TW200902234A - CMP conditioner and its manufacturing method - Google Patents
CMP conditioner and its manufacturing method Download PDFInfo
- Publication number
- TW200902234A TW200902234A TW096135548A TW96135548A TW200902234A TW 200902234 A TW200902234 A TW 200902234A TW 096135548 A TW096135548 A TW 096135548A TW 96135548 A TW96135548 A TW 96135548A TW 200902234 A TW200902234 A TW 200902234A
- Authority
- TW
- Taiwan
- Prior art keywords
- protective layer
- layer
- abrasive
- metal
- cmp conditioner
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006258894A JP4854445B2 (ja) | 2006-09-25 | 2006-09-25 | Cmpコンディショナおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200902234A true TW200902234A (en) | 2009-01-16 |
TWI335854B TWI335854B (ja) | 2011-01-11 |
Family
ID=39230018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096135548A TW200902234A (en) | 2006-09-25 | 2007-09-21 | CMP conditioner and its manufacturing method |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090239454A1 (ja) |
JP (1) | JP4854445B2 (ja) |
KR (1) | KR20090074741A (ja) |
CN (1) | CN101547770A (ja) |
TW (1) | TW200902234A (ja) |
WO (1) | WO2008038583A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2646973C (en) * | 2008-12-18 | 2015-12-01 | Sunnen Products Company | Honing tool having enhanced wear resistance properties |
US8512098B1 (en) * | 2010-09-28 | 2013-08-20 | Jeffrey Bonner | Machining technique using a plated superabrasive grinding wheel on a swiss style screw machine |
TWI422466B (zh) * | 2011-01-28 | 2014-01-11 | Advanced Surface Tech Inc | 鑽石研磨工具及其製造方法 |
CN203390712U (zh) * | 2013-04-08 | 2014-01-15 | 宋健民 | 化学机械研磨修整器 |
JP5681826B1 (ja) * | 2014-06-16 | 2015-03-11 | 嘉五郎 小倉 | 軸芯測定装置 |
JP6453666B2 (ja) * | 2015-02-20 | 2019-01-16 | 東芝メモリ株式会社 | 研磨パッドドレッサの作製方法 |
CN108237467B (zh) * | 2016-12-23 | 2020-10-02 | 中芯国际集成电路制造(上海)有限公司 | 一种研磨垫的处理方法 |
TWI636854B (zh) * | 2017-06-12 | 2018-10-01 | 中國砂輪企業股份有限公司 | 研磨工具及其製造方法 |
KR102013386B1 (ko) * | 2018-01-29 | 2019-08-22 | 새솔다이아몬드공업 주식회사 | 역도금 패드 컨디셔너 제조방법 및 패드 컨디셔너 |
CN110634776B (zh) * | 2019-09-18 | 2022-03-01 | 西安奕斯伟材料科技有限公司 | 一种硅片样品的制备装置及制备方法 |
CN110782779B (zh) * | 2019-11-01 | 2022-05-13 | Oppo广东移动通信有限公司 | 玻璃件及其表面抛光方法、玻璃壳体和电子设备 |
TWI806466B (zh) * | 2022-03-03 | 2023-06-21 | 中國砂輪企業股份有限公司 | 拋光墊修整器及其製造方法 |
TWI823456B (zh) * | 2022-07-01 | 2023-11-21 | 詠巨科技有限公司 | 修整組件、其製造方法及應用其的組合式修整器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3334041A (en) * | 1964-08-28 | 1967-08-01 | Norton Co | Coated abrasives |
SE442305B (sv) * | 1984-06-27 | 1985-12-16 | Santrade Ltd | Forfarande for kemisk gasutfellning (cvd) for framstellning av en diamantbelagd sammansatt kropp samt anvendning av kroppen |
US4992082A (en) * | 1989-01-12 | 1991-02-12 | Ford Motor Company | Method of toughening diamond coated tools |
US5206083A (en) * | 1989-09-18 | 1993-04-27 | Cornell Research Foundation, Inc. | Diamond and diamond-like films and coatings prepared by deposition on substrate that contain a dispersion of diamond particles |
SE503038C2 (sv) * | 1993-07-09 | 1996-03-11 | Sandvik Ab | Diamantbelagt skärande verktyg av hårdmetall eller keramik |
US5551959A (en) * | 1994-08-24 | 1996-09-03 | Minnesota Mining And Manufacturing Company | Abrasive article having a diamond-like coating layer and method for making same |
US5688557A (en) * | 1995-06-07 | 1997-11-18 | Lemelson; Jerome H. | Method of depositing synthetic diamond coatings with intermediates bonding layers |
JPH1058306A (ja) * | 1996-08-09 | 1998-03-03 | Mitsubishi Materials Corp | 研磨布のドレッシング装置および研磨布ドレッシング用砥石 |
US5921856A (en) * | 1997-07-10 | 1999-07-13 | Sp3, Inc. | CVD diamond coated substrate for polishing pad conditioning head and method for making same |
US6054183A (en) * | 1997-07-10 | 2000-04-25 | Zimmer; Jerry W. | Method for making CVD diamond coated substrate for polishing pad conditioning head |
JP2001210613A (ja) * | 2000-01-27 | 2001-08-03 | Allied Material Corp | Cmp用パッドコンディショナー |
JP3609059B2 (ja) * | 2002-04-15 | 2005-01-12 | 株式会社ノリタケスーパーアブレーシブ | Cmp加工用ドレッサ |
JP4463084B2 (ja) * | 2003-11-27 | 2010-05-12 | 株式会社オクテック | ドレッシング工具 |
CA2564748C (en) * | 2004-09-23 | 2013-05-21 | Element Six (Pty) Ltd | Coated abrasive materials and method of manufacture |
JP2007109767A (ja) * | 2005-10-12 | 2007-04-26 | Mitsubishi Materials Corp | Cmpコンディショナおよびその製造方法 |
JP2007260886A (ja) * | 2006-03-30 | 2007-10-11 | Mitsubishi Materials Corp | Cmpコンディショナおよびその製造方法 |
-
2006
- 2006-09-25 JP JP2006258894A patent/JP4854445B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-21 CN CNA2007800355219A patent/CN101547770A/zh active Pending
- 2007-09-21 KR KR1020097005986A patent/KR20090074741A/ko not_active Application Discontinuation
- 2007-09-21 TW TW096135548A patent/TW200902234A/zh not_active IP Right Cessation
- 2007-09-21 WO PCT/JP2007/068356 patent/WO2008038583A1/ja active Application Filing
- 2007-09-21 US US12/311,226 patent/US20090239454A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2008038583A1 (fr) | 2008-04-03 |
JP4854445B2 (ja) | 2012-01-18 |
TWI335854B (ja) | 2011-01-11 |
CN101547770A (zh) | 2009-09-30 |
JP2008073825A (ja) | 2008-04-03 |
KR20090074741A (ko) | 2009-07-07 |
US20090239454A1 (en) | 2009-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |