201201959 六、發明說明： 【發明所屬之技術領域】 本發明是關於液晶顯示板、等離子顯示板等顯示面板 中，採用的玻璃基板以及其他硬質脆性板的倒角加工方法 和倒角加工裝置。 【先前技術】 顯示面板的玻璃基板通過割斷（分割並切斷）被切斷 爲預定尺寸，在割斷面（被割斷了的板厚方向的面）與面 板的表背面相交的部分形成有鋒利的棱線（邊）^該棱線 有可能成爲鋒利的刀具而給處理該面板的作業者帶來危 害。此外，在該棱線上往往存在小碎片（碎屑（chjpping))、 被稱作水平裂紋的小裂縫（以下統稱作“碎屑”），從而 存在著以該碎屑爲起點産生大的碎片、裂縫，或者由此産 生的被稱作碎玻璃的玻璃碎片附著於基板表面形成不合格 ⑽的情況。因此’使旋轉砂輪沿該棱線行進，進行將該棱 線斜著削去的倒角加工。 對於倒角加工所採用的砂輪的形狀、砂輪的旋轉軸的 方向等’提出有多種方案。近些年大多採用下述的倒角加 方法·旋轉砂輪轴與要倒角的棱線平行地設置，將多片 圓板狀的砂輪沿軸向隔開間隔地固定於所述旋轉砂輪軸， 使所述多片圓板砂輪—邊同時旋轉—邊與玻璃基板的棱線 平行地相對移動。 士 ® 1和圖6所示’在該倒角加工方法中’將砂輪轴 5ϋ 5d配置於玻璃基板2的割斷面22外側的上下，使安 裝於各砂輪軸上的多片圓板砂輪1 (1a〜1d)相互隔開間 3 201201959 隔，且配置成固定於上下砂輪軸5u、5d上的圓板砂輪彼此 進入到被固定於相反側的軸上的圓板砂輪之間利用上下 的圓板砂輪1的外周面同時對割斷面22的上下棱線7( 7U、 7d)進行倒角加工。 以往，在進行該倒角加工時，利用圓板砂輪1斜著被 :削成的面（倒角面）9(9u、9d)與破璃基板的板面（表 月面）8 ( 8u、8d )之間的夾角（倒角角度）0約爲4〇〜 45度’圓板砂輪，的旋轉方向如圖6的箭頭b所示，爲圓 板令輪1的周面11從板面8側向割斷面22側滑動摩擦倒 角面9的方向。 在現有的倒角加工中，使砂輪向圓板砂輪的周面彳1沿 從板面8側向割斷面22側離開（滑動摩擦）倒角面9的： 向旋轉’ it是爲了在砂輪的離去側多產生碎屑。即，這是 爲了在顯不面板的玻璃基板的板面設置電路圖案，並避免 在設有該電路圖案的那一側産生碎屑。 立此外，如圖7所示，加工所採用的多片圓板砂輪的刀 4 (外周部），在各圓板砂輪’ a〜，d的相對移動方向前方 的外周緣，形成有隨所述相對移動而切人玻璃基 狀的進刀自料面）’並將該進刀面11a的相_ 向後方作爲用於磨削至無火花（spa「k_〇ut)的圓筒面 。並且，採用如下結構：使多個圓板砂輪中相對移 ° :方的部分（先與玻璃基板抵接的部分）的直徑比後方 =口P :的直小，且使前後相鄰的圓板砂輪的直徑差形 .越罪後方的圓板砂輪相互間的直徑差越小。 201201959 請參看下述專利文獻： 專利文獻1 :日本發明公開2006-82147號公報。 專利文獻2 :日本發明公開2006-26845號公報。 隨著電子設備的小型化和輕量化，由於顯示面板的玻 璃基板的厚度變薄（薄壁化）、以及提高生産性的需求， 要求旋轉砂輪相對於玻璃基板的相對移動速度（進給速度） 的咼速化，並且有必要防止隨著所述薄壁化和高速化而呈 增加趨勢的不合格品的產生。即，使砂輪的進給速度高速 化，則容易産生碎屑’並且隨著玻璃基板的薄壁化，在倒 角加工時産生的碎屑在後續工序中形成大的裂縫、碎片的 可能性增大，因此，有必要比以往更嚴格地減少碎屑並防 止不合格品産生。 【發明内容】 本發明正是爲了解決上述的問題，其課題在於獲得能夠[Technical Field] The present invention relates to a chamfering processing method and a chamfering processing apparatus for a glass substrate and other hard brittle sheets used in a display panel such as a liquid crystal display panel or a plasma display panel. [Prior Art] The glass substrate of the display panel is cut into a predetermined size by cutting (division and cutting), and a sharp portion is formed in a portion where the cut surface (the surface in the direction of the cut thickness direction) intersects the front and back surfaces of the panel. The ridge line (edge) ^ This ridge line may become a sharp tool and pose a hazard to the operator who handles the panel. In addition, there are often small fragments (chjpping) on the ridge line, small cracks called horizontal cracks (hereinafter collectively referred to as "chips"), so that there is a large fragment starting from the debris, The crack, or the resulting glass shards called cullet, adhere to the surface of the substrate to form a failure (10). Therefore, the rotating grinding wheel is advanced along the ridge line, and the chamfering process for cutting the ridge line obliquely is performed. There are various proposals for the shape of the grinding wheel used for chamfering, the direction of the rotating shaft of the grinding wheel, and the like. In recent years, the chamfering method described below is generally employed. The rotating grinding wheel shaft is disposed in parallel with the ridge line to be chamfered, and a plurality of disc-shaped grinding wheels are fixed to the rotating grinding wheel shaft at intervals in the axial direction. The plurality of disc grinding wheels are simultaneously rotated while moving side by side parallel to the ridge line of the glass substrate. In the 'Chamfering method', the grinding wheel shaft 5ϋ 5d is placed on the upper and lower sides of the cut surface 22 of the glass substrate 2 to form a plurality of circular grinding wheels 1 