TW200930481A - Anti-oxidative fine copper powder and conductive paste with anti-oxidative fine copper powder - Google Patents

Anti-oxidative fine copper powder and conductive paste with anti-oxidative fine copper powder Download PDF

Info

Publication number
TW200930481A
TW200930481A TW97101103A TW97101103A TW200930481A TW 200930481 A TW200930481 A TW 200930481A TW 97101103 A TW97101103 A TW 97101103A TW 97101103 A TW97101103 A TW 97101103A TW 200930481 A TW200930481 A TW 200930481A
Authority
TW
Taiwan
Prior art keywords
copper powder
fine copper
powder
oxidation
oxidative
Prior art date
Application number
TW97101103A
Other languages
English (en)
Chinese (zh)
Other versions
TWI341756B (enrdf_load_stackoverflow
Inventor
Qiu-Lang Lai
zhao-rui Lai
Original Assignee
Qiu-Lang Lai
zhao-rui Lai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qiu-Lang Lai, zhao-rui Lai filed Critical Qiu-Lang Lai
Priority to TW97101103A priority Critical patent/TW200930481A/zh
Publication of TW200930481A publication Critical patent/TW200930481A/zh
Application granted granted Critical
Publication of TWI341756B publication Critical patent/TWI341756B/zh

Links

Landscapes

  • Conductive Materials (AREA)
TW97101103A 2008-01-11 2008-01-11 Anti-oxidative fine copper powder and conductive paste with anti-oxidative fine copper powder TW200930481A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97101103A TW200930481A (en) 2008-01-11 2008-01-11 Anti-oxidative fine copper powder and conductive paste with anti-oxidative fine copper powder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97101103A TW200930481A (en) 2008-01-11 2008-01-11 Anti-oxidative fine copper powder and conductive paste with anti-oxidative fine copper powder

Publications (2)

Publication Number Publication Date
TW200930481A true TW200930481A (en) 2009-07-16
TWI341756B TWI341756B (enrdf_load_stackoverflow) 2011-05-11

Family

ID=44864960

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97101103A TW200930481A (en) 2008-01-11 2008-01-11 Anti-oxidative fine copper powder and conductive paste with anti-oxidative fine copper powder

Country Status (1)

Country Link
TW (1) TW200930481A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107354534A (zh) * 2017-08-23 2017-11-17 厦门翔鹭化纤股份有限公司 一种导电聚酯纤维的制备方法
US20190035513A1 (en) * 2016-01-29 2019-01-31 Toyo Ink Sc Holdings Co., Ltd. Electroconductive composition, method for producing the same, and electroconductive material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190035513A1 (en) * 2016-01-29 2019-01-31 Toyo Ink Sc Holdings Co., Ltd. Electroconductive composition, method for producing the same, and electroconductive material
CN107354534A (zh) * 2017-08-23 2017-11-17 厦门翔鹭化纤股份有限公司 一种导电聚酯纤维的制备方法
CN107354534B (zh) * 2017-08-23 2022-08-23 厦门翔鹭化纤股份有限公司 一种导电聚酯纤维的制备方法

Also Published As

Publication number Publication date
TWI341756B (enrdf_load_stackoverflow) 2011-05-11

Similar Documents

Publication Publication Date Title
CN105531774B (zh) 层叠陶瓷电子部件
CN101714607B (zh) 金属铝电极压电陶瓷元件及其制备方法
CN101290817B (zh) 一种耐高温抗氧化无铅镍导体浆料及其制备方法
TWI223290B (en) Conductive paste, manufacturing method of laminated ceramic electronic device and laminated ceramic electronic device
CN103380467B (zh) 电子元器件的安装结构
TW201003694A (en) Ceramic electronic component and method for manufacturing the same
JP2013191832A (ja) 積層セラミック電子部品
JP2004362950A (ja) 銀粉末を主体とする導体ペースト及びその製造方法
CN104956213B (zh) 用于形成气体传感器电极的金属膏
WO2019220667A1 (ja) 導電性ペースト、電子部品及び積層セラミックコンデンサ
JP5476631B2 (ja) 電子部品およびその製造方法
JP6727588B2 (ja) 導電性ペースト
CN103165222B (zh) 一种ntc热敏电阻用高温烧结导电银浆及其制备方法
WO2019188775A1 (ja) 導電性ペースト、電子部品、及び積層セラミックコンデンサ
JP3799933B2 (ja) 導電性ペーストおよびセラミック電子部品
TW498349B (en) Electroconductive composition and printed circuit board using the same
CN101486094A (zh) 抗氧化的微细铜粉及具有抗氧化的微细铜粉的导电性浆料
TW200930481A (en) Anti-oxidative fine copper powder and conductive paste with anti-oxidative fine copper powder
US6452780B2 (en) Capacitor
TW200418222A (en) Terminal electrode compositions for multilayer ceramic capacitors
CN103165223A (zh) 一种ptc热敏电阻用高温烧结导电银浆及其制备方法
JPH09190950A (ja) 電子部品の外部電極
JP2002008938A (ja) 積層型電子部品およびその製法
JP6290131B2 (ja) ガラス基板用導電性ペースト、導電膜の形成方法、および銀導電膜
CN104282404B (zh) 复合式铜电极陶瓷正温度系数热敏电阻及其制备工艺