittle material substrate will also not have damage. The present invention, with the glass substrate on the opposed surface side of one surface side of the resin membrane, forms the crevice in the thickness range of 10% to 100% of the glass substrate in a generally vertical direction. It presses the cutting blade at the surface of the resin membrane corresponding to the crevice position or neighboring positions and makes their blades back and forth relative to the layer-laminated body. Thereby it forms a cutting opening in the resin membrane and makes the cutting opening to reach the thickness range above 90% of the resin membrane and does not reach the range of the glass substrate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cutting a laminate in which a brittle material substrate and a resin film are laminated, and a cutter used in the method. [Prior Art] ❹ ❹ Since the brittle material substrate such as glass or ceramic is brittle in mechanical properties, the cutting of the brittle material substrate is performed, for example, by crimping and rolling on the substrate by using a Cutter Wheel on the substrate surface. The cutting line (Scribe Line) generates a crack in the vertical direction from the surface of the substrate (cutting step), and then stress is applied to the substrate to vertically grow the crack to the back surface of the substrate (breaking step), thereby cutting the substrate. On the other hand, the resin film generally has flexibility or ductility, so the cutting of the resin film 'for example: frictional shearing by two sharp metal blades with sharp edges, or by using a very sharp cutting tool or The cutting force of the cutting wheel is cut to perform cutting. 'As described above, since the brittle material substrate and the resin film differ greatly in physical properties, as a method of cutting the laminate of the brittle material substrate and the resin film, there are the following methods, for example, on a brittle material substrate and a tree. Insert a scraper between the moon and the film, and move the cutter to the surface of the predetermined pressure film and move the blade and the cutter relative to the laminate. The film is separated from the brittle material base (4). The surface of the brittle material (four) plate is cut, and the laminate is applied == The laminate is cut (for example, refer to Patent Document 2). [Patent Document 1] JP-A-2003-335536, JP-A-H07-335656, JP-A-H07-45656, however, in the above-described cutting method, a resin film is inevitably produced, 200930532 When a squeegee is inserted between a brittle material substrate and a tree to perform relative movement, a table of a brittle material substrate may be caused by a plate. [Invention] The present invention has been made in view of the above-described conventional problems, and the object thereof is In the cutting process in which the laminate of the inert material substrate and the resin film is laminated, waste such as a release sheet or a cut piece is not generated, and the surface of the material substrate is not damaged. Further, the object of the present invention is to provide a cutter which has a long service life and which can surely prevent rotation or the like during use. According to the present invention, there is provided a method of cutting a laminate in which one or two or more resin films are encountered in a side layer of a brittle material substrate, which is characterized in that the resin film is formed from the brittle material substrate a side of the opposite side of the one side, a split bite on the surface of the weird silk surface, the crack is in the range of less than 100% of the thickness of the substrate of the inert material; then, in the resin The position of the outermost resin film in the film corresponding to the crack (the extended position of the crack) or the vicinity of the crimping cut 2 ❿ causes the cutter to describe the laminated body _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The thickness of the tree material on the material substrate side is _ or more and does not reach the range of the brittle material substrate. Here, in order to reliably cut the laminated body, a step of applying stress to the stacked body after forming the crack and the slit may be included. In addition, in the case where the brittle material substrate and one or two resin films are laminated via a binder layer, the entire material is completely read by the cutter, and the adhesive is applied to the binder. (10) or more and the thickness of the layer is less than the thickness of the slit 4 200930532. Further, in the case where the phase of the side of the tree-shaped film of the brittle material substrate is laminated, it is difficult to apply the film and the above-mentioned fragile The raw material substrate forms the above crack. Further, in order to form the crack on the brittle material substrate, it is preferable that the cutting wheel is used for cutting or irradiating a laser. The crimping force of the above cutter is preferably in the range of 〇.〇1 to 〇 4 MPa. Further, the ruthenium is formed by a resin film on the side of the substrate of the brittle material

