TW200904935A - Pressure-sensitive self-adhesive tape - Google Patents

Pressure-sensitive self-adhesive tape Download PDF

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Publication number
TW200904935A
TW200904935A TW097104289A TW97104289A TW200904935A TW 200904935 A TW200904935 A TW 200904935A TW 097104289 A TW097104289 A TW 097104289A TW 97104289 A TW97104289 A TW 97104289A TW 200904935 A TW200904935 A TW 200904935A
Authority
TW
Taiwan
Prior art keywords
pressure
adhesive tape
adhesive layer
sensitive adhesive
adhesive
Prior art date
Application number
TW097104289A
Other languages
English (en)
Inventor
Yuki Sugo
Yoshio Terada
Hiroyuki Kondou
Hitoshi Takano
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200904935A publication Critical patent/TW200904935A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)

Description

200904935 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種壓感性黏著帶。更詳細而言，本發明 係關於一種適合於使用金屬製引線框架之半導體裝置之製 造的壓感性黏著帶。 【先前技術】 近年來，在LSI(large-Scale integrati〇n ,大規模積體電 r 路）之安裝技術中，CSP(ChiP SiZe/Scale Package，晶片尺 寸封裝）技術引人注目。在CSP技術中，以QFN(Quad Flat Non-leaded Package，四側無引腳扁平封裝）為代表之將引 線端子引入到封裝内部之形態的封裝’係在小型化與高集 成方面特別引人注目之封裝形態之_。 於QFN之製造方法中，近年來倍受關；主之製造方法為， 將複數個QFN用之晶片整齊地排列於引線框架之封裝圖案 區域内的晶片焊墊（die pad)上，於模具之模穴（cavity)内;' “ 利用密封樹脂統-密封之後’將其切斷分開而成為個別 、 QFN構造物，藉此使得單位引線框架面積之生產性得到飛 躍性提高。 如上所述之將€數料導體晶片、统一密封之㈣的製造 方法中’由樹脂密封時之澆鑄模具所夾持的區域僅為比封 裝圖案區域更向外側擴展之樹脂密封區域的外側。因此， 於封裝圖案區域、尤其於其中央部，無法將外部引線面以 充分之壓力按壓到液锖模具上，從而非常難以抑制密 脂向外部引線㈣漏。由此產生QFN之端子等由樹脂包覆 128873.doc 200904935 之問題。 為解決上述問題，於QFN之製造方法中，以下製造方法 被認為特別有效，即，於引線框架之外部引線側貼附壓感 性黏著帶，利用該膠帶之自黏力（遮蔽’ masking)進行密 封，藉由此效果而防止樹脂密封時向外部引線側之樹脂洩 漏現象。 於上述製造方法中，在操作方面，實際上難以在將半導 體晶片安裝於引線框架上之後或者在打線接合之後貼合壓 感性黏著帶。因此，較理想的是’壓感性黏著帶於最初階 段貼合於引線框架之外部墊片面上，其後，經過半導體晶 片之安裝步驟或打線接合步驟後進行貼合，直至密㈣脂 之密封步驟為止。 如上所述，要求壓感性黏著帶具有如下各種特性，即， 不僅防止密封樹㈣漏，而且具有耐受半導體晶片之安裝 i,. 步驟的高度耐熱性，以及不會對打線接合步驟之細緻操作 性造成妨礙等。 為了防止半導體裝置之製造中的密封樹脂之浅漏，提出 =感：點著帶，該虔感性黏著帶係由具有特定 脹係數之基材層、及且有胜令 听皇4… 有特疋厚度之黏著劑層而構成（來 π專利文獻1)。