TW200849160A - Light output device - Google Patents
Light output device Download PDFInfo
- Publication number
- TW200849160A TW200849160A TW097111738A TW97111738A TW200849160A TW 200849160 A TW200849160 A TW 200849160A TW 097111738 A TW097111738 A TW 097111738A TW 97111738 A TW97111738 A TW 97111738A TW 200849160 A TW200849160 A TW 200849160A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- light output
- light
- light source
- wires
- Prior art date
Links
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10706—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being photo-polymerized
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Electroluminescent Light Sources (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
200849160 九、發明說明: 【發明所屬之技術領域】 本發明係關於光輸出裝置,特定言之,係關於使用與一 透光基板結構相關之離散光源。 【先前技術】 此類知、明裝置之一已知範例稱為,,破螭中之LED,,裝置。 在圖1中顯示一範例。通常,使用具有形成電極之一透明
Ο 導^•塗層(例如,ITO)之一玻璃板。圖案化該導電塗層以 便製造連接至一半導體LED裝置之電極。藉由層壓該玻璃 而完成組裝,其中LED在一熱塑層(例如,聚乙烯醇縮丁醛 (PVB))内。 此頸裒置之應 一,眼,圮梁外艰、辦公室隔 f、牆面覆層以及裝飾照明。照明裝置可用於其他物體的 照明、用於一影像之顯示或僅用於裝飾目的。 當前玻璃產品中的LED之一問題在於透明導電層具有一 較高的電阻以使得許多電源喪失。此外,㈣ιτ〇層無法 經圖案化用以形成極窄導體線,因為此將進一步增加電 阻。存在對此問題所提議之解決方式,其使用一半透明導 :網。例如,US 5,218,351揭示用作-(半)透明導體之一 電線網之使用。此需要一微影 序其因此在較大規模及 罕乂大$上生產係困難且昂貴的。 【發明内容】 本發明之一目的係提供具有整人 罢^ 正。先源裝置之一光輸出裝 置’在該等整合光源裝置中,一知^道+ I N導電且較高透明電極 129637.doc 200849160 配置可具有一較低的成本程序。 依據本發明,提供一種光輸出裝置,其包括: 一基板配置,其包括: 第-與第二透光基板與夾在f亥等基板之間的一電極配 置;以及 • 複數個光源裝置,其係整合於該基板配置之結構中且連 接至該電極配置, p 其中该電極配置包括間隔不透明電線之一至少半透明導 體配置,該等電線包括一導電油墨。 本發明提供使用以較高導電油墨印刷而產生之導電電線 或-導電網。較佳地’導電率小於Q1歐姆/sq/mU^更佳地 小於0.75歐姆/sq/mil。 電阻適用於光輸出應用中且該等電線可以複雜圖案放置 而不增加電阻。 透光基板材料可為透明(光學清晰)或一擴散透射材料。 〇 油墨可包括銀或其他導電顆粒,例如一熱塑黏合劑中的 銀顆粒。 一該等光源裝置較佳隔開至少15毫米,且更佳藉由大於30 笔米’且甚佳藉由大於50毫米。間隔越大,該電極圖案之 - 5亥專電線可隔開越遠,此改良總透明度。 该電極配置較佳包括寬度小於1〇〇〇微米,更佳小於Μ。 微米之複數個電線。寬度越小,透明度越大。然而,該寬 度較佳為大於75微米(例如,大於15〇微米)以提供所要求之 低電阻。 129637.doc 200849160 該光源裝置可包括—T 驻罢 栝LED裝置或一群組LED裝置。例 如,各裝置可為一群组二色led,B 4 + LED’且該電極圖案因此 引導至各LED之個別供應電極線及從各光源裝置引導之一 共用汲極電極線或分離電極線。 除該半透明電極配置外’可提供-完全透明導體配置, 其(例如m用作為透明材料之—透明導電氧化物(例如, ITO)連接至該電極配置。