The slit is formed such that the brittle material substrate is cut or nearly cut off. As the cutter, a part of the outer circumference including the blade may be formed in the disk field in which the blade is formed on the outer peripheral edge, and a plurality of planes may be formed on the outer circumference. Further, according to the present invention, there is provided a cutter for use in the above cutting method, the cutter being detachably supported on a holder, characterized in that the blade is formed on the disc formed on the outer peripheral edge and includes a blade a part of the outer portion f, and forming a plurality of planes on the outer circumference, and any two of the plurality of planes are held in the branch by abutting against the two abutting faces formed on the holder On the seat, the position of the blade of the cutter crimped on the resin film is changed by changing the two planes ' of the cutter abutting against the abutting surface. Here, in order to effectively use the entire blade formed on the outer periphery, it is preferable to form a plurality of planes on one side semicircle and a knife blade on the other side semicircle. Alternatively, one of the abutting faces formed on the holder may be formed. In order to reduce the friction with the resin film, the cutting is performed with a small crimping force. Preferably, the blade angle ranges from 2 〇 Q to 8 〇 Ω. 200930532 In order to make the life longer, the material is preferably made of super hard alloy or sintered diamond. The invention has the effect that in the cutting method of the present invention, after the crack of the predetermined depth is formed on the brittle material substrate, the cutting is performed. The blade is pressed against the corresponding position of the crack on the resin film or in the vicinity thereof, and is cut to a predetermined depth to cut the laminate. Therefore, no waste is generated in the cutting process, and the cutting is performed. The member does not come into contact with the contact surface of the brittle material substrate in contact with the resin film, so that the surface of the substrate is not damaged. ❹

In the cutter of the present invention, since the position of the blade which is pressed against the resin film can be changed again every time the loss occurs, the service life can be extended as compared with the prior art, and the problem of rotation during use can be effectively prevented. . [Embodiment] Hereinafter, the cutting method of the present invention will be described in more detail, and the present invention is not limited to these embodiments. The first drawing is a drawing showing an embodiment of the cutting method of the present invention. This wire is cut off from the laminated body 51 in which the slabs 41 of the slabs 41 are laminated on the slabs of the slabs. The figure on the left side of the other figure is a cross section of the vertical crack ί ^ relative to the crack 31, and the figure on the right side is _ ::= along the crack 31. In (4) of the first figure, first, a pre-cut is applied: the glass substrate 3 is relatively moved, and a dicing line is formed on the glass substrate. At this time, the crack 31 on the glass substrate 3 is obtained. What is important here is that it is opened...: The surface forms a heavy straight square tiger. The depth of the shank crack 31 is D = = plate 3 is thick, _ is above and less than coffee. If the iceness D is shallower than the above range, the stacking (four) cannot be cut. On the other hand, 200930532' is likely to cause resin. If the depth D of the crack 31 is deeper than the above range, the surface on the surface side of the film 41 is damaged. In order to control the depth D of the crack 31 within the above range, the material to be cut to the wheel 1, the shape of the blade, the load applied to the cutting wheel, and the like can be adjusted, for example, in order to deepen the depth D of the crack 31, the cutting wheel! A knife having a substantially V-shaped cross section may be formed at a circumferential portion of the disk-shaped wheel body, and a plurality of grooves may be formed at intervals of a thief as a ridge line of the blade. As the outer diameter of the above-mentioned cutting wheel, it is recommended to use the range of lmm to 1〇_; as the depth of the above groove, it is recommended to use

25_ or more; as the groove_ridge length, it is recommended that the claw is above. Further, as a method of forming the crack 31 of a predetermined depth on the glass substrate 3, in addition to the cutting method using the cutting wheel 1, a method of irradiating the laser to form the crack 31 may be employed, wherein as the laser, for example, c〇2 Gas lasers, YAG lasers or titanium sapphire lasers. Next, as shown in (b) of the first figure, at a position corresponding to the above-mentioned crack 31 on the outer surface of the resin film 41 or in the vicinity thereof, the cutter 2 is pressed by a predetermined load so that the cutter 2 is opposed to the resin film. 41 is relatively moved, and a slit 43' is formed in the resin film 41. One of the important matters here is that the cutter 2 is crimped onto the resin film 41 to form a slit 43 in the resin film 41; thus, in the glass substrate 3 in the previous process The crack 31 formed thereon extends to the resin crucible side of the glass substrate 3 (as D' illustrated in (b) of the first drawing), and the glass substrate 3 is cut or nearly cut off ◎ is applied to the cutter 2 The load may be appropriately determined depending on the material of the resin crucible 41 or the glass substrate 3, the shape of the cutter 2, and the like, but the load is preferably in the range of 0.1 to MPa. Another important point is that the depth d of the slit 43 is set to be more than 90% of the thickness of the resin film 41 and does not reach the range of the glass substrate 3 (at this time, less than 10%) 7 200930532. Therefore, the resin of the main film surface side of the 鲈 鲈 四 四 四 订 订 纯 在 在 在 在 在 在 在 在 在 在 在 在 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂Formula (4). According to the resin film (4) h Γ turn, sometimes the load is dispersed and cannot be rounded.

ϋ, the cutter 2 fixed by the knife 77 is generally recommended. The cutter 2 suitable for use in the tree is further described later. 2 pairs, as shown in (e) of the first figure, a pressing force is applied from the side of the glass substrate 3, whereby the glass substrate 3 and the tree; the film 41 is cut at the portions of the shape 31 and the slit 43 (e.g., - Figure (4) shows). In the above step (b), when the crack 31 of the glass substrate 3 has not reached the surface side of the diaphragm 21, the crack 31 reaches the surface side of the resin film 41 by applying the pressing force. Further, since the slit 43 of 90% or more of the resin film 41 is formed, the cutting force is easily performed by the above-described pressing force. As a method of applying stress to the laminated body S1 from the outside, in addition to applying the above-described pressing force. In addition to the method, for example, a method of generating a thermal stress by applying a temperature difference to the laminated body S1 along the cutting line may be employed. Further, when the thickness of the laminated body si is thin, it is naturally separated along the cutting line, so that a step of applying external stress is not required at this time. In the above embodiment, the pressing force is applied from the side of the glass substrate 3, but a pressing force ' may be applied from the resin film 41 side or a pressing force may be applied from both the glass substrate 3 side and the resin film 41 side'. In addition, when a pressing force is applied from the resin film 41 side depending on the material of the resin film 41, the fibrous material may be produced on the cut surface of the resin film 41. Therefore, it is preferable to apply the pressing from the side of the glass substrate 3 to 200930532. force. The brittle material substrate of the cutting method object of the invention may be, for example, 2: ceramic, sapphire, sapphire (Sa卯hire), the material base _ thickness is not limited, and the range is 500//m~1〇〇 〇#πι. For example, the resin is formed by adding the following resin to the resin: for example, a cellulose acetate resin such as polyethylene terephthalate (TAc), propylene, or the like. , four chaotic ethylene-hexafluoropropylene system: = fat flats; polyester resin such as bismuth diacetate, polyfluorene = fat: poly, wind-based resin, polystyrene resin, amine, catastrophe! 2, Poly-rolled vinyl resin, polyolefin resin or Juyiyue female system. The thickness of the resin film is not limited, but the 500 t chart generally shows another embodiment of the cutting method of the present invention. The layer 4 is a layered body, and the protective film 13 is laminated on the surface of the resin film of the glass substrate 3. At this time, the predetermined load film 13 is applied to perform relative movement on the surface of the protective film, and the protective film 13 used for the dicing is used to form a crack 3 on the glass substrate 3, for example, a PET film or a TAC film. The second breaking layer _ is laminated with two resin films 41: 4t: j is deep on one side of the glass substrate 3 as phase __42; ^, the slit 43 produced by the cutter 2 is deep in the resin film 41 On the side of the glass substrate 3 to the glass substrate 3, the thickness of the glass substrate 3 is more than 41, and the surface of the glass substrate 3 is not as shown in the above-mentioned 'the crack formed on the glass substrate 3 2009 200932 pattern 31 extends the side of the resin 祺 41 while not In the case of damaging the resin film, the resin film 4 of the broken plate 3 is cut off; the material of the surface side and the resin film 42 may be the same or different. In addition, the number of sheets of the tree slaps 41 and 42 of the 3-side upper layer # is not limited to two sheets, and may be three or more sheets. although

