TW200838378A - Water soluble pressure sensitive adhesive for fine solder ball replacement and alignment of fine solder ball on a printed board - Google Patents

Water soluble pressure sensitive adhesive for fine solder ball replacement and alignment of fine solder ball on a printed board Download PDF

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Publication number
TW200838378A
TW200838378A TW097107838A TW97107838A TW200838378A TW 200838378 A TW200838378 A TW 200838378A TW 097107838 A TW097107838 A TW 097107838A TW 97107838 A TW97107838 A TW 97107838A TW 200838378 A TW200838378 A TW 200838378A
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Taiwan
Prior art keywords
solder ball
water
adhesive
solder
solder balls
Prior art date
Application number
TW097107838A
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English (en)
Inventor
Takeo Kuramoto
Kaichi Tsuruta
Takashi Hori
Takeo Saitoh
Shinichi Nomoto
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Senju Metal Industry Co
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Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW200838378A publication Critical patent/TW200838378A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
    • C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C09J139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/58—Ethylene oxide or propylene oxide copolymers, e.g. pluronics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

200838378 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種為了配置形 模組基板等印刷基板所用微細焊球的方法及：用 焊球配置用水溶性黏著劑。 【先前技術】 Ο 如BGA及csp等多功能部品，於稱呼為m 板之功能部品用基板背面設置有多數的電極。於裝設 該多功能部品於印刷基板之際，係以焊條焊接。例: 在構成多功能部品之基板電極預先形成谭粒，而血印 刷於印刷基板上的軟焊膏比對位置，以回流爐加熱炼 融焊粒，而焊接多功能部品與印刷基板。 然而多功能部品用的焊粒，一般係在模組基板上 用悍球做成。在直接配置焊球於模組基板上時，係使 用叫做焊球塔載器的裝置配置谭球於基板上。使用焊 球塔载器的塔裁方法，如揭示於特開平i wo⑵號 =報（專利文獻υ等方式，裝人桿球於斗狀收納容^ 中，從收納容器吸取焊球於焊球塔載器的吸著頭，停 止吸引而落下谭球於基板上，此乃主要方式。、τ θ又，有時可使用稱為焊球墊片的器具，係具有軟 w模組基板電極配置同―位置之塾片。本申請人曾 5 200838378 扣不-種烊球配置墊片，其係以設定形態所設複數焊 球插入孔的罩子，收容於該插入孔的痒球，及用以保 持焊球於該插Λ孔中之固著劑所構成者，公開於持開 2004-80024號公報（專利文獻2)。 (專利文獻1)持開平u_33〇123號公報 (專利文獻2)持開2〇〇4·8〇〇24號公報 【發明内容】 以知球i合载器配置焊球時，因焊球在斗狀吸納容 器上被滾轉移動至吸引孔上，引起產生靜電使焊球互 相吸著的問題。因此如專利文獻1所揭示，就需吹襲 空氣於過多附著的焊球，或對吸著頭本㈣以衝擊， =除去不需要的焊球等方法。但是使用焊球塔載器的 知球配置法’固可毫無問題的應用於粒徑約0.3 mm以 内，0.2刪以下者，因焊球本身重量太輕，一旦產 生靜電，因空氣的吹襲及衝擊致使需要的焊球也落 下。又如專利文獻！之記載’在塗有焊接劑之模組基 板上配置焊球時，通常對卡住在吸著頭之吸引孔的焊 球力士口以衝|而令其掉落，但遇到〇2關以下的微小焊 球時，—旦掉落的輝球因本身太輕而致產生靜電，使 其再度附著於吸著頭’為了形成BGA或CSP等模組 基板的烊粒所使用焊球的尺寸微小化，靜電問題就不 能回避。 6 200838378 本發明所欲解決的課題，在一 基板上時能避免產生靜電。 /、種烊球於模組 本發明人等經銳意研究焊球 為了避免靜電的發生而配置 方之 =:現 ㈣板上時，先前的焊球塔载器乃 々mu樣’以掃耙器將安置 =Γ::Γ桿球上較少發生靜電而有效二 依此方法’如不使料定的”劑來切 的焊球，則會再度附著於罩子。洛 本發明係關於一種臨時固 *明。 讲# 士、+ 4 丁口疋用黏耆劑及黏著層 二屬罩係對應於基板電極形態而形成開口部的 於對準位罩後散佈焊球於該罩子上，而以 ί皮“寺均句散佈’掉落焊球於該開口部並排列焊 二，。之後剝除罩子，以該電極形狀留存焊球。進行此 Ο 。、hb載烊球於該電極上前，供應該黏著劑。 對於2 0 〇娜徑以下的微細形態者，如以上所述既 知的知球塔载法是無效的。另一方面，業列 微小料的直接塔載於基板，經檢討後，、通常'的方法 為將烊球i合载用焊嘗利用屏蔽印刷等手法供應於電 極。卩後，烊球配列用罩子與基板做位置比對，排列焊 =而j濡焊膏臨時固定後，剥除罩子，則焊球之一部 7附著於罩子’基板上容易產生焊球缺損部。此原困 係在於微細形態的場合，在焊膏印刷之際無法避免位 200838378 置偏移，部份斤*
接觸而讓部份致令罩子與焊膏相 本發日月φ -V 焊膏供給方、★慮了這樣的現狀’經銳意研究結果， 不採印刷法，想到了一種簡便而塔載性 :發明:、應法’同時發現了效果優良的黏著劑而達成 文獻2所用 Ο
