CN220491850U - Wet etching cleaning equipment - Google Patents
Wet etching cleaning equipment Download PDFInfo
- Publication number
- CN220491850U CN220491850U CN202322033741.7U CN202322033741U CN220491850U CN 220491850 U CN220491850 U CN 220491850U CN 202322033741 U CN202322033741 U CN 202322033741U CN 220491850 U CN220491850 U CN 220491850U
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- section
- water
- pipe
- wet etching
- water washing
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- 238000004140 cleaning Methods 0.000 title claims abstract description 50
- 238000001039 wet etching Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 96
- 238000005406 washing Methods 0.000 claims abstract description 51
- 239000007921 spray Substances 0.000 claims abstract description 32
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 12
- 230000007704 transition Effects 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 10
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 16
- 238000001035 drying Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000006210 lotion Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The utility model discloses wet etching cleaning equipment, which comprises: the device comprises a plurality of water washing sections which are sequentially connected and can be sequentially passed by a feeding sheet, wherein the last water washing section is communicated with a water supply pipeline, the other water washing sections are respectively provided with a circulating spray pipeline, and the water washing sections sequentially overflow layer by layer from the last water washing section to the first water washing section. Through the design of the layer-by-layer overflow to the front section after the liquid level in the tank reaches the designated liquid level, the liquid supply mode avoids the arrangement of an external water tank and a pipeline, and saves a large amount of space and resources. Meanwhile, the overflow from back to front is adopted, so that the water in the subsequent washing section can be ensured to be cleaner, the actual washing condition is met, the alkaline washing process is simplified, and the waste of space and energy is reduced.
Description
Technical Field
The utility model relates to the field of wet etching equipment, in particular to wet etching cleaning equipment applied to photovoltaic glass.
Background
Wet etching equipment is a key equipment used in the fields of semiconductor manufacturing and the like, and a required microstructure can be formed on a silicon wafer or other substrates through wet etching. The prior art realizes the wet etching process by using an external water tank for supplying liquid in different process sections. However, the liquid supply mode of the external water tank can bring about waste of space and energy, and meanwhile certain difficulty is also increased in the transportation process of equipment.
Disclosure of Invention
The utility model provides wet etching cleaning equipment for solving the technical problems in the prior art.
The technical scheme adopted by the utility model is as follows:
the utility model provides wet etching cleaning equipment, which comprises: the device comprises a plurality of water washing sections which are sequentially connected and can be sequentially passed by a feeding sheet, wherein the last water washing section is communicated with a water supply pipeline, the other water washing sections are respectively provided with a circulating spray pipeline, and the water washing sections sequentially overflow layer by layer from the last water washing section to the first water washing section.
Preferably, the plurality of water wash sections comprises: the water supply pipeline is communicated with the pure water cleaning section for supplying water.
Further, the water pump of the circulating spray pipeline of the HPS high-pressure cleaning section is a high-pressure pump.
The circulating spray pipeline comprises: one end of the circulating pipe is connected to the bottom of the washing section, the water pump is arranged on the circulating pipe, the spraying pipe is connected with the other end of the circulating pipe, and the spraying pipe stretches into the washing section and sprays the material sheets through the spraying head at the end part.
Further, the circulation spray pipeline further comprises: one end of the balance pipe is connected with the bottom of the water washing section, and the other end of the balance pipe is connected with the water outlet side of the water pump of the circulating pipe.
One end of the water supply pipeline is connected with the water supply end, and the other end is connected with the spray pipe.
Further, the spray pipes comprise a first spray pipe and a second spray pipe, a plurality of spray heads arranged at the end parts of the first spray pipe are located above the material sheet conveying surface, and a plurality of spray heads arranged at the end parts of the second spray pipe are located below the material sheet conveying surface.
Furthermore, each washing section is internally provided with a liquid level floating ball for detecting the liquid level.
Further, the wet etching cleaning equipment further comprises a feeding section, a first transition section, a hairbrush alkaline washing section and a second transition section which are sequentially connected before the plurality of washing sections, and a drying section, an AP plasma section and a discharging section which are sequentially connected after the plurality of washing sections.
Compared with the prior art, the utility model can reduce the use of the water tank by adopting the design of layer-by-layer forward overflow, and simultaneously can ensure that the water in the subsequent water washing section is cleaner, accords with the actual washing condition, generates a more simplified alkaline lotion process flow and reduces the waste of space and energy.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a structure in an embodiment of the present utility model;
FIG. 2 is a schematic structural diagram of each functional segment in an embodiment of the present utility model;
1. a feeding section; 2. a first transition section; 3. a brush alkaline wash section; 4. a second transition section; 5. a brush segment; 6. an HPS high pressure cleaning section; 7. a pure water cleaning section; 8. a drying section; 9. an AP plasma segment; 10. a discharging section; 11. a circulation pipe; 12. a shower pipe; 13. a drain pipe; 14. a water pump; 15. and a liquid level floating ball.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
The principles and structures of the present utility model are described in detail below with reference to the drawings and the examples.
