TW200913026A - Two-fluid supply module for cleaning substrate and cleaning device using the same - Google Patents

Two-fluid supply module for cleaning substrate and cleaning device using the same Download PDF

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Publication number
TW200913026A
TW200913026A TW097120381A TW97120381A TW200913026A TW 200913026 A TW200913026 A TW 200913026A TW 097120381 A TW097120381 A TW 097120381A TW 97120381 A TW97120381 A TW 97120381A TW 200913026 A TW200913026 A TW 200913026A
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Taiwan
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air
cleaning liquid
cleaning
module
inlet
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TW097120381A
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Chinese (zh)
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Kun-Young Lim
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K C Tech Co Ltd
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Publication of TW200913026A publication Critical patent/TW200913026A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Nozzles (AREA)

Abstract

Provided are a two-fluid supply module that supplies two fluids of gas and liquid used in cleaning a substrate toward an injection nozzle and a cleaning device using the same. The two-fluid supply module includes a cleaning liquid inlet, an air inlet, a cleaning liquid channel, an air channel, a cleaning liquid outlet and an air outlet to supply a cleaning liquid and air for forming two-fluid bubbles toward the upper and lower nozzle modules for cleaning a substrate, and supports the upper and lower nozzle modules. With this configuration, a structure of a substrate cleaning device using two fluids is so simple that it is easy to manufacture, install and maintain the cleaning device and this cleaning device is advantageous to an installation layout.

Description

200913026 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種用於清洗一基板之裝置,且更特定言 之,係關於一種朝一注射噴嘴供應用於清洗一基板之氣體 與液體之雙流體之雙流體供應模組及一種使用該模組之清 洗裝置。 【先前技術】 一平板顯示器(FPD)之一基板及其它此等基板經由各種BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for cleaning a substrate, and more particularly to a gas and liquid supply for cleaning a substrate toward an injection nozzle. A fluid dual fluid supply module and a cleaning device using the same. [Prior Art] A substrate of a flat panel display (FPD) and other such substrates are via various

過程被製造。在此等過程中,一表面處理過程包含藉由注 射諸如一清洗液、一蝕刻液或一顯影液之類的處理液至該 基板來清洗、蝕刻、顯影或光阻剝離。在該表面處理過程 中,藉由一傳送帶或其他傳送機構以恒速水平移動該基 板,且該處理液被施加或注射至該基板之頂部或底部表面 或該基板之頂部表面與底部表面兩者,因而清洗、蝕刻、 顯影或光阻剝離。 同時,由於該基板之表面在經歷包含該表面處理過程之 該等各種製造過程時受到粒子或其他污染物污染,所以清 洗過程必須在—些製造過程之前及之後被執行以移除該等 污染物。舉例而言’用於清洗該基板之表面之清洗過程包 含一化學液處理過程、-沖洗過程及-乾燥過程。特定言 之:該化學液處理過程使用諸如去離子水、化學品或等; 之類的清洗液以去除諸如自該基板之表面之該等粒子之類 的該等污染物。 此外,在該清洗過程中, 當該清洗液被注射至該基板以 131681.doc 200913026 移除粒子或污染物時’該清洗液及乾淨的乾燥空氣(其後 稱之為”以”)之雙流體被混合並起心提高清洗效率。因 此,該泡碰觸並清洗該基板之表面。 圖1係-用於該清洗過程之—習用噴泡型清洗裝置 視圖》The process is manufactured. In such a process, a surface treatment process involves cleaning, etching, developing or photoresist stripping by injecting a treatment liquid such as a cleaning liquid, an etching liquid or a developing solution onto the substrate. During the surface treatment, the substrate is moved horizontally at a constant speed by a conveyor belt or other conveying mechanism, and the treatment liquid is applied or injected to the top or bottom surface of the substrate or both the top surface and the bottom surface of the substrate. Therefore, cleaning, etching, development or photoresist peeling. At the same time, since the surface of the substrate is contaminated by particles or other contaminants during the various manufacturing processes including the surface treatment process, the cleaning process must be performed before and after some manufacturing processes to remove the contaminants. . For example, the cleaning process for cleaning the surface of the substrate comprises a chemical liquid treatment process, a -rinsing process, and a drying process. In particular: the chemical liquid treatment process uses a cleaning fluid such as deionized water, chemicals or the like to remove such contaminants such as the particles from the surface of the substrate. In addition, during the cleaning process, when the cleaning liquid is injected onto the substrate to remove particles or contaminants at 131681.doc 200913026, the cleaning liquid and the clean dry air (hereinafter referred to as "to") double The fluid is mixed and raised to improve cleaning efficiency. Therefore, the bubble touches and cleans the surface of the substrate. Figure 1 is a conventional bubble spray cleaning device for the cleaning process.