然而，該塵感性 ^ „ 黏者帶令，由於黏著劑声 之健存彈性模數較低，故難 9 雜、4 文難以正常地進行打線接合，因此 難以有效地防止密封樹脂之洩漏。 然而，為了防止樹脂茂漏而利用重視高度黏著性 的壓感性黏著帶時，因黏著 叙 J層之彈性較低，故黏著劑層 128873.doc 200904935 較軟。因此，產生實際上無法進行打線接合等之問題。 另-方面’亦已知如下方法，即，使用具有開口部、端 子部、及外部墊片之配線樹脂基板來取代引線框架，其 中，上述開口部上配置有半導體晶片，上述端子部配置於 上述開口部之外側表面，上述外部墊片配置於上述端子部 之内侧面，將半導體晶片配置於上述開口部上，進行打線 接合步驟或岔封樹脂之密封步驟，以此製造半導體裝置。 上述製造方法中，並不拘泥於使用厚度大於引線框架之 配線樹脂基板，與使用引線框架時相同，會產生樹脂密封 時之向外部引線側的樹脂茂漏現象。x，由於使用配線樹 脂基板，因此打線接合步驟中的壓感性黏著帶之黏著劑層 的影響與使用引線框架時不同。 專利文獻1 .日本專利特開2002-184801號公報 【發明内容】 發明所欲解決之問題 本發明之課題在於提供一種壓感性黏著帶，其將黏著劑 層之儲存彈性模數之值控制於適當之範圍，從而可較好地 防止在使用金屬製引線框架之半導體裝置之製造中於密封 步驟產生之樹脂洩漏。 解決問題之技術手段 為解決上述課題，本發明者等進行潛心研究。其結果發 現，使特定之層狀黏土礦物分散於聚矽氧系黏著劑組成物 中，藉此可有效地達成上述課題，從而完成本發明。 本發明之壓感性黏著帶係於基材薄片上具有黏著劑層， 128873.doc 200904935 :黏著劑層包含聚碎氧系黏著劑組成物及分散於該聚石夕氧 系黏著劑組成物中之親油性層狀黏土礦物。 較l實施形態為，上述層狀黏土礦物係膨潤石系黏度礦 物及/或雲母系黏度礦物。 、 較佳實施形態為，於100重量份之上述聚石夕氧系黏著劑 、’且成物中，含有2〜20重量份之上述層狀黏土礦物。 較佳實施形態為，上述黏著劑層之儲存彈性模 0.3〜6.0 MPa。 較佺貝施形態為，上述黏著劑層之厚度為1〜乃。 ，較佳實施形態為，本發明之麼感性黏著帶用於使用金屬 製引線框架之半導體裝置之製造中。 發明之效果 根據本發明’可提供—種壓感性黏著帶，其將黏著劑層 之儲存彈性模數之值控制於適當之範圍，從而可較好地防 止在使用金屬製引線框架之半導體裝置之製造中於密封步 驟產生之樹脂洩漏。 使:寺定之層狀黏土礦物分散於聚石夕氧系黏著劑組成物 中’藉此可有效地體現上述效果。 【實施方式】 本發明之壓感性黏著帶於基材薄片上具有黏著劑層，该 黏著劑層包含聚石夕氧系黏著劑組成物及分散於該黏著劑组 士物中之親油性層狀黏土礦物。黏著劑層之厚度可採用任 意適當之厚度。黏著劑層之厚度較好的是2〜5〇 _，更好 的是2〜25 μΠ1。本發明之壓感性黏著帶的較佳實施形態之 128873.doc 200904935 —不於圖1中。如圖1所示，本發明之膠帶100於基材薄片 10上具有黏著劑層20，該黏著劑層20包含聚矽氧系黏著劑 組成物30及親油性層狀黏土礦物4〇。該親油性層狀黏土礦 物40可實際上排列在相對於基材薄片丨〇之平行方向上，亦 可實際上排列在相對於基材薄片丨〇之垂直方向上，其排列 狀態可為該等之混合狀態，亦可排列於隨機之方向上。當 ' 考慮剝離之難易度時，較好的是，親油性層狀黏土礦物40 , 實質上排列在相對於基材薄片10之垂直方向上。 上述親油性層狀黏土礦物之排列狀態可利用電子顯微鏡 (SEM(scanning electr〇n micr〇sc〇pe，掃描式電子顯微 鏡）TEM(transmission electron microscopy，穿透式電子 顯微鏡））進行剖面觀察而確認。 所謂「實際上排列在相對於基材薄片之垂直方向上」， 係才曰相對於基材溥片之主面排列而成的角度較好的是⑼度 〜120度，更好的是70度〜Π0度，進而好的是80度〜100度。 L)所謂「實際上排列在相對於基材薄片之平行方向上」，係 指相對於基材薄片之主面排列而成的角度較好的是-3 0度 • 〜30度，更好的是_20度〜2〇度，進而好的是-10度〜10度。 作為述I石夕氧系黏著劑組成物，可採用市售之聚石夕氧 系黏著Μ等任意適當之組成物。在使用聚石夕氧系黏著劑組 ^物t &amp; 了耐熱性高之外，高溫下之儲存彈性模數及黏 著力，成為適虽值。作為上述聚石夕氧系黏著劑組成物，較 好，是使用過氧化物交聯型黏著劑、加成反應型黏著劑、 脫氫反應型黏著劑、及濕氣硬化型黏著劑。尤其是加成反 128873.doc 10 200904935 應型黏著劑，因其雜質少而較佳。 在不損及本發明之效果之範圍内，於上述Μ氧系 劑組成物中亦可含有任意適當之添加劑。 ^ 上述親油性層狀黏土礦物係對結晶構造中具有交 離子之層”酸鹽礦物進行親油化處理而成者。、