The existing wet etching cleaning equipment generally adopts an external water tank liquid supply mode to cause waste of space and energy, and meanwhile certain difficulty is also increased in the equipment transportation process. In this way, the utility model provides wet etching cleaning equipment with partial functional sections adopting overflow mode, and the design of the water tank is reduced in a layer-by-layer overflow mode, so that the volume of the equipment is reduced, and the production and manufacturing cost is reduced.
As shown in fig. 1 and 2, the present utility model provides a wet etching cleaning apparatus, which is formed by sequentially connecting a plurality of functional sections (it is to be noted that the connection may be sequentially arranged, so that photovoltaic glass can be transferred from a previous functional section to a next functional section), the plurality of functional sections specifically include a plurality of water washing sections sequentially connected to each other and through which a material sheet can sequentially pass, a last water washing section is communicated with a water supply pipeline, other water washing sections are respectively provided with a circulation spray pipe 12, and the plurality of water washing sections sequentially overflow layer by layer from the last water washing section to the first water washing section. Through adopting the design of overflow forward layer by layer, can reduce the use of water tank, adopt simultaneously from back forward overflow, can ensure that the water of washing section behind is cleaner, accords with actual cleaning condition, produces more retrench alkaline lotion process flow, reduces the waste of space and energy.
The structure adopted by the layer-by-layer overflow can be that a transverse overflow hole is arranged on the partition plate between two adjacent washing sections, and the height of the overflow hole is lower along with the position of the partition plate to form the layer-by-layer overflow structure.
In a specific embodiment, the plurality of water wash sections of the wet etch cleaning apparatus comprises: the brush section 5, the HPS high-pressure cleaning section 6 and the pure water cleaning section 7 are sequentially arranged, and a water supply pipeline is communicated with the pure water cleaning section 7 for supplying water. The brush segment 5 is mainly used for roughly pre-cleaning the surface of the material sheet, removing larger particles and impurities, and preparing for subsequent efficient cleaning. The HPS high-pressure cleaning section 6 provides strong spraying through a high-pressure pump, so that residues and organic pollution on the surface of the tablet are effectively removed, and the processing effect of high purity is ensured. The pure water cleaning section 7 is used for finally ensuring the high cleanliness of the surface of the material sheet and eliminating any pollution sources which can influence the subsequent process.
In a specific embodiment, the water pump 14 of the circulation spray pipe 12 of the HPS high-pressure cleaning section 6 of the wet etching cleaning device is a high-pressure pump, and the other two water cleaning sections adopt a conventional water pump 14. The high-pressure spraying can sufficiently wash and remove micro residues and nano-scale impurities on the surface of the material sheet, and the consistency of etching quality and good surface quality are ensured.
Specifically, the circulation spray pipe 12 comprises a circulation pipe 11 with one end connected to the bottom of the washing section, a water pump 14 arranged on the circulation pipe 11, and a spray pipe 12 connected with the other end of the circulation pipe 11, wherein the spray pipe 12 stretches into the washing section, and sprays the material sheets through a spray header at the end of the spray pipe, so that uniform spraying and coverage on the surface of the material sheets are ensured. The design of the spray header can enable etching liquid to form uniform mist spray on the surface of the material sheet, so that a comprehensive cleaning effect is achieved. The shower pipe 12 includes a first shower pipe and a second shower pipe, a plurality of shower heads provided at the end of the first shower pipe are located above the web conveying surface, and a plurality of shower heads provided at the end of the second shower pipe are located below the web conveying surface. The arrangement of the first spray pipe and the second spray pipe ensures that the tablet is sprayed in the upper direction and the lower direction, ensures that the cleaning liquid forms comprehensive coverage on the surface of the tablet, removes all residues on the surface, and avoids negative influence on the subsequent process.
The circulating spray pipe 12 also comprises a balance pipe, one end of which is connected with the bottom of the water washing section, and the other end of which is connected with the water outlet side of the water pump 14 of the circulating pipe 11. The balance pipe is arranged to be helpful for balancing the water pressure and flow in the 12 paths of the circulating spray pipe, ensure the stability of the spraying process and avoid influencing the cleaning effect due to overhigh or overlow water pressure.
One end of the water supply pipeline is connected with a water supply end, and the other end is connected with a spray pipe 12. The shower 12 also includes a first shower and a second shower, the plurality of showerheads of the first shower end being located above the web conveying surface and the plurality of showerheads of the second shower end being located below the web conveying surface.