attached to the respective grinding wheel shafts ( 1a to 1d) spaced apart from each other 3 201201959, and the circular plate grinding wheels fixed to the upper and lower grinding wheel shafts 5u, 5d are placed between the circular plate grinding wheels fixed to the opposite side of the shaft, and the upper and lower circular plates are used. The outer peripheral surface of the grinding wheel 1 simultaneously chamfers the upper and lower ridge lines 7 (7U, 7d) of the cut surface 22. Conventionally, in the chamfering process, the rounded grinding wheel 1 is inclined by the surface (the chamfered surface) 9 (9u, 9d) and the surface of the glass substrate (the surface of the moon) 8 (8u, The angle between the 8d) (chamfer angle) 0 is about 4〇~45 degrees. The direction of rotation of the circular plate grinding wheel is as shown by the arrow b in Fig. 6, which is the circumferential surface 11 of the circular plate wheel 1 from the plate surface 8. The lateral cut section 22 side slides the direction of the rubbing chamfered surface 9. In the conventional chamfering process, the grinding wheel is moved toward the circumferential surface 彳1 of the circular plate grinding wheel from the side of the plate surface 8 toward the side of the cutting section 22 (sliding friction) of the chamfering surface 9: the rotation 'it is for the grinding wheel More debris is produced on the leaving side. That is, this is to provide a circuit pattern on the surface of the glass substrate on which the panel is displayed, and to avoid generation of debris on the side where the circuit pattern is provided. Further, as shown in Fig. 7, the knives 4 (outer peripheral portions) of the plurality of circular plate grinding wheels used for the machining are formed on the outer peripheral edge of the respective disc grinding wheels 'a to d in the forward direction of the relative movement direction, as described above. Relatively moving, the glass-shaped infeed is fed from the material surface)' and the phase of the infeed surface 11a is rearward as a cylindrical surface for grinding to a non-sparking (spa "k_〇ut"). The following structure is adopted: the relative movement of the plurality of circular plate grinding wheels is relatively small: the diameter of the square portion (the portion abutting the glass substrate first) is smaller than the diameter of the rear surface of the port P: and the adjacent circular disk grinding wheel In the case of the diameter difference, the diameter difference between the disc wheels after the sin is smaller. 201201959 Please refer to the following patent documents: Patent Document 1: Japanese Invention Publication No. 2006-82147. Patent Document 2: Japanese Invention Publication 2006-26845 With the miniaturization and weight reduction of electronic equipment, the thickness of the glass substrate of the display panel is reduced (thinning) and the demand for productivity is increased, and the relative moving speed of the rotating grinding wheel relative to the glass substrate is required. Speeding up the speed), and Further, it is necessary to prevent the occurrence of defective products which tend to increase as the thickness is reduced and the speed is increased. That is, when the feed speed of the grinding wheel is increased, debris is easily generated and along with the thin wall of the glass substrate Since the chips generated during the chamfering process are likely to form large cracks and fragments in the subsequent process, it is necessary to reduce the chips more strictly than before and prevent the occurrence of defective products. The present invention is to solve the above problems, and the object of the present invention is to obtain
