TW200923590A - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method Download PDF

Info

Publication number
TW200923590A
TW200923590A TW097129417A TW97129417A TW200923590A TW 200923590 A TW200923590 A TW 200923590A TW 097129417 A TW097129417 A TW 097129417A TW 97129417 A TW97129417 A TW 97129417A TW 200923590 A TW200923590 A TW 200923590A
Authority
TW
Taiwan
Prior art keywords
liquid
support plate
substrate
wafer
exposure apparatus
Prior art date
Application number
TW097129417A
Other languages
English (en)
Chinese (zh)
Inventor
Tomofumi Nishikawara
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200923590A publication Critical patent/TW200923590A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW097129417A 2007-08-08 2008-08-01 Exposure apparatus and device manufacturing method TW200923590A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007206531A JP4961299B2 (ja) 2007-08-08 2007-08-08 露光装置およびデバイス製造方法

Publications (1)

Publication Number Publication Date
TW200923590A true TW200923590A (en) 2009-06-01

Family

ID=40346177

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097129417A TW200923590A (en) 2007-08-08 2008-08-01 Exposure apparatus and device manufacturing method

Country Status (4)

Country Link
US (1) US7630056B2 (enExample)
JP (1) JP4961299B2 (enExample)
KR (1) KR20090015824A (enExample)
TW (1) TW200923590A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5001343B2 (ja) * 2008-12-11 2012-08-15 エーエスエムエル ネザーランズ ビー．ブイ． 流体抽出システム、液浸リソグラフィ装置、及び液浸リソグラフィ装置で使用される液浸液の圧力変動を低減する方法
NL2004305A (en) 2009-03-13 2010-09-14 Asml Netherlands Bv Substrate table, immersion lithographic apparatus and device manufacturing method.
NL2006127A (en) * 2010-02-17 2011-08-18 Asml Netherlands Bv A substrate table, a lithographic apparatus and a method for manufacturing a device using a lithographic apparatus.
EP2856262B1 (en) * 2012-05-29 2019-09-25 ASML Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
NL2010762A (en) * 2012-05-29 2013-12-02 Asml Netherlands Bv An object holder, a lithographic apparatus and a device manufacturing method.
US10578959B2 (en) 2015-04-29 2020-03-03 Asml Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
JP6702753B2 (ja) 2016-02-17 2020-06-03 キヤノン株式会社 リソグラフィ装置、及び物品の製造方法
WO2017194247A1 (en) * 2016-05-12 2017-11-16 Asml Netherlands B.V. Extraction body for lithographic apparatus
US10534271B2 (en) * 2017-01-26 2020-01-14 Asml Netherlands B.V. Lithography apparatus and a method of manufacturing a device
KR20220145343A (ko) * 2020-02-24 2022-10-28 에이에스엠엘 네델란즈 비.브이. 기판 지지체 및 기판 테이블

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100568101C (zh) * 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
US7213963B2 (en) * 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2738792B1 (en) * 2003-06-13 2015-08-05 Nikon Corporation Exposure method, substrate stage, exposure apparatus, and device manufacturing method
JP3862678B2 (ja) 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
KR101941351B1 (ko) * 2003-12-15 2019-01-22 가부시키가이샤 니콘 스테이지 장치, 노광 장치, 및 노광 방법
JP4600286B2 (ja) * 2003-12-16 2010-12-15 株式会社ニコン ステージ装置、露光装置、及び露光方法
JP4826146B2 (ja) * 2004-06-09 2011-11-30 株式会社ニコン 露光装置、デバイス製造方法
US7701550B2 (en) * 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG10201801998TA (en) 2004-09-17 2018-04-27 Nikon Corp Substrate holding device, exposure apparatus, and device manufacturing method
EP2472332B1 (en) * 2004-11-01 2014-03-12 Nikon Corporation Exposure apparatus and device fabricating method
EP2995997B1 (en) * 2004-12-15 2017-08-30 Nikon Corporation Exposure apparatus, exposure method, and device fabricating method
JP2006173527A (ja) * 2004-12-20 2006-06-29 Sony Corp 露光装置
JP4844186B2 (ja) * 2005-03-18 2011-12-28 株式会社ニコン プレート部材、基板保持装置、露光装置及び露光方法、並びにデバイス製造方法
JP4752320B2 (ja) * 2005-04-28 2011-08-17 株式会社ニコン 基板保持装置及び露光装置、基板保持方法、露光方法、並びにデバイス製造方法
JP2007019392A (ja) * 2005-07-11 2007-01-25 Canon Inc 露光装置
JP3997244B2 (ja) 2005-10-04 2007-10-24 キヤノン株式会社 露光装置及びデバイス製造方法
US7420194B2 (en) * 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US8027019B2 (en) * 2006-03-28 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7841352B2 (en) * 2007-05-04 2010-11-30 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8514365B2 (en) * 2007-06-01 2013-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
JP2009043879A (ja) 2009-02-26
US7630056B2 (en) 2009-12-08
US20090040481A1 (en) 2009-02-12
JP4961299B2 (ja) 2012-06-27
KR20090015824A (ko) 2009-02-12

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