200901866 九、發明說明： 【發明所屬之技術領域】 '本發明涉及-種散熱裝置，尤其係指 -構並用於對電子元件散熱之散熱裝置。 巧 【先前技術】 、亲電子產業之迅速發展’如電腦中電子元件之運算 = 提而’其產生之熱量也隨之劇增，如何將電子 兀件之熱量散發出去，以保證其正常 子 需解決之問題。眾所周知仏業者必 .係電腦系統之核…電„ :九機板上之中央處理器 過客夕&日人 田电月命運仃時，中央處理器產生埶量。 .過夕之熱量會導致中央處理器盔 a 中央處理器在運行過程中產生;;敎量吊為有效散發 裝一與中央處理器接觸置^吊在電路板上加 發出去。此外，在中^ 便將其產生之熱量散 电日日體之類之發熱電子元件，為保 女衣者稷數诸如 同樣需要解決該等發熱電子 之運行穩定性， 間限制及成本考慮，通常血法對4：： =題，惟，由於空 散熱裝置。 …、對°亥專电子元件安裝專門之 現今常用的散熱裝置一般 ，排列之散熱韓片及安裝於散心頂f數平行基座 置该風扇—般係通過風扇固定架或導風罩ί或一側之風 置上。然而，該風扇產生之強制裝到散熱裝 對中央處理器之散熱效率，卻無法二:： 200901866 T : 11f、:或者，在導風罩上設置分流結構，將部八 "士周邊电子凡件以達到對它們散熱，铁， .二將很大程度減少吹向散熱裳置之氣流， .熱衣置對中央處理器之散熱效果。 〜曰政 【發明内容】 本毛明曰在提供一種有效利用風扇氣流之散敛聲置。 一種散熱裝置，用於對安裝在電路板上央處 進行散熱，包括-基座、㈣在該基座上之—散埶 2褒在錢熱片組及該基座—侧之—風扇， = :Γ，形成有導流面，以將風扇產生之小部分ΐ 級、°女衣在该中央處理器周邊之發熱電子元件。 上述散熱裝置安裝在其一侧之風扇正對該导流面 將該風扇底端部分產生之氣流導向中央處理器周 子元件，而能充分合理地利用風扇產生之氣流冷卻 、处理為，同時兼顧對其周邊電子元件之散熱。 【實施方式】 ’' 圖丄和圖2所示為本發明一實施之散熱裝置其用於對安 ’在電路板6G上之中央處理器64及安裝於該中央處理器64 周，之如電晶體之類之發熱電子元件（未標號）進行散熱， 該散熱裝置包括一基座10、位於基座1〇上之—散熱片、組 、將該基座10與散熱片組30導熱連接之一熱管組加、安 衣°亥於散熱片組30-侧之導風罩40和安裝在該導風罩4〇上 之—風扇50。 200901866 理為64之周圍均勻開設有穿孔 (圖未示）穿過而將該散熱裝 62， 上述電路板6〇在中央處 該穿孔62用於供固定件 定在該電路板6〇上。 明併苓閱圖4 ’上述基座1〇大致為一矩形金屬板 該基座10底面中部開設有與該熱管組2〇配合之一第—容置 槽11 ’在該第—容置槽u兩側開設有關於該第—容置ς 對稱之二第二容置槽12。該第—容置槽以長條形且^該 基座10兩相對長邊緣平行。該第二容置槽12包括與第—容 置槽1—1緊靠ϋ平行之主體部12G及從該主體部⑽相對兩端 成了疋角度向外側傾斜延伸之兩翼部122。該第—容置槽U 及第二容置槽12之兩末端均開設有貫穿該基㈣上下^之 通孔13，該通孔13為圓形，用於供該熱管組2〇穿設。該基 座10在第—容置槽U與兩第二容置槽12間之連接處分別； 直凸伸二凸條14。該基座10底面在一第二容置槽12主體部 120中部與靠近該第二容置槽12邊緣之間凸設一梯形凸台 15，該梯形凸台15與該凸條14等高，且其寬度從第二容置 槽12向該基座10邊緣遞減；該基座1〇底面在另—第二容置 槽12主體部12〇中部附近位置凸設一與該梯形凸台15對應 之二角凸台16,該三角凸台16與梯形凸台15等高且1 與該第二容置槽12之一邊緣重合。該基座1〇靠近該三角凸 台15之一侧面形成一導流面17，該導流面17包括沿基座 上表面向外凸伸之一薄平板面170和連接該平板面並從該 側面由基座10頂面向其底面逐漸凹陷而成之一弧形面 172,以將風扇50產生之部分氣流導引向中央處理器64周圍 200901866 之電子元件。該基座10在靠近導流面17之角落上各開設一 螺孔18 ’用以與螺釘（圖未示）配合安裝導風罩4〇。該基 -座10之各個角落沿對角線向外延伸一固定臂19，該固定臂 .19近末端開設—供固定件（圖未示）穿設之安裝孔19〇。 上述熱管組20包括均大體呈υ形之一第一熱管22和分 別位於該第—熱管22兩侧之二第二熱管24。該第一熱管22 包括一平直之第—吸熱段220及從該第一吸熱段220兩端垂 ，直向上延伸之二第—放熱段222,該第二熱管24包括一第二 吸熱段240及從該第二吸熱段24〇兩端垂直向上延伸之二第 一放熱段242，該第二吸熱段24〇形狀為與該基座1〇第二容 •置槽12對應之形狀，其包括一平直之主體部（未標號）及 從该主體部兩端向一侧傾斜延伸之兩翼部（未標號），該 翼部末端再垂直向上延伸出該第二放熱段242。該第一吸熱 部220及第二吸熱部24〇容置在該基座1〇之第一、第二容置 槽11、12内，且它們之上下表面均被處理成平面，以使其 ν頂面與該基座1G之第—及第二容置槽u、12之底面接觸， 底面兵基座1〇底面之長條凸部、梯形凸部Μ及三角凸 部16形成與中央處理器64接觸之平面。 上述，熱片組30包括由矩形金屬薄片形成之複數散熱 °亥荨放熱片32平行該基座1 〇表面並相互等距間隔形 成供氣流通過之通道（未標號）。該散熱片組30在其近兩 端處各開設—組並排分佈之容置孔34，每組容置孔34包括 相互平订間隔亚垂直散熱片32延伸之三容置孔％，該容置 孔34用於供熱官22、24之放熱段222、冰穿置。該散熱片 8 200901866 組30相對兩侧面在靠近基座10導風面17—側各開設一垂直 散熱片32之豎直扣槽36，該扣槽36用於固定該導風罩40。 請同時參閱圖3，上述導風罩40與散熱片組30之扣槽36 配合而固定到散熱片組30—侧，其包括一矩形頂板42及從 該頂板42兩端垂直向下延伸之兩矩形侧板44。該頂板42 — 侧邊緣近兩端處各設置垂直向下延伸之一第一固定片 422，該固定片422中間開設有配合孔4220，以與螺釘（圖未 示）配合將風扇50固定。該侧板44底端垂直向内平行延伸一 安裝板442，該安裝板442在靠近散熱片組30—端設置一與 基座10之螺孔18對應之透孔4420。一第二安裝片444從該安 裝板440遠離該透孔4420之一端邊緣垂直向下延伸，該第二 安裝片444近末端處開設有供螺釘穿設以固定該風扇50之 一配合孔4440。該第二安裝片444向下延伸之長度較該第一 安裝片422之長，使風扇50安裝至該導風罩40後正好覆蓋到 基座10之導流面17。該侧壁44靠近散熱片組30之一侧邊緣 垂直向内凸設有二扣片446，該兩扣片446相互相隔且分別 靠近該側壁44兩端，以與散熱片組30之扣槽36扣接。 上述風扇50包括一與導風罩40相對應之矩形框架（未 標號），該框架各個角落各開設一透孔52，該等透孔52用 於供螺釘穿過與該導風罩40之第一、第二安裝片422、442 之配合孔4220、4420對應螺合，而將風扇50固定。 上述散熱裝置處於組裝狀態時，該第一熱管22和第二 熱管24之放熱段222、242自基座10之通孔13穿過並容置在 位於該基座10上面之散熱片組30之對應容置孔34内；該第 9 200901866 一熱管22和第二熱管24之吸熱段220、240分別對應容置在 該基座10之第一容置槽11和第二容置槽12内，且該等吸熱 段220、240之底面與基座10底面之長條凸部14、梯形凸部 15及三角凸部16形成一接觸面並在使用時與中央處理器64 緊密接觸。該風扇50通過螺釘穿過其上之透孔52再與導風 罩40第一、第二安裝片422、442之配合孔4220、4420對應 螺合而與導風罩40結合在一起。該導風罩40之扣片446與該 散熱片組30扣槽36扣接，其固定腳442上之透孔4420對應該 基座10螺孔18並通過螺釘固定。 上述散熱裝置在使用時，該散熱裝置通過固定件固定 到電路板60上，該中央處理器64及其周邊之電子元件位於 該散熱裝置之基座10下方，該等熱管22、24之吸熱段220、 240直接從中央處理器64吸熱，再通過其放熱部222、224將 熱量傳導到散熱片組30上，最後通過與風扇50產生之強制 氣流之熱交換作用下，散熱片組30之熱量被快速散發到周 l圍環境中。此外，該基座10—侧面形成一弧形導風面17， 同時安裝在該散熱裝置一侧之風扇50覆蓋到該導風面17 上，該導風面17可將該風扇50底端部分產生之氣流導向安 裝在中央處理器64周邊之電子元件，該散熱裝置從而能充 分合理地利用風扇50產生之氣流冷卻中央處理器64同時兼 顧對其周邊電子元件之散熱，進而保證系統之穩定性。 综上所述，本發明符合發明專科要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 10 200901866 或變化，皆應涵蓋於 【圖式簡單說明】 以下之申請專利範圍内 圖1係本發明—實施例中散熱裝置之組裝圖。 圖2係圖1之立體分解圖。 圖3係圖1之部分分解圖。 圖4係圖2中基座之倒置視圖。 【主要元件符號說明】 v 基座 10 第一容置槽 11 第二容置槽 12 主體部 120 翼部 122 通孔 13 凸條 14 梯形凸台 15 二角凸台 16 導流面 17 平极面 170 弧形面 螺孔 18 固定臂 172 安裝孔 190 熱管紐 19 弟一'敎管 *、，、 P 22 第一 D及熱段 20 〇 〇 ^ 第一放熱段 222 第二熱管 第二吸熱段 240 第二敌熱段 24 散熱片組 30 ' ^--V 散熱 242 容置孔 34 扣槽 32 導風罩 40 頂板 36 第一固定片 422 配合子匕 42 422〇 444〇 11 200901866 側壁 44 安裝板 442 透孔 4420 > 52 第二安裝片 444 .扣片 446 風扇 50 .電路板 60 穿孔 62 中央處理器 64 12200901866 IX. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention relates to a heat dissipating device, and in particular to a heat dissipating device for dissipating heat from an electronic component. Qiao [previous technology], the rapid development of the pro-electronics industry, such as the operation of electronic components in the computer = and the heat generated by it has also increased dramatically, how to dissipate the heat of the electronic components to ensure their normal needs Solve the problem. It is well known that it is the core of the computer system...Electric „: The central processor on the nine-board board passes the eve of the day, and the Japanese processor generates the amount of enthusiasm. The heat of the night will cause the central The processor helmet a central processor is generated during the running process; the measuring crane is effectively distributed to the central processor and is attached to the circuit board to be sent out. In addition, the heat generated by the heat is dispersed in the middle The heating electronic components such as electric sun and the sun, in order to protect the number of female clothes, such as the need to solve the operational stability, inter-limitation and cost considerations of these heating electrons, usually the blood method is 4:: =, but because Air-dissipating device. ..., the special heat-dissipating device that is commonly used in the installation of electronic components in general. The heat-dissipating Korean film is arranged and the fan is mounted on the parallel base of the fringe top. The fan is driven by a fan holder or a wind guide. The cover ί or the wind on one side is placed. However, the heat generated by the fan to the heat sink is not able to be dissipated to the central processor: 200901866 T : 11f, or: a shunt structure is arranged on the air hood , Department of the Eight " Circumference of electronic parts to achieve their heat dissipation, iron, . . . will greatly reduce the airflow blowing to the heat sink, the hot clothes set the heat dissipation effect on the central processor. 