P制碎屑的産±，並且以更高速度對玻璃基板進行倒角加 工的技術手段。 本發明的倒角加工方法炱，世^+ _ 次馬對於在顯不面板的玻璃基板 及其他硬質脆性板2的割斷 d斷面22和板面8相交的部分所形 成的鋒利的棱線7，使繞 見一該棱線平行的砂輪軸5旋轉的多 片圓板砂輪1相對於接綠 、棱線7平行地進給的同時，利用圓板 砂輪1的周面11斜著削去該棱線。 在本發明的倒角加工 方法中’將通過削去棱線7形成的 傾斜的倒角面9與板面8夕„ 之間的夾角（倒角角度）Θ設爲 201201959 35度〜饧度的範圍的角度，並使圓被砂輪，的旋轉方向爲 與以往相反的方向，即、進行旋轉砂輪的周面”從割斷面 22側向板面8側滑動摩擦倒角面9的方向的旋轉，由此解 決了上述課題。 即，本發明所述的硬質脆性板的倒角加工方法的特徵在 於，對硬質脆性板2的板面8(8u、8d)和割斷面22相交 的棱線7(7U、7d)，利用繞與該棱線平行的砂輪轴5(5卜 ⑽疋轉且與該棱線平行地相對進給移動的多個圓板砂輪， (1a〜⑷的短圓錐狀或者短圓筒狀的周面川⑴、川 進行磨削，並將該棱線7斜著削去，其令，將板面8盘被 斜者削去的面（倒角面）9之間的夾角設定爲35〜15度 並且使圓板砂輪1沿圓板砂輪1的周面”從該棱線7:倒 角面9的割斷面22側向板面8側滑動摩擦該棱線7或倒角 面9的方向進行旋轉。 三個以上圓板砂輪1隔開間隔地配置於一根砂輪轴5上 的上述倒角加工方法中的所述三個以上圓板砂輪伪〜代的 直㈣成爲’使第一個與被削去的棱線7或倒角 料的圓板砂輪13的直徑比第二個滑動摩擦的圓板仰 ^的直徑小，並且使最後-個滑動摩擦的圓板砂輪^的: k與最後—個的前一個滑動摩擦的圓板…c的直徑相 性板丁倒角加工，由此’特別是在板厚薄的硬質跪 板的倒角加工中’能夠得到更加平滑的倒角面9β 201201959 適於實施本發明的倒角加工方法的倒角加工裝置的特 徵在於’該倒角加工裝置具備：工作臺3，所述工作臺3以 載置硬質脆性板的下表面的狀態支撐硬質脆性板的下表 面’砂輪單元4,所述砂輪單元4配置於該工作臺的寬度方 向兩側；以及進給裝置，所述進給裝置使該砂輪單元相對 於工作臺3在該工作臺的面内向與所述寬度方向X正交的 方向Y相對移動，所述砂輪單元4具備繞與要進行倒角的 硬質脆性板的棱線7平行的上下砂輪轴5旋轉的多個圓板 砂輪1’利用所述圓板砂輪^短圓錐狀或者短圓筒狀的周 面1 1磨削硬質脆性板2的板面8與割斷面22相交的所述 棱線7,其中’該倒角加工裝置具備：砂輪電動機6(6二 ，所述砂輪電動機6(6u、6d)驅動所述砂輪軸5朝 正向和反向旋轉；以及升降支架14，所述升降支架“設定 所述上下砂輪軸5u、5d的 ^所述上下的砂輪1中的一 方經由該升降支架14裝配於砂輪座12上。 通過採用上述妹播沾彳 μ, 構的倒角加工裝置，能夠以同—穿置進 灯利用現有方法的倒自 裝置進 工。 j角加4利用本發明的方法的倒角加 隨著作爲倒角加工的物件的硬質脆 薄，其割斷面側的切的板厚變 :i也不传不減小， 倒角面9與板面8 因此必然使 <間的夾角θ變小，以 情況則變爲35度以τ 爲4〇〜45度的 下，例如30度或者2〇度。 201201959 伴隨旋轉砂輪1滑動摩擦倒角面9而產生的碎屑，容易 產生在砂輪向切屬從主體分離的方向滑動摩擦的砂輪周面 1 1的離開側。 因此，在使圓板砂輪]朝向從硬質脆性板2的割斷面 側向板面8側㈣摩擦砂輪周面心方向旋轉的本發明 的Γ法中，雖然考慮到了忌緯產生碎屬的板面8侧會產生 大里碎屑，然而通過減小該部分 J X两θ而增大了對碎屑 的抑制效果，從而抑制了 I利Γ板面8側的碎屑的產生。 另—方面，割斷面22側爲砂銓用而“ j舄y輪周面11的進入側，因此 與現有方法相比也減少了. Γ在該割斷面的碎屑的産生。即， 根據本發明的方法，一 制了板面8側和倒角面9側的 碎屑，能夠降低因後續工序中 & 斤甲砰屑引起的缺損而産生不合 口口。此外，由於_併抑制 市j 了割斷面22側和板面8側的碎 屑，因此能夠使圓板砂輪彳 _ 了於硬質脆性板的進給速度 南速化，能夠實現加工速度的提高。 此外’隨著硬質脆性板 的溥壁化和倒角面Θ與板面8 之間的夾角Θ減小，磨削4 σ寺的加工反作用力引起的硬 質脆性板2的撓曲增加了。 μ撓曲爲倒角面9從圓板砂輪] 離開的方向的撓曲’因此 彳史疋心要利用砂輪的直徑差獲 侍預期的進刀量’也會因該挽 又疋々里減小與硬質脆 十板2的撓曲增大相應的 ^ m k思未者，即使是前後相鄰 的圓板砂輪的直徑差爲〇，德碎 後々的圓板砂輪還是存在著與因 201201959 硬質脆性板的撓曲而切削留存的量相應的進刀量。 即，在將三片以上圓板砂輪裝配於一根砂輪軸並以本發 明的方法進行倒角加工時’對於進刀量小的最後一個砂 輪，根據情況不同，通過使最後一個砂輪和倒數第二個= 輪與倒數第二個砂輪前方的砂輪直徑相同，能夠職予適量 的進刀量，充分地㈣至無火花，能夠㈣平滑的倒角^ 【實施方式】 以下，參照圖i〜圖5和圖8、圖9，對本發明進一步 說明。圓中的例子爲將四片圓板砂輪設置於一根砂輪 例子。 ’ 在圖1、圖2中’作爲加工物件的玻璃基板2具有相互 平行的對置側邊21。玻璃基板2通過真空吸附等被固定於 工作臺 對置的兩側邊21處於從該工作臺伸出的狀態。 砂輪單元4由與玻璃基板的側邊21平行的方向的上下 砂輪轴〜、5d、以及被固定於各個砂輪軸的各四片圓板砂 輪1a〜1d構成。各砂輪軸5u、&的基端被固定並支撐於 圖5所示的砂輪電動機6u、6d的轴上。砂輪電動機⑼、 6d可正轉和反轉。在利用本發明的方法進行倒角加工時， 砂輪電動機㈣向與現有方法相反的方向旋轉，即使 l:r5U、5d"下述方向旋轉：各圓板砂輪的周面11從 L面22侧向板面8側滑動摩擦玻璃基板2的棱線7的部 刀的方向（圖2的箭頭A方向）。此時’如圖2所示切 201201959 削液（通常爲純水）從設於 輪早元4的與玻璃基板相反 一側的切削液噴嘴19朝向割斷面22噴射。 上下砂輪電動機中的—個 砂輪電動機6d被裝配於砂輪 座12的固定位置，另一砂 y %電動機6u則被裝配於升降支 架14，所述升降支架14利用 不J用升降電動機13以自由升降和 疋位的方式設於砂輪座1 2。z，丨、认+ 掏座12砂輪座12裝配在設於工作臺3 的寬度方向（圖1的箭頭X方向）兩側的未圖示的立柱(支P is a technical means for chamfering the glass substrate at a higher speed. According to the chamfering method of the present invention, the sharp ridge line 7 formed by the portion of the glass substrate and the other hard brittle sheets 2 where the cut d section 22 and the board surface 8 intersect is formed. The plurality of circular plate grinding wheels 1 that rotate around the grinding wheel shaft 5 in which the ridge lines are parallel are fed in parallel with the greening and ridge lines 7, and are cut obliquely by the circumferential surface 