WO2008096611A1 - 感圧性粘着テープ - Google Patents

感圧性粘着テープ Download PDF

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Publication number
WO2008096611A1
WO2008096611A1 PCT/JP2008/050986 JP2008050986W WO2008096611A1 WO 2008096611 A1 WO2008096611 A1 WO 2008096611A1 JP 2008050986 W JP2008050986 W JP 2008050986W WO 2008096611 A1 WO2008096611 A1 WO 2008096611A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive tape
adhesive layer
silicone
Prior art date
Application number
PCT/JP2008/050986
Other languages
English (en)
French (fr)
Inventor
Yuki Sugo
Yoshio Terada
Hiroyuki Kondou
Hitoshi Takano
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to US12/526,142 priority Critical patent/US20100323191A1/en
Publication of WO2008096611A1 publication Critical patent/WO2008096611A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

　粘着剤層の貯蔵弾性率が適切な範囲の値にコントロールされ、金属製のリードフレームを用いる半導体装置の製造における封止工程での樹脂漏れを好適に防止することが可能な、感圧性粘着テープを提供する。 　本発明の感圧性粘着テープは、シリコーン系粘着剤組成物と該シリコーン系粘着剤組成物中に分散した親油性の層状粘土鉱物を含む粘着剤層を基材シート上に有する。
PCT/JP2008/050986 2007-02-07 2008-01-24 感圧性粘着テープ WO2008096611A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/526,142 US20100323191A1 (en) 2007-02-07 2008-01-24 Pressure-Sensitive Adhesive Tape

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JP2007-027481 2007-02-07
JP2007027481A JP2008189858A (ja) 2007-02-07 2007-02-07 感圧性粘着テープ

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Publication number Priority date Publication date Assignee Title
US8048690B2 (en) * 2007-11-08 2011-11-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet and process for producing semiconductor device having same
EP2639278A1 (en) * 2012-03-13 2013-09-18 Nitto Denko Corporation Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape
US20180111777A1 (en) 2016-10-26 2018-04-26 Cpfilms Inc. Packaged flexible film and flexible film packaging system therefor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002167557A (ja) * 2000-12-01 2002-06-11 Sekisui Chem Co Ltd 粘着剤用組成物、粘着剤及び粘着シート
JP2002294209A (ja) * 2001-03-30 2002-10-09 Sekisui Chem Co Ltd 粘着剤組成物及びその製造方法、並びに粘着テープ
JP2004014930A (ja) * 2002-06-10 2004-01-15 Nitto Denko Corp 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ
JP2004530012A (ja) * 2001-04-04 2004-09-30 スリーエム イノベイティブ プロパティズ カンパニー 親有機性クレー板状粒子を含むホットメルト加工性感圧接着剤、製造方法、及びそれによって製造された物品
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU615730B2 (en) * 1988-04-07 1991-10-10 Kanegafuchi Chemical Industry Co. Ltd. Pressure-sensitive adhesive material
US6884833B2 (en) * 2001-06-29 2005-04-26 3M Innovative Properties Company Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
JP4213887B2 (ja) * 2001-10-26 2009-01-21 日東電工株式会社 透明性粘着剤組成物とその粘着シート
JP3888679B2 (ja) * 2002-04-23 2007-03-07 日東電工株式会社 両面粘着テープおよび固定方法
JP4718146B2 (ja) * 2004-09-01 2011-07-06 株式会社Ｓｈｉｎｄｏ 多孔質シート用エマルション型シリコーン粘着剤組成物および再剥離性粘着シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002167557A (ja) * 2000-12-01 2002-06-11 Sekisui Chem Co Ltd 粘着剤用組成物、粘着剤及び粘着シート
JP2002294209A (ja) * 2001-03-30 2002-10-09 Sekisui Chem Co Ltd 粘着剤組成物及びその製造方法、並びに粘着テープ
JP2004530012A (ja) * 2001-04-04 2004-09-30 スリーエム イノベイティブ プロパティズ カンパニー 親有機性クレー板状粒子を含むホットメルト加工性感圧接着剤、製造方法、及びそれによって製造された物品
JP2004014930A (ja) * 2002-06-10 2004-01-15 Nitto Denko Corp 半導体装置の製造方法及びこれに用いる耐熱性粘着テープ
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート

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US20100323191A1 (en) 2010-12-23
TW200904935A (en) 2009-02-01

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