WO2009013894A1 - 密封構造体 - Google Patents

密封構造体 Download PDF

Info

Publication number
WO2009013894A1
WO2009013894A1 PCT/JP2008/001949 JP2008001949W WO2009013894A1 WO 2009013894 A1 WO2009013894 A1 WO 2009013894A1 JP 2008001949 W JP2008001949 W JP 2008001949W WO 2009013894 A1 WO2009013894 A1 WO 2009013894A1
Authority
WO
WIPO (PCT)
Prior art keywords
quartz
sealing
metal
sealing structure
ceramic
Prior art date
Application number
PCT/JP2008/001949
Other languages
English (en)
French (fr)
Inventor
Satoshi Tohdoh
Takahiro Kariya
Takeshi Ikeda
Original Assignee
Mitsubishi Cable Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries, Ltd. filed Critical Mitsubishi Cable Industries, Ltd.
Publication of WO2009013894A1 publication Critical patent/WO2009013894A1/ja

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/08—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing
    • F16J15/0887—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing the sealing effect being obtained by elastic deformation of the packing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gasket Seals (AREA)
  • Glass Compositions (AREA)

Abstract

　本発明は、半導体や液晶の製造装置に於て用いられる石英（又はセラミック）と金属という線膨張係数が相違する２部材間の密封性（シール性）に優れ、特に、ヒートサイクルを繰り返しても高いシール性能を維持できて、かつ、石英（又はセラミック）から成る相手部材が割れることがない寿命の長い密封構造体を提供することを目的とし、石英の板状脆性部材（１）を、金属のメインシール（１０）と、金属の副シール（２０）にて、弾発的遊離状態で、挾着保持するものである。
PCT/JP2008/001949 2007-07-23 2008-07-22 密封構造体 WO2009013894A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007190969A JP4855356B2 (ja) 2007-07-23 2007-07-23 密封構造体
JP2007-190969 2007-07-23

Publications (1)

Publication Number Publication Date
WO2009013894A1 true WO2009013894A1 (ja) 2009-01-29

Family

ID=40281154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001949 WO2009013894A1 (ja) 2007-07-23 2008-07-22 密封構造体

Country Status (3)

Country Link
JP (1) JP4855356B2 (ja)
TW (1) TW200918792A (ja)
WO (1) WO2009013894A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109155267A (zh) * 2016-05-06 2019-01-04 精密聚合物工程有限公司 一种弹性密封件

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583151B2 (ja) 2012-01-23 2014-09-03 三菱電線工業株式会社 金属シール
JP5717662B2 (ja) 2012-01-27 2015-05-13 三菱電線工業株式会社 金属シール
JP2015200366A (ja) * 2014-04-08 2015-11-12 日本特殊陶業株式会社 接合体
JP2017040280A (ja) * 2015-08-18 2017-02-23 日本バルカー工業株式会社 金属リングガスケット

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223517A (ja) * 1985-07-23 1987-01-31 Yamaha Motor Co Ltd エンジンの排気管連結装置
JPS6250374U (ja) * 1985-09-18 1987-03-28
JPH01133589U (ja) * 1988-03-08 1989-09-12
JP2003194226A (ja) * 2001-12-25 2003-07-09 Mitsubishi Cable Ind Ltd ジャケットシール
JP2006153062A (ja) * 2004-11-25 2006-06-15 Mitsubishi Cable Ind Ltd 金属シール材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6250374A (ja) * 1985-08-30 1987-03-05 Mitsui Toatsu Chem Inc 耐熱性接着剤
JPH05248542A (ja) * 1991-12-30 1993-09-24 Japan Atom Energy Res Inst メタルガスケットを用いた真空シール構造、真空シール方法、真空シール用メタルガスケットおよびメタルガスケット用真空フランジ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223517A (ja) * 1985-07-23 1987-01-31 Yamaha Motor Co Ltd エンジンの排気管連結装置
JPS6250374U (ja) * 1985-09-18 1987-03-28
JPH01133589U (ja) * 1988-03-08 1989-09-12
JP2003194226A (ja) * 2001-12-25 2003-07-09 Mitsubishi Cable Ind Ltd ジャケットシール
JP2006153062A (ja) * 2004-11-25 2006-06-15 Mitsubishi Cable Ind Ltd 金属シール材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109155267A (zh) * 2016-05-06 2019-01-04 精密聚合物工程有限公司 一种弹性密封件
CN109155267B (zh) * 2016-05-06 2024-01-26 精密聚合物工程有限公司 一种弹性密封件

Also Published As

Publication number Publication date
TW200918792A (en) 2009-05-01
JP2009024838A (ja) 2009-02-05
JP4855356B2 (ja) 2012-01-18

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