JP2013095649A - Method for producing brittle material substrate from mother brittle material substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a brittle material substrate from a mother brittle material substrate, by which quality (end face strength) of a cleaved face of a brittle material substrate after scribing is enhanced.SOLUTION: In the method for producing a brittle material substrate from a mother brittle material substrate, a large number of abrasive granules 23, containing water and formed by aggregating a plurality of abrasive grains, are blown on an end face 22 of a brittle material substrate 20 formed from the mother brittle material substrate by means of a scribing wheel to polish the end face of the brittle material substrate. Only the end face 22 of the brittle material substrate 20 can be favorably polished by holding the brittle material substrate 20 by implements 21a, 21b in such a way that only the end face 22 is exposed in polishing.

Description

  The present invention relates to a method for manufacturing a brittle material substrate from a mother brittle material substrate so that the quality (end surface strength) of the fractured surface of the brittle material substrate after scribing is increased.

  Conventionally, in the manufacturing process of flat display panels such as liquid crystal display panels and organic electroluminescence (EL) panels, and solar cells, a brittle material substrate scribing process is provided. For example, a liquid crystal display panel has a configuration in which two glass substrates are bonded together and liquid crystal is injected into the gap. In addition, in the case of a reflective substrate among projector substrates called LCOS, a pair of substrates in which a quartz substrate and a semiconductor wafer are bonded together are used. A bonded substrate obtained by bonding such substrates usually forms a scribe line on the surface of a large size bonded substrate which is a mother substrate, and then breaks the substrate along the formed scribe line, The unit substrate is divided into predetermined dimensions.

  In these cutting and cutting processes, a scribe line is formed by rolling the scribing wheel on the surface of the brittle material substrate while loading the scribing wheel according to various conditions such as the material and thickness of the brittle material substrate. Then, by applying a predetermined force to the brittle material substrate, the brittle material substrate is divided along the scribe line to manufacture individual panels and glass plates.

  In this specification, forming a scribe line on a mother substrate is referred to as “scribe”, and breaking the mother substrate along a scribe line formed by scribing is referred to as “break”. Dividing into brittle material substrates of a desired size by means of “cleaving” is called “cleaving”, and further, dividing the brittle material substrate cleaved through conveyance after the cleaving step into individual unit substrates is called “separation”. In the present specification, the property of a scribing wheel that extends a vertical crack from the surface of the substrate in the thickness direction of the substrate by forming a scribe line is referred to as a “penetration effect”.

  By the way, as a result of various improvements in substrate materials and heat treatment processing in glass material manufacturers, when scribing using a scribing wheel (hereinafter also referred to as a normal wheel) with a conventional cutting edge (normal cutting edge) In addition, a phenomenon has been observed in which the cutting edge slips on the surface of the substrate immediately after the wheel rolls, that is, the scribe line does not begin to form immediately after the wheel rolls. For this reason, a “good” cutting edge is required rather than a conventional scribing wheel having a normal cutting edge. In addition, the “good” point can be coped with by using a scribing wheel (hereinafter also referred to as “high penetration wheel”) disclosed in Patent Document 1 below. The quality of the cross section, that is, the end face strength is lowered, and for example, it becomes difficult to ensure the end face strength quality standard required at the manufacturing site of the flat display panel.

  On the other hand, the following Patent Document 2 was formed on the outer peripheral edge portion in the same manner as the scribing wheel disclosed in Patent Document 1 below, for the purpose of improving the coverage on the glass surface while suppressing the high penetration effect. A plurality of cutouts and protrusions alternately formed in the circumferential direction along the circumferential ridge line are provided, but the circumferential length of the cutouts is shorter than the circumferential length of the protrusions. An invention of a scribing wheel (hereinafter also referred to as “medium penetration wheel”) is disclosed. When the medium penetration wheel disclosed in the following Patent Document 2 is used, the permeability and coverage are inferior to those of the high penetration wheel disclosed in the following Patent Document 1, but higher end surface strength is achieved. In addition, although the end face strength is inferior to that in the case of using a normal wheel, it has an excellent effect that the permeability and the covering property are good.

