JP3929393B2 - Cutting device - Google Patents

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JP3929393B2
JP3929393B2 JP2002351329A JP2002351329A JP3929393B2 JP 3929393 B2 JP3929393 B2 JP 3929393B2 JP 2002351329 A JP2002351329 A JP 2002351329A JP 2002351329 A JP2002351329 A JP 2002351329A JP 3929393 B2 JP3929393 B2 JP 3929393B2
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cutting
brittle
cooling
laser irradiation
irradiation means
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JP2004182530A (en
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勉 寺本
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株式会社日本エミック
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
    • B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B32B17/1099—After-treatment of the layered product, e.g. cooling
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0207—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet being in a substantially vertical plane
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • C03B33/078—Polymeric interlayers

Description

【０００１】
【発明の属する技術分野】
本発明は、樹脂部材と脆性部材とからなる積層板を切断線に沿って切断する切断装置に関する。
【０００２】
【従来の技術】
ガラス板とプラスチック板とにより構成された積層板は、防犯ガラスや自動車の安全ガラス等に使用されている。この積層板の具体的な構造は、２枚のガラス板の間に１枚のポリカーボネート等のプラスチック板を挟み、接着剤等により貼り合わされたものとなっている。
この積層板を所望の形状・寸法に切断する従来の方法としては、以下のような方法がある。
(1)ガラス板の表面にガラス切断用の工具により傷を付け、その後、機械的応力（曲げ力）を加えて割る方法。
(2)ガラス板内部に熱応力を生じさせて表面に亀裂を発生させ、その後、機械的応力（曲げ力）を加えて割る方法（例えば、特許文献１参照）。
【０００３】
【特許文献１】
特開平１−１０８００６号公報
【０００４】
【発明が解決しようとする課題】
しかし、上記 (1)及び (2)の方法では、中間層のプラスチック層を切断線に沿って切ることができないため、片面のガラス板を工具により大きく切り込んで切断し、プラスチック板を露出させ、その後、熱カッタ等の工具によりプラスチック板を切断する必要がある。
しかしこの方法は、切断線上において切断用の工具による切り込み作業が何度も必要である等、作業性が非常に悪く、作業効率が悪いという欠点がある。
【０００５】
そこで本発明は、簡単かつ効率良く樹脂部材と脆性部材とからなる積層板を精度良く切断する切断装置を提供することを目的とする。
【０００６】
【課題を解決するための手段】
上述の目的を達成するために、本発明に係る切断装置は、樹脂部材を両面から脆性部材により挟んで構成した積層板を切断線に沿って切断する切断装置に於て、上記積層板の一面側の第一作業ヘッドと他面側の第二作業ヘッドとを備え、上記第一作業ヘッドは、上記樹脂部材を上記切断線に沿って切断する第一レーザ照射手段と上記一面側の脆性部材を上記切断線に沿って加熱する第二レーザ照射手段と該第二レーザ照射手段に追従して該脆性部材を冷却する冷却手段とを有し、上記第二作業ヘッドは、上記他面側の脆性部材を該切断線に沿って加熱する第三レーザ照射手段と該第三レーザ照射手段に追従して該脆性部材を冷却する冷却手段とを有するものである。
また、上記第一作業ヘッドに一直線上に配設された上記第一レーザ照射手段と第二レーザ照射手段と冷却手段の直線配設方向と、上記第二作業ヘッドに一直線上に配設された上記第三レーザ照射手段と上記冷却手段の直線配設方向とが、上記積層板の切断線の方向に応じて方向変換可能とされている。
【０００７】
【発明の実施の形態】
以下、図示の実施の形態に基づき、本発明を詳説する。
【０００８】
本発明に係る切断装置及び切断方法により切断を行うワークとしては、ガラス板にプラスチック板を貼り合わせた積層板であり、例えば図１に示すように１枚の樹脂部材（プラスチック板）１を両面から２枚の脆性部材（ガラス板）２，２により挟んで構成した積層板Ｗであり、脆性部材２，２が外層であり、樹脂部材１が中間層の積層構造による板部材がある。そして現在、この積層板は防犯用の窓ガラス等に使用されている。