如圖1所示,該習用噴泡型清洗裝置包含—上喷嘴模㈤ 及-下喷嘴模組2,其相互垂直對稱。該上喷嘴模W包含 一上清洗液分配管la、一上空氣分配管lb及一上喷嘴k。 該下噴嘴模組2包含一下清洗液分配管〜、一下空氣分配 f2b及:下喷嘴2e。作為_實例去離子水經由該上清洗 液刀配官la及下清洗液分配管2a被供應,1空氣經由該上 空氣分配管⑽下空氣分配f2b被供應。待清洗之基板通 過該上喷嘴模組i與該下噴嘴模組2之間。 該上清洗液分配管la經由複.數個連接埠3a被連接至一上 π洗液供應管3以便接收自一外部清洗液供應源(未顯示)之 '月洗液。該下清洗液分配管2a經由複數個連接埠4a被連接 至一下清洗液供應管4以便接收自一外部清洗液供應源(未 顯不)之清洗液。同樣,該上空氣分配管lb經由複數個連 接埠5a被連接至一上空氣供應管5以便接收自一外部空氣 供應源(未顯示)之空氣。該下空氣分配管2b經由複數個連 接埠6a被連接至一下空氣供應管6以便接收自一外部空氣 供應源(未顯示)之空氣。 因此’該清洗液經由該上清洗液分配管丨a自該上清洗液 供應S 3被供應至該上喷嘴1 c,且同時經由該下清洗液分 J3168].d〇i 200913026 配管2a自該下清洗液供應管4被供應至該下喷嘴2c。此 外’空氣經由該上空氣分配管lb自該上空氣供應管5被供 應至該上噴嘴1 c,且經由該下空氣分配管2b自該下空氣供 應管6被供應至該下喷嘴2C ^此時,該清洗液及該空氣被 混合及起泡以經由該上噴嘴lc被注射,且該清洗液及該空 氣被混合及起泡以經由該下喷嘴2c被注射。因此,該起泡 之雙流體被注射至該基板。 然而,在該習用喷泡型清洗裝置中,被連接至該上噴嘴 模組1之該上清洗液供應管3及上空氣供應管5及被連接至 s玄下喷嘴模組2之該下清洗液供應管4及下空氣供應管6被 提供作為分開的長管。如此,由於此種習用清洗裝置具有 一複雜結構並佔據太多的空間,所以其不利於一安裝佈 置。 【發明内容】 本發明提供一種具有一用於分別供應一清洗液及空氣至 一上喷嘴模組及一下噴嘴模組之簡單結構的雙流體供應模 組,及一種使用該模組之清洗裝置。 本發明之額外態樣將在以下描述中提出,且部分將在該 說明中顯而易見,或可藉由本發明之實施而瞭解該等態 樣。 本發明之-實施例揭示—種雙流體供應模組,其支持用 、’月洗基板之上喷嘴模組及下噴嘴模組並供應一用以形 成又机體泡之清洗液及空氣至該上噴嘴模組及下喷嘴模 組’該雙流體供應模組包含:—清洗液人口,-清洗液自 131681.doc 200913026 外部被引進至該清洗液入口;一空氣入口,空氣自外部被 引進至該空氣入口;-清洗液出口,其朝該上喷嘴模组及 下喷嘴模組排出被引進該清洗液入口中之該清洗液;一空 氣出口,其朝該上喷嘴模組及下喷嘴模組排出被引進該空 氣入口之該空氣卜清洗液通道’其將該清洗液入口盘該 清洗液出口連通;及一空氣通道,其將該空氣入口與該空 氣出口連通。 該清洗液人口、該空氣人口、該清洗液通道、該空氣通 道、該清洗液出口及該空氣出口可包含與該上喷嘴模組連 通之一第:清洗液入口、-第一空氣入口 一第一清洗液 通道 第一空氣通道、一第一清洗液出口及—第一空氣 出口;及與該下喷嘴模組連通之一第二清洗液入口、一第 二空氣入口、一第二清洗液通道、一第二空氣通道、一第 二清洗液出口及一第二空氣出口。 本發明之另—實施例揭示—基板清洗裝置,其包含前述 之雙流體供應模組、一上噴嘴模組、一下噴嘴模組及—支 推鬼特疋。之’ β亥上噴嘴模組可包含複數個上喷嘴,其 朝待清洗之基板之-頂部表面注射一清洗液及空氣之雙流 體泡;一上清洗液分配管,其接收自該雙流體供應模組之 -清洗液出口之清洗液並分配該清洗液至該等上喷嘴;及 -上空氣分配管’其接收自該雙流體供應模組之一空氣入 口之空氣並分配該空氣至該等上喷嘴。此外,下喷嘴模板 可包含複數個下喷嘴’其朝該基板之一底部表面注射一产 洗液及空氣之雙流體泡;—下清洗液分配管,其接收自= 131681.doc 200913026 雙流體供應模組之智洛、、φψ η > + 之尨明洗液出口之清洗液並分配該清洗液 s等下噴嘴,及一下空軋分配管,其接收自該雙流體供 應模組之該空氣出口之空氣並分配該空氣至該等下喷嘴。 而且,該支樓塊與該雙流體模組—起支撲該上喷嘴模組及 下喷嘴模組。 應瞭解前述之大體描述及以下之詳細描述兩者係例示性 的及說明性的,且旨在提供如所主張的本發明之進一步說 明。 f 【實施方式】 被包含以提供本發明之進__步瞭解並被併人本說明書及 構成本說明書之一部分之該等附圖圖解本發明之例示性實 施例,且與該描述一起用於說明本發明之該等態樣。 在下文中,參考顯示本發明之例示性實施例之該等附 圖,將更加全面地描述本發明。然而,本發明可以許多不 同形式體現,且不應被解釋為限制於本文所述之例示性實 施例。更確切言之,提供此等例示性實施例以使本發明揭 不之内容係全面的,且將全面地表達本發明之範疇予熟習 此項技術者。在該等圖式中,為清晰起見,層及區域之尺 寸及相對尺寸可被放大。該等圖式中之相同的參考數字表 示相同的元件。 圖2係一根據本發明之一實施例的一雙流體供應模組之 透視圖,圖3係一顯示一從圖2之雙流體供應模組至一注射 噴嘴之通道之示意圖,及圖4係一安裝有圖2之雙流體供應 模組之清洗裝置之透視圖。 131681.doc 200913026 首先’如圖4所示’根據本發明之—實施例的__基板清 ,裝置H)〇包含-被設置於-待清洗之基板s上方之上噴嘴 杈組110、一被設置於該基板s下方之下喷嘴模組120、一 支律該上喷嘴模組11G與下噴嘴模組m並供應雙流體之雙 流體供應模組130,及一支撐該上噴嘴模組11〇與下喷嘴模 組120之支撐塊140。 該上喷嘴模組110包含若干上喷嘴m、一上清洗液分配 管112,及一上空氣分配管113。提供複數個該等上喷嘴 111,且其經配置成一列並面向該待清洗的基板3之一頂部 表面,因而經由其注射該清洗液及空氣之起泡的雙流體。 在此,該上清洗液分配管112分配用以形成該起泡的雙流 體之該清洗液至該等上喷嘴m,且該上空氣分配管113分 配用以形成該起泡的雙流體之空氣至該等上喷嘴丨i i。因 此,被供應至該等上喷嘴lu之該清洗液及空氣被混合並 起泡,使得該起泡的雙流體可被注射至該基板8之頂部表 面,因而清洗該基板s之該頂部表面。 同樣地’該下喷嘴模組丨20包含若干下喷嘴丨21、一下清 洗液分配管122及一下空氣分配管123。提供複數個與該等 上喷嘴111對稱之該等下喷嘴121,且其經配置成—列並面 向該待清洗的基板S之一底部表面,因而經由其注射該清 洗液及空氣之起泡的雙流體。在此,該下清洗液分配管 122分配用以形成該起泡的雙流體之該清洗液至該等下噴 嘴121,且該下空氣分配管123分配用以形成該起泡的雙流 體之空氣至該等下噴嘴121。因此,被供應至該等下噴嘴 131681.doc • 10- 200913026 12 1之該清洗液及空氣被混合及起泡,使得該起泡的雙流 體可被注射至該基板S之底部表面,因而清洗該基板S之底 部表面。 根據本發明之一實施例’該雙流體供應模組13 0與該支 樓塊140—起沿縱向於該基板清洗裝置1〇〇之左端部及右端 部處支掠該上噴嘴模組11 〇及下喷嘴模組丨2〇。 該雙流體供應模組130被劃分為上部分及下部分,該上 噴嘴模組110及該下喷嘴模組12〇經由連接支架15〇及16〇及 封裝(未顯示)被分別連接至該上部分及下部分。此外,該 雙流體供應模組130具有被連接至該上噴嘴模組u〇及下喷 嘴換組120之若干單元並供應該清洗液及空氣,其詳情如 下。 如圖2及3所示’該雙流體供應模組13〇包含排列於該雙 流體供應模組130之一下部分之一第一空氣入口 131、一第 一空氣入口 131’、一第一清洗液入口 132及一第二清洗液入 口 132’。此等入口 131、131,、132及132,被各自連接至外部 空氣供應源(未顯示)及外部清洗液供應源(未顯示)並接收 自外部空氣供應源之空氣及自外部清洗液之供應源之清洗 液。 此外’具有形成分別從該第一空氣入口 131、該第二空 氣入口 131’、該第一清洗液入口 132、及該第二清洗液入口 132’至上噴嘴模組11()及下噴嘴模組12〇的通道。即,形成 從該第一空氣入口 131至該上喷嘴模組11〇之上空氣分配管 113的一第—空氣通道133,及形成從該第二空氣入口 131, 131681.doc 11 200913026 至該下噴嘴模組120之下空氣分配管123的一第二空氣通道 133’。此外’形成從該第一清洗液入口 132至該上喷嘴模組 110之上清洗液分配管112的一第一清洗液通道134,及形 成從該第二清洗液入口 132,至該下喷嘴模組120之下清洗液 分配管122的一第二清洗液通道134'。 而且’一第一空氣出口 135被形成於接觸該上空氣分配 管Π3之該第一空氣通道丨33之一端部處,及一第一清洗液 出口 136被形成於接觸該上清洗液分配管112之該第一清洗 液通道134之一端部處。同樣,一第二空氣出口 135,被形成 於接觸該下空氣分配管123之該第二空氣通道133,之一端部 處’及一第二清洗液出口 136,被形成於接觸該下清洗液分 配管122之該第二清洗液通道134,之一端部處。 經由具有該等前述配置之雙流體供應模組,該雙流體被 供應為如下。 