  In addition, in recent years, it has been demanded to suppress an increase in weight while adopting a large-sized display device for a portable device, and accordingly, a thinner glass substrate is used. It has become like this. According to the display device employing such a thin and large glass substrate, if the edge surface strength of the glass substrate is weak, the glass substrate may be destroyed when an external force is applied to the display surface. .

  Here, a mechanism generated in the brittle material substrate when the brittle material substrate is scribed using a scribing wheel will be described with reference to FIGS. FIG. 5 is a side view schematically showing a state of scribing with the scribing wheel, and FIG. 6 is a front view schematically showing how vertical cracks are generated in the scribing of FIG.

  First, during scribing, a load acts on the cutting edge of the scribing wheel, causing elastic deformation on the surface of a brittle material such as a glass substrate that is in contact with the cutting edge. Deformation occurs. When the blade load further increases, the limit point of plastic deformation is exceeded. As a result, brittle fracture occurs, and vertical cracks begin to grow in the thickness direction of the brittle material. The vertical crack grows at the depth of the tip of the vertical crack depending on the blade edge load and the material and thickness of the brittle material (the distance from the surface of the brittle material, also referred to as the “depth of arrival”). It ends when it reaches it.

  Thus, when scribing using a scribing wheel, press marks based on plastic deformation and vertical cracks based on brittle fracture are formed, so that even if a brittle material substrate such as a glass substrate is subsequently cleaved and divided, The split section is not a smooth flat surface, and the quality of the split section is inferior. Therefore, when individual brittle material substrates are obtained from the mother brittle material substrate using a scribing wheel, the end face strength is lowered.

  For this reason, after cleaving using a scribing wheel, an end face treatment for improving the end face strength is performed by mechanically and chemically processing the end face of a brittle material substrate such as a glass substrate. As this end surface treatment, a method for polishing a glass end surface with a grindstone (see Patent Document 3 below), a chemical strengthening method for performing titanium infiltration treatment on the glass end surface (see Patent Document 4 below), and chemically etching the glass end surface. The method (refer patent document 5 below) etc. to employ | adopt is adopted.

  Here, a method of polishing a glass end face disclosed in Patent Document 3 below with a grindstone will be described with reference to FIG. FIG. 7 is a front view of a glass end face polishing machine disclosed in Patent Document 3 below. The glass end surface polishing machine 50 includes a pair of support legs 53, a pair of polishing apparatuses 54, and a glass support 55 via an intermediate support base 52 mounted on a base 51. The glass support 55 floats and supports the glass substrate 56 by air pressure. The pair of support legs 53 is provided with a vacuum suction means 57 inside, and sucks the back surface of the glass substrate 56 placed on the glass support 55 to support the glass substrate 56.

  Further, each of the pair of polishing apparatuses 54 is provided with a rotating grindstone 58 at a position where it abuts against the end surface of the glass substrate 56. End portions of the glass substrate 56 are supported by the vacuum suction means 57 provided on the glass support 55 and the pair of support legs 53, and the end surfaces of the glass substrate 56 are rotated while being conveyed in a direction orthogonal to the drawing. It is polished by the grindstone 58.

Japanese Patent No. 3074143 International Publication WO2007 / 004700 Japanese Patent Laid-Open No. 08-243895 JP 2006-282492 A JP 2009-227523 A JP 2001-207160 A

  If the means for polishing the glass end face as disclosed in Patent Document 3 with a grindstone is employed, the end face of the glass substrate 56 can be continuously polished, and the end face strength of the glass substrate can be improved. The effect that can be produced. However, when the thickness of the glass substrate is reduced, it is difficult to hold the glass substrate in a predetermined position, and there is a problem that the glass substrate is easily damaged when polishing the end face of the glass substrate.

