TW200808933A - Pressure sensitive adhesive layer for cleaning, process for producing the same, cleaning sheet, delivery member with cleaning function, and method of cleaning off foreign matter - Google Patents

Pressure sensitive adhesive layer for cleaning, process for producing the same, cleaning sheet, delivery member with cleaning function, and method of cleaning off foreign matter Download PDF

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Publication number
TW200808933A
TW200808933A TW096113841A TW96113841A TW200808933A TW 200808933 A TW200808933 A TW 200808933A TW 096113841 A TW096113841 A TW 096113841A TW 96113841 A TW96113841 A TW 96113841A TW 200808933 A TW200808933 A TW 200808933A
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Taiwan
Prior art keywords
cleaning
adhesive layer
adhesive
layer
foreign matter
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TW096113841A
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Chinese (zh)
Inventor
Akihisa Murata
Takayuki Yamamoto
Mitsuhiro Kanada
Kaori Mizutani
Hironori Yasuda
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Nitto Denko Corp
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Publication date
Priority claimed from JP2006115919A external-priority patent/JP2007283263A/en
Priority claimed from JP2006115913A external-priority patent/JP4868925B2/en
Priority claimed from JP2006190696A external-priority patent/JP4970862B2/en
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200808933A publication Critical patent/TW200808933A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00Crosslinking
    • C08L2312/06Crosslinking by radiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cleaning In General (AREA)

Abstract

A pressure sensitive adhesive layer for cleaning that excels in both of the capabilities of delivery within substrate treating apparatus and removal of foreign matter adhering in the apparatus and thus is suitable for use in a cleaning sheet; a process for producing the same; a cleaning sheet; a delivery member with cleaning function; and a method of cleaning off foreign matter. There is provided a pressure sensitive adhesive layer for cleaning having a planar surface and used to remove any foreign matter from a treatment object, the layer consisting of a product of hardening of a radiating hardening or thermosetting acrylic pressure sensitive adhesive containing an acrylic polymer, characterized in that the surface of the pressure sensitive adhesive layer has discontinuous open depressions, and that the average diameter of openings is smaller than the average size of foreign matter.

Description

200808933 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種使用表面具有 細 、’特疋非連績性凹部之清 >糸用黏者劑層的異物清潔方法。 ^ ^ ^ 又,關於一種表面具有特 疋非連續性凹部之清潔用黏著 百蜊增及其製造方法,進而關 於一種具有上述清潔用黏著劑層 ^ ^ /月缄片,進而關於一種 使用 潔片之具清潔功能之搬送 、傅1干,進而關於一種使用 “荨的基板處理裝置之清潔方法。 立本發明之異物清潔方法可用於各種用途,由表面具有凹 部之上述黏著劑層構成之清潔層可控制其表面黏著性及異 物捕集性,因此呈髀而士& m#好地適用於各種基板處理裝 置之清潔。例如,本發明之異物清潔方法可用於清潔半導 =、平板顯示器、印刷基板等之製造裝置或檢查裝置等忌 異物之基板處理裝置。 太 本發明之清潔片(清潔用黏著 )可用於各種用途’表面具有凹部之上述黏著劑層可控 、、表面4著丨生及異物捕集性,因此可用作雖未附著於各 種基板衣置本身,但具有異物捕集性之清潔各種基板處理 衣置的/ “兔片。例如’本發明之清潔片可用作半導體、平 板顯不為、印刷基板等之製造裝置或檢查裝置等忌異物之 基板處理裝置的清潔片等。 【先前技術】 半導,、平板顯示器、印刷基板等之製造裝置或各種基 置 面使各搬送系統與基板進行物理性接觸, 面進仃搬达。此時,若異物附著於基板或搬送系統,則 120368.doc 200808933 會接連污染後續基板。因此,必續a ▲ 以除去異物之清洗處理。因此止裝置’進行用 *勞動力之問題…清洗時二轉:下降:需要大 有異物附著於其他部位之問題目此有¥亦產生 藉由搬送固著有黏著狀物之基板, 有 處理裝置内之異物的方法(專利文 寸者於基板 ...^奸 獻1},或者藉由搬送板狀 構件’而除去附者於基板背面之異物的方法(專利文獻2)。200808933 IX. OBJECTS OF THE INVENTION: 1. Field of the Invention The present invention relates to a foreign matter cleaning method using an adhesive layer having a fine, 'unconventional non-conformal concave portion on the surface. ^ ^ ^ Further, regarding a cleaning adhesive sheet having a special discontinuous concave surface and a manufacturing method thereof, and further relates to a cleaning adhesive layer having the above-mentioned cleaning adhesive layer, and further relates to a cleaning sheet The cleaning function of the cleaning function, the dry cleaning, and the cleaning method using the substrate processing device of the crucible. The foreign matter cleaning method of the present invention can be used for various purposes, and the cleaning layer is composed of the above-mentioned adhesive layer having a concave portion on the surface. The surface adhesion and the foreign matter trapping property can be controlled, so that the 髀士士&m# is well suited for the cleaning of various substrate processing apparatuses. For example, the foreign matter cleaning method of the present invention can be used for cleaning semi-conducting =, flat panel display, A substrate processing apparatus that avoids foreign matter such as a manufacturing apparatus or an inspection apparatus such as a printed board. The cleaning sheet of the present invention (adhesive for cleaning) can be used for various purposes. The above-mentioned adhesive layer having a concave portion on the surface is controllable, and the surface 4 is abrupt. And foreign matter trapping property, so it can be used as a cleaning substrate which is not attached to various substrate clothing itself but has foreign matter trapping properties. Garment facing / "Rabbit sheet. For example, the cleaning sheet of the present invention can be used as a cleaning sheet for a substrate processing apparatus which avoids foreign matter such as a semiconductor or a flat panel, a manufacturing apparatus such as a printed board, or an inspection apparatus. [Prior Art] A manufacturing apparatus such as a semi-conductor, a flat panel display, a printed circuit board, or the like, and various substrate surfaces physically contact each of the transport systems and the substrate, and the surface is moved. At this time, if foreign matter adheres to the substrate or the transport system, 120368.doc 200808933 will successively contaminate the subsequent substrate. Therefore, a ▲ must be continued to remove the foreign matter. Therefore, the device is used for the problem of 'workforce'. The second turn of the cleaning: the lowering: the problem that the foreign matter is attached to other parts, and there is a problem that the substrate is fixed by the transfer, and the substrate is fixed by the processing device. A method of removing foreign matter attached to the back surface of the substrate by a method of transferring a foreign material to a substrate (patent document 1) or a method of transporting a plate-shaped member (Patent Document 2).