11 of the circular plate grinding wheel 1. Ridge line. In the chamfering method of the present invention, the angle (chamfer angle) between the inclined chamfered surface 9 formed by the ridge line 7 and the slab surface 8 is set to 201201959 35 degrees to 饧 degrees. The angle of the range is such that the rotation direction of the grinding wheel is the opposite direction to the conventional one, that is, the circumferential surface of the rotating grinding wheel is rotated in the direction of sliding the chamfering surface 9 from the side of the cutting section 22 toward the side of the plate surface 8 . This solves the above problems. That is, the chamfering method of the hard brittle sheet according to the present invention is characterized in that the ridge line 7 (7U, 7d) intersecting the plate surface 8 (8u, 8d) of the hard brittle sheet 2 and the cut surface 22 is utilized. A plurality of circular grinding wheels 5 (5b (10)) which are parallel to the ridge line and which are moved in parallel with the ridge line, and have a short conical shape or a short cylindrical shape of the circumferential surface of (1a to (4) (1), the Sichuan grinds, and the ridge line 7 is obliquely cut, so that the angle between the face (the chamfered surface) 9 on which the plate 8 is chamfered is set to 35 to 15 degrees and The disk grinding wheel 1 is rotated along the ridge line 7: the cut surface 22 side of the chamfer surface 9 toward the plate surface 8 side in the direction in which the ridge line 7 or the chamfer surface 9 is rubbed along the circumferential surface of the circular plate grinding wheel 1. The three or more disc grinding wheels of the three or more disc grinding methods in which the three or more disc grinding wheels 1 are disposed at intervals on one of the grinding wheel shafts 5 are made "to the first one and are cut." The diameter of the circular rim line 7 of the ridge line 7 or the chamfer is smaller than the diameter of the second sliding friction disc, and the last sliding friction disc wheel: k and most The diameter of the first sliding friction disc...c is chamfered by the phase of the slab, which makes it possible to obtain a smoother chamfered surface in the chamfering process of the hard slab of the thin plate. 9β 201201959 The chamfering apparatus for carrying out the chamfering processing method of the present invention is characterized in that the chamfering processing apparatus includes a table 3 that supports the hard brittle board in a state in which the lower surface of the hard brittle board is placed. a lower surface 'grinding wheel unit 4, the grinding wheel unit 4 is disposed on both sides in the width direction of the table; and a feeding device that causes the grinding wheel unit to face in the plane of the table with respect to the table 3 The direction Y orthogonal to the width direction X is relatively moved, and the grinding wheel unit 4 is provided with a plurality of circular grinding wheels 1' that rotate around the upper and lower grinding wheel shafts 5 parallel to the ridge line 7 of the hard brittle plate to be chamfered. a circular plate grinding wheel ^ a short conical or short cylindrical peripheral surface 1 1 grinding the ridge line 7 of the plate surface 8 of the hard brittle plate 2 and the cutting section 22, wherein the chamfering processing device is provided with: a grinding wheel Motor 6 (6 two, said The wheel motor 6 (6u, 6d) drives the grinding