【０００９】
積層板Ｗの樹脂部材１としてはポリカーボネート、ポリエチレン、ＰＶＴフィルム、吹付塗ポリマーフィルム等であり、脆性部材２としては平板ガラス、ガラスセラミック、セラミック等が使用されている。
そして、樹脂部材１と脆性部材２との接合は、接着剤層によるものや、脆性部材２の上に押出法、注型法、スプレー法、ローラコーティング法により樹脂部材１を形成したものや、ガラス板にプラスチックフィルムをラミネートすることにより形成された構造である。
【００１０】
図２は積層板Ｗの切断作業を説明する積層板Ｗの断面図である。この積層板Ｗを切断線（切断を意図する切断予定線）に沿って切断する切断方法は、積層板Ｗの樹脂部材１のみを第一レーザ光Ａにより切断する樹脂部材切断工程と、両面の脆性部材２，２の夫々において第二レーザ光Ｂと冷却媒体を噴出する冷却手段３によりその表面に亀裂ａ，ａを生じさせる脆性部材亀裂形成工程と、両脆性部材２，２に生じた亀裂ａ，ａに沿って積層板Ｗを分断する分断工程と、を有している。そして、この樹脂部材切断工程と脆性部材亀裂形成工程とを同時に行い、その後、積層板Ｗを切断線に沿って分断している。
【００１１】
つまり、図２と図３の切断装置の斜視図に示すように、積層板Ｗの一面側に第一レーザ光Ａを照射する第一レーザ照射手段７と第二レーザ光Ｂを照射する第二レーザ照射手段８と冷却手段３とを配設し、さらに、積層板Ｗの他面側に第二レーザ光Ｂを照射する第三レーザ照射手段９と冷却手段３とを配設する。そして、これらを切断線に沿って移動させ、一枚の積層板Ｗに対して、一面側から第一レーザ光Ａと第二レーザ光Ｂと冷却手段３による冷却媒体とを照射・噴出し、他面側から第二レーザ光Ｂと冷却手段３による冷却媒体とを照射・噴出する。
【００１２】
この積層板Ｗを切断線に沿って切断する切断装置についてさらに説明すると、図３に示すように、この装置は、積層板Ｗの一面側の第一作業ヘッド５と他面側の第二作業ヘッド６とを備えている。第一作業ヘッド５は、樹脂部材１を切断線に沿って切断する第一レーザ照射手段７と一面側の脆性部材２を切断線に沿って加熱する第二レーザ照射手段８と第二レーザ照射手段８による加熱エリアＨに所定の間隔Ｇをもって追従して脆性部材２を冷却する冷却手段３とを有している。そして、第二作業ヘッド６は、他面側の脆性部材２を切断線に沿って加熱する第三レーザ照射手段９と第三レーザ照射手段９による加熱エリアＨに所定の間隔Ｇをもって追従して脆性部材２を冷却する冷却手段３とを有している。
そして、この第一作業ヘッド５と第二作業ヘッド６とはアーム部材10に連結しており、アーム部材10の駆動により積層板Ｗに対して位置変化（移動）できる。
【００１３】
図２の矢印Ｅは、積層板Ｗに対するこれらレーザ照射手段７，８，９と冷却手段３，３の進行方向を示しており、図２では、樹脂部材１用の第一レーザ光Ａを脆性部材２用の第二レーザ光Ｂと冷却手段３より先行させているが（第一レーザ光Ａが進行方向前方側としているが）、これとは逆に、図示省略するが、第二レーザ光Ｂと冷却手段３を、第一レーザ光Ａより先行させてもよい。
【００１４】
樹脂部材切断工程について説明すると、積層板Ｗの脆性部材２を透過して樹脂部材１において吸収されて樹脂部材１を加熱する第一レーザ光Ａにより、樹脂部材１を切断線に沿って切断する作業である。この樹脂部材（プラスチック）切断用レーザである第一レーザ光Ａとしては、ＹＡＧレーザ、ＹＶＯ４レーザ、半導体レーザ等であり、その発振波長が0.4 μｍ以上２μｍ未満のものとしている。
【００１５】
即ち、この工程において、樹脂部材１が吸収する波長のレーザを樹脂部材１の表面または樹脂部材１の内部に焦点を合わせることによりエネルギーを集め樹脂部材１を切断する。
また、これ以外にも、脆性部材２を透過し樹脂部材１に吸収される波長であって樹脂部材１を破壊しうるエネルギーを持ったレーザであってもよく、又はその他として熱線、粒子、放射線等を使用してもよい。
【００１６】
この樹脂部材１の切断においては、第一レーザ光Ａにより熱破壊されるが、その両面をガラス等の脆性部材２により挟まれて大気と隔絶されているため、熱による酸化（燃焼等）がほとんど発生しないため、黒煙を発生させず作業環境に対して非常に好ましい。
【００１７】
脆性部材亀裂形成工程は、積層板Ｗの両面側から、夫々の脆性部材２，２を切断線に沿って第二レーザ光Ｂ，Ｂと冷却手段３，３とにより加熱し冷却して熱応力により、脆性部材２，２の表面に夫々亀裂ａ，ａを生じさせ割断（熱割断）する作業である。つまり、脆性部材２を熱源により材料表面を溶融・破壊することなく加熱を行い、加熱した部位を急冷することにより、材料内部に熱応力を発生させ、この熱応力により脆性部材２の表面に亀裂ａを発生させるものである。
【００１８】
第二レーザ光Ｂは、脆性部材２に吸収される波長のレーザを使用することで脆性部材２を切断するが、具体的な第二レーザ光Ｂとしては、ＣＯ2 レーザ、ＣＯレーザ、半導体レーザ等であり、その発振波長が１μｍ以上20μｍ以下のものとしている。なお、通常のガラスの透過領域は、波長が 400ｎｍ〜3000ｎｍ程度である。
つまり、脆性部材２と樹脂部材１とからなる積層板Ｗを夫々異なる波長のレーザ光線を使用して、非接触で切断及び亀裂ａの形成を行う。
【００１９】
冷却手段３は、脆性部材２へ冷却媒体を吹きつける噴出手段（ノズル）と、冷却媒体の吹きつけを遮断するシャッター手段と、を有し、冷却媒体としては、気体及び液体であり、エア、エアと水の気液混流物、ヘリウム等のガス、液化ガス、ドライアイス等がある。
【００２０】
さらに、亀裂形成工程について説明すると、図４は、脆性部材２における亀裂ａ発生を説明する積層板Ｗの平面図であり、積層板Ｗの切断を意図する線（図４の一点鎖線）に沿って、第二レーザ光Ｂにより脆性部材２を加熱し、第二レーザ光Ｂによる加熱エリアＨに間隔Ｇをもって追従して冷却手段３により脆性部材２を冷却している。さらに、加熱エリアＨと冷却手段３による冷却ポイントＣとの間隔Ｇを変更（調整）可能としている。
【００２１】
なお、加熱エリアＨとは、後述する複数本のレーザビーム（第二レーザ光Ｂ）によるビーム列により積層板Ｗが照射された領域であり、また、冷却ポイントＣとは、冷却媒体による積層板Ｗ表面の冷却エリアの中心点である。そして、間隔Ｇは、加熱エリアＨの後方側端部と冷却ポイントＣとの距離を表す。なお、図４に示すように、矢印Ｅは、第二レーザ光Ｂと冷却手段３による冷却媒体の積層板Ｗに対する進行方向である。つまり、加熱エリアＨは、冷却ポイントＣより前方であると言える。
また、図４は積層板Ｗの一面側を示しており、樹脂部材１切断用の第一レーザ光Ａが加熱エリアＨよりさらに前方に所定の間隔をもって移動（位置）している。そして、図示省略の積層板Ｗの他面側においては、（第一レーザ光Ａは照射されず）加熱エリアＨと冷却ポイントＣとの関係は、一面側と同様である。
【００２２】
また、亀裂形成工程における第二レーザ光Ｂによる加熱と、冷却手段３による冷却とについてさらに説明すると、本発明では、図４に示すように、異なったエネルギーを持つ複数のビームによる列を形成し、これを第二レーザ光Ｂとして脆性部材２に照射している。つまり、第二レーザ照射手段８は、図示省略するが、一本のレーザビームを複数本のビームによるビーム列とする変換手段（ビームスプリッタ）を有し、ビーム列による加熱エリアＨの長手方向を積層板Ｗの切断線方向としている。
【００２３】
さらに、この熱応力による亀裂ａ発生についてさらに説明すると、脆性部材２の加熱を行うことにより、加熱された領域（加熱エリアＨより広い範囲）は脆性部材２内部で膨張しようと働き、図４に示すように、その周囲の加熱されていない領域によって押し返されるために脆性部材２に圧縮応力が発生する。この後、加熱エリアＨの後方側位置の冷却を行うと、熱膨張した部分が急激に収縮し引張応力が発生し、この引張応力が材料の破壊靱性値を超えた際に、材料表面に亀裂ａを形成する。
【００２４】
そして、冷却ポイントＣは、加熱分布によって最適な部位が存在しており、その部位に正確に冷却作用を与える事で効率よく最大の引張応力を発生させることができる。つまり、冷却手段３による冷却ポイントＣとしては、図４に示すように、脆性部材２の切断線上で加熱による膨張により生ずる脆性部材２の圧縮応力が引張応力へと変化する応力変曲点11乃至その近傍を冷却し、脆性部材２の表面に亀裂ａを生じさせるようすればよい。
具体的に説明すると、図４に示すように、脆性部材２において加熱された領域は圧縮応力が作用するが、熱源（加熱エリアＨ）の移動方向前方側及び後方側には、（何もしない状態において）引張応力が作用している。そして、この内部応力が圧縮から引張に変化する点であって、加熱エリアＨの後方側の切断線上の点を冷却すればよい。
【００２５】
なお、この脆性部材２内部に生じる応力は、例えば、有限要素法を用いて解析することができ、冷却すべき位置の特定が可能となる。つまり、材料の特性、熱源、熱源後方の熱分布等によって決定される位置に、圧縮応力から引張応力に変化する位置（変曲点）11が存在する。そして、この位置を中心としたエリアを冷却し、その変曲点11前後の温度差を拡大させることにより、発生する内部応力を最大にすることができる。この場合、亀裂ａを発生させる引張応力は、変曲点11を越える位置で発生するため、冷却する面積は極めて小さくてよく、冷却量も材料の強度を超える応力が発生する一定量以上であればよいため、冷却量の変化に結果が影響されにくい。
【００２６】
そして、樹脂部材切断工程と脆性部材亀裂形成工程とを経て、図５に示すように、切断線に沿って、樹脂部材１が切断され、脆性部材２の表面に亀裂ａが形成できる。そして、この後の分断工程において、両面の脆性部材２，２に生じた亀裂ａ，ａに沿って積層板Ｗを分断する。
【００２７】
分断工程について説明すると、積層板Ｗには、両面に脆性部材２，２が配置されているため、その両面の脆性部材２，２を切り離す（分断する）必要がある。そして、図５に示すように、その脆性部材２，２には、夫々反対方向へ開口する亀裂ａ，ａが形成されているため、図７に示す従来より考えられる方法のように、積層板Ｗ全体に曲げ力を作用させると、一面側の亀裂13は亀裂13を開く方向へ力が作用して一面側の脆性部材２を割ることができるが、他面側の亀裂14は、亀裂14を閉じる方向となる。従って、両面ともを割るためには、両側に大きな曲げ力を作用させることが必要であり、さらに、防犯用のガラスのように高い強度を持つ材料では、材料を曲げるために大きな力が必要であり、装置が大型化し大きな動力が必要となって、コストアップを招くという問題がある。
【００２８】
さらに、この従来の方法では、一面側を分断した後、他面側を分断しようとすると、既に分断した面同士が押しつけられることとなり、その面が破壊されて切断面の品質・精度を低下させるという問題があり、また、ガラス粉が発生し環境に対して好ましくない。
そこで、本発明では、この分断工程において、図６に示すように、熱応力により生じさせた脆性部材２の表面における亀裂ａを、超音波により脆性部材２の厚さ方向に進行させ、積層板Ｗを分断している。
【００２９】