  Moreover, in the titanium infiltration processing method described in Patent Document 4 described above, since it is necessary to heat to a high temperature of 650 to 900 ° C. in order to infiltrate titanium, various methods formed on the glass substrate. The subject that the thermal influence on a member becomes large exists. Furthermore, in the chemical etching method of the end surface of the glass substrate disclosed in Patent Document 5, it is necessary to prevent the surface other than the end surface of the glass substrate from being etched. Depending on the application of the glass substrate, there is a problem that a step of removing the resist film after etching is required.

  The inventor has conducted various studies to solve the problems of the method of processing the end face of the conventional glass substrate as described above. As a result, the method is completely different from the methods disclosed in Patent Documents 3 to 5. A brittle material is made by spraying only an end face of a brittle material substrate such as glass with an abrasive material in which a large number of fine abrasive particles are adhered to a core having desired elasticity and adhesiveness. The inventors have found that the end face of the substrate can be effectively polished and the end face strength of the brittle material substrate can be improved, and the present invention has been completed. In addition, in Patent Document 6 described above, by spraying the surface of the material to be polished with a water-containing abrasive material in which a large number of fine abrasive particles are adhered to a core having desired elasticity and adhesiveness. Although there is a description about polishing the surface of the material to be polished, there is no description that suggests polishing only the end face of the brittle material substrate.

  That is, an object of the present invention is to provide a method for producing a brittle material substrate from a mother brittle material substrate in which the end face strength of the brittle material substrate after scribing is increased.

  In order to achieve the above object, a method for manufacturing a brittle material substrate from a mother brittle material substrate according to the present invention includes a plurality of abrasive particles directed toward an end face of a brittle material substrate formed from a mother brittle material substrate using a scribing wheel. A large number of abrasives that aggregate and contain moisture are sprayed to polish the end face of the brittle material substrate.

  According to the method for manufacturing a brittle material substrate from the mother brittle material substrate of the present invention, the end surface of the brittle material substrate is polished by spraying a large number of abrasives that agglomerate a plurality of abrasive particles and contain moisture. The end face of the brittle material substrate is a smooth flat surface, and the brittle material substrate with improved end face strength can be easily manufactured.

  The brittle material substrate to which the present invention can be applied is not particularly limited in terms of form, material, use and size, and is a single substrate or a laminated substrate obtained by bonding two or more single plates. The thin film or the semiconductor material may be attached to or included in the surface or the inside thereof. Typical examples of the brittle material substrate include a glass substrate, a ceramic substrate, a semiconductor (silicon, etc.) substrate, and a sapphire substrate. The abrasive particles are preferably harder than the brittle material substrate, and those made of diamond fine particles are particularly preferable.

  The moisture contained in the abrasive of the present invention is used for aggregating a plurality of abrasive particles to impart adhesiveness and elasticity, and the moisture content is appropriately determined experimentally. Further, a thickener such as gelatin or carboxymethylcellulose may be contained in the moisture. If the abrasive particles are sprayed onto the end face of the brittle material substrate in the absence of moisture, the end face of the brittle material substrate can be polished once, but the polished surface becomes ground and the increase in end face strength is small. Become. On the other hand, when a plurality of agglomerated abrasive particles containing moisture and having a plurality of agglomerated abrasive particles as constituent components and the abrasives in a state in which adhesiveness and elasticity are optimally adjusted are sprayed on the end face of the brittle material substrate, The end surface can be in a mirror state, the quality of the fractured surface of the brittle material substrate becomes better, and a brittle material substrate with higher end surface strength can be obtained.

Furthermore, in order to achieve the above object, a method for producing a brittle material substrate from the mother brittle material substrate of the present invention comprises:
(1) a first step of forming individual brittle material substrates from a mother brittle material substrate using a scribing wheel;
(2) a second step of holding the brittle material substrate so that an end face of the brittle material substrate obtained in the first step is exposed;
(3) Third step of polishing the end face of the brittle material substrate by spraying a large number of abrasives in which a plurality of abrasive particles aggregate and contain moisture toward the exposed end face of the brittle material substrate. ,
It is characterized by having.