揭不於專利文獻丨之方法係克服上述課題之有效方法。 然而’該方法中,有黏著性物質與裝置接觸部過於強烈接 著而造成無法卿之虞,且有無法確實地搬送基板,或者 ,壞搬送裝置之虞。又,亦產生附著於基板搬送裝置之黏 著性物質污染基板之虞。 ,又’揭示於專利文獻2之方法,可無任何問題地進行搬 送’但存在首要之除塵性差之問題。χ,固著該等黏著性 物質之基板’通常在使用之前,將其黏著性物質表面以通 常塗佈有矽氧烷等脫模劑之剝離膜加以保護。然而,該方 法中,存在脫模劑成分轉移至清潔層表面,進而該轉移脫 模劑成分污染搬送裝置之基板接觸部的問題。 又’提出有於黏著劑層之表面設置有編織物等多孔清潔 層之清潔膠帶(專利文獻3),以及將多孔質之非黏著性層作 為清潔層之清潔片(專利文獻4、專利文獻5)。然而,該等 清潔片雖在某種程度上滿足基板處理裝置内之搬送性、及 附著於裝置内之異物除去性,但並非充分滿足。又,提出 有將清潔層之抗張彈性模數規定為0.98〜4900 N/mm2 120368.doc 200808933 (〇·98〜4900 MPa)(專利文獻6) ’若抗張彈性模數下降,則 存在產生搬送不良之傾向,另一方面,若抗張彈性模數上 升,則存在捕集異物之能力下降之傾向。 專利文獻1 ·日本專利特開平10_154686號公報 專利文獻2 :日本專利特開平11-87458號公報 專利文獻3:曰本專利特開平11-232621號公報 專利文獻4:日本專利特開2〇〇2_329699號公報 專利文獻5 :曰本專利特開2〇〇3_115521號公報 ⑩ 專利文獻6 :曰本專利特開2001-198075號公報 【發明内容】 發明所欲解決之問題 鑒於上述實情,本發明之目的在於提供一種清潔用黏著 劑層及其製造方法,該清潔用黏著劑層於基板處理裝置内 之搬送性及附著於裝置内之異物除去性兩方面優異,且適 用於清潔片。 _ 又,本發明之目的在於提供一種使用上述清潔用黏著劑 層之/月漂片,使用上述清潔片之具清潔功能之搬送構件, 進而提供一種使用該等的基板處理裝置之清潔方法。 ‘ 解決問題之技術手段 ‘ 本發明者等人為達成上述目的而積極研究,結果發現藉 由以下所示之清潔用黏著劑層(清潔層)及其製造方法、清 /累片(α 用黏著片)、具清潔功能之搬送構件及異物清潔 方法,不會產生上述搬送性問題,進而可簡單且確實地剝 離除去異物,從而完成本發明。 120368.doc 200808933 即,本發明係一種清潔用黏著劑層,其特徵在於:其係 由含有丙稀酸系聚合物之放射線硬化性或熱硬化性丙稀酸 系黏著劑之硬化物形成,且具有平面狀之表面,用以將異 物自處理對象體除去者’該黏著劑層之表面具有非連續性 開口部之凹部,且,開口部之平均開口徑小於平均異物尺 寸。 於上述黏著劑層中’較好的是上述異物包含異物尺寸為 10 μιη以下者。 於上述黏著劑層中,較好的是上述開口部之平均開口徑 小於異物尺寸為10 μιη以下之異物的平均異物尺寸。 於上述黏著劑層中,較好的是上述非連續性凹部之投影 面積相對於上述黏著劑層表面之總投影面積的比例為 3 % 〜8 0 % 〇 於上述黏著劑層中,較好的是上 J疋上連黏者劑層表面(凹部 以外)之彈性模數為10 MPa以上。 於上述黏著劑層中,較好的杲 开旳疋上述凹部之深度(h)相對 於上述黏㈣層之厚度(H)的比(h/H)狀Q ^ .9。 於上述黏著劑層中,較好的县 杈好的疋上述凹部之開口部大致為 圓形,其平均開口徑為(U〜3 j μΠ1上述開口徑之標準偏差 為〇·7 μιη以下,上述開口部之合 <刀佈係與相鄰開口部之中心 距離之標準偏差為 1 μιη以下。 於上述黏著劑層中,較好 疋上$非連續性凹部之投影 面積相對於上述黏著劑層表 ’、 15〜80%。 “又衫面積的比例為 120368.doc 200808933 於上㈣Μ層中’較好的是上述凹部之深度(h)相對 於上述黏著劑層之厚度(H)的比(h/H)為〇 〇ι〜〇.】。 ;上述黏著^層中,較好的是上述凹部以外之平面狀表 面之中心線平均粗度(Ra)為〇〇1〜〇3μιη。 於上述黏著劑層中,較好的是上述非連續性凹部之投影 面積相對於上述獻荽南I Μ圭y ^ 片!層表面之總投影面積的比例為 3%〜800/〇〇· " 於上述黏著劑層中’較好的是上述凹部之開口部大致為 攀圓形’其平均開口徑為〇Μ㈣。 於上述黏著劑層中,較好的是上述凹部之深度(h)相對 於上述黏著劑層之厚度(H)的比(應)為G G ^.9。 *於上述黏著劑層中’較好的是上述黏著劑層之抗張彈性 模數為 0.98 MPa〜500 MPa。 於上述黏著劑層中,較好的是放射線硬化性或熱硬化性 丙烯酸系黏著劑含有丙稀酸系聚合物及聚合性不飽和化合 物0 於本發明之清潔片中,較好的是上述清潔用黏著劑層以 其非連續性凹部成為表面之方式,設置於支持體之至少單 面上作為清潔層。 於本發明之清潔片中,較好的是上述清潔用黏著劑層以 其非連續性凹部成為表面之方式,設置於支持體之單面上 作為清潔層,於另一面上具有固定用黏著劑層。 於本發明之具清潔功能之搬送構件中,較好的是上述清 潔片經由固定用黏著劑層而設置於搬送構件。 120368.doc 200808933 本發明之清潔用黏著劑層之製造方法係上述清潔用黏著 劑層之製造方法,較好的是包括:步驟⑴,藉由將黏著劑 組合物溶液塗佈於基材上’進行乾燥,而形成黏著劑組合 物層’上述黏著劑組合物溶液係將於含有丙烯酸系聚合物 之放射線硬化性或熱硬化性丙稀酸系黏著劑中,進而雜 二上述丙烯酸系聚合物不相容之化合物的黏著劑組合物, 洛解於包含溶解上述丙稀㈣聚合物之溶劑(A)及使上述 丙浠酸系聚合物與上述不相容化合物二者相容之相容溶劑 (B)的混合溶劑中而#本•止 ,v驟(2),對上述黏著劑組合物 曰’進行放射線照射或加熱,使上述丙烯酸系黏著劑硬 匕’亚且形成黏著劑層前驅物’該黏著劑層前驅物且 硬化物,上述不相容化合物之相分離結構;以及步驟(3)了 所獲仵之黏著劑層前驅物中除去不相容化合物。 於本《明之清潔用黏著劑層之製造方法中,較好 上述丙烯酸系聚合物與上述不相容化合物二者相容之相容 =⑻,其相容性參數尤參數,相對於丙稀酸系聚合物為 •,相對於不相容化合物為 0·5〜3。 :本:明之清潔用黏著劑層之製造方法中,較好的是上 且、、弗:::匕合物相對於丙烯酸系聚合物之χ參數為7以上, 且沸點為19〇。〇以上。 於本發明之清潔用黏著劑層之製造 述黏著劑組合物溶液a 早又好的疋上 不存在之狀綠下:句狀態’但為了於相容溶劑⑻ (B) 0 " 生相分離而選擇溶劑(A)及相容溶劑 120368.doc -11- 200808933 於本發明之清潔用黏著劑層之製造方法中,較好的是上 述相容溶劑(B)為醇系溶劑。The method disclosed in the patent document is an effective method for overcoming the above problems. However, in this method, the contact portion between the adhesive substance and the device is too strongly connected to cause a problem, and the substrate cannot be reliably conveyed or the transfer device is defective. Further, the adhesive substance adhering to the substrate transfer device contaminates the substrate. Further, the method disclosed in Patent Document 2 can be carried out without any problem, but there is a problem that the primary dust removal property is poor. χ, the substrate to which the adhesive substances are fixed is usually protected by a release film which is usually coated with a release agent such as a decane, before the use. However, in this method, there is a problem that the release agent component is transferred to the surface of the cleaning layer, and the transfer agent component contaminates the substrate contact portion of the transfer device. Further, a cleaning tape having a porous cleaning layer such as a woven fabric on the surface of the adhesive layer is proposed (Patent Document 3), and a cleaning sheet in which a porous non-adhesive layer is used as a cleaning layer (Patent Document 4, Patent Document 5) ). However, these cleaning sheets satisfy the conveyance property in the substrate processing apparatus and the foreign matter removal property adhering to the apparatus to some extent, but are not sufficiently satisfied. Further, it is proposed that the tensile modulus of the cleaning layer is set to 0.98 to 4900 N/mm 2 120368.doc 200808933 (〇·98 to 4900 MPa) (Patent Document 6) 'If the tensile modulus decreases, there is a generation On the other hand, if the tensile modulus increases, the ability to trap foreign matter tends to decrease. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei No. Hei 11-87458 (Patent Document No. Hei. No. Hei. No. Hei. Patent Document 5: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. 2001-198075. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In view of the above facts, the object of the present invention The present invention provides a cleaning adhesive layer which is excellent in both the transportability in the substrate processing apparatus and the foreign matter removal property adhering to the apparatus, and is suitable for use in a cleaning sheet. Further, it is an object of the present invention to provide a cleaning member using the above-described cleaning adhesive layer, a cleaning member using the cleaning sheet, and a cleaning method using the substrate processing apparatus. The present inventors have actively studied the above-mentioned objects, and as a result, found a cleaning adhesive layer (cleaning layer) and a method for producing the same, and a cleaning/decomposing sheet (adhesive sheet for α) The conveying member having the cleaning function and the foreign matter cleaning method do not cause the above-described conveyance problem, and the foreign matter can be easily and reliably removed and removed, thereby completing the present invention. 120368.doc 200808933 The present invention relates to a cleaning adhesive layer which is formed of a cured product of a radiation curable or thermosetting acrylic adhesive containing an acrylic polymer, and The surface having a flat surface for removing foreign matter from the object to be processed has a concave portion having a discontinuous opening on the surface of the adhesive layer, and the average opening diameter of the opening is smaller than the average foreign matter size. In the above adhesive layer, it is preferable that the foreign matter contains a foreign matter having a size of 10 μm or less. In the above adhesive layer, it is preferred that the average opening diameter of the opening portion is smaller than the average foreign matter size of the foreign matter having a foreign matter size of 10 μm or less. Preferably, in the adhesive layer, the ratio of the projected area of the discontinuous concave portion to the total projected area of the surface of the adhesive layer is 3% to 80% 〇 in the adhesive layer, preferably It is the elastic modulus of the surface of the upper adhesive layer (outside the concave portion) of the upper J 为 is 10 MPa or more. In the above adhesive layer, a ratio (h/H) of the depth (h) of the concave portion to the thickness (H) of the above-mentioned viscous (four) layer is preferably ^. In the above-mentioned adhesive layer, the opening of the concave portion is preferably circular, and the average opening diameter is (U~3 j μΠ1, and the standard deviation of the opening diameter is 〇·7 μηη or less, The opening of the opening portion <the standard deviation of the center distance between the knife cloth and the adjacent opening portion is 1 μm or less. In the above adhesive layer, it is preferable that the projected area of the discontinuous concave portion is relative to the above adhesive layer Table ', 15~80%. "The ratio of the area of the shirt is 120368.doc 200808933. In the upper (four) layer, the ratio of the depth (h) of the above recess to the thickness (H) of the above adhesive layer is preferred. h/H) is 〇〇ι~〇.]. In the above-mentioned adhesive layer, it is preferred that the center line average roughness (Ra) of the planar surface other than the above-mentioned concave portion is 〇〇1 to 〇3 μιη. In the adhesive layer, it is preferred that the ratio of the projected area of the discontinuous concave portion to the total projected area of the surface of the layer of the above-mentioned 荽 荽 y y ! 为 为 为 为 为 为 为 为 为 于 于 于 于In the above adhesive layer, it is preferable that the opening portion of the concave portion is substantially rounded. The average opening diameter is 〇Μ (4). In the above adhesive layer, it is preferred that the ratio (h) of the depth (h) of the concave portion to the thickness (H) of the adhesive layer is GG ^.9. In the above adhesive layer, it is preferred that the above-mentioned adhesive layer has a tensile modulus of elasticity of from 0.98 MPa to 500 MPa. Among the above adhesive layers, a radiation curable or thermosetting acrylic adhesive is preferably contained. The acrylic polymer and the polymerizable unsaturated compound 0 In the cleaning sheet of the present invention, it is preferred that the cleaning adhesive layer is provided on at least one side of the support so that the discontinuous concave portion becomes a surface. In the cleaning sheet of the present invention, it is preferred that the cleaning adhesive layer is provided on the one surface of the support as a cleaning layer on the other side in such a manner that the discontinuous concave portion becomes a surface. In the conveying member having the cleaning function of the present invention, it is preferable that the cleaning sheet is provided on the conveying member via the fixing adhesive layer. 120368.doc 200808933 The cleaning adhesive of the present invention The manufacturing method is the method for producing the above-mentioned cleaning adhesive layer, preferably comprising the step (1) of forming an adhesive composition layer by applying a solution of the adhesive composition onto a substrate. The adhesive composition solution is an adhesive composition of a compound containing a radiation-curable or thermosetting acrylic acid-based adhesive containing an acrylic polymer, and further containing the above-mentioned acrylic polymer-incompatible compound, In a mixed solvent comprising a solvent (A) which dissolves the above-mentioned propylene (tetra) polymer and a compatible solvent (B) which is compatible with both the above-mentioned propionic acid-based polymer and the above-mentioned incompatible compound, v (2), irradiating or heating the adhesive composition 曰' to cause the acrylic adhesive to harden and form an adhesive layer precursor 'the adhesive layer precursor and hardened, the above A phase separation structure of the compatible compound; and a step (3) of removing the incompatible compound from the obtained binder layer precursor. In the method for producing the cleaning adhesive layer of the present invention, it is preferred that the above acrylic polymer is compatible with the above incompatible compound = (8), and the compatibility parameter is particularly high, relative to the acrylic acid. The polymer is •, and is 0.5 to 3 relative to the incompatible compound. In the method for producing a cleaning adhesive layer, it is preferred that the ruthenium::: ruthenium compound has a ruthenium parameter of 7 or more with respect to the acrylic polymer, and has a boiling point of 19 Å. 〇 Above. In the manufacture of the adhesive layer of the present invention, the adhesive composition solution a is as good as the green on the sputum: the sentence state 'but for the compatible solvent (8) (B) 0 " phase separation The solvent (A) and the compatible solvent are selected. 120368.doc -11-200808933 In the method for producing a cleaning adhesive layer of the present invention, it is preferred that the compatible solvent (B) is an alcohol solvent.

本發明之清潔用黏著劑層之製造方法係上述清潔用黏著 劑層之製造方法,較好的是包括:步驟(1),將於放射線硬 化性或熱硬化性丙烯酸系黏著劑中,進而調配與上述丙烯 酸系黏著劑不相容之化合物的黏著劑組合物,塗佈於基材 上,形成黏著劑組合物層;步驟(2),以具有中心線平均粗 度(Ra)為〇·〇ι〜〇·3 μιΠ2表面的覆蓋膜,以覆蓋膜之具有上 述中心線平均粗度(Ra)之表面成為上述黏著劑組合物層之 表面側的方式,覆盍上述黏著劑組合物層表面,於該狀態 下,進打放射線照射或加熱,使上述丙烯酸系黏著劑硬 化並且形成黏著劑層前驅物,該黏著劑層前驅物具有其 硬化物與上述不相容化合物之相分離結構;以及步驟(3 ), 自所獲得之黏著劑層前驅物中除去不相容化合物。 於本發明之清潔用黏著劑層之製造方法中,較好的是於 上述步驟⑴中’作為黏著劑組合物,將調配可溶解黏著劑 組合物之有機溶劑的黏著劑組合物溶液塗佈於基板上,進 而進行乾燥,藉此形成黏著劑組合物層。 、、於本發明之清潔用黏著劑層之製造方法中,較好 :步驟(3)藉由加熱,自黏著劑層前驅物中除去不相容:合 於本發明之清潔用黏著劑 述步驟(3)藉由溶劑萃取,自 化合物。 層之製造方法中,較好的是上 黏著劑層前驅物中除去不相容 120368.doc 12- 200808933 於本發明之清潔用黏著劑層 述溶劑萃取所用之溶劑為液化 之 氣化碳。 之製造方法中,較好的是上 二氧化碳或處於超臨界狀態 、於本發明之清潔用黏著劑層之製造方法中,較好的是上 述v驟(2)中’於以覆盍膜覆蓋黏著劑組合物層表面之狀離 下進行放射線照射或加熱。 # 於=發明之異物清潔方法中,較好的是將包含上述清潔The method for producing a cleaning adhesive layer of the present invention is the method for producing the above-mentioned cleaning adhesive layer, preferably comprising the step (1) of preparing a radiation curable or thermosetting acrylic adhesive. An adhesive composition of a compound which is incompatible with the above acrylic adhesive is applied to a substrate to form an adhesive composition layer; and step (2) has a center line average roughness (Ra) of 〇·〇 a cover film of the surface of the adhesive composition layer covering the surface of the adhesive composition layer in such a manner that the surface of the film having the average thickness (Ra) of the center line of the cover film is on the surface side of the adhesive composition layer In this state, the acrylic adhesive is hardened and the adhesive layer precursor is formed by radiation irradiation or heating, and the adhesive layer precursor has a phase separation structure of the cured product and the incompatible compound; and a step (3) removing incompatible compounds from the obtained adhesive layer precursor. In the method for producing a cleaning adhesive layer of the present invention, it is preferred that in the above step (1), as an adhesive composition, an adhesive composition solution in which an organic solvent capable of dissolving the adhesive composition is applied is applied. The substrate is further dried to form an adhesive composition layer. Preferably, in the method for producing the cleaning adhesive layer of the present invention, the step (3) removes the incompatibility from the adhesive layer precursor by heating: the cleaning adhesive step of the present invention is described. (3) From the compound by solvent extraction. In the method of producing the layer, it is preferred to remove the incompatible material in the precursor of the upper adhesive layer. 120368.doc 12-200808933 The solvent for solvent extraction in the cleaning adhesive layer of the present invention is liquefied vaporized carbon. In the production method, it is preferred that the carbon dioxide or the supercritical state is used in the method for producing the cleaning adhesive layer of the present invention, and it is preferred that the above-mentioned v (2) is covered with a coating film. The surface of the composition layer is irradiated or heated by radiation. #于=Invented foreign matter cleaning method, it is better to include the above cleaning