具体的な構成について説明すると、図６に示すように、積層板Ｗの両面側から材料表面の亀裂ａ上又はその近傍部位に超音波発生手段12の当接部を接触させ、超音波を発生させ、超音波を積層板Ｗの面に垂直な方向へ向かって材料内を伝搬させる。材料内部に進行した超音波は、気体や液体では縦波であるが、固体中では縦波だけではなく、変位が進行方向と垂直な横波の作用も持つこととなる。これにより、両面側の亀裂ａ，ａの先端には、超音波の伝搬に伴い開く方向の力と閉じる方向の力が交互に作用し、開く方向の力により表面に形成された亀裂ａは、脆性部材２の裏面に向かって進行することができる。
【００３０】
また、樹脂部材切断工程と脆性部材亀裂形成工程とが開始される前において、積層板Ｗの切断線の切断開始始点（積層板Ｗの端縁）に、機械的手段にて初期亀裂ａ0 を形成する。つまり、積層板Ｗの切断線の始端に機械的切欠手段４により初期亀裂ａ0 を形成してから、第二レーザ光Ｂが初期亀裂ａ0 近傍位置から切断線に沿って照射する。
この切欠手段４は、図３に示すように、第一作業ヘッド５及び第二作業ヘッド６に設置されて自動制御されて駆動し、積層板Ｗに当接し、初期亀裂ａ0 を形成するものであり、例えば、硬質金属、セラミック、タングステンカーバイド、ダイヤモンド含有焼結金属により作製された切断ホイールや切断刃とし、これを脆性部材２の端縁に接触させる。
【００３１】
本発明においては、脆性部材２における亀裂ａの発生は熱応力による割断としたが、さらに高熱源による加熱破壊（溶断）にてガラスに亀裂ａの発生をさせた場合、ガラスの溶融及び収縮の際に亀裂ａに多数の微細なクラック（マイクロクラック）が発生する。これにより、亀裂ａが複雑な形状となり、分断すると多数のクラック（亀裂）に沿って割れるため、思わぬ方向へ破壊が進行し、切断面の表面精度が悪くなって製品の品質が低下する。従って、切断されたガラスの表面精度を高めるための砥石等による端面の仕上げ加工及びそれによって発生するガラス屑の洗浄作業が必要となり、生産コストが高くなったり、環境の悪化が生ずる。
しかし、本発明によれば、これらは全て解消でき、低エネルギーで高速、高精度に切断が行える。
【００３２】
図３に示した切断装置についてさらに説明すると、積層板Ｗは傾斜作業面16に傾斜状にして下部に設けた搬送手段15に載置状とされている。そして、傾斜作業面16には、多数のエア噴出孔17が形成されており、エアの噴出により、積層板Ｗを浮上させ姿勢を保持している。さらに、傾斜作業面16には、レーザ式の距離センサ18が設けられており、積層板Ｗまでの距離を検知し、上記のレーザ光Ａ，Ｂの焦点調整が行われる。
【００３３】
また、積層板Ｗの切断方向について説明すると、切断線Ｙに沿って切断するには、上記第一作業ヘッド５及び第二作業ヘッド６をアーム部材10の上昇（又は下降）動作させ、積層板Ｗの一面側において第一レーザ照射手段７と第二レーザ照射手段８と冷却手段３、及び、他面側において第三レーザ照射手段９と冷却手段３を切断線Ｙに沿って走行させればよい。
【００３４】
そして、この切断線Ｙに直交方向である切断線Ｘに沿って切断するには、第一作業ヘッド５及び第二作業ヘッド６を90°回転させ、搬送手段（コンベア）15により積層板Ｗを移動させながら、レーザの照射等を行えばよい。
また、第一作業ヘッド５及び第二作業ヘッド６を所定の角度に回転させ、搬送手段15とアーム部材10との連動動作により、斜め切断が可能となる。
【００３５】
つまり、第一作業ヘッド５には、第一レーザ照射手段７と第二レーザ照射手段８と冷却手段３とが一直線上に配設されており、これら第一レーザ照射手段７と第二レーザ照射手段８と冷却手段３の直線配設方向は、第一作業ヘッド５の回転により積層板Ｗの切断線の方向に応じて方向変換可能とされており、また、第二作業ヘッド６には、第三レーザ照射手段９と冷却手段３とが一直線上に配設されており、これら第三レーザ照射手段９と冷却手段３の直線配設方向とは、第二作業ヘッド６の回転により積層板Ｗの切断線の方向に応じて方向変換可能とされている。
【００３６】
【発明の効果】
本発明は上述の構成により次のような効果を奏する。
【００３７】
（請求項１によれば）内層の樹脂部材１とその両面の脆性部材２，２とを一度に切断でき、工程短縮が図れる。切断線に沿ってレーザ照射手段７，８，９と冷却手段３とが移動でき、切断精度を高くすることができる。
【００３８】
（請求項２によれば）積層板Ｗを一方向にしたまま、任意の方向への切断が可能となり、作業の効率化が図れる。
【図面の簡単な説明】
【図１】 本発明の切断装置により切断される積層板の断面図である。
【図２】 本切断装置による作用を説明する積層板の断面図である。
【図３】 本発明に係る切断装置の斜視図である。
【図４】 脆性部材亀裂形成工程の説明図である。
【図５】 樹脂部材切断工程と脆性部材亀裂形成工程とが終了した状態の積層板の斜視図である。
【図６】 超音波による分断工程を説明する積層板の断面図である。
【図７】 従来の分断工程を説明する積層板の断面説明図である。
【符号の説明】
１ 樹脂部材
２ 脆性部材
３ 冷却手段
４ 切欠手段
５ 第一作業ヘッド
６ 第二作業ヘッド
７ 第一レーザ照射手段
８ 第二レーザ照射手段
９ 第三レーザ照射手段
Ａ 第一レーザ光
ａ 亀裂
ａ0 初期亀裂
Ｂ 第二レーザ光
Ｗ 積層板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a disconnect device you along the laminate comprising a resin member and the brittle member to the cutting line.
[0002]
[Prior art]
A laminated plate composed of a glass plate and a plastic plate is used for security glass, automobile safety glass, and the like. The specific structure of the laminated plate is such that a single plastic plate such as polycarbonate is sandwiched between two glass plates and bonded together with an adhesive or the like.
As a conventional method for cutting this laminated plate into a desired shape and size, there are the following methods.
(1) A method of scratching the surface of a glass plate with a tool for cutting glass, and then cracking it by applying mechanical stress (bending force).
(2) A method in which a thermal stress is generated in a glass plate to cause cracks on the surface, and then mechanically (bending force) is applied for cracking (for example, see Patent Document 1).
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 1-108006
[Problems to be solved by the invention]
However, in the methods (1) and (2) above, since the intermediate plastic layer cannot be cut along the cutting line, the glass plate on one side is largely cut with a tool and cut to expose the plastic plate, Thereafter, it is necessary to cut the plastic plate with a tool such as a heat cutter.
However, this method has the disadvantages that workability is very poor and work efficiency is poor, such as the need for cutting work with a cutting tool many times on the cutting line.
[0005]
Accordingly, the present invention aims at providing a simple and efficient resin member and the brittle member and disconnecting device laminates you accurately cut consisting of.
[0006]
[Means for Solving the Problems]
To achieve the above purposes mentioned, the cutting device according to the present invention, the resin member At a cutting device for cutting along the cutting line a laminate constructed by sandwiching a brittle member from both sides, of the laminate A first working head on one side and a second working head on the other side, wherein the first working head includes first laser irradiation means for cutting the resin member along the cutting line and brittleness on the one side. A second laser irradiation means for heating the member along the cutting line; and a cooling means for cooling the brittle member following the second laser irradiation means. A third laser irradiation means for heating the brittle member along the cutting line and a cooling means for cooling the brittle member following the third laser irradiation means.
Further, the first laser irradiation means, the second laser irradiation means, and the cooling means arranged in a straight line on the first work head, and the straight lines in the second work head. The direction in which the third laser irradiation unit and the linear arrangement direction of the cooling unit are arranged can be changed in accordance with the direction of the cutting line of the laminated plate.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on the illustrated embodiment.
[0008]
The workpiece to be cut by the cutting device and the cutting method according to the present invention is a laminated plate in which a plastic plate is bonded to a glass plate. For example, as shown in FIG. 1, a single resin member (plastic plate) 1 is provided on both sides. 2 is a laminated plate W sandwiched between two brittle members (glass plates) 2, 2, with the brittle members 2, 2 being an outer layer and the resin member 1 being a plate member having a laminated structure of an intermediate layer. And now, this laminated board is used for the window glass for crime prevention.
[0009]
As the resin member 1 of the laminated board W, polycarbonate, polyethylene, PVT film, spray coating polymer film, or the like is used, and as the brittle member 2, flat glass, glass ceramic, ceramic, or the like is used.
The bonding between the resin member 1 and the brittle member 2 is performed by an adhesive layer, the resin member 1 formed on the brittle member 2 by an extrusion method, a casting method, a spray method, or a roller coating method, It is a structure formed by laminating a plastic film on a glass plate.
[0010]
FIG. 2 is a cross-sectional view of the laminated sheet W for explaining the cutting operation of the laminated sheet W. A cutting method for cutting the laminated plate W along a cutting line (a planned cutting line intended for cutting) includes a resin member cutting step of cutting only the resin member 1 of the laminated plate W with the first laser light A, In each of the brittle members 2, 2, the second laser beam B and the cooling means 3 for ejecting the cooling medium cause a crack a, a on the surface of the brittle member crack forming step, and cracks in both the brittle members 2, 2 a dividing step of dividing the laminated sheet W along a and a. And this resin member cutting process and a brittle member crack formation process are performed simultaneously, and the laminated board W is divided | segmented along the cutting line after that.
[0011]
That is, as shown in the perspective views of the cutting device in FIGS. 2 and 3, the first laser irradiation means 7 that irradiates the first laser light A and the second laser light B that irradiates one surface side of the laminated plate W. The laser irradiation means 8 and the cooling means 3 are disposed, and further, the third laser irradiation means 9 and the cooling means 3 for irradiating the second laser light B to the other surface side of the laminated plate W are disposed. Then, these are moved along the cutting line, and the first laser beam A, the second laser beam B, and the cooling medium by the cooling means 3 are irradiated and ejected from one side to the single laminated plate W, The second laser beam B and the cooling medium by the cooling means 3 are irradiated and ejected from the other surface side.
[0012]
The cutting device that cuts the laminated plate W along the cutting line will be further described. As shown in FIG. 3, this device includes a first working head 5 on one side of the laminated plate W and a second work on the other side. And a head 6. The first working head 5 includes a first laser irradiation means 7 for cutting the resin member 1 along the cutting line, a second laser irradiation means 8 for heating the brittle member 2 on the one surface side along the cutting line, and a second laser irradiation. Cooling means 3 for cooling the brittle member 2 by following the heating area H by means 8 with a predetermined gap G is provided. The second working head 6 follows the third laser irradiation means 9 for heating the brittle member 2 on the other surface along the cutting line and the heating area H by the third laser irradiation means 9 with a predetermined interval G. And a cooling means 3 for cooling the brittle member 2.
The first working head 5 and the second working head 6 are connected to the arm member 10 and can be moved (moved) relative to the laminated plate W by driving the arm member 10.
[0013]
An arrow E in FIG. 2 indicates the traveling direction of the laser irradiation means 7, 8, 9 and the cooling means 3, 3 with respect to the laminated plate W. In FIG. 2, the first laser light A for the resin member 1 is brittle. Although the second laser beam B for the member 2 is preceded by the cooling means 3 (the first laser beam A is on the front side in the traveling direction), on the contrary, although not shown, the second laser beam is omitted. B and the cooling means 3 may be preceded by the first laser beam A.
[0014]
The resin member cutting step will be described. The resin member 1 is cut along the cutting line by the first laser light A that passes through the brittle member 2 of the laminated plate W and is absorbed in the resin member 1 to heat the resin member 1. Work. The first laser beam A which is a laser for cutting the resin member (plastic) is a YAG laser, a YVO4 laser, a semiconductor laser or the like, and has an oscillation wavelength of 0.4 μm or more and less than 2 μm.
[0015]
That is, in this step, the laser beam having a wavelength absorbed by the resin member 1 is focused on the surface of the resin member 1 or the inside of the resin member 1 to collect energy and cut the resin member 1.
In addition to this, a laser having a wavelength that is transmitted through the brittle member 2 and absorbed by the resin member 1 and that can destroy the resin member 1 may be used. Etc. may be used.
[0016]
In the cutting of the resin member 1, it is thermally destroyed by the first laser beam A, but since both surfaces thereof are sandwiched by the brittle member 2 such as glass and isolated from the atmosphere, oxidation (combustion etc.) due to heat is caused. Since it hardly generates, it does not generate black smoke and is very preferable for the working environment.
[0017]
In the brittle member crack forming step, the respective brittle members 2 and 2 are heated by the second laser beams B and B and the cooling means 3 and 3 along the cutting line from both sides of the laminated plate W, and then cooled to cause thermal stress. Thus, the cracks a and a are generated on the surfaces of the brittle members 2 and 2, respectively, and are cleaved (thermal cleaving). That is, the brittle member 2 is heated by a heat source without melting or destroying the material surface, and the heated portion is rapidly cooled to generate a thermal stress inside the material, and the surface of the brittle member 2 is cracked by this thermal stress. a is generated.
[0018]
The second laser beam B cuts the brittle member 2 by using a laser having a wavelength that is absorbed by the brittle member 2. Specific examples of the second laser beam B include a CO 2 laser, a CO laser, and a semiconductor laser. The oscillation wavelength is 1 μm or more and 20 μm or less. In addition, the transmission region of normal glass has a wavelength of about 400 nm to 3000 nm.
That is, the laminated plate W composed of the brittle member 2 and the resin member 1 is cut in a non-contact manner and a crack a is formed using laser beams having different wavelengths.
[0019]
The cooling means 3 includes jetting means (nozzles) for blowing a cooling medium to the brittle member 2 and shutter means for blocking the blowing of the cooling medium. The cooling medium is a gas and a liquid, and air, There are gas-liquid mixture of air and water, gas such as helium, liquefied gas, dry ice and the like.
[0020]
Further, the crack forming process will be described. FIG. 4 is a plan view of the laminated board W for explaining the generation of cracks a in the brittle member 2, and is along a line intended for cutting the laminated board W (the dashed line in FIG. 4). Then, the brittle member 2 is heated by the second laser beam B, and the brittle member 2 is cooled by the cooling means 3 following the heating area H by the second laser beam B with a gap G. Furthermore, the interval G between the heating area H and the cooling point C by the cooling means 3 can be changed (adjusted).
[0021]
The heating area H is a region irradiated with the laminated plate W by a beam array of a plurality of laser beams (second laser light B) described later, and the cooling point C is a laminated plate made of a cooling medium. This is the center point of the cooling area on the W surface. The interval G represents the distance between the rear end of the heating area H and the cooling point C. As shown in FIG. 4, the arrow E indicates the traveling direction of the cooling medium with respect to the laminated plate W by the second laser beam B and the cooling means 3. That is, it can be said that the heating area H is ahead of the cooling point C.
FIG. 4 shows one surface side of the laminated plate W, and the first laser light A for cutting the resin member 1 moves (positions) further forward than the heating area H with a predetermined interval. Then, on the other surface side of the laminated plate W (not shown), the relationship between the heating area H and the cooling point C (not irradiated with the first laser light A) is the same as that on the one surface side.
[0022]
Further, the heating by the second laser beam B and the cooling by the cooling means 3 in the crack forming step will be further described. In the present invention, as shown in FIG. 4, a row of a plurality of beams having different energies is formed. The brittle member 2 is irradiated with this as the second laser beam B. That is, although not shown, the second laser irradiation means 8 has conversion means (beam splitter) that converts a single laser beam into a beam train of a plurality of beams, and the longitudinal direction of the heating area H by the beam train is changed. The cutting line direction of the laminated board W is used.
[0023]
Further, the generation of the crack a due to the thermal stress will be further described. By heating the brittle member 2, the heated region (range wider than the heating area H) works to expand inside the brittle member 2, and FIG. As shown, a compressive stress is generated in the brittle member 2 because it is pushed back by an unheated region around it. Thereafter, when the rear side position of the heating area H is cooled, the thermally expanded portion contracts suddenly and tensile stress is generated. When this tensile stress exceeds the fracture toughness value of the material, the surface of the material is cracked. a is formed.