首先’用於形成該等雙流體泡之清洗液自該清洗液供應 源被引進至該雙流體供應模組130之該第一清洗液入口 132 及第二清洗液入口 132'。同樣,用於形成該等雙流體泡之 空氣自該空氣供應源被引進至該雙流體供應模組13〇之該 第一空氣入口 131及第二空氣入口 131,。 被引進至該第一清洗液入口 132之清洗液經由該第一清 洗液通道134流入該第一清洗液出口 1 36,且被供應至被連 接至該第一清洗液出口 1 3 6之該上噴嘴模組11 〇之該上清洗 液分配管112 ’因而被分配至該系列之上喷嘴丨丨1。此外, 被引進至該第一空氣入口 131之空氣經由該第一空氣通道 131681.doc -12- 200913026 133流入該第一空氣出口 135,且被供應至該上喷嘴模組 II 〇之該上空氣分配管113,因而被分配至該系列之上喷嘴 III ^因此,被分配至該等各自的上噴嘴丨丨丨之清洗液及空 氣透過該等上噴嘴111被混合及注射成泡,使得該基板§之 頂部表面可藉由此種噴泡方法被清洗。 類似地,被引進至該第二清洗液入口 132,之清洗液經由 s亥第一 α洗液通道1 34'流入該第二清洗液出口丨3 6,,且被 供應至該下喷嘴模組120之該下清洗液分配管1S2,因而被 分配至該系列之下喷嘴121。此外,被引進至該第二空氣 入口 131’之空氣經由該第二空氣通道133,流入該第二空氣 出口 135 ’且被供應至該下喷嘴模組120之下空氣分配管 123,因而被分配至該系列之下噴嘴121。因此,被分配至 «亥等各自的下嘴嘴121之清洗液及空氣透過該等下噴嘴I〗} 被混合及注射成泡,使得該基板8之底部表面藉由此種噴 泡方法被清洗。 同時,較佳但並非絕對必要的是,被從該清洗液供應源 供應至該上清洗液分配管丨12及下清洗液分配管122之清洗 液之一壓力與被從該空氣供應源供應至該上空氣分配管 113及下二氣分配管123之空氣之一壓力高於該上喷嘴m 及下喷嘴121之正常塵力。 從上述中之顯而易見,一雙流體供應模組與一支撐塊 起/σ縱向於—基板清洗裝置之左端部及右端部處支撐 上喷嘴模組及下噴嘴模組,且其本身具有各自與該上喷嘴 核組與下喷嘴模組連通之雙流體供應通道。 131681.doc 13 200913026 因此,根據本發明之一實施例之清洗裝置不需要一諸如 各自安裝於該習用噴泡型清洗裝置之該上喷嘴模組及下噴 嘴模組處之一清洗液供應管及一空氣供應管之複雜的管配 置。 因此,根據本發明之一實施例,使用雙流體之該基板清 洗裝置之該結構係如此簡單以致於容易製造、安裝及維1 該清洗裝置’且此清洗裝置有利於一安裝佈置。 熟習此項技術者瞭解在無違本發明之精神或範圍下可對 本發明作各種修改及變更。因此,希望本發明涵蓋本發明 之該等修改及變更,只要其等係在該等附加請求項及其等 效物之範圍内。 【圖式簡單說明】 圖1係一通用喷泡型清洗裝置之透視圖; 圖2係一根據本發明之一實施例之一雙流體供應模組之 透視圖; 圖3係一顯示一從圖2之雙流體供應模組至一注射喷嘴之 通道之示意圖; 圖4係一安裝有圖2之雙流體供應模組之清洗裝置之透視 圖。 【主要元件符號說明】 1 上喷嘴模組 1 a 上清洗液分配管 lb 上空氣分配管 1 c 上噴嘴 131681.doc -14- 200913026 2 下喷嘴模組 2a 下清洗液分配管 2b 下空氣分配管 2c 下喷嘴 3 上清洗液供應管 3a 連接埠 4 下清洗液供應管 4a 連接埠 5 上空氣供應管 5a 連接埠 6 下空氣供應管 6a 連接埠 100 基板清洗裝置 110 上喷嘴模組 111 上喷嘴 112 上清洗液分配管 113 上空氣分配管 120 下噴嘴模組 121 下喷嘴 122 下清洗液分配管 123 下空氣分配管 130 雙流體供應模組 131 第一空氣入口 13Γ 第二空氣入口 131681.doc -15- 200913026 132 第一 清洗液入口 132' 第二 清洗液入口 133 第一 空氣通道 133' 第二 空氣通道 134 第一 清洗液通道 134' 第二 清洗液通道 135 第一 空氣出口 135’ 第二 空氣出口 136 第一 清洗液出口 136' 第二 清洗液出口 140 支撐塊 150 支架 160 支架 S 基板 131681.doc - 16-As shown in Fig. 1, the conventional bubble type cleaning device comprises an upper nozzle die (5) and a lower nozzle module 2 which are vertically symmetrical with each other. The upper nozzle die W includes an upper cleaning liquid distribution pipe 1a, an upper air distribution pipe lb, and an upper nozzle k. The lower nozzle module 2 includes a lower cleaning liquid distribution pipe, a lower air distribution f2b, and a lower nozzle 2e. As the example, deionized water is supplied via the upper cleaning liquid knife dispensing unit 1 and the lower cleaning liquid dispensing tube 2a, and 1 air is supplied via the upper air distribution tube (10) lower air distribution f2b. The substrate to be cleaned passes between the upper nozzle module i and the lower nozzle module 2. The upper cleaning liquid distribution pipe 1a is connected to an upper π lotion supply pipe 3 via a plurality of ports 3a for receiving a 'month wash liquid from an external cleaning liquid supply source (not shown). The lower cleaning liquid dispensing pipe 2a is connected to the lower cleaning liquid supply pipe 4 via a plurality of ports 4a for receiving the cleaning liquid from an external cleaning liquid supply source (not shown). Similarly, the upper air distribution pipe lb is connected to an upper air supply pipe 5 via a plurality of connecting ports 5a for receiving air from an external air supply source (not shown). The lower air distribution pipe 2b is connected to the lower air supply pipe 6 via a plurality of connecting ports 6a for receiving air from an external air supply source (not shown). Therefore, the cleaning liquid is supplied to the upper nozzle 1 c from the upper cleaning liquid supply S 3 via the upper cleaning liquid distribution pipe 丨a, and at the same time, the lower cleaning liquid is divided into J3168].d〇i 200913026 piping 2a The lower cleaning liquid supply pipe 4 is supplied to the lower nozzle 2c. Further, 'air is supplied from the upper air supply pipe 5 to the upper nozzle 1 c via the upper air distribution pipe 1b, and is supplied from the lower air supply pipe 6 to the lower nozzle 2C via the lower air