wheel shaft 5 to rotate in the forward and reverse directions; and the lifting bracket 14 that "sets the upper and lower grinding wheels 1 of the upper and lower grinding wheel shafts 5u, 5d" One of the two is attached to the wheel head 12 via the elevating bracket 14. By using the above-described scissor processing device, the chamfering device can be used to perform the same method of inserting the lamp into the lamp using the conventional method. Adding 4 using the method of the present invention, the chamfering is added to the hard and thin object of the chamfered object, and the thickness of the cut sheet on the side of the cut section is changed: i does not pass or decrease, the chamfered surface 9 and the surface of the board 8 Therefore, the angle θ between < is inevitably made small, and in the case of 35 degrees, τ is 4 〇 to 45 degrees, for example, 30 degrees or 2 degrees. 201201959 The debris generated by the sliding of the grinding chamfer surface 9 with the rotating grinding wheel 1 is likely to occur on the leaving side of the peripheral surface 11 of the grinding wheel which is slidably rubbed in the direction in which the grinding wheel is separated from the main body. Therefore, in the boring method of the present invention in which the disk grinding wheel is rotated from the cut surface side of the hard brittle plate 2 toward the plate surface 8 side (four) in the circumferential direction of the friction grinding wheel, it is considered that the slat surface is generated by the flank. On the 8 side, large debris is generated. However, by reducing the portion of JX two θ, the effect of suppressing debris is increased, thereby suppressing the generation of debris on the side of the plate 8 side. On the other hand, the side of the cut section 22 is used for the sand shovel and "j y y the entry side of the circumferential surface 11 of the wheel, so that it is also reduced compared with the conventional method. The generation of debris in the cut section. According to the method of the invention, the chips on the side of the plate surface 8 and the side of the chamfer surface 9 are formed, which can reduce the gap caused by the defects caused by the smashing of the squid in the subsequent process. In addition, due to the _ and the suppression of the city Since the scraps on the side of the cut surface 22 and the side of the plate surface 8 are cut, it is possible to increase the feed speed of the round rim rim to the south of the hard brittle board, and to improve the processing speed. The angle between the wall and the chamfered surface is reduced, and the deflection of the hard brittle sheet 2 caused by the machining reaction force of the grinding 4 σ temple is increased. μ deflection is the chamfering surface 9 The circular plate grinding wheel] the deflection of the direction of departure 'so the history of the use of the difference in the diameter of the grinding wheel to obtain the expected amount of the feed will also reduce the deflection of the hard and crisp 10 Increase the corresponding ^ mk thinking, even if the diameter difference between the front and rear adjacent circular grinding wheels is 〇, The round disc of the rear cymbal still has an infeed amount corresponding to the amount of cutting retained by the flexing of the hard fragile plate of 201201959. That is, the method of the present invention is performed by assembling three or more disc grinding wheels on one grinding