用黏者劑層之清潔層,應用於附著有異物之處理對象體, 自處理對象體除去異物。 於本發明之異物清潔方法中,較好的是使用上述清潔 片。 厶、 較好的是使用上述具清潔 於本發明之異物清潔方法中 功能之搬送構件。 ^本發明之異物清潔方法中’其係上述清潔方法,較好 的疋將上述清潔片、或上述具清潔功能之搬送構件,搬送 至基板處理裝置内。 發明之效果 上述本發明之用於除去異物的清潔用黏著劑層(清潔 y )其表面具有非連續性開口部之凹部,因此其接著力 表面不八有凹部之平滑結才籌的黏$劑層之接著著力相比 較低。該黏著劑層藉由將其黏著力設為實質上以凹部使其 :低之設計,而不會產生搬送問題’另一方面,以具有凹 部之,潔㈣著劑層(清潔層)捕集各種尺寸之異物,無需 使之洛下’即可確實地除去。即,該黏著劑層具有微細之 120368.doc • 13 - 200808933 凹苦P , , '^所 L Jr K貝上表面較為平坦,因此與異物之接觸極為 緊岔,又,異物之全部或其一部分進入凹部,藉此發揮可 確實地捕集異物之效果。該黏著劑層可藉由其表面之凹部 大小、比例設計,而控制表面黏著性,及對各種尺寸之異 物的異物捕集性。 Μ 尤其疋,本發明之清潔用黏著劑層係以上述開口部之平 均開口住(以下,所謂平均開口徑係指與平均直徑相同之 含義。)小於平均異物尺寸之方式設計,可有效捕集,自 處理對象體除去異物。尤其是,本發明之清潔用黏著劑層 於將附者有異物尺寸為1〇㈣以下之微小異物者作為處置 對象體之t月形時有效,將清潔層凹部之開口部之平均開口 么彡又為小於異物尺寸兔〗〇 、> 八初κ寸為10 μπι以下之異物的平均異物尺 寸,藉此即使對微小異物, 除去異物。 ”有效捕集’自處理對象體 又:上述本發明之清潔用黏著劑層,其上述凹部之平均 開口徑微細,為〇· 1〜3 " 、Λ 、 ’亚且開口徑之標準偏差為0,7 μηι以下’開口徑無不均, 口此不存在由黏著劑層表面之 地點不同而引起之特性兀 、, 起特性不均’可發揮上述效果,故較佳。 並且,將黏著劑層表面 y曰表面之凹部之開口 使其與相鄰開口部中 以 於該方面亦發揮上述效果,故較佳。 _以下 進而,上述本發明之清“& 之平面狀表面之中心線…以層丨上述凹部以外 um,里物插隹μ* =通度(Ra)被控制為0.01〜0.3 μϊΆ異物捕集性及搬送性良好。 120368.doc -14. 200808933 根據具有該清潔用黏著劑層作為清潔層 用黏著片),又,使用該清潔片之具清潔功能=: 件’清潔層之黏著性實質上大幅度低於具有平滑面之黏著 劑層’另—方面,以哗級觀察之情形時,凹部内部之黏 著性本身與具有平滑面之黏著劑相同,因此搬送清潔片或 下述搬送構件時,可於未與裝置接觸部強烈接著之狀態下 確實地搬送基板處理裝置内,並且捕集附著於裝置内之 μιη級微細異物,無需使之落下,即可簡單且確實地除 去。 該清潔用黏著劑層由放射線硬化性或熱硬化性丙稀酸系 黏著劑形成’作為其製法,例如可藉由實施上述步驟⑴至 (3)而進行。再者’作為於叫級之微細表面形成凹凸結構 ,之方法’可列舉:轉印法、相分離現象之利用、喷墨技 術、雷射加工等。例如,作為利用相分離現象形成凹凸結 構之方法,於日本專利特開細3·26832號公報巾揭示有以 下方法:作為防眩性硬塗臈用,蒸發混合溶劑,利用硬化 性透明樹脂與殘留溶劑間之相分離及剝離現象,於基材上 形成包含硬化性透明樹脂之硬化物的點狀物作為硬塗層. 或者於日本專利特開·3·277534號公報中揭*有方法: 〜為^置修正膠▼用’蒸發混合溶劑’利用黏著劑之不良 ^與黏者劑間之相分離及剝離現象,於基材上形成黏著 劑之點狀物;Χ,於日本專利特開2_-151642號公報中 揭:有_層之形成方法,其特徵在於:於透明基材上, 以贺墨方式射出含有形成微細凹凸結構之防眩性賦予組人 120368.doc -15- 200808933 物的墨水液滴,於該基材表 . 上开7成具有微細凹凸結構之 ill然而’藉由該等方法而獲得之結構均為突起狀, 該等方法亦並未形成黏著劑層。該 田 开〆成犬起狀結構’因此接著力大幅度下降’即使 2黏著劑層之形成,亦無法確保異物捕集性。又,該等 句難以大面積實施。 本發明之異物清潔方法將上述清潔用黏著劑層用作清潔 ^以上迷開口部之平均開口則、於平均異物尺寸之方式 體除去異物。 ”有效捕集’自處理對象 【實施方式】 、下關於本發明之清潔用黏著劑層(清潔層)及其製造 方法、清潔片(清㈣黏著片)、具清潔功能之搬送構件及 異物清潔方法,詳細說明實施形態。 對本發明之清潔用黏著劑層(清潔層),一面參照圖式, :面加以說明。圖i係本發明之清潔用黏著劑層之立體 二=剖面圖。如圖1、圖2所示,本發明之清潔用黏 潔層)卜其表面8呈平面狀,該表面8上具有非 =生凹部a。所謂表面8呈平面狀,係表示清潔用黏著劑 ^泳層之厚度⑻大致相等(最大厚度與最小厚度之差 為±10%左右)。 (1)清潔層(平均開口徑:10 μηι以下) 本發明之清潔用黏著劑層(清潔層之表面s中的凹部& 之比例(存在比率),較好的是凹部a之投影面積相對於表面 120368.doc • 16 - 200808933 s之總投影面積的比例為3%〜8〇%。上述比例較 5。/〇〜观’更好的是10%〜5〇%,更好的是1〇%〜4〇%。、: 者,所謂上述投影面積,係指以顯微鏡自表面觀察清 黏著劑層(清潔層)!之凹部3的情形時,觀察作為凹部 位的面積比率。於凹部a之投影面積過小之情形時,存: 實質上黏著劑層之接著力未下降,無法充分表現出於用作 清潔層之情料㈣望之基錢送 於一影面積過大之情形時,存在清潔二: (清潔層)之接著力顯著下降,無法獲得所期望之異物捕集 f生的ί月幵/ X,存在清潔用黏著劑層(清潔層)表面之耐摩 擦性過低’凹部之結構遭到破壞,而於搬送時逆污染基板 的情形。 、土 又,凹部a之開口部形狀並無特別限制,如所示,就 易於控制接著力之方面、及易於形成之方面而言,較好的 是略圓形。所謂略圓形’係指圓、或長軸長度不超過短軸 長度之2倍的橢圓狀之形狀。其中,即使為蜂巢形狀或四 角形狀,亦無任何問題。 又,上述凹部a之開口部,根據附著於處理對象體之異The cleaning layer of the adhesive layer is applied to the processing target body to which the foreign matter adheres, and the foreign matter is removed from the processing target body. In the foreign matter cleaning method of the present invention, it is preferred to use the above cleaning sheet. Preferably, the above-described conveying member having the function of cleaning the foreign matter cleaning method of the present invention is used. In the above-described cleaning method of the foreign matter cleaning method of the present invention, it is preferable that the cleaning sheet or the conveying member having the cleaning function is conveyed into the substrate processing apparatus. Advantageous Effects of Invention The cleaning adhesive layer (cleaning y) for removing foreign matter of the present invention has a concave portion having a discontinuous opening on the surface thereof, and therefore the adhesive surface of the adhesive surface is not smooth. The next layer of the layer is relatively low. The adhesive layer is formed by substantially setting the adhesive force to a concave portion to a low design without causing a transport problem. On the other hand, the adhesive layer (cleaning layer) is trapped with a concave portion. Foreign matter of various sizes can be reliably removed without having to let it go. That is, the adhesive layer has a fine 120368.doc • 13 - 200808933 concave bitter P, and the surface of the 'J J K shell is relatively flat, so the contact with the foreign matter is extremely close, and all or part of the foreign matter By entering the concave portion, the effect of reliably collecting the foreign matter is exhibited. The adhesive layer can be designed to control surface adhesion and foreign matter trapping of foreign materials of various sizes by the size and proportion of the concave portion of the surface. In particular, the cleaning adhesive layer of the present invention is designed such that the opening of the opening portion (hereinafter, the average opening diameter means the same as the average diameter) is smaller than the average foreign matter size, and can be effectively trapped. Remove foreign matter from the object to be treated. In particular, the cleaning adhesive layer of the present invention is effective when a small foreign matter having a foreign matter size of 1 〇 or less is used as the t-shaped shape of the object to be treated, and the average opening of the opening of the concave portion of the cleaning layer is 彡In addition, it is smaller than the foreign matter size, and the average foreign matter size of the foreign matter of 10 μπι or less is used to remove foreign matter even for small foreign matter. "Effectively collecting" self-processing object: In the cleaning adhesive layer of the present invention, the average opening diameter of the concave portion is fine, and the standard deviation of the opening diameter is 〇·1~3 ", Λ, ' 0,7 μηι or less 'there is no unevenness in the opening diameter, and the mouth does not have the characteristic 兀 caused by the difference in the surface of the adhesive layer, and the unevenness of the characteristics can exert the above effects, so it is preferable. It is preferable that the opening of the concave portion on the surface of the layer surface and the adjacent opening portion exerts the above-described effects in this respect. Further, the center line of the planar surface of the above-mentioned clear "& In addition to the above-mentioned recesses of the layer um, the 隹μ* = the degree of flux (Ra) is controlled to be 0.01 to 0.3 μm, and the foreign matter collecting property and the transport property are good. 120368.doc -14. 200808933 According to the adhesive layer having the cleaning adhesive layer as a cleaning layer), and further, the cleaning function of the cleaning sheet is used: the adhesiveness of the cleaning layer is substantially lower than that of the smoothing layer. In the case of the adhesive layer on the surface, the adhesion inside the concave portion is the same as that of the adhesive having a smooth surface. Therefore, when the cleaning sheet or the following conveying member is conveyed, it is not in contact with the device. The portion is reliably conveyed in the substrate processing apparatus in a strong state, and the fine foreign matter adhered to the inside of the apparatus is collected, and can be easily and surely removed without dropping it. The cleaning adhesive layer is formed of a radiation curable or thermosetting acrylic adhesive as a method for producing the same, and can be carried out, for example, by carrying out the above steps (1) to (3). Further, the method of forming the uneven structure on the fine surface of the grade is exemplified by a transfer method, a use of a phase separation phenomenon, an ink jet technique, and a laser processing. For example, as a method of forming a concavo-convex structure by a phase separation phenomenon, Japanese Laid-Open Patent Publication No. Hei. No. 3,26832 discloses a method of evaporating a mixed solvent as an anti-glare hard coating, and using a curable transparent resin and a residue. A phase separation and a peeling phenomenon between the solvents are formed on the substrate to form a hardened material containing a hardened transparent resin as a hard coat layer. Alternatively, it is disclosed in Japanese Patent Laid-Open No. Hei. No. 3,277,534. For the correction glue ▼, the 'evaporation mixed solvent' is used to form the adhesive on the substrate by using the phase difference and peeling phenomenon between the adhesive and the adhesive; Χ, in Japanese Patent Special 2_ JP-A-151642 discloses a method for forming a layer, which is characterized in that an anti-glare imparting group 120368.doc -15-200808933 containing a fine uneven structure is formed on a transparent substrate. The ink droplets were opened on the surface of the substrate by 70% of the fine concavo-convex structure. However, the structures obtained by the methods were all protrusion-shaped, and the adhesive layer was not formed by these methods. In the field, the dog-like structure is opened, so that the force is greatly reduced. Even if the adhesive layer is formed, the foreign matter collection property cannot be ensured. Moreover, these sentences are difficult to implement on a large scale. In the foreign matter cleaning method of the present invention, the cleaning adhesive layer is used as an average opening of the opening portion, and the foreign matter is removed in an average foreign matter size. "Effective collection" self-processing object [Embodiment], the cleaning adhesive layer (cleaning layer) of the present invention, a manufacturing method thereof, a cleaning sheet (clearing sheet), a cleaning member having a cleaning function, and a foreign matter cleaning The embodiment will be described in detail. The cleaning adhesive layer (cleaning layer) of the present invention will be described with reference to the drawings: Fig. i is a perspective view of the cleaning adhesive layer of the present invention. 1. As shown in Fig. 2, the cleaning adhesive layer of the present invention has a flat surface 8 having a non-recessed portion a on the surface 8. The surface 8 is a flat surface and represents a cleaning adhesive. The thickness (8) of the layers is substantially equal (the difference between the maximum thickness and the minimum thickness is about ±10%). (1) Cleaning layer (average opening diameter: 10 μηι or less) The cleaning adhesive layer of the present invention (in the surface s of the cleaning layer) The ratio of the concave portion & (presence ratio) is preferably such that the ratio of the projected area of the concave portion a to the total projected area of the surface 120368.doc • 16 - 200808933 s is 3% to 8〇%. /〇~观' is better 10%~5〇%, more preferably 1〇%~4〇%.,: The above-mentioned projected area refers to the case where the concave portion 3 of the adhesive layer (cleaning layer) is observed from the surface by a microscope. Observing the area ratio of the concave portion. When the projected area of the concave portion a is too small, the adhesion force of the adhesive layer is not lowered, and the base material for the cleaning layer cannot be sufficiently expressed (4) When the area of a shadow is too large, there is a clean two: (the cleaning layer) the adhesion is significantly reduced, the desired foreign matter is not captured, the ί月幵/X, and the cleaning adhesive layer (cleaning layer) The frictional resistance of the surface is too low, and the structure of the concave portion is broken, and the substrate is reversely contaminated during transportation. The shape of the opening of the concave portion a is not particularly limited, and as shown, it is easy to control the adhesion force. In terms of aspects and ease of formation, it is preferably a slightly round shape. The term "slightly circular" means a circle or an elliptical shape having a major axis length not exceeding 2 times the length of the minor axis. Honeycomb shape or square shape, no Problem. In addition, a portion of the recessed opening section, according to adhere to the body of the processed iso