In addition, each washing section is provided with a drain pipe 13, and the circulating water in the washing section can be discharged when needed. And a liquid level floating ball 15 is arranged to detect and control the liquid level, so that the effective realization of each process is ensured. And each section is equipped with the exhaust in the flow, guarantees inside pressure, and each section still is equipped with multiple inductor, monitors process time, guarantees equipment safe and effective use.
Specifically, the wet etching cleaning equipment further comprises a feeding section 1, a first transition section 2, a hairbrush alkaline cleaning section 3 and a second transition section 4 which are sequentially connected before the plurality of washing sections, and a drying section 8, an AP plasma section 9 and a discharging section 10 which are sequentially connected after the plurality of washing sections. The arrangement of the additional sections forms a complete wet etching and cleaning process flow, ensures that the etching process is carried out continuously and efficiently, and the material sheet can be properly treated and cleaned at each stage.
The flow of each functional section is as follows:
step 1, conveying glass to an NEU (neutral transition) section through feeding;
step 2, transferring the NEU (first neutral transition) section to a brush alkaline washing section;
step 3, in the brush alkaline washing section, liquid is circularly supplied from a water tank to the tank by a pump, and glass is conveyed to an NEU (neutral transition) section;
step 4, transferring the water from the NEU (second neutral transition) section to the brush pure water section, and brushing by a pump from the circulating liquid supply in the tank in cooperation with the brush;
step 5, the brush pure water section is transmitted to an HPS (high pressure) cleaning section, and the high pressure pump is used for circularly supplying liquid from the tank to complete cleaning;
step 6, transferring the water from the HPS (high pressure) cleaning section to the pure water cleaning section, and supplying the water to the pure water cleaning section through an external pure water pipeline to finish cleaning;
step 7, conveying the pure water to a drying section from a pure water cleaning section, heating the pure water by a high-pressure blower, and finishing hot air drying by an air knife;
step 8, the organic matters are transferred to an AP (electrode) plasma section from a drying section, O atoms are generated after the treatment of the AP electrode, and react with the organic matters on the glass to finish the removal of the organic matters;
and 9, conveying the AP (electrode) plasma section to a discharging section to complete the whole process.
It is noted that the above-mentioned terms are used merely to describe specific embodiments, and are not intended to limit exemplary embodiments according to the present utility model. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present utility model.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (9)
1. A wet etching cleaning apparatus, comprising: the device comprises a plurality of water washing sections which are sequentially connected and can be sequentially passed by a feeding sheet, wherein the last water washing section is communicated with a water supply pipeline, the other water washing sections are respectively provided with a circulating spray pipeline, and the water washing sections sequentially overflow layer by layer from the last water washing section to the first water washing section.
2. The wet etching cleaning apparatus of claim 1, wherein the plurality of water wash sections comprises: the water supply pipeline is communicated with the pure water cleaning section for supplying water.
3. The wet etching cleaning apparatus according to claim 2, wherein the water pump of the circulation shower line of the HPS high-pressure cleaning stage is a high-pressure pump.
4. The wet etching cleaning apparatus according to claim 1, wherein the circulation shower line includes: one end of the circulating pipe is connected to the bottom of the washing section, the water pump is arranged on the circulating pipe, the spraying pipe is connected with the other end of the circulating pipe, and the spraying pipe stretches into the washing section and sprays the material sheets through the spraying head at the end part.
5. The wet etching cleaning apparatus according to claim 1, wherein one end of the water supply line is connected to the water supply end, and the other end is connected to the shower pipe.
6. The wet etching cleaning apparatus of claim 4, wherein the circulation spray line further comprises: one end of the balance pipe is connected with the bottom of the water washing section, and the other end of the balance pipe is connected with the water outlet side of the water pump of the circulating pipe.
7. The wet etching cleaning apparatus according to claim 4 or 5, wherein the shower pipe includes a first shower pipe and a second shower pipe, the plurality of shower heads provided at the end of the first shower pipe are located above the web conveying surface, and the plurality of shower heads provided at the end of the second shower pipe are located below the web conveying surface.
8. The wet etching cleaning apparatus according to claim 1, wherein a liquid level float ball for detecting a liquid level is provided in each of the water washing sections.
9. The wet etching cleaning apparatus of claim 1, further comprising a feed section, a first transition section, a brush alkaline wash section, and a second transition section connected in sequence before the plurality of water wash sections, and a dry section, an AP plasma section, and a discharge section connected in sequence after the plurality of water wash sections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322033741.7U CN220491850U (en) | 2023-07-31 | 2023-07-31 | Wet etching cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322033741.7U CN220491850U (en) | 2023-07-31 | 2023-07-31 | Wet etching cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220491850U true CN220491850U (en) | 2024-02-13 |
Family
ID=89839822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322033741.7U Active CN220491850U (en) | 2023-07-31 | 2023-07-31 | Wet etching cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220491850U (en) |
-
2023
- 2023-07-31 CN CN202322033741.7U patent/CN220491850U/en active Active
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