distribution pipe 2b. At this time, the cleaning liquid and the air are mixed and foamed to be injected through the upper nozzle lc, and the cleaning liquid and the air are mixed and foamed to be injected through the lower nozzle 2c. Therefore, the foamed two fluid is injected to the substrate. However, in the conventional bubble type cleaning device, the upper cleaning liquid supply pipe 3 and the upper air supply pipe 5 connected to the upper nozzle module 1 and the lower cleaning device connected to the s-nower nozzle module 2 are The liquid supply pipe 4 and the lower air supply pipe 6 are provided as separate long pipes. Thus, since such a conventional cleaning device has a complicated structure and occupies too much space, it is disadvantageous for a mounting arrangement. SUMMARY OF THE INVENTION The present invention provides a two-fluid supply module having a simple structure for separately supplying a cleaning liquid and air to an upper nozzle module and a lower nozzle module, and a cleaning device using the module. Additional aspects of the invention will be set forth in the description which follows, The embodiment of the present invention discloses a two-fluid supply module for supporting, 'removing the nozzle module above the substrate and the lower nozzle module and supplying a cleaning liquid and air for forming the body bubble to the Upper nozzle module and lower nozzle module 'The two-fluid supply module comprises: - a cleaning liquid population, - a cleaning liquid is introduced from the outside of 131681.doc 200913026 to the cleaning liquid inlet; an air inlet, air is introduced from the outside to The air inlet; the cleaning liquid outlet, the cleaning liquid introduced into the cleaning liquid inlet is discharged toward the upper nozzle module and the lower nozzle module; and an air outlet facing the upper nozzle module and the lower nozzle module Discharging the air cleaning fluid passage introduced into the air inlet, which communicates the cleaning fluid inlet tray with the cleaning fluid outlet; and an air passage that communicates the air inlet with the air outlet. The cleaning liquid population, the air population, the cleaning liquid passage, the air passage, the cleaning liquid outlet, and the air outlet may include one of communicating with the upper nozzle module: a cleaning liquid inlet, a first air inlet a cleaning liquid passage first air passage, a first cleaning liquid outlet and a first air outlet; and a second cleaning liquid inlet, a second air inlet, and a second cleaning liquid passage communicating with the lower nozzle module a second air passage, a second cleaning liquid outlet, and a second air outlet. Another embodiment of the present invention discloses a substrate cleaning apparatus comprising the above-described two-fluid supply module, an upper nozzle module, a lower nozzle module, and a push-pull feature. The '[beta] upper nozzle module may comprise a plurality of upper nozzles for injecting a cleaning fluid and air bifluid bubble toward the top surface of the substrate to be cleaned; an upper cleaning liquid dispensing tube received from the two fluid supply a cleaning fluid of the cleaning fluid outlet of the module and dispensing the cleaning fluid to the upper nozzles; and an upper air distribution pipe that receives air from an air inlet of the two fluid supply module and distributes the air to the air Upper nozzle. In addition, the lower nozzle template may include a plurality of lower nozzles that inject a two-fluid bubble that produces a lotion and air toward a bottom surface of the substrate; a lower cleaning liquid distribution tube that is received from the =131681.doc 200913026 dual fluid supply The module of Zhiluo, φψ η > + the cleaning liquid of the washing liquid outlet and the lower nozzle of the cleaning liquid s, and the empty rolling distribution pipe, which receives the air from the two-fluid supply module The