  In the manufacturing method of the brittle material substrate from the mother brittle material substrate according to the present invention, in the second step, each brittle material substrate formed from the mother brittle material substrate using various known scribing wheels is used. It is held so that the end face of is exposed. In this state, if the end surface of the brittle material substrate is polished by spraying a polishing material containing a plurality of abrasive particles agglomerated and containing moisture toward the exposed end surface of the brittle material substrate, the exposed brittle material The end surface of the substrate can be polished well. Therefore, according to the method for manufacturing a brittle material substrate from the mother brittle material substrate according to the present invention, it is possible to easily and easily manufacture a brittle material substrate having good fractured surface quality and high end face strength. become able to. As a method for holding the brittle material substrate, any method can be used as long as the brittle material substrate is placed on a table and can be fixed with the end face of the brittle material substrate exposed, for example, by placing a weight. Can be adopted.

  Moreover, in the manufacturing method of the brittle material substrate from the mother brittle material substrate of the present invention, in the second step, it is preferable to hold both sides of the brittle material substrate by sandwiching them with a jig.

  In the method for manufacturing a brittle material substrate from the mother brittle material substrate of the present invention, the brittle material substrate can be stably held by a jig even when the thickness of the brittle material substrate is thin. It is possible to hold only the end face of the steel plate in a state where it is exposed from the jig. In this state, if the end surface of the brittle material substrate is polished by spraying a polishing material containing agglomeration of a plurality of abrasive particles and spraying moisture toward the exposed end surface of the brittle material substrate, the surface other than the end surface of the brittle material substrate Since this surface is shielded by the jig, it is not affected by the abrasive, and only the exposed end surface of the brittle material substrate is satisfactorily polished. Therefore, according to the method for manufacturing a brittle material substrate from the mother brittle material substrate of the present invention, it is possible to easily and easily manufacture a brittle material substrate having better fractured surface quality and higher end face strength. Will be able to.

  Moreover, as a jig | tool used with the manufacturing method of the brittle material board | substrate from the mother brittle material board | substrate of this invention, it is preferable to use what consists of an elastic material, the member of the same material as a brittle material, or a metal material.

  In the method for manufacturing a brittle material substrate from the mother brittle material substrate of the present invention, both surfaces of the brittle material substrate can be sandwiched so that only the end surface of the brittle material substrate is exposed as a jig, and the sprayed polishing is performed. As long as the material does not penetrate and contact any surface other than the end face of the brittle material substrate, it may be polished by the sprayed abrasive, and it is an elastic material or a thick member made of the same material as the brittle material substrate Alternatively, members made of various metal materials such as stainless steel can be used.

  Moreover, in the manufacturing method of the brittle material substrate from the mother brittle material substrate according to the present invention, each brittle material substrate is a scribing wheel and has a V-shaped blade over the entire circumference along the circumference of the disc-shaped wheel. It is preferable to apply to the one formed by using notches having a constant depth at a constant pitch in a direction in which the cross section intersects the V-shaped blade.

  As a scribing wheel, a V-shaped blade is formed over the entire circumference along the circumference of the disc-shaped wheel, and notches with a constant depth are formed at a constant pitch in a direction in which the cross section intersects the V-shaped blade. Scribing a mother brittle material substrate with what is formed to form individual brittle material substrates is much faster than using a scribing wheel (normal wheel) without these notches The scribing property is excellent, but the end face strength is lowered. According to the manufacturing method of the brittle material substrate of the present invention, the fracture surface of the brittle material substrate can be obtained by performing the second step and the third step on the brittle material substrate having a reduced end face strength. A brittle material substrate with good quality and high end face strength can be obtained.

  Moreover, in the manufacturing method of the brittle material substrate from the mother brittle material substrate of the present invention, the second step and the third step can be sequentially performed while conveying the individual brittle material substrates.