The fourth chart is not related to the cutting method of the present invention. The cut object stack S4 in the fourth drawing is on the glass substrates 3 and . A layer of adhesive η is laminated between them. When the laminated body s 4 having such a structure is cut, the cut π 43 generated by the cutter 2 completely breaks the tree sill 41, and the adhesive agent 11 is broken to the thickness ❸· or more and the glass substrate 3 is not formed: . As a result, the adhesive layer 11 of the glass substrate 3 is cut without damaging the surface side of the resin film 41 while forming the crack 31 & the resin film 41 side of the glass substrate 3 as described above. The material of the binder layer U is, for example, an ultraviolet curable resin or a thermosetting resin, or a resin which is cured by both of them, and specifically, for example, an ethylene anhydride copolymer (epoxy resin binder) or a polyurethane. A resin-based adhesive, a thermosetting adhesive such as a phenol resin-based adhesive, or an ultraviolet curable adhesive such as a linoleic acid resin, a cyanoacrylate or an acrylic resin. Further, the thickness of the binder layer is not particularly limited, but is usually in the range of from 1 to 50 / / m. Fig. 5 is a view showing still another embodiment of the cutting method of the present invention. In the cut object layered body S5 in the fifth embodiment, the glass substrate 3 and the resin film 41 are laminated by a binder layer 12 provided on the outer peripheral portion, and a space is formed in the center portion of both of them. When the laminated body S5 of such a structure is cut, the slit 43 produced by the cutter 2 can completely break the resin film 41, but the cutter 2 must be prevented from reaching the glass substrate 3. On the other hand, when the slit 43 produced by the cutter 2 is not completed 200930532, the depth of the slit 43 needs to be 90% or more of the thickness of the resin film 41 when the resin film 41 is completely broken. Further, a laminate in which a space between the glass substrate 3 and the resin film 41 is formed by using a separator such as fine particles instead of the binder layer 12 can be cut in the same manner as shown in the figure.

In particular, it is applicable to the cutting of a substrate on which a polarizing plate is laminated on the glass substrate 3, and the like. The above polarizing plate is usually attached to the support film on both sides of the polarizer=:polarizer, and the polarizing plate is, for example, a resin, a polyvinyl acetate, a vinyl acetate, a Um, a sulphur or a a poly (four) material on a polarizing sub-substrate on an alcohol film or a polarizing plate, or in a molecularly oriented polyethylene and a crucible, a "molecular dehydration product of the enol P〇y-vinylene", a molecular chain of the palm, etc. In addition, for the production of eccentric materials; ethylene copolymerization, but for the purpose of thinning the polarizer, etc., on the other hand, as a support and protect the range below the polaron; 祺 or norbornene (norbornene) The two-system support film is not limited, for example, but the thickness of the support film is not particularly suitable for use in the sixth figure. For example, (a) a of the sixth figure; (b) of the cutting blade of the cutting method is a right side view. The cutting blade = 21 is a front view, and the sixth drawing is formed with a knife-shaped cemented carbide or a sintered diamond shape formed with a through hole 21a at the outer peripheral edge. # 9ϊ. Also 'in the center of the cutter 21 77 (shown in the seventh figure A plane 21c and a plane peripheral edge are formed at the lock a which is inserted as a support shaft, and the partial removal cutter is formed by, for example, extending the flat 21c and the plane 21d by cutting the disc-shaped cutter , laser cutting or grinding plus 200930532 work to form. The group 22 of the seat 22 of the water and the knife u has a base wire 71 and a cover plate 72. In the first figure / body ®. The main view of the support And the right side view, the right side view of the cover plate ^the earth plate 71 is shown in the ninth figure. The front view and the seat 22 according to the seventh to ninth drawings are explained by T.

In the seventh and eighth figures, the notch portion 73 of the base plate 71 for mounting the cutter 21 is provided. Gap section? 3 is surrounded by three planes: _^ = abutting surface 75 and second abutting surface 76. The side has a hole for the pin π of the support shaft of the cutter 21. When the pin 77 is inserted in the upper 78 and the cutter 21 is attached, the blade is stuck. The lower side (four) (four) of the hole 71 is out. In addition, when the cutter 21 is attached to the base plate 71, the plane 21c and the plane 21d of the cutter 21 abut against the first abutting surface of the base plate 71 and the second, respectively. The abutting surface 76, and the cutter 21 is rotatably attached to the base plate 7. In addition, when the cutter 21 is reversely mounted, the plane 2id of the cutter 21 and the first abutting surface 75 of the base plate 71 are attached. When the abutment, the plane 2ic abuts against the second abutting surface 76, and the blade portion that protrudes outward from the lower side of the base plate 71 is exchanged. As shown in the eighth figure, screw holes 80, 81 for fixing the cover plate 72 are formed in the center of the base plate 71. A hole 82 for fixing to the elevating mechanism 23 is formed near the upper side of the base plate. On the left side of the base plate 71, a convex portion 83 capable of abutting against the cover plate 72 and positioning is formed. As shown in the ninth figure, holes 85, 86 for mounting screws fixed to the base plate 71 are formed in the center of the cover plate 72, and a lifting mechanism 23 is formed in the vicinity of the upper side (as shown in the seventh figure). Hole 87 on the). 12 200930532 As shown in the tenth figure, 'Install the lift 槿μ of the cutter unit CM', the fork 22 is attached to the structure 23. The cutter of the tenth figure is placed on the sill. On the gantry 51, along the relative silver, the seven thousand people / ν, 罝匕 · 动 动 ; ; ; ; ; ; ; ; ; ; ; ; 在 在 在 在 在 在 在 在In the left and right direction (X direction), the pedestal 59 is moved; in the pedestal 59, the 疋 w 沾 沾 沾 β β β β β β β β β β β β β β β β β β β β 65 65 65 65 65 65 Rotating #66 and laminating the surface, the tree: The glass substrate 3 of the film (turret board) is free to move in the horizontal plane through these structures. Nickname in