作為上述層狀料鹽礦物，可採用任意適當之層狀石夕酸 鹽礦物。作為上述層狀料鹽礦物，可列舉例如：蒙脫 土、皂石、鋰蒙脫石、矽鎂石等膨潤石系黏土礦物；氟四 石夕雲母等雲母系黏土礦物。該等可僅使用旧，亦可將2種 以士併用。較好的是雲母系黏土礦物。其原因在於，該雲 母系黏土礦物可獲得良好之強韌性。 上述親油性層狀黏土礦物之形狀較好的是板狀。此時， 厚度較好的是約0.1〜10 nm，更好的是〇5〜5 nm。又，寬度 較好的是10〜10000 nm，更好的是2〇〜7000 nm，進而好的 是50〜5000 nm。此處所謂厚度或寬度係指平均長度。該平 均長度可藉由對電子顯微鏡（TEM)照片進行實測而求出。 若上述寬度超過10000 nm，則可能導致伸長率降低，若上 述寬度不足10 nm，則可能際致斷裂應力變高。 上述親油性層狀黏土礦物較好的是，利用有機陽離子等 對層間交換性陽離子進行離子交換處理，以實現層間親油 化0 上述交換性陽離子係指存在於層狀矽酸鹽礦物之結晶層 表面上的鈉或鈣等金屬離子。該等離子為親水性，故親油 性單體無法滲入至層狀矽酸鹽礦物之層間，因此無法獲得 128873.doc -11 - 200904935 物。為了使單體渗人至層間，必須利用親油性 =性界面活性劑等對交換性陽離子進行離子交換。 為上述陽離子性界面-¾ Μ·十丨 输 面/舌性劑，可列舉例如：四級銨 鹽、四級鱗鹽。 作為上述四級銨鹽，可 睡、山 歹]舉例如：十二烷基三甲基銨 瓜、十八烷基三甲基銨鹽、= —辛基鉍鹽、二（十八烷基）二 〒基叙鹽、二（十八惊其、_ # w 私加 土）—苄基銨鹽、具有取代環氧丙烷 月求之銨鹽。該等可僅使 仗用1種，亦可將2種以上併用。 作為上述四級鱗鹽，可別斑 甘一 τ列舉例如：癸基三苯基鱗鹽、甲 暴二本基鱗鹽、十二惊其=田甘 ±—甲基—鹽、十八烧基三甲基鱗 孤、二（十八烷基）二甲基鱗 ^ ^ 一（十八烷基）二苄基鱗 鹽。該等可僅使用1種，亦可將2種以上併用。 ::亡發明之壓感性黏著帶，較好的是於使用該壓感性 黏者f則，使上述親油性層狀黏土礦物之層彼此充分地剝 離。作為將層彼此進行剝離之方法，可採用任意適當之方 法。例如，使用超音波剝離、高壓切斷剝離、超高速攪 拌、超臨界CO成拌。尤其好的是高屢切斷剝離法，其原 因在於’該南塵切斷剝雜可尤 ㈣刺離了在不使親油性層狀黏土礦物破 碎之情況下將層彼此剝離。親油性層狀黏土礦物之剝離狀 態較好的是，將層狀黏土礦物之石夕酸鹽層剝離成平均重叠 達6層以下。若超過6層，則可能導致層狀黏土礦物之總表 面積減少’與有機成分之相互作用減少，從而黏著劑的強 ㈣降低。平均重叠之分析可利用電子顯微鏡（TEM)來進 行0 128873.doc 200904935 於100重量份之上述聚矽氧系黏著劑組 油性層狀黏土礦物之j 、 中，上述親 一重量份較好的是2,重量份，更好 董里伤進而好的是4〜10重量份 例不足2重量份，則可处包、+ — 上迷3有比 P +人 無法充分發揮本發明之效果。4 上述含有比例超過20重量份，則可能引起黏著劑H二 增大，從而導致塗佈外觀降低β θ '又 上述黏著劑層中，除了上述 r 述親油性層狀黏土礦物之外，於不者劑組成物及上 圍内，亦可包含任意適當之成分。 之犯 上述黏著劑層之儲存彈性模數較好的是0.3〜6.〇 MPa， 更好的是0.5〜5·〇 MPa，進而好的是1()〜5 () Mpa 劑層之儲存彈性模數為0.3 MPa以下，則黏著劑層會過分 柔軟’因此’例如在使用金屬製引線框架之半導體裝置之 製造中，可能會導致打線接合時引線框架活動而無^進行 打線接合。又’若黏著劑層之儲存彈性模數為6.〇奶以 上’則黏著劑層會過硬’使得點著力降低，從而可能導致 自引線框架上剝離。於本發明中，黏著劑層之儲存彈性模 數係根據ASTMSTP846，由黏彈性光儀所測定之值。 作為上述基材薄片’可採用任意適當之基材薄片。