WO2009013894A1 - 密封構造体 - Google Patents
密封構造体 Download PDFInfo
- Publication number
- WO2009013894A1 WO2009013894A1 PCT/JP2008/001949 JP2008001949W WO2009013894A1 WO 2009013894 A1 WO2009013894 A1 WO 2009013894A1 JP 2008001949 W JP2008001949 W JP 2008001949W WO 2009013894 A1 WO2009013894 A1 WO 2009013894A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- quartz
- sealing
- metal
- sealing structure
- ceramic
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/08—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing
- F16J15/0887—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing the sealing effect being obtained by elastic deformation of the packing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Gasket Seals (AREA)
- Glass Compositions (AREA)
Abstract
本発明は、半導体や液晶の製造装置に於て用いられる石英(又はセラミック)と金属という線膨張係数が相違する2部材間の密封性(シール性)に優れ、特に、ヒートサイクルを繰り返しても高いシール性能を維持できて、かつ、石英(又はセラミック)から成る相手部材が割れることがない寿命の長い密封構造体を提供することを目的とし、石英の板状脆性部材(1)を、金属のメインシール(10)と、金属の副シール(20)にて、弾発的遊離状態で、挾着保持するものである。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007190969A JP4855356B2 (ja) | 2007-07-23 | 2007-07-23 | 密封構造体 |
JP2007-190969 | 2007-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009013894A1 true WO2009013894A1 (ja) | 2009-01-29 |
Family
ID=40281154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/001949 WO2009013894A1 (ja) | 2007-07-23 | 2008-07-22 | 密封構造体 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4855356B2 (ja) |
TW (1) | TW200918792A (ja) |
WO (1) | WO2009013894A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109155267A (zh) * | 2016-05-06 | 2019-01-04 | 精密聚合物工程有限公司 | 一种弹性密封件 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5583151B2 (ja) | 2012-01-23 | 2014-09-03 | 三菱電線工業株式会社 | 金属シール |
JP5717662B2 (ja) | 2012-01-27 | 2015-05-13 | 三菱電線工業株式会社 | 金属シール |
JP2015200366A (ja) * | 2014-04-08 | 2015-11-12 | 日本特殊陶業株式会社 | 接合体 |
JP2017040280A (ja) * | 2015-08-18 | 2017-02-23 | 日本バルカー工業株式会社 | 金属リングガスケット |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6223517A (ja) * | 1985-07-23 | 1987-01-31 | Yamaha Motor Co Ltd | エンジンの排気管連結装置 |
JPS6250374U (ja) * | 1985-09-18 | 1987-03-28 | ||
JPH01133589U (ja) * | 1988-03-08 | 1989-09-12 | ||
JP2003194226A (ja) * | 2001-12-25 | 2003-07-09 | Mitsubishi Cable Ind Ltd | ジャケットシール |
JP2006153062A (ja) * | 2004-11-25 | 2006-06-15 | Mitsubishi Cable Ind Ltd | 金属シール材 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6250374A (ja) * | 1985-08-30 | 1987-03-05 | Mitsui Toatsu Chem Inc | 耐熱性接着剤 |
JPH05248542A (ja) * | 1991-12-30 | 1993-09-24 | Japan Atom Energy Res Inst | メタルガスケットを用いた真空シール構造、真空シール方法、真空シール用メタルガスケットおよびメタルガスケット用真空フランジ |
-
2007
- 2007-07-23 JP JP2007190969A patent/JP4855356B2/ja active Active
-
2008
- 2008-07-21 TW TW97127690A patent/TW200918792A/zh unknown
- 2008-07-22 WO PCT/JP2008/001949 patent/WO2009013894A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6223517A (ja) * | 1985-07-23 | 1987-01-31 | Yamaha Motor Co Ltd | エンジンの排気管連結装置 |
JPS6250374U (ja) * | 1985-09-18 | 1987-03-28 | ||
JPH01133589U (ja) * | 1988-03-08 | 1989-09-12 | ||
JP2003194226A (ja) * | 2001-12-25 | 2003-07-09 | Mitsubishi Cable Ind Ltd | ジャケットシール |
JP2006153062A (ja) * | 2004-11-25 | 2006-06-15 | Mitsubishi Cable Ind Ltd | 金属シール材 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109155267A (zh) * | 2016-05-06 | 2019-01-04 | 精密聚合物工程有限公司 | 一种弹性密封件 |
CN109155267B (zh) * | 2016-05-06 | 2024-01-26 | 精密聚合物工程有限公司 | 一种弹性密封件 |
Also Published As
Publication number | Publication date |
---|---|
JP4855356B2 (ja) | 2012-01-18 |
JP2009024838A (ja) | 2009-02-05 |
TW200918792A (en) | 2009-05-01 |
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