】 The present invention provides a ventilated sound that effectively utilizes the fan airflow. A heat sink for dissipating heat at a central portion of the circuit board, including a pedestal and (d) on the pedestal 2 褒 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在The fan installed on one side of the heat dissipating device directly guides the airflow generated by the bottom end portion of the fan to the central processor peripheral component of the flow guiding surface, and can fully and reasonably utilize the airflow generated by the fan to cool and process the same. [Embodiment] FIG. 2 and FIG. 2 show a heat dissipating device according to an embodiment of the present invention, which is used to mount a central processing unit 64 on a circuit board 6G and is mounted in the center. Processor 64 A heat-generating electronic component (not labeled) such as a transistor is used for heat dissipation, and the heat sink includes a base 10, a heat sink, a set on the base 1 , and the base 10 and the heat sink set. 30 heat-conducting connection heat pipe group is added, and the air-shielding cover 40 is disposed on the heat-dissipation group 30-side and the fan 50 is mounted on the air-guiding cover 4 2009. 200901866 (not shown) passes through the heat sink 62, the circuit board 6 is centered at the center, and the through hole 62 is used for fixing the fixing member on the circuit board 6. The same as the base 1 The 〇 is substantially a rectangular metal plate. The middle portion of the bottom surface of the base 10 is provided with a first accommodating groove 11 ′ of the heat pipe group 2 在. The first accommodating groove u is opened on both sides of the first accommodating groove u. The second symmetry slot 12 is symmetrical. The first accommodating groove is elongated and parallel to the opposite long edges of the susceptor 10. The second accommodating groove 12 includes a main body portion 12G that is parallel to the first accommodating groove 1-1, and two wing portions 122 that extend obliquely outward from the opposite ends of the main body portion (10). Both ends of the first receiving groove U and the second receiving groove 12 are provided with through holes 13 extending through the base (four), and the through holes 13 are circular for the heat pipe group 2 to pass through. The base 10 is respectively connected at a joint between the first receiving groove U and the two second receiving grooves 12; the two protruding strips 14 are directly protruded. A trapezoidal boss 15 is protruded from a bottom surface of the base 10 in a middle portion of the main body 120 of the second receiving slot 12 and adjacent to the edge of the second receiving slot 12 . The trapezoidal boss 15 is equal to the protruding strip 14 . The width of the pedestal 1 is reduced from the second accommodating groove 12 toward the edge of the pedestal 10; the bottom surface of the pedestal 1 is convexly disposed at a position near the middle portion of the main body portion 12 of the second accommodating groove 12, and corresponds to the trapezoidal boss 15 The two-corner boss 16 is equal in height to the trapezoidal boss 15 and 