可列 舉例如：聚對苯二甲酸乙二醋(ρΕΤ，ρ〇ι”Μ_ terephthalate)薄膜、聚萘二甲酸乙二醋（pEN， polyethylene naphthaiate)薄膜、聚醚石風（pEs， ⑽lf〇ne)薄膜、聚醚醯亞胺（PEI, p〇lyetherimide)薄膜、聚 硬（PSF ’ polysulfone)薄膜、聚苯硫醚（pps， 128873.doc 200904935 sum㈣薄膜、聚㈣酮（PEEK，p〇lyestereste细。叫薄 膜、聚芳酉旨（PAR，P〇lyarylate)薄膜、芳香族聚酿胺薄膜、 聚酿亞胺薄膜、及液晶聚合物（咖，uquid crystal ㈣y叫薄膜。當考慮耐熱性時，較好的是由聚酿 料構成之薄膜。 作為基材薄片之厚度’可採用任意適當之厚度。為了防 止折f或斷裂’以良好地保持操作性，上述厚度較好的是 5 〜250 μιη。 本發明之壓感性黏著帶之製作方法可採用任意適當之方 法。例如，使用的方法為，將含有上述親油性層狀黏土礦 物之聚妙氧系、黏著劑組成物首先塗佈於任意基板上，並使 其乾燥’以此製作使上述親油性層狀黏土礦物分散於聚石夕 氧系黏著劑組成物中之黏著薄片，並使其形成於基材薄片 上，或者將含有上述親油性層狀黏土礦物之聚石夕氧系黏著 劑組成物塗佈於基材薄片上，，然後使其乾燥並固定化。 i.. 本發明之塵感性黏著帶中’亦可使用用以保護黏著劑層 之保護薄膜。作為保護薄膜，可列舉例如：利用聚石夕氧 系、長鏈烧基系、敦系、脂肪酸酿胺系、二氧化石夕系剝離 劑等進行義處理後之聚氯乙稀、氯、㈣苯 二甲酸乙二醋、聚對苯二曱酸丁二醋、聚胺基甲酸醋、乙 稀乙酸乙烯醋共聚物、離子鍵樹脂、乙烯_(甲基)丙婦酸共 聚物、乙烯-(甲基）丙烯酸_共聚物、聚苯乙稀、聚碳酸酯 等所構成之塑膠薄膜。又’對於聚乙稀' 聚丙稀、聚丁 烯、聚丁二烯、聚甲基戊烯等聚烯烴樹脂系薄膜而言，即 128873.doc • 14 - 200904935 便不使用脫模處理劑亦具有脫模性’因此亦可使用其單體 作為保護薄膜。此種保護薄膜之厚度較好的是10〜100 μηι 左右。 本發明之壓感性黏著帶可應用於任意適當之用途。尤其 可較好地防止使用金屬製引線框架之半導體裝置之製造中 於掛封步驟產生之樹脂茂漏，因此較好的是，應用於使用 金屬製引線框架之半導體裝置之製造中。 實施例 以下，利用實施例對本發明進行更具體之說明，但本發 明並不限定於該等實施例。又’實施例之「份」係重量基 準。 [實施例1] 以厚度25 μιη之聚醯亞胺薄膜（Toray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使20重量份之親油性層狀黏土礦物 (Coopchemical製造，商品名：Somasif MAE)分散於100重 量份之聚石夕氧系黏著劑（Toray Dowcorning製造，商品名： SD-4585)中，以此製作壓感性黏著帶（1)。該壓感性黏著帶 (1)之黏著劑層之厚度為10 μηι。 [實施例2] 以厚度25 μιη之聚醯亞胺薄膜（Toray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層，該黏著劑層係使10重量份之親油性層狀黏土礦物 (Coopchemical製造，商品名：Somasif MAE)分散於100重 128873.doc -15- 200904935 罝份之聚石夕氧系黏著劑（Toray Dowcorning製造，商品名： SD·4585)中，以此製作壓感性黏著帶（2)。該壓感性黏著帶 (2) 之黏著劑層之厚度為1〇 μπ1。 [實施例3] 以厚度25 μηι之聚酸亞胺薄膜（Toray Dupont製造，商品 名：Kapt〇nl〇OH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使5重量份之親油性層狀黏土礦物 (Coopchemical製造，商品名：Somasif MAE)分散於100 重 置份之聚石夕氧系黏著劑（Toray Dowcorning製造，商品名： SD-4585)中，以此製作壓感性黏著帶（3)。該壓感性黏著帶 (3) 之黏著劑層之厚度為 1 0 μηι。 [實施例4 ] 以厚度25 μηι之聚酸亞胺薄膜（Toray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使20重量份之親油性層狀黏土礦物 (Coopchemical製造，商品名：Somasif MAE)分散於 100 重 里份之聚石夕氧系黏著劑（Toray Dowcorning製造，商品名： SD-4585)中’以此製作壓感性黏著帶（4)。