  By adopting such a method, the end surfaces of many individual brittle material substrates can be polished in a short time, and the processing efficiency is improved.

FIG. 1A is a front view seen from a direction orthogonal to the rotation axis common to the normal wheel and the medium penetration wheel, and FIG. 1B is a side view thereof. 2A is an enlarged view of the II part of FIG. 1B in the case of a normal wheel, and FIG. 2B is an enlarged view of the II part of FIG. 1B in the case of a medium penetration wheel. It is a schematic front view explaining the grinding | polishing method of the end surface of the test piece of an Example. It is the schematic of the measuring method of the bending strength of each test piece. It is a side view which shows typically the mode of the scribe by a scribing wheel. It is a front view which shows typically a mode that the vertical crack in the scribe of FIG. 5 is produced | generated. It is a front view of the polisher of the glass end surface of a prior art example.

  Hereinafter, the manufacturing method of the brittle material substrate of the present invention will be described in detail with reference to the drawings by way of examples, comparative examples and reference examples. However, the following embodiment shows an example of a method for manufacturing a brittle material substrate using a medium osmosis wheel for embodying the technical idea of the present invention, and the present invention uses the medium osmosis wheel. The present invention is not intended to be specific to the manufacturing method of the brittle material substrate, and the present invention is applicable to other embodiments included in the claims, such as when a normal wheel or a high penetration wheel is used. To get. In addition, in each drawing used for the description in this specification, in order to make each member a size that can be recognized on the drawing, the scale is appropriately changed for each member. It is not displayed in proportion to the actual dimensions.

  Further, the brittle material substrate to be processed in the present invention is not particularly limited with respect to the form, material, use and size, and a single substrate or two or more single plates bonded together. A laminated substrate may be used, and a thin film or a semiconductor material may be attached to or included in the surface or inside thereof. Further, the brittle material substrate is a brittle material substrate to be processed in the present invention even if a thin film or the like not corresponding to the brittle material is attached to the surface.

  Examples of the material of the brittle material substrate of the present invention include glass, ceramics, semiconductors (silicon, etc.), sapphire, etc., and their uses include liquid crystal display panels, plasma display panels, organic EL display panels, field emission displays (FEDs). Panel for FPD, such as a panel for use. In addition, “centerline average roughness Ra” used in this specification is one of the parameters representing the surface roughness of industrial products defined in JIS B 0601, and is randomly determined from the surface of the object. It is the arithmetic average value extracted.

  First, the shape of the scribing wheel used in Examples, Comparative Examples, and Reference Examples of the present invention will be described with reference to FIGS. 1A is a front view seen from a direction orthogonal to the rotation axis common to the normal wheel and the medium penetration wheel, and FIG. 1B is a side view thereof. 2A is an enlarged view of a portion II in FIG. 1B in the case of a normal wheel, and FIG. 2B is an enlarged view of a portion II in FIG. 1B in the case of a medium penetration wheel.

  As shown in FIGS. 1 and 2, the normal wheel 10 </ b> A and the medium osmotic wheel 10 </ b> B both have an outer peripheral edge portion 14 in which the bottom portions of two truncated cones 12 sharing the rotation shaft 11 intersect to form a circumferential ridge line 13. A plurality of cutouts 15 and protrusions 16 are formed along the circumferential ridgeline 13 in the circumferential direction. The circumferential ridge line 13 is formed by grinding from the axial center toward the outer side in the radial direction, and a grinding streak remains on the surface of the outer peripheral edge portion 14 subjected to the grinding process. The outer peripheral edge portion 14 is formed to have a convergence angle (α). The normal wheel 10A and the medium penetration wheel 10B are disk-shaped wheels, and are formed with shaft holes 17 through which pins (not shown) for pivotally supporting the center of the disk are passed. In addition, as the material of the normal wheel 10A and the medium penetration wheel 10B, a sintered diamond material is used here, but the same result can be obtained by using a cemented carbide, ceramic or cermet material. .