air exiting and distributing the air to the lower nozzles. Moreover, the branch block and the two-fluid module support the upper nozzle module and the lower nozzle module. It is to be understood that the foregoing general descriptions f [Embodiment] The accompanying drawings, which are included to provide a part of the specification These aspects of the invention are illustrated. In the following, the invention will be described more fully hereinafter with reference to the accompanying drawings which illustrate However, the invention may be embodied in many different forms and should not be construed as being limited to the illustrative embodiments described herein. Rather, these exemplary embodiments are provided so that this disclosure will not be In the drawings, the dimensions and relative sizes of layers and regions may be exaggerated for clarity. The same reference numbers in the drawings indicate the same elements. 2 is a perspective view of a dual fluid supply module according to an embodiment of the present invention, and FIG. 3 is a schematic view showing a passage from the two-fluid supply module of FIG. 2 to an injection nozzle, and FIG. A perspective view of a cleaning device with the dual fluid supply module of Figure 2. 131681.doc 200913026 Firstly, as shown in FIG. 4, 'the substrate clearing according to the embodiment of the present invention, the device H) 〇 comprises - disposed above the substrate s to be cleaned, above the nozzle group 110, one is The nozzle module 120, the upper nozzle module 11G and the lower nozzle module m are disposed under the substrate s, and the two-fluid two-fluid supply module 130 is supplied, and the upper nozzle module 11 is supported. And a support block 140 of the lower nozzle module 120. The upper nozzle module 110 includes a plurality of upper nozzles m, an upper cleaning liquid distribution pipe 112, and an upper air distribution pipe 113. A plurality of the upper nozzles 111 are provided and are arranged in a row and facing the top surface of one of the substrates 3 to be cleaned, thereby injecting the bubbling two fluids of the cleaning liquid and air therethrough. Here, the upper cleaning liquid dispensing pipe 112 distributes the cleaning fluid for forming the foamed two fluids to the upper nozzles m, and the upper air distribution pipe 113 distributes the air for forming the foaming two-fluid To the upper nozzle 丨 ii. Therefore, the cleaning liquid and air supplied to the upper nozzles lu are mixed and foamed so that the foamed two fluid can be injected onto the top surface of the substrate 8, thereby cleaning the top surface of the substrate s. Similarly, the lower nozzle module 20 includes a plurality of lower nozzles 21, a lower cleaning liquid distribution tube 122, and a lower air distribution tube 123. Providing a plurality of the lower nozzles 121 symmetrical with the upper nozzles 111, and configured to line up and face a bottom surface of the substrate S to be cleaned, thereby injecting the cleaning liquid and the foaming of the air therethrough Two fluid. Here, the lower cleaning liquid dispensing tube 122 distributes the cleaning fluid for forming the foamed two fluid to the lower nozzles 121, and the lower air distribution tube 123 distributes the air for forming the foaming two-fluid To the lower nozzles 121. Therefore, the cleaning liquid and air supplied to the lower nozzles 131681.doc • 10-200913026 12 1 are mixed and foamed so that the foamed two fluid can be injected onto the bottom surface of the substrate S, thereby cleaning The bottom surface of the substrate S. According to an embodiment of the present invention, the two-fluid supply module 130 and the branch block 140 hang the upper nozzle module 11 at a left end and a right end of the substrate cleaning device 1A. And the lower nozzle module 丨2〇. The two-fluid supply module 130 is divided into an upper part and a lower part, and the upper nozzle