TW200846649A - Pattern inspection device and method used thereby - Google Patents

Pattern inspection device and method used thereby Download PDF

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Publication number
TW200846649A
TW200846649A TW097105577A TW97105577A TW200846649A TW 200846649 A TW200846649 A TW 200846649A TW 097105577 A TW097105577 A TW 097105577A TW 97105577 A TW97105577 A TW 97105577A TW 200846649 A TW200846649 A TW 200846649A
Authority
TW
Taiwan
Prior art keywords
illumination
pattern
light
pit
substrate
Prior art date
Application number
TW097105577A
Other languages
English (en)
Chinese (zh)
Inventor
Kentaro Nomoto
Ryozo Matsuda
Hiroki Hayashi
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200846649A publication Critical patent/TW200846649A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method

Landscapes

  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW097105577A 2007-05-24 2008-02-18 Pattern inspection device and method used thereby TW200846649A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007137577A JP2008292273A (ja) 2007-05-24 2007-05-24 パターン検査装置およびパターン検査方法

Publications (1)

Publication Number Publication Date
TW200846649A true TW200846649A (en) 2008-12-01

Family

ID=40100436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097105577A TW200846649A (en) 2007-05-24 2008-02-18 Pattern inspection device and method used thereby

Country Status (4)

Country Link
JP (1) JP2008292273A (ja)
KR (1) KR20080103403A (ja)
CN (1) CN101311706A (ja)
TW (1) TW200846649A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481908B2 (ja) * 2009-04-02 2014-04-23 セイコーエプソン株式会社 画像読取装置およびその制御装置、プログラム、制御方法
JP2010251815A (ja) 2009-04-10 2010-11-04 Seiko Epson Corp 画像読取装置、画像読取方法、プログラム
JP5439977B2 (ja) * 2009-06-24 2014-03-12 富士ゼロックス株式会社 動作判定システム、動作判定装置およびプログラム
CN102095377A (zh) * 2010-11-04 2011-06-15 深圳市华星光电技术有限公司 线宽量测装置
KR101182822B1 (ko) * 2011-03-29 2012-09-13 삼성전자주식회사 발광소자 검사장치 및 방법
US9074886B2 (en) 2012-07-09 2015-07-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Line-width measurement device and measurement method using the same
CN102768017B (zh) * 2012-07-09 2014-06-25 深圳市华星光电技术有限公司 线宽量测装置及其方法
JP2020085587A (ja) * 2018-11-21 2020-06-04 日本電気硝子株式会社 ガラス板の製造方法、及びガラス板の製造装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005024386A (ja) * 2003-07-02 2005-01-27 Ushio Inc 配線パターン検査装置

Also Published As

Publication number Publication date
JP2008292273A (ja) 2008-12-04
CN101311706A (zh) 2008-11-26
KR20080103403A (ko) 2008-11-27

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