  The outer peripheral edge portion 14 is constituted by the side surfaces of the two truncated cones 12 and is derived from the grinding process for forming the circumferential ridge line 13, but grinding marks remain, but the center line average roughness of the outer peripheral edge portion 14 is left. For example, Ra is processed to be 0.05 μm or more and 0.35 μm or less. For this reason, compared with the conventional grinding process with larger centerline average roughness Ra, the total amount of the expensive cutting edge constituent material made of sintered diamond can be reduced, thereby suppressing the wear of the protrusions 16. Life can be greatly extended.

  The circumferential ridge line 13 has fine unevenness formed by grinding marks on the side surface of the truncated cone 12 constituting the outer peripheral edge portion 14, and the center line average roughness Ra of the unevenness is, for example, 0.05 μm or more and 0.0. It is 20 μm or less. Thereby, when forming the notch 15 in the circumferential ridgeline 13, it becomes possible to easily determine the height position (position in the radial direction) of the circumferential ridgeline 13 where the machining of the notch 15 is started. .

  In the normal wheel 10A, as shown in FIG. 2A, the circumferential ridge line 13 is uniformly formed over the entire circumference. On the other hand, in the medium penetration wheel 10B, as shown in FIG. 2B, the notches 15 are formed at a pitch P so as to be orthogonal to the ridgeline 13 on the circumference, and the circumferential length a is the circle of the protrusion 16. The length is shorter than the circumferential length b. In addition, the protrusion 16 is comprised by the part of the circumferential ridgeline 13 which has the length in the circumferential direction which the circumferential ridgeline 13 was notched and remained. The notches 15 are formed by notching a substantially V-shaped groove from the flat circumferential ridge line 13 to a depth h at every pitch P. By forming the notches 15 as described above, the protrusions 16 having a height h are formed on the circumferential ridge line 13 at every pitch P. The portion corresponding to the circumferential ridge line 13 of the protrusion 16 has fine unevenness formed by grinding marks on the side surface of the truncated cone 12, and the centerline average roughness Ra of the unevenness is 0.05 μm or more and 0. 20 μm or less.

  Since the shape of the notch 15 viewed from the direction of the rotation axis 11 of the medium penetration wheel 10B is substantially V-shaped, the depth of the notch 15 (height of the protrusion 16) can be changed by changing the angle of the center of the V-shape. While securing h, the circumferential length a of the notch 15 and the circumferential length b of the protrusion 16 can be easily adjusted.

  Here, an example of the manufacturing method of the normal wheel 10A and the medium penetration wheel 10B will be described. First, a cylindrical disk serving as a base of the normal wheel 10A and the medium penetration wheel 10B is prepared, and the outer peripheral edge portions 14 on both sides are ground with respect to the cylindrical disk so that the side surfaces of the two truncated cones 12 intersect. Thus, the circumferential ridgeline 13 is formed. In this grinding process, it is preferable to reduce the surface roughness of the side surface of the truncated cone 12 and the waviness in the axial direction of the circumferential ridge line 13 derived from the surface roughness.

  The side surface of the truncated cone 12 has a center line average roughness Ra of, for example, 0.05 μm or more and 0.35 μm or less, and the circumferential ridge line 13 has fine irregularities formed by grinding marks on the side surface of the truncated cone 12. The particle size of the grindstone to be used is selected so that the center line average roughness Ra of the unevenness is, for example, 0.05 μm or more and 0.20 μm or less. In this way, by suppressing the surface roughness of the side surface of the truncated cone 12 and the circumferential ridge line 13, the formed scribe line becomes narrow and constant, and the glass after separation obtained by scribing with the scribing wheel 10. Generation | occurrence | production of a chip | tip (chipping) etc. in the split surface of the board | substrate G is suppressed. This state corresponds to the normal wheel 10A.

  The medium penetration wheel 10B has a notch 15 formed in the circumferential ridge line 13 with respect to the normal wheel 10A obtained as described above. As an example of forming the notch 15, there is a method in which the notch 15 having a V shape when viewed from the direction of the rotation axis of the wheel is formed on the outer peripheral edge by laser light irradiation.

  The outer diameter of the normal wheel 10A and the medium penetration wheel 10B and the convergence angle (α) of the outer peripheral edge portion 14, the pitch P of the notches 15 of the medium penetration wheel 10B, the circumferential length a of the notches 15 and the protrusions 16 The specifications of the scribing wheel such as the circumferential length b and the depth h of the notch 15 depend on the type of brittle material to be cut, the thickness, the thermal history, the quality of the desired section of the brittle material, etc. Is set appropriately. The normal wheel 10A used in the following reference example has an outer diameter of 3 mm and a convergence angle (α) = 140 degrees, and the medium penetration wheel 10B used in the examples and comparative examples has an outer diameter of 2 mm and the number of notches. = 200, notch depth h = 3 to 3.5 μm. Moreover, the glass substrate as a brittle material substrate used for the measurement of the end face strength is 0.3 mm thick and 0.3 mm thick non-alkali glass (OA-10) manufactured by Nippon Electric Glass Co., Ltd. : Product name) Single plate.

  In addition, the bending strength is determined on two straight and opposite surfaces (rear surface) that are separated from each other by 5 mm on both sides from the center line on one surface of each test piece (line divided into 40 mm × 25 mm size). Stress at the time of breaking by applying pressure F from the vertical direction to the glass substrate on two straight lines 10 mm apart on both sides from the upper center line (line facing the center line of the surface) Was measured as a 4-point bending strength (unit: N). In addition, the outline of the measuring method of the bending strength of each test piece was shown in FIG. The 4-point bending tester used was EzS / CE manufactured by Shimadzu Corporation, and the measurement was performed at a test speed of 1 mm / min.

[Preparation of test piece]
As a reference example, the above-described normal wheel 10A was used to prepare 20 test pieces, and the bending strength of these test pieces was measured. Moreover, as a comparative example, 20 test pieces were similarly produced using the above-described medium penetration wheel 10B, and the bending strength of these test pieces was measured. As an example, the above-described medium penetration wheel 10B was used to prepare 20 test pieces, and after polishing the end faces of the 30 test pieces by the method described below, the bending strength was measured.

[Method of Polishing End Face of Example]
As shown in FIG. 3, the 20 test pieces 20 produced as described above were sandwiched by non-alkali glass jigs 21a and 21b as shown in FIG. The end face 22 was projected so that the height H was about 1 mm. Next, according to the method disclosed in Patent Document 7, the end face 22 of the projecting test piece 20 has a predetermined elasticity and adhesive core containing water and gelatin, and a number of fine abrasives. Polishing was performed by using a polishing apparatus 24 that sprays abrasive 23 adhered with diamond fine particles as particles using centrifugal force while moving the spraying position of the abrasive 23 along the exposed end surface 22. . As the polishing apparatus 24, a commercially available product under the trade name AERO LAP was appropriately modified and used.

  It seems that the abrasive 23 may be sprayed only on the plastic deformation region (see FIG. 6) formed by the scribing wheel of the test piece 20, but the test piece 20 is thin so that it protrudes. The test was performed until the entire end surface 22 of the test piece 20 was in a mirror state. When polishing only the plastic deformation region, it is only necessary to polish 10 to 100 μm in the surface direction of the end face 22 of the test piece 20 and 10 μm or more in the depth direction. Next, the bending strength was measured in the same manner as in the case of the reference example and the comparative example described above. The measurement results of the bending strength are statistically processed together with the measurement results of the reference example and the comparative example, and the average values are shown in Table 1 below as high (100N or more), medium (less than 100N, 50N or more), and low (less than 50N). Shown together.