[0024]
The cooling point C has an optimum portion depending on the heating distribution, and the maximum tensile stress can be efficiently generated by accurately giving a cooling action to the portion. That is, as the cooling point C by the cooling means 3, as shown in FIG. 4, the stress inflection points 11 to 11 at which the compressive stress of the brittle member 2 caused by expansion due to heating on the cutting line of the brittle member 2 changes to tensile stress. The vicinity thereof may be cooled to cause a crack a on the surface of the brittle member 2.
Specifically, as shown in FIG. 4, compressive stress acts on the heated area in the brittle member 2, but nothing is done on the front side and the rear side in the movement direction of the heat source (heating area H). In the state) tensile stress is acting. And what is necessary is just to cool the point on the cutting line of the back side of the heating area H, Comprising: This internal stress changes from compression to tension | tensile_strength.
[0025]
The stress generated in the brittle member 2 can be analyzed using, for example, a finite element method, and the position to be cooled can be specified. That is, a position (inflection point) 11 where the compressive stress changes to the tensile stress exists at a position determined by the material characteristics, the heat source, the heat distribution behind the heat source, and the like. The generated internal stress can be maximized by cooling the area around this position and expanding the temperature difference around the inflection point 11. In this case, since the tensile stress that generates the crack a is generated at a position exceeding the inflection point 11, the area to be cooled may be extremely small, and the cooling amount may be a certain amount or more that generates stress exceeding the strength of the material. Therefore, the result is not easily affected by changes in the cooling amount.
[0026]
Then, through the resin member cutting step and the brittle member crack forming step, the resin member 1 is cut along the cutting line and a crack a can be formed on the surface of the brittle member 2 as shown in FIG. Then, in the subsequent dividing step, the laminated plate W is divided along the cracks a and a generated in the brittle members 2 and 2 on both sides.
[0027]
The splitting process will be explained. Since the brittle members 2 and 2 are arranged on both sides of the laminated sheet W, the brittle members 2 and 2 on both sides need to be separated (divided). Then, as shown in FIG. 5, the brittle members 2 and 2 are formed with cracks a and a that open in opposite directions, respectively, so that the laminated plate as in the conventional method shown in FIG. When bending force is applied to the entire W, the crack 13 on one side can act in the direction of opening the crack 13 to break the brittle member 2 on one side, but the crack 14 on the other side is crack 14 The direction is to close. Therefore, in order to split both sides, it is necessary to apply a large bending force to both sides. Furthermore, a material having high strength such as security glass requires a large force to bend the material. In addition, there is a problem that the apparatus becomes large and requires a large amount of power, resulting in an increase in cost.
[0028]
Furthermore, in this conventional method, when one surface side is divided and then the other surface side is divided, the already divided surfaces are pressed against each other, and the surfaces are broken to reduce the quality and accuracy of the cut surface. In addition, glass powder is generated, which is undesirable for the environment.
Therefore, in the present invention, in this dividing step, as shown in FIG. 6, the crack a on the surface of the brittle member 2 caused by thermal stress is advanced in the thickness direction of the brittle member 2 by ultrasonic waves, and the laminated board W is divided.
[0029]
A specific configuration will be described. As shown in FIG. 6, the contact portion of the ultrasonic wave generating means 12 is brought into contact with the crack a on the surface of the material or the vicinity thereof from both sides of the laminate W to generate ultrasonic waves. The ultrasonic wave is propagated in the material in a direction perpendicular to the surface of the laminated plate W. Ultrasonic waves traveling inside the material is, in the gas or liquid is longitudinal, not only longitudinal waves in solids, the displacement is to have also the action of progression Direction perpendicular transverse. Thereby, the force in the opening direction and the force in the closing direction act alternately on the front ends of the cracks a and a on both sides, and the crack a formed on the surface by the force in the opening direction It can proceed toward the back surface of the brittle member 2.
[0030]
In addition, before the resin member cutting step and the brittle member crack forming step are started, an initial crack a 0 is formed by mechanical means at the cutting start point (edge of the laminated plate W) of the cutting line of the laminated plate W. Form. That is, after the initial crack a 0 is formed by the mechanical notch means 4 at the starting end of the cutting line of the laminate W, the second laser beam B is irradiated along the cutting line from the position near the initial crack a 0 .
As shown in FIG. 3, this notch means 4 is installed in the first working head 5 and the second working head 6 and is automatically controlled and driven to come into contact with the laminated plate W to form an initial crack a 0. For example, a cutting wheel or cutting blade made of hard metal, ceramic, tungsten carbide, or diamond-containing sintered metal is used, and this is brought into contact with the edge of the brittle member 2.
[0031]
In the present invention, the crack a in the brittle member 2 is cleaved due to thermal stress. However, when crack a is generated in the glass by heat destruction (melting) by a high heat source, the melting and shrinkage of the glass is caused. At this time, many fine cracks (microcracks) are generated in the crack a. As a result, the crack a has a complicated shape, and when divided, it breaks along a large number of cracks (cracks), so that the breakage progresses in an unexpected direction, the surface accuracy of the cut surface is deteriorated, and the quality of the product is deteriorated. Therefore, it is necessary to finish the end face with a grindstone or the like for improving the surface accuracy of the cut glass and to clean glass waste generated thereby, resulting in an increase in production cost and deterioration of the environment.
However, according to the present invention, all of these can be eliminated, and cutting can be performed with low energy, high speed and high accuracy.
[0032]
The cutting apparatus shown in FIG. 3 will be further described. The laminated plate W is inclined on the inclined work surface 16 and is placed on the conveying means 15 provided in the lower portion. A large number of air ejection holes 17 are formed in the inclined work surface 16, and the laminated sheet W is lifted and held in an attitude by the air ejection. Further, a laser type distance sensor 18 is provided on the inclined work surface 16, and the distance to the laminated plate W is detected to adjust the focus of the laser beams A and B described above.