“紋述及本發明所使用黏著劑與專利 黏著劑之不同。 本發明的黏著劑，其上之焊球熔融而沾佈於電極 ^際’其㈣财妨碍焊膏之㈣性，而域融後之 水/刀洗淨可充分實施，具備以上兩項性能。反之，專 =獻2之黏著^因非屬直接與電極接觸之構成，可 :王不考慮其沾；需性，而在轉寫之際谭膏才直接與法 ，性有關。其次本發明的黏著層屬於水溶性，而且黏 著劑之黏著力在50〜300gf，全然沒有施加交連1 應’因^其洗淨性本質上非常優異。—般所用黏著劑 為了提兩其凝集力而施以交連反應，所以欲其兼具水 溶性通常有困難。為了證明此點，提出了本發明使用 專利文獻2所使用之尿烷系黏著劑時之性能做為未 考例0 ” 4 尿烧系黏著劑經15(TC 1分鐘的加熱交連後，經 至/服下3天的老化後使用。此黏著劑的黏者力決不低 於本發明所用者，但其沾濡性及洗淨性則有遜色，故 8 200838378 不能使用於本用途。 本發明使用者為分子量2。。以上，黏度测沿 I人物黏二力50〜300§f之氧化乙稀-氧化丙稀共 二口，减乙婦—氧化丙婦縮合附加乙二胺， 背聚物中選一水！古* 、 合性阿黏稠液狀物質做為黏著劑。此 入卜二、他黏著劑者為PVA氧化乙烯附加物，峻聚 Ο :二二烯吡咯烷酮一醋酸乙烯共重合樹脂的水溶 :月曰-種，與沸點2，c以上的水溶性液狀物質以 :月曰：液狀物質量比2:1〜1:7之比例混合，黏著 成二:3〇〇釭的水溶性黏著劑。將這些黏著劑預先形 思、球配列用電極部，並臨時固定該焊球。黏 者《的形成法與已知的屏蔽印刷的辉膏供廡法 同，係將該黏著劑稀釋於溶媒中，以過剩狀供應於基 反上利用橡皮掃把均勻耗佈而充填電極部的凹部。 f後在乾燥爐中蒸發溶媒而形成黏著層於凹部中。先 2刷法中焊膏供應上的問題已如前述。本發明的效 祝明如下。纟發明的手法為將黏著劑溶解於溶媒中 而以過剩狀供應於基板上，經掃減乾燥。殘存於基 板上之黏著劑在乾燥後極為微量，即使於焊球排列日^ f罩子接觸在實用上已達於無問題之水準。亦即印刷 /中因位置偏移所造成基板上焊膏之量較多。 【實施方式】 〔本發明之實施形態〕 200838378 本發明所使用黏著劑，雖未經加熱 具有的黏著性，亦應能將易發生靜電的微小，：，f 於模組基板上。又如#著性 _于、固疋 板剝除，如強力剝除，則連同谭球罩一^ 黏著劑的黏著力如在50gf以下， 黏著力如超過师則過強。基板上即使 殘存，剝除罩子時亦可能有障礙 有仏里 兩ί的斑荽士 马此本务明的黏著 3 0 f 必須在常温時（25。〇時保持50〜 =，攻好在70〜 250gf。從氧化乙稀〜氧化丙婦共 承5物，巩化乙—氧化丙縮合附加乙二胺， 烷齊聚物令選出之水溶性高黏稠液狀物質&二= 化乙烯附加物，醚聚合物，乙烯吼咯烷綱—醋酸乙= 物水溶性樹脂與液狀物之甘醇類，甘油類以質 蚩 …· 7之祀圍、此合，依照JIS Ζ 3284附屬 :值之‘者性試驗施行測試時，獲得50〜300gf的良 、使用本發明黏著劑配置在印刷基板電極上的 球，係以噴射法與發泡法塗佈焊膏於印刷基板上 而施以焊接。因此本發明之黏著劑不必別 ”有知接性’但不可阻礙谭接性。普通的黏著帶所使 ==或同屬尿烧系的專利文獻2所記載的必 =以父連的尿烧系黏著劑，會在回流焊接時阻礙焊 ’不此形成良好之焊粒。本發明之黏著劑氧化乙 200838378 :乙氧：丙烯一合物，氧化乙烯-氧化丙烯縮合附 Γ 水溶性尿燒齊聚物，pva氧化乙稀附加 物’：聚合物，乙稀_燒嗣一醋酸乙缔共聚= 甘“員、甘油類，w不致於阻礙後續進程之焊接性， 可完成良好的焊接。 本發明所使用的點著劑，以下列者較為適宜。 1.虱化乙烯-氧化丙烯共聚合物 洋 厂 尔。一瓜75H-90000」（商 業製 品名，高黏稠，分子量15000)等 2.氧化乙烯—氧化丙烯合附加乙二胺 日本7亍力公司製造之「7、口二v夕TR-704」 (商品名’高黏稠’分子量約3〇〇)等 3 ·尿烷齊聚物 根上工業公司製造之「UN-1000」（商品名，高黏 稠，分子量約12000)等 ( 水溶性樹脂與沸點扣〇 t以上㈣物質混合U 著劑之例 4· PVA氧化乙沐附加物 曰本合成化學公司製造之「if _七7 7 Y 7 — LW-100」（商品名，為水溶性樹脂）等 5.醚聚合樹脂 日本觸媒股份有限公司製造之「PX3-EH1000N」 (商品名，為水溶性樹脂）等 200838378 口°° 名， 6·乙烯吡咯烷酮一醋畋己烯共聚合物 ISP科技公司製造之「ρνρ/νΑΙ_53