該等光源裝置可包括無機LED、有機LED、聚合物LED 或雷射二極體。 本發明亦提供製造一光輸出裝置之一方法,其包括. 使用一導電油墨將一電極配置印刷在一基板配置之一第 一透光基板上用以定義不透明電線之一至少半透明導體配 置; 提供連接至該電極配置之複數個光源裝置;以及 提供-第二透光基板,且將該電極配置夾在該等基板之 間,因此將該等光源裝置整合在該基板配置之該結構内。 該兩個基板可使用一熱塑層或樹脂(例如,聚乙烯醇縮 丁醛(PVB)或一紫外(uv)樹脂)黏合在一起。 該印刷可包括絲網印刷、噴墨印刷或平版印刷。 【實施方式】 上在圖2中顯示在玻璃照明裝置中之一已知led的結構。 "亥妝明裝置包括玻璃板丨與2。在該等玻璃板之間係(半)透 明電極3a與3b (例如,使用IT〇形成)及連接至該等透明電 極3a與3b之一LED 4。將一層熱塑材料5 (例如,pvB4Uv 129637.doc 200849160 樹脂)提供在破璃板1與2之間。 ㈣玻璃板通常可具有U毫米至2.1毫米的厚度。在連 接至該LED之該等電極之間的間隔通常為0·〇1毫米至3毫 米例如、力0·1 5毫米。該熱塑層具有〇·3毫米至2毫米之典 型厚度,且該等電極之電阻係在2至8〇歐姆或1〇至儿歐姆/ 平方之範圍内。 該等電極較佳係實質上透明以使得其在該裝置之通常使 用中不為觀察者所覺察。較佳地,透明度大於8()%,更佳 地為90%,且甚佳地為99〇/〇。 本發明提供類似於圖2之已知結構之一結構,但使用包 括至^、半透明導體配置之一電極配置,該半透明導體配 置包括使用一導電油墨形成之隔開的不透明電線。可因此 印刷該導體配置。 可使用各種印刷方法,I目前一較佳方法係網版印刷或 絹印(先前名為絲網印刷)。此係使用一模板及一多孔織物 傳統上建立一銳緣影像之一印刷技術。 具有導電網版印刷線之玻璃板在汽車行業中為吾人所 知/飞車行業已製造汽車,其具有包含用以移除形成在窗 表面的霜之電加熱元件的後窗。該等後窗藉由一絲網印刷 程序來印刷’纟中-金屬材料之網格接著在該玻璃窗上燃 燒用以形成該電加熱元件。 在大多數實例中,形成戎加熱元件之該網格配置包含沿 該窗之各側延伸之一匯流條及橫跨該窗水平延伸之一系列 細線,纟中該等細線係連接至該等匯流條。形成該加熱元 129637.d〇( -9- 200849160 件之該網格材料通常為含有—銀粉及分散在—印刷媒介 (例如’適用於絲網印刷之油)中之—少量的軟錯破璃的一 混合物。在-絲網印刷程序巾將該網格材料應用於該破璃 基板。 製造用於汽車窗加熱器之導電電線具有一較高的電阻。 由於此原目,此類電線不適用於在玻璃中連接LED,因為 此將導致一不必要的電源損失。 一
參考圖2之已知結構,本發明使用採用_導電油墨印刷 之電極3a與3b,該導電油墨具有選擇之—電阻及尺寸以提 供總透明度及一較低電阻之一想要組合。特定言之,電極 3係極細,在該等電極之間具有一較寬間⑮以们寻整個導 電結構係半透明’具有以上所提及之想要的高透明度。 圖3顯示依據本發明之一結構之一俯視圖,其顯示印刷 電極3a與3b、兩個1^ 4與兩個匯流條6读61)。藉由在該 等匯流條上施加一電壓,透過該等電極及led一電流將在 該等匯流條之間流動。 針對該等印刷電極存在若干設計問題,且在下文中依次 吞兄明此等電極。 油墨之組成物 在以下表1中提供導電油墨之某些範例。為達到該等電 線之一較低電阻’使用一較高導電油墨係重要的。通常 地’-適當油墨包括在一熱塑黏合劑中之細分割銀顆粒, 該固化油墨具有在i mil(= 〇〇25毫米)厚度上小於每平方 0.075Ω之一薄片電阻。 