TW200918792A - Sealing structure - Google Patents

Sealing structure Download PDF

Info

Publication number
TW200918792A
TW200918792A TW97127690A TW97127690A TW200918792A TW 200918792 A TW200918792 A TW 200918792A TW 97127690 A TW97127690 A TW 97127690A TW 97127690 A TW97127690 A TW 97127690A TW 200918792 A TW200918792 A TW 200918792A
Authority
TW
Taiwan
Prior art keywords
sealing
metal
flat surface
sealing structure
seal
Prior art date
Application number
TW97127690A
Other languages
English (en)
Chinese (zh)
Inventor
Satoshi Tohdoh
Takahiro Kariya
Takeshi Ikeda
Original Assignee
Mitsubishi Cable Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Ind Ltd filed Critical Mitsubishi Cable Ind Ltd
Publication of TW200918792A publication Critical patent/TW200918792A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/08—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing
    • F16J15/0887—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing the sealing effect being obtained by elastic deformation of the packing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Gasket Seals (AREA)
  • Glass Compositions (AREA)
TW97127690A 2007-07-23 2008-07-21 Sealing structure TW200918792A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007190969A JP4855356B2 (ja) 2007-07-23 2007-07-23 密封構造体

Publications (1)

Publication Number Publication Date
TW200918792A true TW200918792A (en) 2009-05-01

Family

ID=40281154

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97127690A TW200918792A (en) 2007-07-23 2008-07-21 Sealing structure

Country Status (3)

Country Link
JP (1) JP4855356B2 (ja)
TW (1) TW200918792A (ja)
WO (1) WO2009013894A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583151B2 (ja) 2012-01-23 2014-09-03 三菱電線工業株式会社 金属シール
JP5717662B2 (ja) 2012-01-27 2015-05-13 三菱電線工業株式会社 金属シール
JP2015200366A (ja) * 2014-04-08 2015-11-12 日本特殊陶業株式会社 接合体
JP2017040280A (ja) * 2015-08-18 2017-02-23 日本バルカー工業株式会社 金属リングガスケット
EP3453047B1 (en) * 2016-05-06 2022-04-06 Precision Polymer Engineering Limited An elastomeric seal

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0629549B2 (ja) * 1985-07-23 1994-04-20 ヤマハ発動機株式会社 エンジンの排気管連結装置
JPS6250374A (ja) * 1985-08-30 1987-03-05 Mitsui Toatsu Chem Inc 耐熱性接着剤
JPS6250374U (ja) * 1985-09-18 1987-03-28
JPH01133589U (ja) * 1988-03-08 1989-09-12
JPH05248542A (ja) * 1991-12-30 1993-09-24 Japan Atom Energy Res Inst メタルガスケットを用いた真空シール構造、真空シール方法、真空シール用メタルガスケットおよびメタルガスケット用真空フランジ
JP4037647B2 (ja) * 2001-12-25 2008-01-23 三菱電線工業株式会社 ジャケットシール
JP2006153062A (ja) * 2004-11-25 2006-06-15 Mitsubishi Cable Ind Ltd 金属シール材

Also Published As

Publication number Publication date
JP4855356B2 (ja) 2012-01-18
JP2009024838A (ja) 2009-02-05
WO2009013894A1 (ja) 2009-01-29

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