為水溶性物質）等 A 7·甘醇類（液狀） 聚乙烯甘醇#600(分子量 等 里 6〇〇，沸點約 25〇〇c
;弗點 290°C ) 8·甘油類（液狀） 甘油（分子量90， 〔實施例〕 比較其黏著性 果如表1所示 製：本發明的水溶性黏著劑， 水'合性黏著劑的組成及試驗結 0 200838378 ./mrn^
洗淨性 ! 〇 〇 〇 沾濡性 〇 〇 0 黏著力 e μ 'w, 174 150 § w 綠 m 配合量(％) 〇 CO Ο m 〇 〇 CO 1 〇 cn Ο CO 练 t 水溶性尿烷齊聚物 UN-1000 I PA 氧化乙烯一氧化丙烯共聚合物非離子活性劑 「二1 —水° 一几75H-90000」商品 IPA 氧化乙烯一氧化丙烯縮合附加非離子界面活 性劑 「7°几口二ッ夕TR-704」商品 乙二胺 < Ql 〇ϊ?^ t— Η (N 200838378 CN丨〔I<〕 洗淨性 〇 〇 0 沾濡性 〇 〇 〇 黏著力 e w) 〇 S to 00 W： 躁 配合量(％) VC τ-Η 寸 CN 〇 〇 r〇 寸 ν〇 CN Ο 〇 cn CM 寸 CN 练 PVA氧化乙稀附加物 「]、、—七7了彳7一LW—100」商品 「PEG4000」商品 IPA 醚聚合樹脂 「ΡΧ3-ΕΗ1000Α」商品 「PEG4000」商品 < CL 乙烯吡咯烷酮一醋酸乙烯共聚合物 rPVP/VA卜535」商品 「PEG4000」商品 < CL 寸 m v〇 {\κ A^) 200838378 e丨〔i <〕 洗淨性 X X 沾濡性 X X 1黏著力 Q 258 配合量(％) 练 被覆用膠帶用黏著劑 L-260 用 壓克力系黏著劑 尿烷系焊球固著劑 請填材料名 專利文獻2 〇ν?ϊ r-H CN Jj ； 200838378 水溶性黏著劑製作法如下·· 高黏稠㈣物質單獨’水溶性樹脂與液 合糸任何場合，均以單獨之水或水與酒精，或可溶於 水的溶劑混合溶媒中攪拌溶解而可得溶液。在水容性 尿院齊聚物之例中，水與異丙醇1:卜混合溶媒中加 入水溶性尿烷齊聚物攪拌而得黏著性容、夜。 Γ 依照、JISZ3284附屬書9之步驟，測定所製作之 黏著劑的黏著性。測定裂置採用日本P X力公 3 :夕V今不又」（商品名稱)測試器，而以50X 50 _靭鍊銅板代替滑動玻璃。測定結果如表工。 ，次調查本發明之水溶性黏著劑：否 接。與^Ζ 3284附屬書9之黏著性試料”方: 冋樣，使用50 X 50刪之勒鍊銅之厚度〇2随 =咖孔#金屬罩印刷水純黏著劑。在水溶性㈣ =央安放焊錫組成Sn-3.叫〇 5Cu，直徑〇 3酬之 ::，以贺射法塗佈千住金屬製焊錫膏，有關 ，及烊錫擴散的測定方法，们ISZ 3197.8 3 i = =散：施行。本發明中只有能確認不阻礙沾心 二』疋方法，以擴散率70%以上判定為〇，擴 政率未滿70%判定為X。 ^ 取後.周查本發明水溶性黏著劑對水之洗淨性，與 俊Η 2 3284附屬# 9之黏著性試料調製方法同樣， 使用Μ關勒鍊銅之厚度〇·2關上開直徑6·5_之金 200838378 屬罩印刷水溶性黏著劑。在調製成2CTC的非離子水中 搖動反/貝1分鐘，水溶性黏著劑完全洗淨者判定爲 〇，只要留存一點殘渣者判定為χ。 其次，做為印刷基板上焊球之配置方法，舉出水 >谷性尿烷齊聚物一例。準備一印刷基板，其上塗佈具 有/以電極節距150鯽排列的10000個電極，電極部開 ； 口徑80腳高20煳之焊錫保護膜，在該印刷基板之 f) 面^ °貝佈表1記載之水溶性尿烷齊聚組成物。之後以 橡胗刀片到除印刷基板表面。經觀察在焊錫保護膜表 面上存有成乎不能以肉眼觀察但顯微鏡下可看得見 的若干液滴殘存。電極部充填有液狀黏著劑組成物。 之後將此印刷基板放入150t之乾燥爐乾燥2分鐘後 取出u復# /皿。此基板以實體顯微鐘觀察，雖在sr 表面完全不能觀察到液滴，但電極部充填有黏著物， 對應於該電子部品電極位置作成的厚100,開口徑 G 巾1GQ 之磁S附以不銹鋼罩，及配置於與該印刷基 板^對準位置之印刷基板背面的電磁式磁石，予以作 動而使兩者密著。其次將組成為錫··銀：鋼質量比率 9曰6·5:、3 ··0·5，直徑70 之焊球，以多於孔數之過 二里塔載灰罩子上，以刷子移動，排列該焊球100%於 "亥罩子之開口部。之後切斷該磁石電源，水平引上該 罩子結果，排列的焊球被固定於形成於該電極上的S 者性組成物，而得以100%塔载。罩子背面完全未附 200838378 著忒站著性組成物，反覆了同樣的過程亦未有問題， 確認均可塔載焊球。其次在充滿氮氣環境的回流爐 中，以設定尖峯温度270t，7秒鐘通過的温度曲線， 使該焊球能夠被該電極沾濡而形成焊粒。由是得以確 s忍電極上的黏著性組成物不會組礙焊接沾濡性。 〔發明之效果〕
f
C 由於使用本發明，可使因靜電的發生而焊球塔載 μ不此配置於模組基板上的〇·2隨以下微細焊球，亦 可確實配置於模組基板上。由於使用本發明的黏著 j，不致於因靜電與黏著劑的黏著性而使微細 著於罩子上。 衣附 又本發明的水溶性黏著劑， 外’亦可與水溶性痒以八旧人 ^為黏著劑 十⑦成刀合做為黏著性士曰古 此場合τ後續之喷佈焊膏並不需要。予Τ使 18 200838378 【圖式簡單說明】 無 【主要元件符號說明】 無

Claims (1)

  1. 200838378 十、申請專利範圍： 1·種坏球配置用水溶性黏著劑，其特微 200〇C以上，分早旦L子— ^ ^ 刀子里200以上，黏度5〇〇〇n^· s以 ^ ’黏著力50〜300gf，由氧化乙稀一氧化丙稀共 小口物’氧化乙烯一氧化丙烯縮合附加乙二胺，及 尿烷背聚物中選擇之高黏稠液體物質所構成者。 2·如申請專利範圍第1項之水溶性黏著劑，並中所述
    高黏稠液體物質，為氧化乙烯—氧化丙烯共聚合 物氣化乙烯一氧化丙婦縮合附加乙二胺反應物。 3·如中請專利範圍第1項之水溶性黏著劑，其中所 述咼黏稠液體物質，為水溶性尿烷齊聚物。 4·種焊球配置用水溶性黏著劑，其係由pvA氧化乙 烯附加物，醚聚合樹脂，乙烯吡咯烷酮一醋酸乙烯 共重合樹脂的水溶性犧脂中選擇一種以上，與從甘 醇類、甘油類中選沸點2〇(Tc以上之水溶性液狀物 質以樹脂；液狀物質之質量比2:1〜1 ··7之比例混合 成具有黏著力50〜300gf者。 •如申請專利範圍第4項之水溶性黏著劑，其中所述 水溶性樹脂類為PVA氧化乙烯附加物，醚聚合物， 乙烯吡咯烷酮一醋酸乙烯共聚合物。 6· —種印刷電路基板上之焊球配置方法，其步驟為塗 佈焊球配置用水溶性，黏著劑於電極部以外使用焊 錫保護膜遮罩之印刷基板電極後，對準焊球配置用 罩子的開口部與電極部，而將焊球塔載於印刷基板 20 200838378 之保護膜上，以掃耙器掃耙焊球成印刷基板之電極 同位置與同一形狀，進而配置焊球於印刷基板之電 200838378 七、指定代表圖： (一） 本案指定代表圖為：第（ ）圖。 (二） 本代表圖之元件符號簡單說明： 無 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式：
TW097107838A 2007-03-15 2008-03-06 Water soluble pressure sensitive adhesive for fine solder ball replacement and alignment of fine solder ball on a printed board TW200838378A (en)

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