module 110 and the lower nozzle module 12 are respectively connected to the upper part via the connection brackets 15 and 16 and a package (not shown) Part and bottom. In addition, the two-fluid supply module 130 has a plurality of units connected to the upper nozzle module u and the lower nozzle exchange 120 and supplies the cleaning liquid and air, as described below. As shown in FIGS. 2 and 3, the two-fluid supply module 13A includes a first air inlet 131, a first air inlet 131', and a first cleaning liquid arranged in a lower portion of the two-fluid supply module 130. The inlet 132 and a second cleaning fluid inlet 132'. The inlets 131, 131, 132 and 132 are each connected to an external air supply source (not shown) and an external cleaning fluid supply source (not shown) and receive air from the external air supply source and supply from the external cleaning fluid. Source of cleaning solution. In addition, 'having a formation from the first air inlet 131, the second air inlet 131', the first cleaning liquid inlet 132, and the second cleaning liquid inlet 132' to the upper nozzle module 11 () and the lower nozzle module 12-inch channel. That is, a first air passage 133 is formed from the first air inlet 131 to the air distribution pipe 113 above the upper nozzle module 11A, and is formed from the second air inlet 131, 131681.doc 11 200913026 to the lower A second air passage 133' of the air distribution pipe 123 below the nozzle module 120. Further, a first cleaning liquid passage 134 is formed from the first cleaning liquid inlet 132 to the cleaning liquid distribution pipe 112 above the upper nozzle module 110, and is formed from the second cleaning liquid inlet 132 to the lower nozzle mold. A second cleaning fluid channel 134' of the cleaning fluid dispensing tube 122 below the group 120. Further, a first air outlet 135 is formed at one end of the first air passage port 33 contacting the upper air distribution pipe 3, and a first cleaning liquid outlet 136 is formed in contact with the upper cleaning liquid distribution pipe 112. One end of the first cleaning liquid passage 134. Similarly, a second air outlet 135 is formed at one end portion of the second air passage 133 contacting the lower air distribution pipe 123 and a second cleaning liquid outlet 136 formed to contact the lower cleaning liquid. One end of the second cleaning fluid passage 134 of the pipe 122. The two fluids are supplied as follows via a two-fluid supply module having the aforementioned configuration. First, a cleaning liquid for forming the two-fluid bubble is introduced from the cleaning liquid supply source to the first cleaning liquid inlet 132 and the second cleaning liquid inlet 132' of the two-fluid supply module 130. Similarly, air for forming the two fluid bubbles is introduced from the air supply source to the first air inlet 131 and the second air inlet 131 of the two fluid supply module 13A. The cleaning liquid introduced into the first cleaning liquid inlet 132 flows into the first cleaning liquid outlet 1 36 via the first cleaning liquid passage 134, and is supplied to the first cleaning liquid outlet 1 36. The upper cleaning fluid dispensing tube 112' of the nozzle module 11 is thus dispensed to the nozzle 丨丨1 above the series. In addition, the air introduced into the first air inlet 131 flows into the first air outlet 135 via the first air passage 131681.doc -12- 200913026 133, and is supplied to the upper air of the upper nozzle module II The distribution tube 113 is thus distributed to the nozzles III above the series. Therefore, the cleaning liquid and air distributed to the respective upper nozzles are mixed and injected into the bubbles through the upper nozzles 111, so that the substrate The top surface of § can be cleaned by this bubble method. Similarly, it is introduced into the second cleaning liquid inlet 132, and the cleaning liquid flows into the second cleaning liquid