wheel shaft. When chamfering is performed, 'for the last grinding wheel with a small amount of feed, depending on the situation, by making the last grinding wheel and the penultimate wheel and the grinding wheel in front of the penultimate grinding wheel have the same diameter, you can work in the right amount. The amount of the blade is sufficiently (four) to no spark, and can be (four) smooth chamfering ^. [Embodiment] Hereinafter, the present invention will be further described with reference to Figs. 1 to 5 and Figs. 8 and 9. The example in the circle is a four-circle circle. The plate grinding wheel is provided in an example of a grinding wheel. 'In Fig. 1 and Fig. 2', the glass substrate 2 as a workpiece has opposite side edges 21 which are parallel to each other. The glass substrate 2 is fixed to the table opposite by vacuum suction or the like. The both side edges 21 are in a state of being extended from the table. The grinding wheel unit 4 is composed of upper and lower grinding wheel shafts ~, 5d in a direction parallel to the side edges 21 of the glass substrate, and four circular plates fixed to the respective grinding wheel shafts. The grinding wheels 1a to 1d are formed. The base ends of the respective grinding wheel shafts 5u, & are fixed and supported on the shafts of the grinding wheel motors 6u, 6d shown in Fig. 5. The grinding wheel motors (9), 6d can be rotated forward and reverse. When the chamfering process is performed, the grinding wheel motor (4) rotates in the opposite direction to the conventional method, even if l: r5U, 5d" rotates in the following direction: the circumferential surface 11 of each of the circular grinding wheels is from the L surface 22 side to the board surface 8 The side slides the direction of the knives of the ridge line 7 of the glass substrate 2 (the direction of the arrow A in Fig. 2). At this time, as shown in Fig. 2, the 201201959 cutting liquid (usually pure water) is set from the wheel early 4 The cutting fluid nozzle 19 on the side opposite to the glass substrate is sprayed toward the cutting section 22. One of the grinding wheel motors 6d in the upper and lower grinding wheel motors is mounted at a fixed position of the wheel head 12, and the other sand y % motor 6u is mounted on the lifting bracket 14. The lifting bracket 14 is provided to the wheel head 12 by means of a lifting/lowering motor 13 for free lifting and clamping. z, 丨, + + 掏 12 12 wheel base 12 is attached to a column (not shown) provided on both sides of the table 3 in the width direction (arrow X direction of Fig. 1)
柱）上，並且沿寬度方向和上下方向（硬質脆性板2的厚 度方向）自由移動和定位。 在對玻璃基板2的上下棱線7u、7d以相同的倒角角度 e和倒角量q行倒㈣，在使升降支㈣升降來設定上 ^輪軸5U、5d的間隔後，將砂輪座12的高度設定爲 使上下砂輪軸5u、5d &中間高度位於玻璃基板的厚度中 =並將y輪座12的寬度方向位置設定爲使進給方向上的 最後的圓板砂輪1」的周面切削出預定的倒角面9的位置。 對於厚度相同的玻璃基板，通過升降支架14的位置設定使 倒角角度Θ變化。即’使上下砂輪軸5u、&接近則倒角角 又Θ i曰大，而使上下砂輪軸5u、5d遠離則倒角角度㊀減小。 子破璃基板的邊緣的上下棱線7U、7d以不同的倒角 角度Θ進行倒角加工時’使砂輪座12能夠繞與玻璃基板的 邊緣21平行的軸擺動地進行定位，或者使砂輪軸5u、5d 的根蛉輪軸以能夠相對於另一根砂輪軸沿玻璃基板的 201201959 寬度方向調整位置的方式裝配於砂輪座12。 固定玻璃基板2的工作臺3相對於砂輪單元4、一应 棱線7平行的圖1的箭頭丫方向進給移動。在伴隨著該進 給移動的磨削加工過程中，圖中的圓板砂輪h爲進仏方向 的第一個（第-級）圓板砂輪，圓板砂輪1d爲最後—個（最 終極）圓板砂輪。 在各圓板砂輪1的位於各玻璃基板的進人側的外 周前緣設有進刀用的圓錐面11a。該圓錐面是頂角爲的度 的固錐面’且其進刀尺寸（因玻璃基板的撓曲，實際的進 刀量比該進刀尺寸）L & , /XI I 1 人τ H L爲’例如在圖3的例子中，第—級 爲〇.3mm’第三級爲0.2_。第一級與第二級的砂輪直徑 相同’第三級與最終極的砂輪直徑相同。此外在圖4的 例子中，第-級爲0.2mm，第二級爲〇1咖。第二級〜最 終極的砂輪直徑相同。 將兩側的砂輪單元4如上所述地設定，並使砂輪轴5心 5d旋轉，採用使玻璃基板的邊緣21從—端部。向另一端 部24通過砂輪單μ的方式使卫作臺3進給，從而同時對 玻璃基板2的兩側邊緣的上下棱線7u、川進行倒角加工。 