[0033]
The cutting direction of the laminated plate W will be described. To cut along the cutting line Y, the first working head 5 and the second working head 6 are moved up (or lowered) by the arm member 10, and the laminated plate If the first laser irradiating means 7, the second laser irradiating means 8, the cooling means 3 on one surface side of W and the third laser irradiating means 9 and cooling means 3 on the other surface side run along the cutting line Y, Good.
[0034]
In order to cut along the cutting line X which is orthogonal to the cutting line Y, the first working head 5 and the second working head 6 are rotated by 90 °, and the laminated plate W is moved by the conveying means (conveyor) 15. Laser irradiation or the like may be performed while moving.
Further, the first working head 5 and the second working head 6 are rotated at a predetermined angle, and the oblique cutting is possible by the interlocking operation of the conveying means 15 and the arm member 10.
[0035]
That is, the first laser irradiation means 7, the second laser irradiation means 8, and the cooling means 3 are arranged in a straight line on the first working head 5, and these first laser irradiation means 7 and the second laser irradiation means. The linear arrangement direction of the means 8 and the cooling means 3 can be changed according to the direction of the cutting line of the laminated plate W by the rotation of the first work head 5, and the second work head 6 includes The third laser irradiation means 9 and the cooling means 3 are arranged in a straight line, and the linear arrangement direction of the third laser irradiation means 9 and the cooling means 3 is determined by the rotation of the second working head 6 and the laminated plate. The direction can be changed according to the direction of the W cutting line.
[0036]
【The invention's effect】
The present invention has the following effects by the above-described configuration.
[0037]
(According to claim 1) in layer of the resin member 1 and be cut at once and brittle members 2 of both sides, thereby the process shortened. The laser irradiation means 7, 8, 9 and the cooling means 3 can move along the cutting line, and the cutting accuracy can be increased.
[0038]
(According to claim 2 ) It becomes possible to cut in any direction while keeping the laminated sheet W in one direction, and work efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a laminated board cut by a cutting device of the present invention.
FIG. 2 is a cross-sectional view of a laminated board for explaining the operation of the cutting device .
FIG. 3 is a perspective view of a cutting device according to the present invention.
FIG. 4 is an explanatory diagram of a brittle member crack forming step.
FIG. 5 is a perspective view of a laminated board in a state where a resin member cutting step and a brittle member crack forming step are completed.
FIG. 6 is a cross-sectional view of a laminated plate for explaining a cutting process using ultrasonic waves.
FIG. 7 is a cross-sectional explanatory view of a laminated board for explaining a conventional dividing step.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Resin member 2 Brittle member 3 Cooling means 4 Notch means 5 First work head 6 Second work head 7 First laser irradiation means 8 Second laser irradiation means 9 Third laser irradiation means A First laser light a Crack a 0 Initial stage Crack B Second laser beam W Laminated plate

Claims (2)

樹脂部材（１）を両面から脆性部材（２）（２）により挟んで構成した積層板（Ｗ）を切断線に沿って切断する切断装置に於て、上記積層板（Ｗ）の一面側の第一作業ヘッド（５）と他面側の第二作業ヘッド（６）とを備え、上記第一作業ヘッド（５）は、上記樹脂部材（１）を上記切断線に沿って切断する第一レーザ照射手段（７）と上記一面側の脆性部材（２）を上記切断線に沿って加熱する第二レーザ照射手段（８）と該第二レーザ照射手段（８）に追従して該脆性部材（２）を冷却する冷却手段（３）とを有し、上記第二作業ヘッド（６）は、上記他面側の脆性部材（２）を該切断線に沿って加熱する第三レーザ照射手段（９）と該第三レーザ照射手段（９）に追従して該脆性部材（２）を冷却する冷却手段（３）とを有することを特徴とする切断装置。  In a cutting apparatus for cutting a laminated board (W) constituted by sandwiching a resin member (1) from both sides by brittle members (2) and (2) along a cutting line, the one side of the laminated board (W) is provided. A first work head (5) and a second work head (6) on the other surface side are provided, and the first work head (5) is a first for cutting the resin member (1) along the cutting line. A second laser irradiation means (8) for heating the laser irradiation means (7) and the brittle member (2) on the one surface side along the cutting line, and the brittle member following the second laser irradiation means (8). Cooling means (3) for cooling (2), and the second working head (6) is a third laser irradiation means for heating the brittle member (2) on the other side along the cutting line. (9) and a cooling means (3) for cooling the brittle member (2) following the third laser irradiation means (9). Cutting device and butterflies. 上記第一作業ヘッド（５）に一直線上に配設された上記第一レーザ照射手段（７）と第二レーザ照射手段（８）と冷却手段（３）の直線配設方向と、上記第二作業ヘッド（６）に一直線上に配設された上記第三レーザ照射手段（９）と上記冷却手段（３）の直線配設方向とが、上記積層板（Ｗ）の切断線の方向に応じて方向変換可能とされた請求項１記載の切断装置。The first laser irradiation means (7), the second laser irradiation means (8) and the cooling means (3) arranged in a straight line on the first working head (5), and the second arrangement direction of the second laser irradiation means (8) and the cooling means (3). The linear arrangement direction of the third laser irradiation means (9) and the cooling means (3) arranged in a straight line on the work head (6) depends on the direction of the cutting line of the laminate (W). cutting device according to claim 1 which is capable redirecting Te.
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