The slide table 52 is movably mounted on a pair of guide rails 54, 55/up. The rails 54, 55 are arranged in parallel on the gantry 51 at a predetermined distance. Further, between the guide rails 54, 55, a motor parallel to the guide rails 54, 55 is provided to drive the forward and reverse freely rotating ball screw 53. Further, a ball nut 56 is provided on the bottom surface of the slide weir 52. The ball nut 56 is screwed to the ball screw 53. The ball nut 56 is moved in the Y direction by the forward rotation and the reverse rotation of the ball screw 53, whereby the slide table 52 which has been broken by the ball nut 56 is moved in the Y direction on the guide rails 54, 55. Further, the pedestal 59 is movably supported by a pair of guiding members 61 which are arranged in parallel on the slide table 52 by a predetermined distance. Further, between the pair of guiding members 61, a ball screw 62 that is driven in parallel with the pair of guiding members 61 to be driven to rotate forward and backward by the motor 63 is provided. Further, the bottom surface of the pedestal 59 is provided with a ball nut 64 and is screwed to the ball color bar. By the positive or negative rotation of the ball screw 62, the ball nut 64 moves in the '^ direction, whereby the pedestal 59 and the ball nut 64 move along the pair of guide members 61 in the X direction. A rotating mechanism 65 is provided on the pedestal 59, and a rotating table 66 is provided on the rotating mechanism 65. The glass substrate 3 on which the resin film is laminated on the surface is fixed to the turntable 66 by the vacant adsorption of the true 13 200930532, and is rotated about the central axis in the vertical direction. The turret 66 is provided with a cutter 21 that cannot be placed above the rotary table 66. The arm frame 25 is extended from the upper end portion of the holder 22 to the horizontal direction in the upper end portion of the holder 22, and the elevating mechanism 23 is attached from the frame 25, and the end portion of the elevating portion 24 is supported by the holder. 22 is suspended by the lifting mechanism 23 along the support 22 . The position where the glass substrate 3 is crimped and the non-cutting knife 2"

Hereinafter, the operation of the cutter to hang the CM will be described. On the knives 21, on the rotating table 66, the female sculpt is stacked _ (not shown) = plate == not with the first abutting surface 75 of the base plate 71 and 帛 _ = 2 effect ^ this cut The knife 21 is rotatably mounted to the holder 22. Further, the position of the positive slide table 52 determines the position in the γ direction to determine the position in the Χ direction. Next, the glass substrate 3 is pressure-bonded by operating the elevator 2 and the cutter 21. By causing the pedestal 59 to die in the X direction, the resin film on the surface of the glass substrate 3 is scanned to form a slit. In the process of repeating the action of forming the slit, if the blade edge loss and sharpness of the cutter 21 deteriorate, the knife replacement operation is entered. The replacement operation of the blade to which the cutter 21 is pressed against the resin film is specifically as follows: First, the cover plate 72 of the holder 22 is removed, and the cutter 21 on the base plate 71 is taken out. Then, the cutter 21 is reversed and attached to the base plate 71 again. Thereby, the position of the changing blade is shown as an unused blade portion on the lower outer side of the base plate 71. The cover plate 72 is fixed to the base plate 71 in this state. The cutter 21' mounted on the base plate 71 has its flat surface 21c and flat surface 21d abutting against the second abutting surface 76 and the first abutting surface 75 of the base plate, respectively, and restricting its rotation 14 200930532 rotation. Thus, by changing the wire of (4) 21 toward ... a cutter 2i can be used twice, thereby extending the service life. In the above embodiment, the cutter 21 that can be used twice and the two abutments formed on the base plate 71 of the support/over-change holder 22 are used, and the outer circumference of the cutter 21 is changed. The number and angle of planes can further increase the number of uses. For example, the eleventh diagram is a front view showing another embodiment of the present invention. '" The state in which the cutter 92 is not mounted on the base plate 91 of the holder 22 is formed. The earth seat plate 91 is formed with two abutting faces 4 which are angled to each other. In addition, the cutter 92 is formed with 3 Planes 95, 96, 97 that are at an angle of 120 '' to each other. In the following, as the form in which the f-cutting blade 92 is attached to the base plate 91, first, for example, the contact surface 93 and the abutting surface of the base plate 91, 94 are respectively opposed to the plane 95 and the plane % of the 92. And abutting the abutting surface two: the shape of the junction 97. Then, after the cutter 92 is reversed, there is a shape in which the abutting surface 93 and the abutting surface 94 of the base plate 91 abut against the plane % and the plane 95 of the crucible 92; and abutting abutment The shape of the face 97 and the abutment face 96. Therefore, one cutter can be used four times. Similarly, if the number of planes formed on the cutter is increased step by step, one cutter can be used more times. The present invention will be described more specifically by way of examples, but the invention is not limited to these embodiments: (Example 1)

