TW200844245A - Flexible laminated plate and production method thereof - Google Patents

Flexible laminated plate and production method thereof Download PDF

Info

Publication number
TW200844245A
TW200844245A TW097114987A TW97114987A TW200844245A TW 200844245 A TW200844245 A TW 200844245A TW 097114987 A TW097114987 A TW 097114987A TW 97114987 A TW97114987 A TW 97114987A TW 200844245 A TW200844245 A TW 200844245A
Authority
TW
Taiwan
Prior art keywords
base
concentration
intermediate layer
base film
flexible
Prior art date
Application number
TW097114987A
Other languages
English (en)
Chinese (zh)
Inventor
Takeshi Sakurai
Wataru Fujisaki
Akira Kowata
Original Assignee
Mitsubishi Shindo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindo Kk filed Critical Mitsubishi Shindo Kk
Publication of TW200844245A publication Critical patent/TW200844245A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW097114987A 2007-05-08 2008-04-24 Flexible laminated plate and production method thereof TW200844245A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007123418A JP2008279610A (ja) 2007-05-08 2007-05-08 フレキシブル積層板及びフレキシブル積層板の製造方法

Publications (1)

Publication Number Publication Date
TW200844245A true TW200844245A (en) 2008-11-16

Family

ID=40114281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097114987A TW200844245A (en) 2007-05-08 2008-04-24 Flexible laminated plate and production method thereof

Country Status (4)

Country Link
JP (1) JP2008279610A (ja)
KR (1) KR20080099167A (ja)
CN (1) CN101304634A (ja)
TW (1) TW200844245A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548195B (zh) * 2011-12-23 2015-09-23 云南云天化股份有限公司 高精度柔性电路板及其制备方法
JP6103375B2 (ja) * 2013-05-13 2017-03-29 大日本印刷株式会社 電子部品を作製するために用いられる積層体および積層体製造方法、フィルムセンサおよびフィルムセンサを備えるタッチパネル装置、並びに、濃度勾配型の金属層を成膜する成膜方法

Also Published As

Publication number Publication date
JP2008279610A (ja) 2008-11-20
KR20080099167A (ko) 2008-11-12
CN101304634A (zh) 2008-11-12

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