圖8和圖9示出了，在採用繞與要進行倒角加工的棱線 平行的軸旋轉的—片圓板砂輪，並設進刀尺寸A 100微米 和200微米（0.1mm#〇0.2mm)、且倒角角度爲3〇度和 20度的情況下，對砂輪的相對進給速度與進行倒角加工時 201201959 產生的最大碎屬的尺寸之間的關係進行 尹’ Α〜ε表示砂輪的種類，接在A 的結果。在圖 和200是以微 E的文字後面的100 俽木爲早位不出的進刀 角度爲20庠AA & Ύ。如圖所示，倒角 角…。度的情況與倒角角度爲 個異常點"外，產生的碎屬的尺 况相比，除了- 試驗結果判斷出，在進給速 、。此外，根據該 —的高速進給區域 〜速度超過 ^ . Α , 碎屬的尺寸減小，在倒角自 φ 度較小且板厚薄的硬質臉 J角角 更買脆/1板的倒角加 的方法能夠進行少產生 又 今桷且问速的倒角加工。 【圖式簡單說明】 圖1是用於表示本發明之倒角 圖2是用於表示本發明之倒角力广的…意圖。 ^ ^ ^ σ工方法中的硬質脆性 板與圓板砂輪關係的示意圖。 目3是用於表示將四片圓板砂輪裝配於—根砂輪軸時 _各圓板砂輪的周緣形狀的示意圖。 圖4是用於表示上述情況下其他的周緣形狀的示意圖。 圖5是本發明之倒角加工裝置的主要部分的立體圖。 圖6是現有倒角Λ 方法中的硬質脆性板與圓板砂輪 的關係的示意圖。 圖7是用於表示將四片圓板砂輪裝配於一根砂輪轴時 各圓板砂輪的現有周緣形狀的示意圖。 圖8是表示倒角角度爲3〇度時碎屑産生狀況的說明圖。 [S] 12 201201959 圖9是示出倒角角度爲20度時碎屑産生狀況的說明圖。 【主要元件符號說明】 I ( 1 a〜1 d )圓板砂輪 2硬質脆性板 3工作臺 4砂輪單元 5(5u、5d)石少輪軸 ^ 6(6u、6d)砂輪電動機 7棱線 8 (8u、8d)板面 9 ( 9u 、 9d)倒角面 II (11a、11b)圓板砂輪的周面 1 2砂輪座 13升降電動機 φ 14升降支架 21側邊 22割斷面 23端部 24另一端部 Θ夾角 X寬度方向Y工作臺的進給方向 [s] 13The column is freely moved and positioned in the width direction and the up and down direction (the thickness direction of the hard brittle plate 2). The upper and lower ridgelines 7u and 7d of the glass substrate 2 are inverted at the same chamfering angle e and the amount of chamfering q, and after the elevating branch (four) is raised and lowered to set the interval between the upper and lower axles 5U and 5d, the wheel holder 12 is placed. The height is set such that the intermediate height of the upper and lower grinding wheel shafts 5u, 5d & is located in the thickness of the glass substrate = and the width direction position of the y wheel base 12 is set to the circumferential surface of the last disc grinding wheel 1" in the feeding direction. The position of the predetermined chamfered surface 9 is cut. For the glass substrate having the same thickness, the chamfer angle Θ is changed by the position setting of the elevating bracket 14. That is, when the upper and lower grinding wheel shafts 5u and & are approached, the chamfering angle is increased, and the chamfering angle is decreased as the upper and lower grinding wheel shafts 5u and 5d are moved away. When the upper and lower ridgelines 7U, 7d of the edge of the sub-glass substrate are chamfered at different chamfering angles ' "the grinding wheel holder 12 can be oscillated about an axis parallel to the edge 21 of the glass substrate, or the grinding wheel shaft The root shaft of the 5u, 5d is mounted to the wheel head 12 so as to be positionable relative to the other wheel axis in the width direction of the 201201959 glass substrate. The table 3 on which the glass substrate 2 is fixed is moved in the direction of the arrow 图 of Fig. 1 in parallel with the grinding wheel unit 4 and a ridge line 7. In the grinding process accompanying the feed movement, the circular grinding wheel h in the figure is the first (first-stage) circular grinding wheel in the direction of the advancement, and the circular grinding wheel 1d is the last one (the final pole). Round plate grinding wheel. A conical surface 11a for feeding is provided on the outer peripheral edge of each of the circular plate grinding wheels 1 on the entry side of each of the glass substrates. The conical surface is a solid cone surface of the degree of the apex angle and its feed size (the actual feed amount is larger than the feed size due to the deflection of the glass substrate) L & /XI I 1 person τ HL is 'For example, in the example of Fig. 3, the first stage is 〇.3mm' and the third level is 0.2_. The grinding wheels of the first and second stages have the