1 coincides with one edge of the second receiving groove 12. A side of the pedestal 1 adjacent to one of the triangular bosses 15 defines a flow guiding surface 17 including a thin flat surface 170 protruding outwardly from the upper surface of the base and connecting the flat surface from the side A curved surface 172 is gradually recessed from the top of the base 10 toward the bottom surface thereof to guide a portion of the airflow generated by the fan 50 to the electronic components of the 200901866 around the central processing unit 64. The base 10 defines a screw hole 18 ′ at a corner close to the flow guiding surface 17 for mounting the air guiding hood 4 with a screw (not shown). Each of the corners of the base-seat 10 extends diagonally outwardly from a fixed arm 19, and the fixed end of the fixed arm 19 opens a mounting hole 19 for the fixing member (not shown). The heat pipe group 20 includes a first heat pipe 22 which is substantially in the shape of a dome and two second heat pipes 24 which are respectively located on both sides of the first heat pipe 22. The first heat pipe 22 includes a flat first heat absorption section 220 and two second heat release sections 222 extending from the first heat absorption section 220 and extending straight upward. The second heat pipe 24 includes a second heat absorption section 240. And two first heat-dissipating segments 242 extending vertically upward from the two ends of the second heat-absorbing portion 24, the second heat-absorbing portion 24 is shaped to correspond to the base 1 and the second receiving slot 12, and includes A flat body portion (not labeled) and two wing portions (not numbered) extending obliquely from one end of the body portion to one side, the wing portion ends extending vertically upwardly from the second heat releasing portion 242. The first heat absorbing portion 220 and the second heat absorbing portion 24 are accommodated in the first and second accommodating grooves 11 and 12 of the susceptor 1 , and the upper and lower surfaces thereof are processed into a plane to make it ν The top surface is in contact with the bottom surface of the first and second receiving grooves u and 12 of the base 1G, and the long convex portion, the trapezoidal convex portion, and the triangular convex portion 16 of the bottom surface of the bottom surface of the base member 1 are formed with the central processing unit 64 contact plane. In the above, the heat sheet group 30 includes a plurality of heat-dissipating heat-dissipating sheets 32 formed of rectangular metal foils which are parallel to the surface of the base 1 and are equally spaced apart from each other to form a passage (not labeled) through which the airflow passes. The heat sink group 30 has a plurality of accommodating holes 34 arranged side by side at the two ends thereof, and each of the accommodating holes 34 includes three accommodating holes % extending from the sub-vertical heat sink 32. The holes 34 are used for the heat release section 222 of the heat supply members 22, 24, and the ice is placed. The heat sink 8 200901866 is provided with a vertical retaining