該壓感性黏著帶 (4) 之黏著劑層之厚度為 20 μηι 〇 [實施例5] 以厚度25 μηι之聚醯亞胺薄膜（Toray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使1 〇重量份之親油性層狀黏土礦物 (Coopchemical製造’商品名：Somasif MAE)分散於100 重 128873.doc -16· 200904935 里伤之I碎氧糸黏著劑（Toray Dowcorning製造’商品名： SD-4585)中，以此製作壓感性黏著帶（5)。該壓感性黏著帶 (5) 之黏著劑層之厚度為20 μιη。 [實施例6] 以厚度25 μηι之聚醯亞胺薄膜（Toray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使5重量份之親油性層狀黏土礦物 (Coopchemical製造，商品名：Somasif MAE)分散於100 重 ϊ份之聚砂氧系黏著劑（Toray Dowcorning製造，商品名： SD-4585)中’以此製作壓感性黏著帶（6)。該壓感性黏著帶 (6) 之黏著劑層之厚度為2〇 μηι 〇 [實施例7] 以厚度25 μηι之聚醯亞胺薄膜（Toray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使1重量份之親油性層狀黏土礦物 (Coopchemical製造，商品名：Somasif MAE)分散於100重 夏份之聚石夕氧系黏著劑（Toray Dowcorning製造，商品名： SD-4585)中’以此製作壓感性黏著帶。該壓感性黏著帶 (7) 之黏著劑層之厚度為1 〇 μπ!。 [實施例8 ] 以厚度25 μηι之聚醯亞胺薄膜（Toray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使2 〇重量份之親油性層狀黏土礦物 (Coopchemical製造，商品名：Somasif MAE)分散於100重 128873.doc -17- 200904935 里伤之^^石夕氧系黏者劑（Toray Dowcorning製造，商品名： SD-4585)中，以此製作壓感性黏著帶（8)。該壓感性黏著帶 (8)之黏著劑層之厚度為5〇 μηι。 [比較例1] 以尽度25 μηι之聚醯亞胺薄膜（T〇ray Dupont製造，商品 名.KaptonlOOH)為基材薄片’於該基材薄片上設置黏著 幻層°亥黏著劑層係由聚石夕氧糸黏著劑（Toray Dowcorning 製造，商品名：SD-4585)所構成，以此製作壓感性黏著帶 (C 1)。該壓感性黏著帶（c 1)之黏著劑層之厚度為丨〇 μηι。 [比較例2] 以尽度25 μπι之聚醯亞胺薄臈（T〇ray Dupont製造，商品 名：KaptonlOOH)為基材薄片，於該基材薄片上設置黏著 劑層’該黏著劑層係使由聚矽氧系黏著劑（T〇ray D〇Wcorning製造，商品名：犯七85)所構成，以此製作壓 感性黏著帶（C2)。該壓感性黏著帶（C2)之黏著劑層之厚度 為 20 μιη。 [評價] 將實施例1〜實施例8及比較例1〜比較例2中製作之壓感性 黏著帶貼合於銅製引線框架的外部墊片側，於該銅製引線 之端子部經鍍銀之一邊，16引腳類型之qFN排列成4個χ4 個。 使用壞氧紛系銀漿將半導體晶片黏接於該引線框架之晶 片焊墊部分，於18CTC之溫度下固化i時間左右，以將其固 定。 128873.doc -18- 200904935 其次，引線框架從壓感性黏著帶側以真空吸氣之形態而 固定於加熱至之加熱塊上，進而以窗式定位器壓住 引線框架之周邊部分而進行固定。 使用115 KHz焊線機（新川製造，商品名：utc_ 3〇〇BIsUper),利用衫5 μπι之金線（田中貴金屬製造，商品 名：GMG-25)’在以下述條件下進行打線接合。 快速接合加壓：13 0 g 快速接合超音波強度：550 mW 快速接合施加時間：8 msec 第-一接合加麼· 13 0 g 第一接合超音波強度：5〇〇 mw 第二接合施加時間：7 msec 進而，利用環氧系密封樹脂（日東電工製造，商品名： HC-300B) ’使用鑄模機（T〇WA製造，商品名：M〇dei_Y_ sense) ’於175 C時，預熱2〇秒、射出時間12秒、固化時間 12〇秒來進行鑄模後，剝離壓感性黏著帶。 再者進而於175 C時進行3小時左右之壓模後烘烤（post