outlet port 36 through the first alpha washing liquid channel 134', and is supplied to the lower nozzle module. The lower cleaning liquid distribution pipe 1S2 is thus distributed to the nozzles 121 below the series. Further, the air introduced to the second air inlet 131' flows into the second air outlet 135' via the second air passage 133 and is supplied to the air distribution pipe 123 below the lower nozzle module 120, thereby being distributed To the nozzle 121 below the series. Therefore, the cleaning liquid and the air which are distributed to the respective lower nozzles 121 and the like are mixed and injected into bubbles so that the bottom surface of the substrate 8 is cleaned by such a bubble method. . Meanwhile, it is preferable, but not absolutely necessary, that a pressure of the cleaning liquid supplied from the cleaning liquid supply source to the upper cleaning liquid distribution pipe 12 and the lower cleaning liquid distribution pipe 122 is supplied from the air supply source to The pressure of one of the air of the upper air distribution pipe 113 and the lower air distribution pipe 123 is higher than the normal dust force of the upper nozzle m and the lower nozzle 121. It is obvious from the above that a dual fluid supply module and a support block support the upper nozzle module and the lower nozzle module at a left end portion and a right end portion of the substrate cleaning device, and have their own and A two-fluid supply passage connecting the upper nozzle core group and the lower nozzle module. 131681.doc 13 200913026 Therefore, the cleaning apparatus according to an embodiment of the present invention does not require a cleaning liquid supply pipe such as one of the upper nozzle module and the lower nozzle module respectively installed in the conventional bubble type cleaning device and A complex tube configuration of an air supply tube. Thus, in accordance with an embodiment of the present invention, the structure of the substrate cleaning apparatus using two fluids is so simple that it is easy to manufacture, install and maintain the cleaning apparatus' and the cleaning apparatus facilitates a mounting arrangement. It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention. Therefore, it is intended that the present invention covers the modifications and modifications of the invention, as long as they are within the scope of the appended claims and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a general-purpose bubble-type cleaning device; FIG. 2 is a perspective view of a two-fluid supply module according to an embodiment of the present invention; 2 is a schematic view of the passage of the dual fluid supply module to an injection nozzle; FIG. 4 is a perspective view of a cleaning device equipped with the two-fluid supply module of FIG. [Main component symbol description] 1 Upper nozzle module 1 a Upper cleaning liquid distribution pipe lb Upper air distribution pipe 1 c Upper nozzle 131681.doc -14- 200913026 2 Lower nozzle module 2a Lower cleaning liquid distribution pipe 2b Lower air distribution pipe 2c Lower nozzle 3 Upper cleaning liquid supply pipe 3a Connection 埠4 Lower cleaning liquid supply pipe 4a Connection 埠5 Upper air supply pipe 5a Connection 埠6 Lower air supply pipe 6a Connection 埠100 Substrate cleaning device 110 Upper nozzle module 111 Upper nozzle 112 Upper cleaning liquid distribution pipe 113 Upper air distribution pipe 120 Lower nozzle module 121 Lower nozzle 122 Lower cleaning liquid distribution pipe 123 Lower air distribution pipe 130 Two-fluid supply module 131 First air inlet 13 Γ Second air inlet 131681.doc -15 - 200913026 132 First cleaning fluid inlet 132' Second cleaning fluid inlet 133 First air passage 133' Second air passage 134 First cleaning liquid passage 134' Second cleaning liquid passage 135 First air outlet 135' Second air outlet 136 first cleaning liquid outlet 136' second cleaning liquid outlet 140 support block 150 bracket 160 bracket S substrate 131 681.doc - 16-