groove 36 for the vertical fins 32 on the side opposite to the air guiding surface 17 of the base 10 on the opposite sides of the base 30. The retaining groove 36 is used for fixing the air guiding cover 40. Referring to FIG. 3 simultaneously, the air guiding cover 40 is fixed to the side of the heat sink group 30 in cooperation with the buckle groove 36 of the heat sink group 30, and includes a rectangular top plate 42 and two vertically extending downward from the two ends of the top plate 42. Rectangular side panel 44. The top plate 42 is provided with a first fixing piece 422 extending vertically downward at the proximal end of the side edge. The fixing piece 422 is provided with a matching hole 4220 in the middle to cooperate with the screw (not shown) to fix the fan 50. The bottom end of the side plate 44 extends vertically inwardly and in parallel with a mounting plate 442. The mounting plate 442 is provided with a through hole 4420 corresponding to the screw hole 18 of the base 10 near the end of the heat sink group 30. A second mounting piece 444 extends vertically downward from an end edge of the mounting plate 440 away from the through hole 4420. The second mounting piece 444 is provided at a proximal end thereof with a fitting hole 4440 for screwing to fix the fan 50. The second mounting piece 444 extends downwardly longer than the first mounting piece 422, so that the fan 50 is mounted to the air guiding cover 40 and covers the guiding surface 17 of the base 10. The side wall 44 is adjacent to the side edge of one of the fins 30 and vertically protrudes inwardly and has two fastening pieces 446. The two fastening pieces 446 are spaced apart from each other and are respectively adjacent to the two ends of the side wall 44 to be engaged with the buckle groove 36 of the heat sink group 30. Fastened. The fan 50 includes a rectangular frame (not labeled) corresponding to the air guiding cover 40. Each of the corners of the frame defines a through hole 52 for the screw to pass through the air guiding cover 40. First, the matching holes 4220 and 4420 of the second mounting pieces 422 and 442 are screwed together to fix the fan 50. When the heat dissipating device is in the assembled state, the heat releasing portions 222 and 242 of the first heat pipe 22 and the second heat pipe 24 pass through the through hole 13 of the base 10 and are accommodated in the heat sink group 30 located above the base 10 Corresponding to the accommodating hole 34; the heat absorbing section 220, 240 of the heat pipe 22 and the second heat pipe 24 of the ninth 200901866 are respectively accommodated in the first accommodating groove 11 and the second accommodating groove 12 of the susceptor 10, The bottom surfaces of the heat absorbing sections 220 and 240 form a contact surface with the elongated protrusions 14, the trapezoidal protrusions 15 and the triangular protrusions 16 on the bottom surface of the base 10 and are in close contact with the central processing unit 64 in use. The fan 50 is screwed to the air guiding cover 40 by screwing through the through holes 52 through which the screws pass and corresponding