The first (polyethylene terephthalate film, second thickness of 0.2 mm) is laminated in order from the glass substrate by a glass-to-side surface of a U-shaped glass having a thickness of U· PET 200930532 The film 'is thus formed a laminate. For such a laminate, first, the cutting wheel is applied with a load of 0.14 MPa on the glass substrate, and the cutting speed is 300 IM/SCC to move relative to the glass substrate to form a cut on the glass substrate. Bao,】 Line. The vertical crack formed at this time is 10% of the glass & plate thickness. In addition, the specifications of the cutting wheel used are as follows: Specifications of the cutting wheel: Outer diameter: 2mm Thickness: 0 65mm Ο Inner diameter: 0. 8mm Blade angle: 115Q Groove depth: 25μιη Width of the ridge between the grooves: 25 // m Next, apply the cutter with a knife angle of 45s to 〇. 8MPa load is crimped to the second PE: On the T film, the cutter is moved relative to the laminate, the second PE:T film is completely cut, and the first PET film is cut, and the depth of the slit is 90% of the thickness of the first PET film. ' Then' from the glass The substrate side applies a pressing force to the laminated body along the cutting line to cause the laminated body to be cracked The slit portion was cut. (Example 2) The structure was the same except that the thickness of the glass substrate was 〇. 55 mm, the thickness of the first PET film was 0.2 mm, and the thickness of the second PET film was 〇.〇5丽. In the same laminate of Example 1, a cutting wheel of the following specifications was applied. The IMPa load was pressure-bonded to the glass substrate, and moved at a cutting speed of 300 imn/sec with respect to the glass substrate to form a cutting line on the glass substrate. The depth of the vertical crack formed is 10% of the thickness of the glass substrate. 200930532 Specification of the cutting wheel. Outer diameter: 3mm Thickness · · 0. 65mm Inner diameter: 0. 8mm Blade angle: 130s Groove depth: 3//m Between grooves The length of the ridge line: 15 /zm Next, the cutter of the cutting edge angle 302 is applied with a load of 0.4 MPa. On the second PET film, the cutter is moved relative to the laminated body, the second PET film is completely cut, and cut into The first PET film has a depth of 90% of the thickness of the first PET film. Then, a pressing force is applied to the laminate from the glass substrate side along the dicing line to cut the laminate at the crack and the slit portion. Simple description of the schema] The first diagram is a table Fig. 2 is a schematic view showing a cutting example of a laminated body in which a protective film is laminated on a glass substrate. The third drawing shows that two sides of the glass substrate are laminated. FIG. 4 is a schematic view showing a cutting example of a laminate in which a glass substrate and a resin film are bonded by a binder layer. The fifth figure shows bonding by a bonding layer. A schematic view of a cut example of a laminate of a glass substrate and a resin film outer peripheral portion. Fig. 6 is a front view and a side view showing an example of a cutter used in the cutting method of the present invention. 17 200930532 The seventh figure is a perspective view showing the cutter of the sixth figure mounted on the support. The eighth figure is a front view and a side view of the base plate. The ninth diagram is a front view and a side view of the cover panel. The tenth diagram is a schematic view showing an example of a cutter device. The eleventh diagram is a front view showing another example of a cutter suitable for use in the present invention. [Main component symbol description] 1 cutting wheel