129637.doc 200849160 表1 :導電油墨之範例 Electrodag 423 SS <42.0 Ω/sq @ 1 mil http://www.achesonindustries .com/doc/pds/Asia/ed 423 ss. pdf Electrodag SP-017 0.075 Ω/sq/mil http://www.laddresearch,com/ SpecSheets/60830.pdf Electrodag 18DB70X <0.015 Ω/sq/mil http ://www. thorlabs. com/ Images/PDF/Voll8 739.pdf 科學公開案 Bancroft 等人 0.010-0.005 Ω/sq/mil BANCROFT R CONDUCTIVE INK A MATCH FOR COPPER ANTENNA MICROWAVES & RF 26 (2): 87&FEB 1987 http://adsabs.harvard.edu/abs/ 1987MicWa..26...87B 如表1中可看出,並非所有油墨均適用於此目的。例 如,Electro dag 423SS具有一極高的電阻且因此僅適用於 (例如)玻璃加熱應用。在表1中所列出之其他油墨全部適 用。 電線之尺寸 當前使用網版印刷所達到的最佳解析度通常為5 mil (125微米)。 為採用寬度為125微米之一不透明電線達到99%之透 光,此意指在該等電線之間的間隔應大於12.5毫米。 若可印刷更細的電線(例如,具有75微米之一寬度),則 該間隔現可減小至最小值7.5毫米。 通常地,在LED之間的間隔為60毫米。在此情況下,電 線寬可最高為600微米。同樣地,若LED間隔為100毫米, 則電線寬可最高為1〇〇〇微米,再次達到99%的透明度。當 然,可存在對透明度的較低要求,其允許將較寬的電極電 129637.doc 200849160 線用於一給定間隔。 根據在觀察者與該玻璃之間的較佳距離,該等電線係幸六 佳足夠細以使其無法看見。與此形成對比,該電線較== 可能寬,以便減小電阻。 該等電線之電阻 士:以上所提及,該等電線之電阻不應太高,因為此導致 較尚的電源損失。仍可接受之最高電阻可被考量為與 電阻具有相同量值等級之一電阻。 例如,Nicha白光LED模型NFSW036BT具有18〇 mA之一 規疋最大電流及684 mW之一最大功率。自此,可將kLED 之一典型電阻計算為21歐姆。 一幸父佳油墨(在以上表1中)為Electr〇dag 18DB7〇X,其具 有<0.015 Ω/sq/mil之導電率。使用ι〇〇毫米之典型led間隔 的一範例,一 100毫米長電線之總電阻因此應具有<21 〇之 電阻。 該電阻可使用以下公式計算·· R = pLa 此公式將一導體之電阻(R)與其比電阻(p)、其長度⑴及 其斷面面積(A)相關。該比電阻可使用以下公式從電阻的 平方來計算: P = Rsquare xd = 0.015 mnx 1 w// = 3.8x 1 〇- 此提供: 129637.doc 12 200849160 7? = 3.8xl0"4Qmmx < 20 Ω
A y4> 3.8x10 4Qmmx = 1.9 x 103 mm2 20 Ω ^ 1.9 χ 103 mm1 = 〇Srnmm = 15, 最後,對於此油墨,該電線所允許之最小寬度(使用1 mil之塗層厚度)為75 μιη = 3 mil。藉由增加此寬度,可進 一步減少電源損失。 因此’一較佳電線寬為>75 μιη,具有1 mil = 25 μιη之一 電線厚度。較佳電線間隔因此為7.5毫米。 當然,若可增加厚度,則可相應減小寬度。 作為比較,現解釋用於玻璃之先前技術LED的ΙΤΟ導體 之尺寸。使用一 ITO塗層,25歐姆之一典型電阻施加於一 10x10公分的塗層。然而,當連接一 LED時,電流集中在 LED附近,從而增加電阻。此係一顯著效應,其導致對於 相同10x10公分板電阻增加至近似5〇歐姆。此顯示對於一 10x10公分ITO塗層,電阻幾乎不可接受。另外,當進一步 圖案化該ITO層時,ITO電線變得更細且電阻增加至不可接 受的數值。 印刷方法 U土印刷方法為絲網印刷 '然而’亦可使用其他印刷技 術(例如,噴墨印刷或平版印刷)。在平版印刷中,將油黑 傳送至板與滾筒上且接著傳送至該玻璃表面上。以此方二 所達到的解析度通常比絲網印刷更佳。 用於導電電線之圓案 129637.doc 13 200849160 使用印刷之一優點在於其允許用於驅動LED之複雜連接 圖案的使用。例如,本發明可用於將三個電線引導至一 LED以控制LED之紅/綠/藍顏色。或者,多個電線可用於 控制LED之色溫或強度。本發明亦可藉由將一分離電線引 導至玻璃板上之各led或藉由添加額外電子器件以製造一 被動或主動矩陣顯不而用於L E D之個別控制。 