same diameter. The third stage has the same diameter as the final stage. Further, in the example of Fig. 4, the first level is 0.2 mm, and the second level is 〇1 coffee. The second stage ~ the most extreme grinding wheel has the same diameter. The grinding wheel unit 4 on both sides is set as described above, and the center of the grinding wheel shaft 5 is rotated 5d, and the edge 21 of the glass substrate is used as the end portion. The guard table 3 is fed to the other end portion 24 by means of a single wheel of the grinding wheel, thereby simultaneously chamfering the upper and lower ridge lines 7u and Sichuan on both side edges of the glass substrate 2. Figures 8 and 9 show a disc-shaped disc rotating around an axis parallel to the ridge line to be chamfered, and setting the feed size A 100 μm and 200 μm (0.1 mm #〇0.2 mm ), and the chamfer angle is 3 和 and 20 degrees, the relationship between the relative feed rate of the grinding wheel and the size of the largest fragment produced by the 201201959 when chamfering is performed is ' Α ε ε represents the grinding wheel The type, the result of the A. In the figure and 200, the angle of the 100-inch coffin behind the micro-E text is 20庠AA & As shown, the chamfer angle.... The degree of the situation and the angle of chamfering are an abnormal point ", in addition to the resulting size of the subordinates, except - the test results are judged at the feed rate. In addition, according to the high-speed feed area of the - speed exceeds ^. Α , the size of the broken genus is reduced, and the chamfering of the hard face of the hard face is smaller than the φ degree and the thickness is thin. The addition method is capable of performing chamfering processing which is less likely to occur and which is slower. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a chamfer of the present invention. Fig. 2 is a view showing a wide range of chamfering force of the present invention. ^ ^ ^ Schematic diagram of the relationship between hard brittle plates and circular grinding wheels in the σ method. Item 3 is a schematic view showing the peripheral shape of each of the disc grinding wheels when the four disc grinding wheels are assembled to the root grinding wheel. Fig. 4 is a schematic view showing another peripheral shape in the above case. Fig. 5 is a perspective view of a main part of the chamfering apparatus of the present invention. Fig. 6 is a schematic view showing the relationship between a hard brittle plate and a circular plate grinding wheel in the conventional chamfering method. Fig. 7 is a schematic view showing the conventional peripheral shape of each of the circular grinding wheels when four disc grinding wheels are assembled to one grinding wheel shaft. Fig. 8 is an explanatory view showing a state of generation of debris when the chamfer angle is 3 〇. [S] 12 201201959 FIG. 9 is an explanatory view showing a state of generation of debris when the chamfer angle is 20 degrees. [Description of main component symbols] I (1 a~1 d) Round plate grinding wheel 2 Hard brittle plate 3 Workbench 4 Grinding wheel unit 5 (5u, 5d) Stone less axle ^ 6 (6u, 6d) Grinding wheel motor 7 ridge line 8 ( 8u, 8d) Slab 9 (9u, 9d) chamfered surface II (11a, 11b) circumferential surface of the circular grinding wheel 1 2 grinding wheel seat 13 lifting motor φ 14 lifting bracket 21 side 22 cutting section 23 end 24 other end Θ angle X width direction Y table feed direction [s] 13