2 Cutter 3 Glass substrate 11, 12 Adhesive layer 13 Protective film 21 Cutter 21a Through hole 21b Blade 21c, 21d Plane 22 Support 23 Elevating mechanism 24 Arm 25 Frame 31 Crack 41, 42 Resin film 43 Cut 51 Sleeve slip Taiwan 18 52 200930532

53 Ball screw 54, 55 Guide 56 Ball nut 59 Base 61 Guide member 62 Ball screw 63 Motor 64 Ball nut 65 Rotating mechanism 66 Rotary table 71 Base plate 72 Cover plate 73 Notch 74 Side 75 First Abutment surface 76-abutment surface 77 pin 78 sub-L 80, 81 screw hole 82 hole 83 convex portion 85, 86, 87 sub-L 91 base plate 92 cutter 200930532 laminated body 93, 94 abutting faces 95, 96 , 97 plane S Bu S2, S3, S4, S5

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Claims (1)

200930532 VII. Patent application scope: 1 . A method for cutting a laminated body in which one or two or more resin films are laminated on one surface side of a brittle material substrate, characterized in that: from the brittle material substrate The surface side opposite to the one side of the resin film forms a crack in a substantially perpendicular direction to the surface of the brittle material substrate. The range of the crack is 1% or more and less than 100% of the thickness of the brittle material substrate. Ο ❹ Then, all the knives are pressure-bonded to the position of the outermost resin film in the resin film at or near the surface of the resin film, so that the cutter moves relative to the layer body, and the cutting is performed so that the cutting is performed. The range of the slit reaches 90% or more of the thickness of the resin film closest to the side of the brittle material substrate and does not reach the brittle material substrate. 2. The method of cutting a laminate according to the scope of the invention, wherein the crack and the slit are formed, and a step of applying stress to the layer body is further included. The method for cutting a laminate according to the above-mentioned item, wherein: the above =, = the formation layer of the brittle material, the sheet and the sheet or the resin film of two or more The resin film is completely cut off by the cutter and the cutter, and the edge of the knife is in a state of the thickness of the bond. a side of the laminated body according to paragraph 2 or 3 of the cut-off side (4) is laminated on the side of the laminate, and the opposite surface of the resin film-face side is reversed to form the crack in the protective film and the The method of cutting a laminate according to the above-mentioned item 1, 2, 3 or 4, wherein: cutting is performed by a cutting wheel to form a crack on the brittle material substrate. The method of cutting a laminate according to the first, second, third or fourth aspect of the invention, wherein the laser is irradiated to form a crack on the brittle material substrate. 7. The method of cutting a laminated body according to the patent application section, wherein: the crimping force of the cutter is 〇1 〇1. The method of cutting a laminate according to the above-mentioned claim, wherein the method of forming a laminate of the resin film closest to the side of the brittle material substrate is: The crack is expanded to the side of the tree surface of the secret substrate, and the brittle material substrate is in a state of being cut or almost cut. The cutting method of the laminated body according to the patent application of the invention, wherein: the cutter is formed by removing the outer circumference including the blade from the disk forming the blade at the outer peripheral edge - Partially forming a plurality of planar cutters on the outer circumference. 10. A method for cutting a laminate according to the invention of claim i, 2, 3, 4, 5, 6, 7, S or 9 a cutting blade supported on a seat and freely attachable and detachable, wherein: a portion of the outer disk including the blade is removed from the outer peripheral edge to form a plurality of planes on the outer circumference; Any two planes of the plurality of planes are held on the support by two subtractive joints formed on the support 22 ❹ Ο 200930532, by changing the abutment with the abutment surface The two planes of the knife are used to change the position of the cutting edge of the cutter crimped on the resin film. 1 = The cutter used in the method of the laminated body described in the 1G item is as follows: The side semicircle is formed with a plurality of planes, and the other side semicircle is formed with a knife cutting method. Circumference: The abutting surface of the laminated body of the above-mentioned 1 (1) wide 11 is formed as a horizontal plane. 13. The cutting method of the first carcass of the patent application range is adopted by Yin. The knives, wherein: or 12 of the stacked knife angles are in the range of 20- to 802. The cutters used in the cutting method of the laminate of the first and second embodiments of the patent application, the item t The material is made of super hard alloy or sintered diamond. 23