Claims (1)

200913026 、申請專利範ffi: 1. 一種雙流體供應模組,1古 模組及下㈣模組並分_ w於清洗—基板之上喷嘴 一 % η #产 ”用於形成若干雙流體泡之 π洗液及工氣至該上喷嘴模組 體供應模組包括: '、 、嘴模組’該雙流 液入口,一清洗液自外部被引進至該清洗液入 Γ7 : 一:氣入口,空氣自外部被引進至該空氣入口; 仴洗液出口,其朝該上喷嘴模組及下喷嘴模組排出 被引進至該清洗液入口之該清洗液; 一空氣出口,其朝該上噴嘴模組及下喷嘴模組排出被 引進至該空氣入口之該空氣; 一清洗液通道,其將該清洗液入口與該清洗液出口連 通;及 一空氣通道’其將該空氣入口與該空氣出口連通。 2.如請求項1之雙流體供應模組,其中該清洗液入口、該 空氣入口、該清洗液通道、該空氣通道、該清洗液出口 及該空氣出口包括: 與該上噴嘴模組連通之一第一清洗液入口、一第一空 氣入口、一第一清洗液通道、一第一空氣通道、一第— 清洗液出口及一第一空氣出口;及 與該下噴嘴模組連通之一第二清洗液入口、一第二空 氣入口、一第二清洗液通道、一第二空氣通道、一第二 清洗液出口及一第二空氣出口。 131681.doc 200913026 3. 一種基板清洗裝置,包括: 一如請求項1之雙流體供應模組; 一上噴嘴模組,其包含複數個朝待清洗之該基板之一 頂邛表面主射一清洗液及空氣之雙流體泡之上喷嘴、一 接收自4雙机體供應棋組之__清洗液出口之該清洗液並 分配該清洗液至該等上喷嘴之上清洗液分配管,及—接 ,自該雙流體供應模組之—空氣出Π之空氣並分配該空 氣至該等上噴嘴之上空氣分配管; 一下喷嘴模組,其包含複數個朝該基板之—底部表面 注射-清洗液及空氣之雙流體泡之下噴嘴、一接收自該 雙流體供應模組之-清洗液出4該清洗液並分配該清 洗液至該等下噴嘴之下清洗液分配管,及一接收自該雙 流體供應模組之該空氣出口之空氣並分配該空氣至該等 下喷嘴之下空氣分配管;及 一支撐塊,其與該雙流體供應模組一起支撐該上喷嘴 模組及下喷嘴模組。 131681.doc200913026, patent application model ffi: 1. A two-fluid supply module, 1 ancient module and the lower (four) module and divided into _w on the cleaning - the nozzle above the substrate - η #产" is used to form a number of two-fluid bubble The π washing liquid and the working gas to the upper nozzle module body supply module include: ', the nozzle module' the double-flow liquid inlet, and a cleaning liquid is introduced from the outside to the cleaning liquid inlet Γ7: a: gas inlet, air Introduced from the outside to the air inlet; the rinsing liquid outlet discharges the cleaning liquid introduced into the cleaning liquid inlet toward the upper nozzle module and the lower nozzle module; an air outlet facing the upper nozzle module And the lower nozzle module discharges the air introduced to the air inlet; a cleaning liquid passage that communicates the cleaning liquid inlet with the cleaning liquid outlet; and an air passage that communicates the air inlet with the air outlet. 2. The dual fluid supply module of claim 1, wherein the cleaning fluid inlet, the air inlet, the cleaning fluid passage, the air passage, the cleaning fluid outlet, and the air outlet comprise: a first cleaning liquid inlet, a first air inlet, a first cleaning liquid passage, a first air passage, a first cleaning liquid outlet, and a first air outlet; and one of communicating with the lower nozzle module a second cleaning liquid inlet, a second air inlet, a second cleaning liquid passage, a second air passage, a second cleaning liquid outlet, and a second air outlet. 131681.doc 200913026 3. A substrate cleaning device, including The dual-fluid supply module of claim 1, wherein the upper nozzle module comprises a plurality of nozzles on the top surface of the substrate to be cleaned, and a double-fluid bubble above the cleaning liquid and air. Receiving the cleaning liquid from the __ cleaning liquid outlet of the 4 pairs of body supply chess sets and distributing the cleaning liquid to the cleaning liquid distribution pipes above the upper nozzles, and - the air from the two-fluid supply module Discharging the air and distributing the air to the air distribution tubes above the upper nozzles; a nozzle module comprising a plurality of nozzles under the bi-fluid bubble injection-cleaning liquid and air toward the bottom surface of the substrate, Connect The cleaning fluid from the two-fluid supply module discharges the cleaning liquid and distributes the cleaning liquid to the cleaning liquid distribution pipe below the lower nozzle, and an air received from the air outlet of the two-fluid supply module Distributing the air to the air distribution tubes below the lower nozzles; and a support block supporting the upper nozzle module and the lower nozzle module together with the dual fluid supply module.
TW097120381A 2007-05-31 2008-05-30 Two-fluid supply module for cleaning substrate and cleaning device using the same TW200913026A (en)

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