  From the results shown in Table 1, the following can be understood. That is, based on the result of Reference Example 1 in which the end surface was not polished using the normal wheel, the measurement result of the comparative example in which the end surface was not polished using the medium penetration wheel was based on the bending strength. It was smaller than the example. On the other hand, the measurement result of the example in which the end face was polished using the medium penetration wheel shows that the bending strength is larger than that of the reference example and the comparative example, and the effect of improving the end face strength is very good. It was confirmed that it was played, that is, the effect that the quality of the fractured surface became better.

  In the comparative examples and examples described above, an example was shown in which an unpolished and polished test piece was prepared using a medium osmosis wheel, but an unpolished test piece and a polished test piece were prepared using a normal wheel. Alternatively, even if an unpolished test piece and a polished test piece are produced using a high penetration wheel as disclosed in Patent Document 1, substantially the same effect is obtained.

  Moreover, in the said Example, the example which fixed and grind | polished the test piece was shown using the thing which consists of a non-alkali glass of the same material as a test piece as a jig | tool. However, as a jig, both sides of the brittle material substrate can be sandwiched so that only the end surface of the brittle material substrate for polishing the end surface is exposed. If it does not contact the surface, it may be polished by the sprayed abrasive, so it is not only a member made of the same material as the brittle material substrate, but also made of various metal materials such as elastic material and stainless steel A member can be used. Moreover, as a method for fixing the test piece, in addition to clamping using the jig employed in the above-described embodiment, a method of placing on a table, covering the upper surface with a protective plate, and spraying from the lateral direction can be employed.

  Further, in the above embodiment, when performing polishing, in the comparative example and the embodiment, an example was shown in which polishing was performed by spraying while moving the spraying position of the abrasive along the exposed end face. In order to be able to polish the end face of the brittle material substrate, the abrasive material may be sequentially sprayed onto the exposed end face while the brittle material substrate is conveyed.

DESCRIPTION OF SYMBOLS 10A ... Normal wheel 10B ... Medium penetration wheel 11 ... Rotating shaft 12 ... Frustum 13 ... Circumferential ridgeline 13a ... End part 14 ... Outer peripheral edge 15 ... Notch 16 ... Protrusion 17 ... Shaft hole 20 ... Test piece 21a, 21b ... Jig 22 ... End face 23 ... Abrasive material 24 ... Polishing device

Claims (6)

  Polishing the end face of the brittle material substrate by spraying a large number of abrasives containing agglomeration of a plurality of abrasive particles from the mother brittle material substrate toward the end face of the brittle material substrate formed using a scribing wheel. A method for producing a brittle material substrate from a mother brittle material substrate. A method of manufacturing a brittle material substrate from a mother brittle material substrate,
(1) a first step of forming individual brittle material substrates from a mother brittle material substrate using a scribing wheel;
(2) a second step of holding the brittle material substrate so that an end face of the brittle material substrate obtained in the first step is exposed;
(3) Third step of polishing the end face of the brittle material substrate by spraying a large number of abrasives in which a plurality of abrasive particles aggregate and contain moisture toward the exposed end face of the brittle material substrate. ,
A method for producing a brittle material substrate from a mother brittle material substrate, comprising:   3. The method for manufacturing a brittle material substrate from a mother brittle material substrate according to claim 2, wherein in the second step, both sides of the brittle material substrate are held by a jig.   4. The method for manufacturing a brittle material substrate from a mother brittle material substrate according to claim 3, wherein the jig is made of an elastic material, a member made of the same material as the brittle material, or a metal material.   Each of the brittle material substrates has a V-shaped blade as the scribing wheel over the entire circumference along the circumference of the disc-shaped wheel, and the cross section is constant in a direction intersecting the V-shaped blade. The brittle material substrate from the mother brittle material substrate according to any one of claims 2 to 4, wherein the brittle material substrate is formed using a notch having a constant depth at a pitch. Production method.   The brittle material from the mother brittle material substrate according to any one of claims 2 to 5, wherein the second step and the third step are sequentially performed while conveying the individual brittle material substrates. A method for manufacturing a substrate.

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