Ure)以使樹脂充分硬化後，利用切塊機（dicer)切 斷而獲得各個QFN型半導體裝置。 以此方式’對使用實施例丨〜實施例8及比較例卜比較例2 所衣作之壓感性黏著帶而獲得的qfn樹脂之洩漏情況進行 了 °平^貝。5平價方法係以引線墊片上附著有樹脂之狀態的引 線塾片為不良’根據1 0〇個引線墊片中產生不良之引線墊 片之數目而求出不良率。 128873.doc -19· 200904935 評價結果示於表1 [表1]
根據表1可判斷，本發明之壓烕性斑 门&lt; ~ u r生黏考帶可較好地防止
使用金屬製引線框架之半導體裝置 I
丁〒虹衣κ製造中於密封步驟產 生之樹脂洩漏。 產業上之可利用性 本發明之壓感性黏著帶尤其可較好地防止使用金屬製引 線框架之半導體裝置之製造中於密封步驟產生之樹脂洩 漏，因此較好的是，應用於使用金屬製引線框架之半導體 裝置之製造中。 【圖式簡單說明】 圖1係本發明之較佳實施形態之壓感性黏著帶的概略剖 128873.doc -20- 200904935 面圖。 【主要元件符號說明】 10 基材薄片 20 黏著劑層 30 聚矽氧系黏著劑組成物 40 親油性層狀黏土礦物 100 膠帶 128873.doc -21 -

Claims (1)

  1. 200904935 十、申請專利範圍： -種壓感性黏著帶，其係於基材薄片 該黏著劑層包含聚發氧系黏著劑組成物；八散：劑層， 氧t黏著劑組成物中之親油性層狀黏土^。“亥聚石夕 2. 如凊求項丨之壓感性黏著帶，1 g±, .«a _ ^ 、〒上逑層狀黏土礦物係 ^糸黏度礦物及7或雲母系黏度礦物。 、Μ 3. 如請求項1或2之壓感性 ^ L 其中相對於100重量份 含有2〜20重量份之上述 其中上述黏著劑層之儲 其中上述黏著劑層之厚 其係用於使用金屬製引 之上述聚矽氧系黏著劑組成物 層狀黏土礦物。 4. 如凊求項1或2之壓感性黏著帶 存彈性模數為0.3〜6.0 MPa。 5. 如凊求項1或2之壓感性黏著帶 度為2〜5 〇 μηι。 6. 如凊求項1或2之壓感性黏著帶 線框架之半導體裝置之製造中 128873.doc
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US8048690B2 (en) * 2007-11-08 2011-11-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet and process for producing semiconductor device having same
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JP2002167557A (ja) * 2000-12-01 2002-06-11 Sekisui Chem Co Ltd 粘着剤用組成物、粘着剤及び粘着シート
JP2002294209A (ja) * 2001-03-30 2002-10-09 Sekisui Chem Co Ltd 粘着剤組成物及びその製造方法、並びに粘着テープ
US6617020B2 (en) * 2001-04-04 2003-09-09 3M Innovative Properties Company Hot melt processable pressure sensitive adhesive comprising organophilic clay plate-like particles, a method of making, and articles made therefrom
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JP3849978B2 (ja) * 2002-06-10 2006-11-22 日東電工株式会社 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート
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