TW200908850A - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
- Publication number
- TW200908850A TW200908850A TW96129687A TW96129687A TW200908850A TW 200908850 A TW200908850 A TW 200908850A TW 96129687 A TW96129687 A TW 96129687A TW 96129687 A TW96129687 A TW 96129687A TW 200908850 A TW200908850 A TW 200908850A
- Authority
- TW
- Taiwan
- Prior art keywords
- signal
- grounding
- hole
- adjacent
- layer
- Prior art date
Links
- 238000012546 transfer Methods 0.000 claims abstract description 35
- 239000000523 sample Substances 0.000 claims description 51
- 238000012360 testing method Methods 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 238000005476 soldering Methods 0.000 claims description 8
- 230000008054 signal transmission Effects 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 59
- 230000005540 biological transmission Effects 0.000 description 26
- 238000010586 diagram Methods 0.000 description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96129687A TW200908850A (en) | 2007-08-10 | 2007-08-10 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96129687A TW200908850A (en) | 2007-08-10 | 2007-08-10 | Multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200908850A true TW200908850A (en) | 2009-02-16 |
| TWI334323B TWI334323B (enExample) | 2010-12-01 |
Family
ID=44211799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96129687A TW200908850A (en) | 2007-08-10 | 2007-08-10 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200908850A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI382801B (enExample) * | 2009-12-24 | 2013-01-11 | ||
| TWI401438B (zh) * | 2009-11-20 | 2013-07-11 | Advanced Semiconductor Eng | 垂直式探針卡 |
| TWI698648B (zh) * | 2019-08-29 | 2020-07-11 | 中華精測科技股份有限公司 | 高頻測試裝置及其信號傳輸模組 |
| TWI750912B (zh) * | 2020-11-20 | 2021-12-21 | 萬旭電業股份有限公司 | 高頻量測線結構 |
| TWI844179B (zh) * | 2022-12-01 | 2024-06-01 | 點序科技股份有限公司 | 測試裝置 |
-
2007
- 2007-08-10 TW TW96129687A patent/TW200908850A/zh not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI401438B (zh) * | 2009-11-20 | 2013-07-11 | Advanced Semiconductor Eng | 垂直式探針卡 |
| TWI382801B (enExample) * | 2009-12-24 | 2013-01-11 | ||
| TWI698648B (zh) * | 2019-08-29 | 2020-07-11 | 中華精測科技股份有限公司 | 高頻測試裝置及其信號傳輸模組 |
| TWI750912B (zh) * | 2020-11-20 | 2021-12-21 | 萬旭電業股份有限公司 | 高頻量測線結構 |
| TWI844179B (zh) * | 2022-12-01 | 2024-06-01 | 點序科技股份有限公司 | 測試裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI334323B (enExample) | 2010-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |