TW200913043A - Dicing device - Google Patents

Dicing device Download PDF

Info

Publication number
TW200913043A
TW200913043A TW97132627A TW97132627A TW200913043A TW 200913043 A TW200913043 A TW 200913043A TW 97132627 A TW97132627 A TW 97132627A TW 97132627 A TW97132627 A TW 97132627A TW 200913043 A TW200913043 A TW 200913043A
Authority
TW
Taiwan
Prior art keywords
workpiece
microscope
cutting device
processing
stages
Prior art date
Application number
TW97132627A
Other languages
English (en)
Chinese (zh)
Inventor
Tomohiro Suzuki
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200913043A publication Critical patent/TW200913043A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0608—Grinders for cutting-off using a saw movable on slideways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW97132627A 2007-08-31 2008-08-27 Dicing device TW200913043A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007226273 2007-08-31

Publications (1)

Publication Number Publication Date
TW200913043A true TW200913043A (en) 2009-03-16

Family

ID=40387088

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97132627A TW200913043A (en) 2007-08-31 2008-08-27 Dicing device

Country Status (3)

Country Link
JP (1) JP5464421B2 (ja)
TW (1) TW200913043A (ja)
WO (1) WO2009028365A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비
JP6205446B2 (ja) * 2016-03-16 2017-09-27 リンテック株式会社 光照射装置および光照射方法
CN112372463A (zh) * 2020-11-23 2021-02-19 湖南邦普汽车循环有限公司 多片式模组电极连接切断装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290040A (ja) * 1989-04-28 1990-11-29 Disco Abrasive Syst Ltd アライメントシステム
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4436641B2 (ja) * 2003-09-09 2010-03-24 株式会社ディスコ 切削装置におけるアライメント方法
JP4571851B2 (ja) * 2004-11-30 2010-10-27 株式会社ディスコ 切削装置
JP4527559B2 (ja) * 2005-01-31 2010-08-18 株式会社ディスコ 露光装置
JP2006222181A (ja) * 2005-02-09 2006-08-24 Matsushita Electric Ind Co Ltd チップ搭載装置およびチップ搭載方法

Also Published As

Publication number Publication date
WO2009028365A1 (ja) 2009-03-05
JP5464421B2 (ja) 2014-04-09
JPWO2009028365A1 (ja) 2010-12-02

Similar Documents

Publication Publication Date Title
TWI451955B (zh) 切割裝置及切割方法
JP4916215B2 (ja) ウエーハ切削装置
TWI457218B (zh) 切割方法
JP2003163178A (ja) ダイシング装置
TWI392004B (zh) Cutting device
TW201736070A (zh) 被加工物的切割方法
JP4697843B2 (ja) アライメント装置及び加工装置
JP2001308034A (ja) 切削装置
TW200918270A (en) Dicing device and dicing method
JP5025383B2 (ja) パッケージ基板の分割方法
TWI450805B (zh) 切割裝置及切割方法
TW200913043A (en) Dicing device
JP2018181931A (ja) 切削装置
TWI771836B (zh) 研削機構及研削裝置
TW202129746A (zh) 切割裝置以及切割方法
JP4542223B2 (ja) 切削装置
JP3815551B2 (ja) ダイシング装置
JP6850569B2 (ja) 研磨方法
TW200911455A (en) Dicing device
JP2020123622A (ja) キーパターンの検出方法、及び装置
JP7572518B2 (ja) 貼り合わせウェーハのエッジトリミング加工方法、及びエッジトリミング加工装置
JP6084144B2 (ja) 切削方法
TWI761609B (zh) 晶圓的加工方法
JP2010062435A (ja) ダイシング方法及びダイシング装置
TW202329315A (zh) 磨削裝置