圖4顯不一複雜電線圖案之一範例,其顯示兩個lEd之 RGB控制。在此情況下,該等電極3a、允與%用於控制紅 色、綠色及藍色之設定,且電極3b係透過在lED封裝4中 之一LED連接至3a、3c與3d之一共同電極。各LED封裝4現 3有具有紅、綠及藍顏色之三個LED。匯流條6b (圖3中) 現採用用於各LED之分離連接器來代替。亦可以使用三個 匯机條,其中共用電極3a、3b或3c係連接至一匯流條。 在某些情況下,想要使某些區域完全透明。在此情況 下,如圖5中所顯示,可使用絲網導體3與完全透明(例 如,氧化銦錫)導體7之一組合。此具體實施例可(例如)用 於較大玻璃窗,其中在中間顯示一影像。 實質上完全透明導體之其他範例為氧化銦鋅、氧化錫或 氟摻雜氧化錫。
地,忒裝置包括欲入在一較大玻璃板中之許多LED 衣置。在該等LED之間的一典型距離可為從丨公分至1〇公 分。 、k以上範例應明白,各電極間隙可藉由1個LED連接, 或其可藉由多個LED共用。 129637.doc -14 - 200849160 在本發明之光輸出萝 展置中,發光之方向可從LED裝置朝 該導體配置或遠離誃1 μ導體配置或既朝向又遠離該導體配 置。該複數個光源可u & 一規則陣列配置,或其可以任何所 要圖案進行配置以逵ξ | 運到一給定照明效應。 該透明基板可通常為破璃或塑膠。 、上略述在導電電線之間的距離及電線寬一起定義 透明度及電阻。一船而4 版而S ,較佳的係間隔實質上大於寬 Γ Ο 度’例如,至少大1 〆立 夕大10倍’且可能至少大50倍或甚至大1〇〇 多倍。 該導體配置可包今彳閣2,丨$ 1 1 — 匕3個別電極線所連接的匯流排。 、範例僅-不整合於該基板結構中的LED裝置。然 而他電子杰件級件(例如,微控制器或電容器)可整合 ;“板…構中。可提供控制器用於各裝置以使得不 需要與各LED裝置的個料部連接來致能獨立控制。相 反,該等微控制器可作X _、& Μ , J作為一連接網路而通信且一減少數目 之連接因此需要傳遞至該裝置之周邊。 感應器(例如,壓力感應器、溫度感應器或光感應器)亦 可整合於該裝置之結構中以提供添加的功能。 X電極配置可(例如μχ _主動或被動矩陣致能lED之個 別控制,或者LED可配置成受到分離控制的群組。 該等基板較佳為透明的,仞Α介 ^ ^仁其亦可為擴散的。不同光輸 出效應可採用不同基板特性而獲得。 熟習技術人士將明白各種修改。 【圖式簡單說明】 129637.doc 200849160 現將參考附圖詳細說明本發明之範例,其中: 圖1顯示在玻璃裝置中之一已知LED ; 圖2更詳細顯示圖1之該裝置之一單一LED且本發明可應 用於此单一 LED中; 圖3顯示本發明之一第一導體配置佈局; 圖4顯示本發明之一第二導體配置佈局;以及 圖5顯示本發明之一第三導體配置佈局。 卜N圃不中之類似零件。 【主要元件符號說明】 相同參考數字用於指示在不同圖 1 玻璃板 2 玻璃板 3a 電極 3b 電極 3c 電極 3d 電極 4 LED 5 熱塑材料層 6a 匯流條 6b 匯流條 7 透明電極 129637.doc -16 -
Claims (1)
- Ο Ο 2· 包括在一熱塑 200849160 十、申請專利範圍: L -種光輸出裝置,其包括: 一基板配置,其包括·· -二及(1、2)與夹在該等基板之㈣ 二數一基板一結構 透明電線之-m 極®置包括隔開0 電油墨。 7半透明導截配置,該等電線包括-導 如請求項1之光輸出梦 ^Α. 置,其中該電極配置係提供在該 寻暴板之一者上。 3·如請求項1或2之光輪屮骷 出扁置,其中該導體配置包括含有 導電顆粒之'一油墨。 4.如請求項1或2之光輪出裝置,其中該油 黏合劑中之銀顆粒。 5·如請求項1或2之光輸出裳置’其十該油墨在0.025毫米之 厚度下具有小於或等於每平…歐姆之—薄片電阻。 6·如請求項1或2之光輪出裝置’其中該固化油墨在0.025毫 米之厚度下具有小於或等於每平方〇 〇乃歐姆之一薄片電 Ρ更j土地在0.025¾米之厚度下具有小於或等於每平方 〇.請歐姆之-薄片電阻,且更佳地在qg25毫米之厚度 下具有小於或等於每平方GG15歐姆之—薄片電阻。 7·如請求項_之光輪出裳置,其中該等光源裝置⑷係隔 開至少1 5毫米。 129637.doc ,其中該等光源裝置(4)係隔 其中該電極配置包括寬度小 其中該電極配置包括寬度小 ,其中該電極配置包括寬度 其中該電極配置包括寬度大 ,其中該電極配置包括寬度 其中該光源裝置(4)包括一 其中各光源裝置(4)包括一 圖案包括引導至各LED之個別 其進一步包括具有連接至 完全透明電極(7)之一第二電極 200849160 8·如請求項丨或2之光輪出裝置 開至少30毫米。 9·如請求項丨或2之光源裝置, 於1000微米之複數個電線。 1〇·如請求項1或2之光源裝置, 於6〇〇微米之複數個電線。 11.如明求項1或2之光輸出裝置 大於7 5微米之複數個電線。 12 ·如請求項11之光輸出裝置, 於150微米之複數個電線。 13.如請求項1或2之光輸出裝置 為0.08毫米至〇·8毫米之複數個電起 14·如請求項1或2之光輸出裴置 LED裝置或一群組LED裝置。 15·如請求項1或2之光輸出裝置 群組三色LED,且該電極 供應電極線(3a、3c、3d)。 16·如請求項!或2之光輸出裝置 該電極配置(3)之實質上 酉己置。 17· 如睛求項16之光輸出 為導電材料之一透明 18. 如睛求項1或2之光輸出裝 無機LED、一有機LED、 裝置’其中該第二電極配置包括作 導電氧化物。 置’其中各光源裝置(4)包括一 一聚合物LED或一雷射二極 129637.doc 200849160 體。 19. 一種照明系統,其包括如前述請求項中任一項之一光輸 出裝置。 20. —種製造一光輸出裝置之方法,其包括: 使用一導電油墨將一電極配置(3a、3b)印刷在一基板 配置之一第一透光基板(1)上以定義不透明電線之一至少 半透明導體配置; 提供連接至該電極配置之複數個光源裝置(4);以及 提供一第二透光基板(2),且將該電極配置夾在該等基 板之間,因此將該等光源裝置整合在該基板配置之該結 構内。 2 1 ·如明求項20之方法,其進一步包括使用一熱塑層或樹脂 將该兩個基板黏合在一起。 22. 如請求項21之方法,其中該熱塑層或樹脂包括聚乙烯醇 縮丁醛或一UV樹脂。 23. 如請求項22之方法,其中該熱塑層或樹脂之厚度係〇·3毫 米至2毫米。 24·如請求項2〇至23中任-項之方法,其中該油墨包括_熱 塑黏合劑中的銀顆粒。 25·如凊求項20或21之方法,其中該印刷包括絲網印刷。 26.如明求項20或2 1之方法,其中該印刷包括噴墨印刷或平 版印刷。 129637.doc
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WO2009016561A2 (en) * | 2007-08-02 | 2009-02-05 | Koninklijke Philips Electronics N.V. | Light output device |
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JP6523179B2 (ja) * | 2013-12-02 | 2019-05-29 | 東芝ホクト電子株式会社 | 発光ユニット、発光装置及び発光ユニットの製造方法 |
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US10427503B2 (en) * | 2017-08-10 | 2019-10-01 | Magna Mirrors Of America, Inc. | Vehicle window assembly with display |
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ITMI20010807A1 (it) * | 2000-04-14 | 2002-10-13 | Saint Gobain | Procedimento per la fabbricazione di piste elettroconduttorici sunun substrato trasparente e substrato ottenuto |
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US20100096647A1 (en) | 2010-04-22 |
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