to the engaging holes 4220 and 4420 of the first and second mounting pieces 422 and 442 of the air guiding cover 40. The buckle 446 of the air guiding cover 40 is fastened to the fastening groove 30 of the heat sink assembly 30, and the through hole 4420 of the fixing leg 442 corresponds to the screw hole 18 of the base 10 and is fixed by screws. When the heat dissipating device is in use, the heat dissipating device is fixed to the circuit board 60 by a fixing member, and the electronic components of the central processing unit 64 and its periphery are located under the base 10 of the heat dissipating device, and the heat absorption portions of the heat pipes 22 and 24 are 220, 240 directly absorb heat from the central processing unit 64, and then conduct heat to the heat sink group 30 through the heat radiating portions 222, 224, and finally heat the heat sink group 30 through heat exchange with the forced air flow generated by the fan 50. It was quickly distributed to the environment around the week. In addition, the pedestal 10 has a curved air guiding surface 17 formed on the side thereof, and a fan 50 mounted on one side of the heat dissipating device covers the air guiding surface 17, and the air guiding surface 17 can be the bottom end portion of the fan 50. The generated airflow is directed to the electronic components mounted around the central processing unit 64. The heat dissipating device can sufficiently utilize the airflow generated by the fan 50 to cool the central processing unit 64 while taking care of the heat dissipation of the surrounding electronic components, thereby ensuring the stability of the system. . In summary, the present invention complies with the requirements of the invention, and patents are filed according to law. However, the above description is only a preferred embodiment of the present invention, and those skilled in the art, in the spirit of the present invention, equivalent modifications 10 200901866 or variations, should be included in the following [simplified description] BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an assembled view of a heat sink in the present invention - an embodiment. 2 is an exploded perspective view of FIG. 1. Figure 3 is a partial exploded view of Figure 1. Figure 4 is an inverted view of the base of Figure 2. [Main component symbol description] v Base 10 First accommodating groove 11 Second accommodating groove 12 Main body portion 120 Wing portion 122 Through hole 13 rib 14 Trapezoidal boss 15 Two-corner boss 16 Guide surface 17 Flat surface 170 curved surface screw hole 18 fixed arm 172 mounting hole 190 heat pipe button 19 brother one '敎 tube *,,, P 22 first D and hot segment 20 〇〇 ^ first heat release segment 222 second heat pipe second heat absorption segment 240 The second enemy heat segment 24 heat sink group 30 ' ^--V heat sink 242 accommodating hole 34 buckle groove 32 air hood 40 top plate 36 first fixing piece 422 mating 匕 42 422 〇 444 〇 11 200901866 side wall 44 mounting plate 442 Through hole 4420 > 52 second mounting piece 444. clasp 446 fan 50. circuit board 60 perforation 62 central processor 64 12