物尺寸大小而適當調整。具體而言’調整為上述開口部I 平均開口徑小於平均異物尺寸。再者,異物尺寸意指各異 物之最大長度。 成為使用有本發明之清潔用黏著劑層(清潔層)的清潔方 法之對象的異物,適合於包含異物尺寸為1〇 ^口以下者之 情形。異物若含有異物尺寸為10㈣以下者,則亦可含有 120368.doc -17 * 200808933 異物尺寸超過1〇 4111者。作為異物,較適合的是應用於作 為異物個數之比例,以異物總體之8〇%以上、進而%%以 上之比例,含有異物尺寸為1〇 μπι以下之微小異物者。 又,將清潔用黏著劑層(清潔層)凹部之開口部大小,控 制為其平均開口徑(平均直徑)(rl)小於作為清潔對象之異 物的平均異物尺寸(r2)。開口部之直徑意指各開口部中之 • t大直徑,平均開口徑⑼如實施例所示,係指藉由圖像 分析而獲得之各開口部的最大直徑之平均值。 # 如上所述,藉由將開口部之平均開口徑⑼控制為小於 平均異物尺寸⑼,而存在直徑相對性小於各異物尺寸之 開口部,因此即使對微小異物,亦可有效捕集。 開口部之平均開口徑⑻與平均異物尺寸(r2)之關係,滿 足開口部之平均開口徑⑻〈平均異物尺寸⑼之關係即 可, 但就微小異物之捕集效果方面而言,較好的是滿足開口 • 冑之平均開口徑(Γΐ)+〇.5 μιη<平均異物尺寸(r2), 更好的是滿;i開口部之平均開口徑⑴)+1 μιη<平均 尺寸(r2)。 / 士於異物包含異物尺寸為1〇 μιη“下之微小異物之情形 %,較好的是控制為小於異物尺寸為1〇 _以下之異物的 “句/、物尺寸(r21)。平均異物尺寸(r21)係異物尺寸為 μπι以下之異物的平均值。 就微小異物之捕集效果方面而言,開口部之平均開 (rl)與平均異物尺寸(r21)之關係, 120368.doc •18- 200808933 較好的是滿3 Μ 物尺寸⑼),開口权平均開口徑⑻+〇.1μιη<平均異 更好的疋滿足開口部之平均開口徑條5 均異 物尺寸(1*21)。 者通系開口部之平均開口徑(rl)較好的是在〇.1〜10 μηι、更好的是 •〜8 0斑之範圍内。尤其好的是包含異物尺 寸為10㈣以下之微小異物之情形。 允又,對凹部a之剖面形狀並無特別規定,就凹部尺寸之 生'、而口軚好的是半球狀。其中,於該剖面形狀並非 半球狀之情形時’亦可確保所期望之異物捕集性。圖:表 =部a之形狀為半球狀之情形。再者’於黏著劑層表面 成為非連績性凹部,而成為突起狀(凸部)之情形時, 存在以下可能神.m — 者面積之大幅度下降而無法獲得所 ^之f物捕集性,或者即使捕集異物,亦難以完全維持 卞狀μ於搬达步驟之途中使異物自清潔層脫落。 二二述,部&之深度(h)相對於清潔用黏著劑層(清潔 "予又(H)的比(h/H),較好的是〇 〇ι〜〇·9 =青_之厚度(Η)及上述凹部a之深度(=: 平均值。於剖面形狀為半球狀之情形時,凹 之深度(h财。於上叫_超物之情形時,ί %凹部a過深,凹部壁面之強度不充分。 Γ)Γ°·01,或小於等於°·。1,則有所必需之異物二 性不充分之情形。上述比(h/H)較好的是設為〇〇ι〜〇5、更 好的是0.02〜0.2、更好的是〇.〇2〜〇1之範圍。 .更 120368.doc •19- 200808933 、上述清^用黏著劑層(清潔層),較好的是將其表面(凹部 以外)之彈性模數設定為1〇 MpaAdjust the size of the object appropriately. Specifically, the adjustment is such that the average opening diameter of the opening portion I is smaller than the average foreign matter size. Further, the foreign matter size means the maximum length of each foreign matter. The foreign matter which is the object of the cleaning method using the cleaning adhesive layer (cleaning layer) of the present invention is suitable for the case where the foreign matter size is 1 〇 or less. If the foreign matter contains a foreign matter size of 10 (four) or less, it may also contain 120368.doc -17 * 200808933 Foreign matter size exceeding 1〇 4111. As the foreign matter, it is preferably used as a ratio of the number of foreign matters, and a foreign matter having a foreign matter size of 1 〇 μπ or less is contained in a ratio of 8 〇 % or more and further % % of the total foreign matter. Further, the size of the opening of the concave portion of the cleaning adhesive layer (cleaning layer) is controlled such that the average opening diameter (average diameter) (rl) thereof is smaller than the average foreign matter size (r2) of the foreign matter to be cleaned. The diameter of the opening means a large diameter of each of the openings, and the average opening diameter (9) is an average value of the maximum diameters of the respective openings obtained by image analysis as shown in the embodiment. # As described above, by controlling the average opening diameter (9) of the opening to be smaller than the average foreign matter size (9), the opening having a diameter relative to each other smaller than the foreign matter size is present, and therefore, it is possible to effectively collect even small foreign matter. The relationship between the average opening diameter (8) of the opening portion and the average foreign matter size (r2) satisfies the relationship between the average opening diameter (8) of the opening portion and the average foreign matter size (9), but it is preferable in terms of the collection effect of the minute foreign matter. It is the average opening diameter (Γΐ) + 〇.5 μιη < average foreign matter size (r2), more preferably full; i average opening diameter (1)) +1 μηη < average size (r2). / In the case where the foreign matter contains a foreign matter having a foreign matter size of 1 〇 μηη, it is preferable to control the sentence to be smaller than the foreign matter having a foreign matter size of 1 〇 _ or less (r21). The average foreign matter size (r21) is an average value of the foreign matter having a foreign matter size of μπι or less. In terms of the trapping effect of tiny foreign matter, the relationship between the average opening (rl) of the opening and the average foreign matter size (r21), 120368.doc •18-200808933 is preferably the full 3 Μ size (9)), the right to open The average opening diameter (8) + 〇.1 μιη <the average difference is better than the average opening diameter of the opening portion 5 and the foreign matter size (1*21). The average opening diameter (rl) of the opening portion is preferably in the range of 〇1 to 10 μηι, more preferably ~8 0 spot. It is particularly preferable to include a small foreign matter having a foreign matter size of 10 (four) or less. Further, the cross-sectional shape of the concave portion a is not particularly limited, and the size of the concave portion is produced, and the mouth is good in a hemispherical shape. However, when the cross-sectional shape is not hemispherical, the desired foreign matter trapping property can be ensured. Figure: Table = The case where the shape of the part a is hemispherical. In addition, when the surface of the adhesive layer becomes a non-continuous concave portion and becomes a protrusion (convex portion), there is a possibility that the following area may be greatly reduced, and the object collection cannot be obtained. Sexuality, or even if foreign matter is trapped, it is difficult to completely maintain the smear-like μ. The foreign matter is detached from the cleaning layer during the transfer step. 22, the depth of the part & (h) is relative to the cleaning adhesive layer (cleaning "to (H) ratio (h/H), preferably 〇〇ι~〇·9 = green _ The thickness (Η) and the depth of the concave portion a (=: average value. When the cross-sectional shape is hemispherical, the depth of the concave (h. In the case of the upper _ super-object, ί % recess a is too deep) The strength of the wall surface of the recess is insufficient. Γ)Γ°·01, or less than or equal to °·1, the necessary foreign matter is insufficient. The above ratio (h/H) is preferably set to 〇. 〇ι~〇5, more preferably 0.02~0.2, more preferably 〇.〇2~〇1. Further 120368.doc •19- 200808933, the above-mentioned adhesive layer (cleaning layer), It is preferable to set the elastic modulus of the surface (outside the concave portion) to 1 〇 Mpa.

Ayrri 右弹性模數小於1 ο a ’則即使於清潔用黏著劑層(清潔層)表面形成上述凹Ayrri has a right elastic modulus of less than 1 ο a ', even if the above-mentioned concave is formed on the surface of the cleaning adhesive layer (cleaning layer)

部以降低接著性,亦隨著大面積化,而於裝置搬送時,產 生引起接著於搬送滾筒或吸附台等,引起運轉不良,或者 :壞基板之情形。另一方面’上述清潔用黏著劑層(清潔 曰)表面(凹部以外)之彈性模數較好岐500 MPa以下。若 上边彈性模數超過_ Mpa,則存在清潔用黏著劑層(清潔 層)表:之黏著力下降,即使形成凹部亦無法表現異物捕 集功能之情形。上述清潔用黏著劑層表面(凹部以外)之彈 性模數較好的是1G MPa〜則Mpa,更好的是Μ踏〜⑽ MPa該等黏著劑層之抗張彈性模數,可根據上述丙稀酸 系黏著劑之組纟’例#丙稀酸系%合物與聚合性不飽和化 合物(單體成分、募聚物成分)之調配量等來適當設定。 本發明之清潔用黏著劑層(清潔層),其以寬度1 0 _貼附於石夕晶圓之鏡面,於室溫(23°C)下以拉伸速度300 mm/min測定的相對於矽晶圓之卯。剝離接著力,較好的是 〇·3 N/10 mm以下。若上述接著力為〇·3 n/i〇 mm以下,則 _為貝貝上獲得搬送性。再者,本發明之清潔用黏著劑層 (清潔層)因於表面具有凹部,故即使減小原料之黏著劑接 著力’亦可以凹部除去異物。 又本务明之清潔用黏著劑層(清潔層),其以寬度5 〇 mni貼附於矽晶圓之鏡面,於其上加重2 kg且放置φ5〇 mm 之測定端子’於室溫(23。〇下以拉伸速度3⑽mm/min垂直 120368.doc 200808933 拉伸時的、子與清潔用黏著劑層(清潔層)之黏著力,較好 的疋0 2G N。若在該範圍内,則認為本發明中保持異物捕 集性,並且實質上獲得搬送性。 本發明之清潔用黏著劑層(清潔層)係具有具上述凹部之 結構,並具有黏著性者,藉由上述凹部之形成可降低接著 力,尤其是易於控制為上述範圍之接著力,因此可使用放 射線硬化性或熱硬化性丙婦酸系黏著劑之硬化物。以下, ㉟放射線硬化性或熱硬化性丙烯酸系黏著劑加以說明。 _ 放射線硬化性或熱硬化性丙烯㈣黏著劑,可無特別限 制地使用具有碳·碳雙鍵等放射線硬化性或熱硬化性官能 基,且表現黏著性者。作為該官能基,較好的是具有(甲 基)丙烯醯基者。所謂(甲基)丙烯醯基,意指丙烯醯基及/ 或甲基丙烯醯基。以下,(曱基)為相同含義。 作為放射線硬化性ifIn order to reduce the adhesion, the part is also increased in size, and when the apparatus is transported, it may cause a malfunction due to a conveyance roller or a suction stage, or a bad substrate. On the other hand, the elastic modulus of the surface of the above-mentioned cleaning adhesive layer (cleaning enamel) (other than the concave portion) is preferably 岐500 MPa or less. If the upper elastic modulus exceeds _ Mpa, there is a cleaning adhesive layer (cleaning layer): the adhesion is lowered, and the foreign matter trapping function cannot be exhibited even if the concave portion is formed. The elastic modulus of the surface of the cleaning adhesive layer (other than the concave portion) is preferably 1 G MPa to Mpa, more preferably the tensile modulus of the adhesive layer of the pressure-sensitive layer (10) MPa, according to the above-mentioned C The composition of the dilute acid-based adhesive 纟 'Example #acrylic acid-based compound and the amount of the polymerizable unsaturated compound (monomer component, polymer component) are appropriately set. The cleaning adhesive layer (cleaning layer) of the present invention is attached to the mirror surface of the Shixi wafer with a width of 10 _, and is measured at a tensile speed of 300 mm/min at room temperature (23 ° C).矽 卯 矽 卯. The peeling force is preferably 〇·3 N/10 mm or less. When the above-mentioned adhesive force is 〇·3 n/i 〇 mm or less, _ is the transportability on the babe. Further, since the cleaning adhesive layer (cleaning layer) of the present invention has a concave portion on the surface, it is possible to remove foreign matter in the concave portion even if the adhesive adhesion force of the raw material is reduced. In addition, the cleaning adhesive layer (cleaning layer) is attached to the mirror surface of the tantalum wafer with a width of 5 〇mni, and a weight of 2 kg is placed thereon, and a measuring terminal of φ 5 〇 mm is placed at room temperature (23. Under the squatting speed of 3 (10) mm / min vertical 120368.doc 200808933, the adhesion between the sub-cleaning adhesive layer (cleaning layer), preferably 疋 0 2G N. If it is within this range, it is considered In the present invention, the foreign matter collecting property is maintained, and the transport property is substantially obtained. The cleaning adhesive layer (cleaning layer) of the present invention has a structure having the above-described concave portion and has adhesiveness, and can be reduced by the formation of the concave portion. In addition, it is easy to control the adhesive force in the above range, and therefore, it is possible to use a cured product of a radiation curable or thermosetting curcumescent acid-based adhesive. Hereinafter, a radiation curable or thermosetting acrylic adhesive is described. _ The radiation-curable or thermosetting propylene (IV) adhesive can be used without any particular limitation, such as a radiation curable or thermosetting functional group having a carbon/carbon double bond, and exhibiting adhesiveness. The group preferably has a (meth) acrylonitrile group. The so-called (meth) acryl fluorenyl group means an acryl fluorenyl group and/or a methacryl fluorenyl group. Hereinafter, the (fluorenyl group) has the same meaning. Radiation hardening if

酿、異癸S旨、十一烧 尤其是碳數為4〜18之 以上用作單體成分的 酉曰、十一烧S旨等烧基之碳數為1〜12, 直鏈狀或支鏈狀烷酯等)之〗種或2種 120368.doc 21 200808933 丙烯酸系聚合物等。 这丙稀fee系聚合物,係以凝聚力、耐熱性等之改質為 目的,根據需要,亦可含有與可與上述(甲基)丙烯酸烷基 酉曰/、χκ a之其他單體成分對應之單元。作為如此之單體成 刀,例如可列舉:丙烯酸、甲基丙烯酸、(甲基)丙稀酸羧 乙S曰(甲基)丙烯酸綾戊酯、亞甲基丁二酸、順丁烯二 酸、反丁烯二酸、丁烯酸等含羧基之單體;順丁烯二酸 酐、亞甲基丁二酸酐等酸酐單體;(曱基)丙烯酸2_羥乙 酉曰、(甲基)丙烯酸2_羥丙酯、(甲基)丙烯酸羥丁酯、(甲 基)丙烯酸6-羥己酯、(甲基)丙烯酸8_羥辛酯、(甲基)丙烯 酸1〇_羥癸酿、(甲基)丙烯酸12_羥基月桂醋、(甲基)丙烯酸 (4-羥甲基環己基)曱酯等含羥基之單體;苯乙烯磺酸、烯 丙基磺酸、2-(甲基)丙烯醯胺_2_甲基丙磺酸、(甲基)丙烯 醯胺丙石頁酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘 磺酸等含磺酸基之單體;2_羥乙基丙烯醯基磷酸酯等含磷 酸基之單體;(甲基)丙烯酸縮水甘油酯、(曱基)丙烯醯 胺、(曱基)丙烯酸N-羥甲基醯胺、(甲基)丙烯酸烷基胺基 烷酯(例如:甲基丙烯酸二甲胺基乙酯、甲基丙烯酸第三 丁胺基乙酯等)、N-乙烯吡咯烷酮、丙烯醯基嗎啉、醋酸 乙烯,、丙酸乙烯酿、苯乙烯、丙烯腈;(甲基)丙烯酸環 烷酯(例如環戍酯、環己酯等)等。該等可共聚合單體成分 可使用1種或2種以上。該等可共聚合單體的使用量,較好 的是總單體成分之70重量%以下’更好的是4〇重量%以 下0 120368.doc -22- 200808933 進而’上述丙烯酸系聚合物,為使其進Ί 要“有多官能性單體等作為共聚合用單體成八 為如此之多官能性單體,例如可列舉.己 成刀。作 烯酸酯、(聚)乙一醇 己一醇二(甲基)丙 美、… 烯酸_、(聚)丙二醇二(甲 基)丙烯酸酯、新戊二醇二( (甲 (Ψ ^ 土)丙烯酉文酯、季戊四醇二 (曱基)丙烯酉夂酯、三羥曱基 1卞基)丙烯酸酯、季虑 四醇二(甲基)丙烯酸酯、二季戊四 ,田甘、^ 吁/、基)丙稀酸酯、 (T基)丙烯酸環氧酯、聚酷fThe number of carbons of the base, the eleventh burn, especially the carbon number of 4 to 18 or more, which is used as a monomer component, is 1 to 12, linear or branched. A type or two kinds of chain alkyl esters, etc. 120368.doc 21 200808933 Acrylic polymer or the like. The acryl-based polymer is intended to be modified by cohesive force, heat resistance, etc., and may contain other monomer components compatible with the above-mentioned (meth)acrylic acid alkyl hydrazine/, χκ a as needed. Unit. Examples of such a monomer-forming tool include acrylic acid, methacrylic acid, (meth)acrylic acid carboxyethyl sulfonium (methyl) decyl methacrylate, methylene succinic acid, maleic acid. a carboxyl group-containing monomer such as fumaric acid or crotonic acid; an acid anhydride monomer such as maleic anhydride or methylene succinic anhydride; (meth)acrylic acid 2-hydroxyethyl hydrazine or (meth)acrylic acid 2-hydroxypropyl ester, hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 1 〇 hydroxy hydroxy (meth) acrylate, ( Methyl)acrylic acid 12-hydroxylauryl vinegar, (meth)acrylic acid (4-hydroxymethylcyclohexyl) decyl ester and other hydroxyl-containing monomers; styrene sulfonic acid, allyl sulfonic acid, 2-(methyl) A sulfonic acid group such as acrylamide, 2, methyl propane sulfonic acid, (meth) acrylamide, sulfopropyl (meth) acrylate, (meth) propylene phthaloxy naphthalene sulfonic acid, etc. Monomer; phosphate-containing monomer such as 2-hydroxyethyl acryloyl phosphate; glycidyl (meth)acrylate, (mercapto) acrylamide, (mercapto)acrylic acid N- Hydroxymethyl decylamine, alkyl aminoalkyl (meth) acrylate (for example: dimethylaminoethyl methacrylate, tert-butylaminoethyl methacrylate, etc.), N-vinylpyrrolidone, propylene oxime Base morpholine, vinyl acetate, vinyl propionate, styrene, acrylonitrile; cycloalkyl (meth)acrylate (eg cyclodecyl ester, cyclohexyl ester, etc.). These copolymerizable monomer components may be used alone or in combination of two or more. The amount of the copolymerizable monomer used is preferably 70% by weight or less of the total monomer component. More preferably, it is 4% by weight or less. 0 120368.doc -22- 200808933 Further, the above acrylic polymer, In order to carry out the reaction, "a polyfunctional monomer or the like is used as a monomer for copolymerization to form such a polyfunctional monomer, and examples thereof include a sulfonate, a (poly) ethyl ketone. Monoalcohol (meth) propyl methacrylate, enoic acid _, (poly) propylene glycol di (meth) acrylate, neopentyl glycol bis ((methyl Ψ 土) propylene decyl ester, pentaerythritol di (indenyl) ) propylene decyl ester, trishydroxy fluorenyl 1 decyl acrylate, quaternary diol di(meth) acrylate, dipentaerythritol, tiangan, ^ y / yl acrylate, (T base) )Acrylic epoxy ester, Ju cool f

(甲基)丙婦酸醋、胺基甲酸輯 (甲基)丙烯酸酯等。該等多官 s月匕注早體亦可使用1種或2種 以上:就:著特性等方面而言’多官能性單體之使用量較 好的是總単體成分之70重量%以下’更好的是3〇重量%以 下0 上述丙烯酸系聚合物,係藉由使單—單體或2種以上之 單體混合物聚合而獲得.聚合可以溶液聚合、乳化聚合、 塊狀聚合、懸浮聚合等任-方式進行。丙稀酸系聚合^之 重量平均分子量(Mw)較好的是50萬〜15〇萬,更好的是8〇 萬〜120萬。又,重量平均分子量(Mw)與數量平均分子量 (Μη)之分散度(Mw/Mn)較好的是6〜1〇。 重量平均分子量係指以GPC法由標準聚苯乙烯換算之 值。作為GPC本體,使用東曹公司製造2ΗΙχ_812(^ρ(:, 管柱溫度40°C、泵流量〇·5 ml/min、使用檢測器RI之資料 處理’預先使用分子量為已知之標準聚苯乙烯之校正曲線 (以分子量500〜2060萬之校正),根據換算分子量求得分子 量0 120368.doc -23- 200808933 使用管柱:TSKgel GMH-H(S)x2根(東曹公司製造) 移動相··四氫吱喃 注入量:100 μΐ 樣品濃度· 1.0 g/ι(四氫吱喃溶液) 异出分散度’作為重量平均分子量與數量平均分子量之 比。以與重篁平均分子量之測定相同之方法實施數量平均 分子量之測定。(Methyl) acetoacetate, urethane (meth) acrylate, and the like. It is also possible to use one or more of these types of sapphire saplings: in terms of characteristics, etc., the amount of the polyfunctional monomer used is preferably 70% by weight or less of the total steroid component. More preferably, the amount of the above-mentioned acrylic polymer is obtained by polymerizing a single monomer or a mixture of two or more kinds of monomers. The polymerization may be solution polymerization, emulsion polymerization, bulk polymerization, or suspension. The polymerization is carried out in any manner. The weight average molecular weight (Mw) of the acrylic acid polymerization is preferably from 500,000 to 150,000, more preferably from 80,000 to 1,200,000. Further, the degree of dispersion (Mw/Mn) of the weight average molecular weight (Mw) and the number average molecular weight (?η) is preferably 6 to 1 Torr. The weight average molecular weight means a value converted from standard polystyrene by the GPC method. As the GPC body, the product was manufactured by Tosoh Corporation using 2ΗΙχ_812 (^ρ(:, column temperature 40 °C, pump flow rate 5·5 ml/min, data processing using detector RI'). Calibration curve (corrected by molecular weight 500~20.6 million), molecular weight calculated according to converted molecular weight 0 120368.doc -23- 200808933 Using column: TSKgel GMH-H(S)x2 (made by Tosoh Corporation) Mobile phase· · tetrahydrofuran injection amount: 100 μΐ sample concentration · 1.0 g / ι (tetrahydrofuran solution) heterogeneous dispersion ' as the ratio of the weight average molecular weight to the number average molecular weight. The same as the determination of the average molecular weight of the heavy enthalpy The method performs a determination of the number average molecular weight.

又,聚合性不飽和化合物係放射線硬化性或熱硬化性單 體成分、寡聚物成分,其係可以放射線或熱等活性能量源 硬化之刀子内合有1個以上不飽和雙鍵的化合物。較好的 是含有2個以上不餘和雙鍵之化合物。該硬化成分適用於 &制用以於搬送8守使清潔用黏著劑層(清潔層)並不與被清 :口 (M立強烈接著之接著力,χ,藉由添加該等單體成分、 养聚物成刀’可降低系統之黏度,因此亦可期待相分離時 凹結構更為均勻形成之效果。 作為上述聚合性不飽和化合物,較好的是非揮發性且重 量平均分子量為1〇_以下之低分子量體,尤其好的是具 =5_以下之分子量者,以有效進行硬化時之清潔用黏著 合物之m 作4如此之聚合性不餘和化 «、: Π 可列舉:苯氧基聚乙二醇(甲基)丙埽 内酉曰(甲基)丙烯酸酯、聚乙二醇二(甲基 S“曰、聚丙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲美丙 稀酸醋、”;1二)_酿、W己二醇(甲基)丙 -工甲基丙烧三(甲基)丙稀酸醋、四經甲基甲烷 120368.doc -24- 200808933 四(曱基)丙烯酸酯、季戍四醇三(甲基)丙烯酸酯、季戊四 醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸 酯、二季戍四醇六(甲基)丙烯酸酯、新戍二醇二(甲基)丙 烯酸酯等(甲基)丙烯酸與多元醇之酯化物;胺基甲酸酯(甲 基)丙烯酸酯、(甲基)丙烯酸環氧酯、寡酯(甲基)丙烯酸酯 等,該等中可使用1種或2種以上。Further, the polymerizable unsaturated compound is a radiation curable or thermosetting monomer component or an oligomer component, and is a compound in which one or more unsaturated double bonds are contained in a knife which is hardened by an active energy source such as radiation or heat. Preferred are compounds containing two or more and double bonds. The hardening component is suitable for &<><>> used to transport 8 keeper so that the cleaning adhesive layer (cleaning layer) is not clear with the mouth: M (strongly followed by force, χ, by adding the monomer components The nutrient-forming knife can reduce the viscosity of the system, so that the effect of forming the concave structure more uniformly during phase separation can also be expected. As the above polymerizable unsaturated compound, it is preferably non-volatile and has a weight average molecular weight of 1〇. _ below the low molecular weight body, particularly preferably having a molecular weight of = 5 Å or less, and m for the cleaning adhesive which is effective for hardening as 4, such polymerization and sufficiency «, : Π Phenoxy polyethylene glycol (methyl) propylene fluorene (meth) acrylate, polyethylene glycol bis (methyl S 曰, polypropylene glycol di (meth) acrylate, 1,4-butyl Diol diol (methyl methacrylate vinegar, "1) _ brewed, W hexane diol (methyl) propyl - methacrylic trimethyl (meth) acrylate vinegar, tetramethyl methacrylate 120368 .doc -24- 200808933 Tetrakis(meth)acrylate, quaternary tetraol tri(meth)acrylate, pentaerythritol tetrakis(methyl) Esterified ester of (meth)acrylic acid and polyhydric alcohol such as acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, diquaternic pentaerythritol hexa(meth)acrylate, neodecanediol di(meth)acrylate And a urethane (meth) acrylate, a (meth) acrylate epoxy ester, an oligoester (meth) acrylate, etc., and one type or two or more types can be used.

上述聚合性不飽和化合物(單體成分、寡聚物成分)之調 配里,相對於100重量份之丙烯酸系聚合物,較好的是 3〜10〇重盲份,更好的是5〜8〇重量份,更好的是重量 份’更好的是10〜60重量份。 又,作為放射線硬化性或熱硬化性丙烯酸系黏著劑,除 上述已說明之添加型以外,作為原料聚合物,亦可列舉使 用有於聚合物侧鏈或主鏈中或者主鏈末端具有碳_碳雙鍵 者的内在型者。内在型硬化性黏著劑,無需含有作為低分 子成分之募聚物成分等,或者並未大量含有,因此募聚物 成分等並未經時性於黏㈣巾移動,可形成穩定之層結構 之清潔用黏著劑層(清潔層)。 /、有上述妷-奴雙鍵之原料聚合物,可無特別限制地使 用具有碳“炭雙鍵且具有黏著性者。作為如此之原料聚合 物’較好的是以丙_㈣合物為基本骨架者。作為丙稀 酸系聚合物之基本骨架’可列舉上述已例示之丙烯酸系聚 合物。 將碳碳雙鍵導入上述丙烯酸系聚合物之方法,並無特 別限制’可採用各種方法,將碳·碳雙鍵導人聚合物侧 120368.doc -25· 200808933 鏈,在分子設計上較為容易。例如可列舉以下方法:預先 使具有官能基之單體共聚合於丙烯酸系聚合物後,將具有 可與該官能基反應之官能基及碳-碳雙鍵之化合物,於維 持碳-碳雙鍵之放射線硬化性之狀態下,進行縮合或加 成。 作為該等官能基之組合之例,可列舉:竣酸基與環氧 基、羧酸基與氮丙啶基、羥基與異氰酸酯基等。該等官能 基之組合中,就反應追蹤之難易度而言,較好的是羥基2 異氰酸酯基之組合。又,若為如藉由該等官能基之組 生成具有上述碳·•碳雙鍵之丙烯酸系聚合物的組合,則官 能基可存在於丙稀酸系聚合物與上述化合物中之任一者 中,於上述較佳組合中,較好的是丙烯酸系聚合物具有羥 基,且上述化合物具有異氰酸酯基之情形。該情形時,作 為具有碳-碳雙鍵之異氰酸酯化合物,例如可列舉··異氮 酸甲基丙烯醯基酯、異氰酸2-甲基丙烯醯氧基乙酯、異氰 酸間異丙烯基·α,α·二甲基Μ等。又,作為丙稀酸系聚合 物,可使用將上述所例示之含羥基之單體或2_羥乙基乙烯 基醚、4-羥丁基乙烯基醚、二乙二醇單乙烯基醚之=化合 物等共聚合而得者。 上述内在型之硬化性黏著劑,可單獨使用具有上述碳_ 碳雙鍵之原料聚合物(丙烯酸系聚合物),亦可於以不會使 特性惡化之程度,調配上述硬化性單體成分或寡聚物成 分。於内在型之硬化性黏著劑之情形時,較好的是含有的 重量%以上、更好的是5〇重量%以上之具有上述碳_碳雙鍵 120368.doc -26 - 200808933 之原料聚合物。 又,為促進作為原 ^ ^ $料‘合物之丙烯酸系聚合物的交聯, 亦可於上述黏著劑中 .^ τ ’根據需要而適當添加外部交聯劑。 作為交聯劑之種類 、 例如較好的是相對於具有羧基或羥基 之丙烯酸系聚合物, ^ 勿 可與該官能基反應之多官能性化合 物。例如,可列I、夭 _ —添加二苯基曱烷二異氰酸酯及曱苯二異 氰酸酯等聚昱考# ^ 八氰日、環氧化合物、氮丙啶化合物、三聚 乱胺系交聯劑、腮始+收 ^In the preparation of the above polymerizable unsaturated compound (monomer component, oligomer component), it is preferably 3 to 10 〇 heavy blind, more preferably 5 to 8 with respect to 100 parts by weight of the acrylic polymer. The parts by weight, more preferably the parts by weight, are more preferably 10 to 60 parts by weight. Further, as the radiation curable or thermosetting acrylic adhesive, in addition to the above-described additive type, the raw material polymer may be used in the side chain or main chain of the polymer or have carbon at the end of the main chain. The intrinsic type of carbon double bond. The intrinsic type curable adhesive does not need to contain a polymer component as a low molecular component, or is not contained in a large amount, so that the polymer component or the like is not moved to the sticky (four) towel, and a stable layer structure can be formed. Cleaning adhesive layer (cleaning layer). /, the raw material polymer having the above-mentioned bismuth-slave double bond, and a carbon "carbon double bond and having adhesiveness" can be used without particular limitation. As such a raw material polymer, it is preferred that the propylene-(tetra) compound is The basic skeleton of the acrylic polymer is exemplified as the above-mentioned exemplified acrylic polymer. The method of introducing a carbon-carbon double bond into the acrylic polymer is not particularly limited, and various methods can be employed. The carbon-carbon double bond leads to the polymer side 120368.doc -25·200808933 chain, which is easy to molecularly design. For example, a method of copolymerizing a monomer having a functional group with an acrylic polymer in advance is exemplified. A compound having a functional group capable of reacting with the functional group and a carbon-carbon double bond is subjected to condensation or addition while maintaining the radiation hardenability of the carbon-carbon double bond. As an example of the combination of the functional groups Examples thereof include a decanoic acid group and an epoxy group, a carboxylic acid group and an aziridine group, a hydroxyl group and an isocyanate group, etc. Among the combinations of the functional groups, in terms of ease of reaction tracking, a hydroxyl group 2 is preferred. different Further, if a combination of an acrylic polymer having the above carbon-carbon double bond is formed by a group of such functional groups, a functional group may be present in the acrylic polymer and the above In any one of the above compounds, in the above preferred combination, it is preferred that the acrylic polymer has a hydroxyl group and the above compound has an isocyanate group. In this case, as an isocyanate compound having a carbon-carbon double bond, For example, methacrylic acid methyl methacrylate, 2-methyl propylene methoxyethyl isocyanate, iso-isopropenyl-α, α-dimethyl hydrazine, etc. As the acrylic acid polymer, a hydroxyl group-containing monomer or 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, a compound, etc., which are exemplified above, can be used. The above-mentioned intrinsic type of curable adhesive may be a raw material polymer (acrylic polymer) having the above carbon-carbon double bond, or may be blended to such an extent that the properties are not deteriorated. A curable monomer component or oligomer component. In the case of an intrinsic type of curable adhesive, it is preferred to contain more than 5% by weight, more preferably 5% by weight or more of the base polymer having the above carbon-carbon double bond 120368.doc -26 - 200808933 Further, in order to promote crosslinking of the acrylic polymer as the raw material, it is also possible to appropriately add an external crosslinking agent to the above-mentioned adhesive. For example, it is preferably a polyfunctional compound which is not reactive with the functional group with respect to an acrylic polymer having a carboxyl group or a hydroxyl group. For example, it may be listed as I, 夭_-addition of diphenylnonane diisocyanate and曱Benzene diisocyanate, etc. ^ 昱 # # ^ octa cyanide, epoxy compounds, aziridine compounds, tri-polyamide crosslinkers, start + receive ^

^ 脈树知、無水化合物、聚胺、含羧基之聚 &各種t屬M '螯合物等所謂交聯劑而進行反應的方 ^該等又聯劑(多官能性化合物)之使用量,相對於100重 里伤之丙烯酸系聚合物,較好的是於20重量份以下之範圍 内更好的是以〇·01〜2〇重量份、〇〇1〜1〇重量份進行調 配。該等交聯劑即使同時使用i種或者2種以上,亦無任何 問題。 上述硬化性之丙烯酸系黏著劑中,根據硬化方式,可含 有引發劑。於以紫外線等使上述硬化性黏著劑硬化之情形 時,含有光聚合引發劑。作為光聚合引發劑,例如可列 舉· 4-(2-羥基乙氧基)苯基羥基_2_丙基)酮、心羥基-α,α -一甲基苯乙酮、2-甲基-2-羥基苯丙酮、ι_羥基環己基 苯基酮等α-酮醇系化合物;甲氧基苯乙酮、2,2_二甲氧基_ 2-苯基苯乙酮、2,2-二乙氧基苯乙酮、2_甲基·(甲硫 基)-苯基]-2-嗎啉基-1-丙酮等苯乙酮系化合物;安息香乙 醚、安息香異丙醚、大茴香偶姻曱醚等安息香醚系化合 物;苄基二甲基縮酮等縮酮系化合物;2-萘磺醯氣等芳香 120368.doc •27- 200808933 Μ醯氣糸化合物"·笨酮-丙二酮 肟等光活性肟系化合物;^ 軋基羰基) L甲氧基-笨美酮、苯甲酿安息香酸、 ^ 基鲖等二苯基酮系化合物.空 嗣L塞嘴酮、”基 :,㈣ 丙㈣酮、2,二氯:乙二基塞嘴_、異 s工甘〜 2,4-一乙基噻噸顯1、2 4_ 一 :基《酮等嘆嘲酮系化合 腦 ’: =鱗人醯基磷酸_等。光聚合引發劑之調配:相= 〇重里伤構成黏著劑之两烯酸系聚合物等原料聚合物, 列如為0.1〜10重量份左右,較好的是0.5〜5重量份。° j述黏著射,根據需要,除上述成分料 ί:Γ所周知之各種黏著賦予劑、老化防止劑、填= 者色劑、鏈轉移劑、塑化劑等添加劑。 、 如=述’,本發明之清潔用黏著劑層(清潔層)之形成方 (产二Jr成表面具有非連續性凹部之清潔用黏著劑層 ’““、&,則無特別限制,例如可藉由實施如下步 :,仃步驟⑴,將於放射線硬化性或熱硬化性丙婦酸 糸黏者劑中’ it而調配與上述丙烯酸系黏著劑不相容之化 t物的黏著劑組合物’塗佈於基材上,形成黏著劑組合物 屬; 步驟⑺,對上述黏著劑組合物層,進行放射線照射或 /、、、使上述丙烯酸系黏著劑硬化,並且形成黏著劑層前 ’物該黏著劑層前驅物具有其硬化物與上述不相容化合 物之相分離結構;以及 σ y驟(3),自所獲得之黏著劑層前驅物中除去不相容化 120368.doc -28- 200808933 合物。 於步驟(i)中,將於放射線硬化性或熱硬化性丙烯酸系 黏著劑中,進而調配與上述丙烯酸系黏著劑不相容之化合 物的黏著劑組合物’塗佈於支持體上’形成黏著劑組合: 層。上述不相容化合物,係用以於清潔用黏著劑層潔 層)之表面形成凹部的對丙烯酸系黏著劑之相容性曰較二的' 添加劑。上述不相容化合物,若為可與上述丙稀㈣黏著 劑混合,且於形成黏著劑組合物層時可進行相分離者,則 無特別限制。通常,將黏著劑組合物用作溶液,因此較好 的是將點著劑組合物塗佈於基材後,於溶劑除去過程中進 订㈣離者。作為上述不相容化合物之相分離程度,較好 的疋於液體狀態下與丙烯酸系黏著^ ^ ^ ^ 狀態者。 合液)形成液相分離 物'述:著劑組合物之製備,可藉由將上述不相容化合 並二广劑與上述丙稀酸系黏著劑屍合而進行。對溶劑 就製^ ’但”可使用有機溶劑。作為有機溶劑, 就製膜時之塗膜穩定性方面而言, 著劑組合物者。作為有 &可句勻溶解黏 燒、庚燒、甲奸 機〉谷劑’例如可列舉:丁院、己 尸甲薛*、鄰-甲苯、間二甲苯、對二f苯、環己 凡甲_、乙醇、異丙醇 醇、二乙齡、s 戊私轅己醇、2-甲基環己 、丙醚、二丁 M ^ 酮、甲基乙基網、甲m —Μ、四…、两 二显丁酮、浐? 土 " 丁基酮、2_庚酮(甲基戊基酮)、 酉同、錯酸戊^ _(環己_,A_e)、甲基環己明、環戊 料酸M、醋酸乙§旨、醋酸丙酯、醋酸= 120368.doc -29· 200808933 酯、N,N-二甲基甲醯胺(DMF)、N,N_二甲基乙醯胺 (DMAc)、N-甲基吡咯烷酮、2_甲氧基乙醇、2·乙氧基乙 醇、2- 丁氧基乙醇等。作為上述有機溶劑,較好的是醋酸 乙酯、甲苯、二甲苯等。又,較好的是使用溶解於上述有 機溶劑、以及甲醇等與丙烯酸系黏著劑不相容之化合物二 者中之/合劑。利用溶劑,通常將黏著劑組合物調整為固形 分濃度為5〜50重量%、較好的是5〜3〇重量%,更好的是 10〜25重量%之溶液。 作為上述不相容化合物之例子,例如可列舉:乙二醇、 乙二醇 乙二醇、聚乙二醇、丙二醇、二丙二醇 丙-醇及*丙—醇,以及彼等單末端之或兩末端甲基封閉 物、單末端或兩末端(甲基)丙烯酸酯封閉物等乙二醇系化 合物作為例子,可選擇使用其一種以上。 ,述不相容化合物之調配量,通常於添加型硬化性丙烯 酸系黏著劑之情形時,相對於丙烯酸系聚合物與聚合性不 飽和化合物之合計1〇〇重量份,較好的是設為3〜重量 份。至於上述調配量,為使所形成之凹部尺寸適當化,較 好的是100重量份以下,更好的是5〇重量份以下。另一方 面’為達成表現凹部之程度的相分離,較好的是5重 以上。 將上述黏著㈣合物塗佈於支持趙上,形成黏著㈣人 ==該形成方法’可採用各種方法。例如,於將連 、置用於形成黏著劑組合物層之情形日夺,例如可列 、下方法·連績供給黏著劑組合物(溶液),自安裝於裝 120368.doc -30- 200808933 置前端之模頭等喷出 又,作為形成,占荽tf I,向片基材上擠出為薄層。 方式之情二::::物層之方法,可列舉於採用批次 基材上,以數料器、或M上將點著劑組合物(溶液則於 法。如此’將薄層化之3黏::知^刀塗佈機成形之方 進行加熱,除去^ 合物積層於支持體上後, β ^藉由乾燥溶劑,而使上述不相容化 合物於丙烯酸系黏著 礼个祁谷化 使非常微細之凹不谷化進行相分離,藉此 之溫度並i UP對乾燥上述混合溶劑 ,、,、特別限制,較好的是設為50〜60t左右。 :?述黏著劑組合物層之厚度並無特別限定,通常較好 的疋5〜100 μιη左右,更 _。薄於上述範圍之 存在清潔用黏著劑層(清潔層)之形狀追^ The amount of the recombining agent (polyfunctional compound) used for the reaction of the so-called cross-linking agent such as the poly-compound, the anhydrous amine, the polyamine, the carboxyl group-containing poly-amp; The acrylic polymer is preferably blended in an amount of 20 parts by weight or less with respect to 100 parts by weight of the acrylic polymer in an amount of 〇01 to 2 parts by weight and 〇〇1 to 1 part by weight. These cross-linking agents have no problem even if they are used in combination of two or more kinds. In the above-mentioned curable acrylic pressure-sensitive adhesive, an initiator may be contained depending on the curing method. When the curable adhesive is cured by ultraviolet rays or the like, a photopolymerization initiator is contained. Examples of the photopolymerization initiator include 4-(2-hydroxyethoxy)phenylhydroxy-2-propyl) ketone, hydroxy-α, α-methylacetophenone, and 2-methyl- An α-keto alcohol compound such as 2-hydroxypropiophenone or i-hydroxycyclohexyl phenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2- Acetophenone-based compound such as diethoxyacetophenone or 2-methyl(methylthio)-phenyl]-2-morpholinyl-1-propanone; benzoin ethyl ether, benzoin isopropyl ether, fennel A benzoin ether compound such as indoline ether; a ketal compound such as benzyl dimethyl ketal; an aromatic solvent such as 2-naphthalene sulfonate 120368.doc • 27- 200808933 Μ醯 糸 compound quot · 酮 · 丙 丙Photoactive lanthanide compounds such as ketone oxime; ^ carbonyl-based) L-methoxy-benzolone, benzoic benzoic acid, ^diphenyl ketone compound such as guanidine, 嗣L plugin, "base: (4) C (tetra) ketone, 2, dichloro: Ethylene sylvestre _, different s gan ~ 2,4-ethyl thioxanthin 1, 2 4 _ one: base "ketone and other sinotic ketones combined brain" : = scales thiophosphoric acid _ etc. Preparation of photopolymerization initiator: phase = 〇 heavy injury The raw material polymer such as the two olefinic polymer constituting the adhesive is, for example, about 0.1 to 10 parts by weight, preferably 0.5 to 5 parts by weight. The adhesion is described, in addition to the above ingredients, ί: Additives such as various adhesion-imparting agents, aging-preventing agents, coloring agents, chain transfer agents, plasticizers, etc., such as the description, the formation of the cleaning adhesive layer (cleaning layer) of the present invention (The production of the adhesive layer of the second Jr having a non-continuous recess on the surface is not particularly limited, for example, by performing the following steps: 仃Step (1), which will be radiation hardening or heat hardening An adhesive composition for dissolving the chelate incompatible with the above-mentioned acrylic adhesive is applied to a substrate to form an adhesive composition genus; step (7), The adhesive composition layer is irradiated with radiation or/and the acrylic adhesive is cured, and the adhesive layer precursor is formed. The adhesive layer precursor has phase separation of the cured product from the incompatible compound. Structure; and σ y (3 Removing the incompatible 120368.doc -28- 200808933 from the obtained adhesive layer precursor. In the step (i), it is to be in a radiation curable or thermosetting acrylic adhesive, and further An adhesive composition formulated to be compounded with the above-mentioned acrylic adhesive is applied to a support to form an adhesive combination: a layer. The above incompatible compound is used for cleaning an adhesive layer. The surface is formed with a concave portion which is compatible with the acrylic adhesive. The above incompatible compound may be mixed with the above propylene (4) adhesive and may be formed in the formation of the adhesive composition layer. There is no particular limitation on the phase separation. Usually, the adhesive composition is used as a solution, and therefore it is preferred to apply the dosing composition to the substrate and then dispense (iv) away from the solvent during the solvent removal process. As the degree of phase separation of the above incompatible compound, it is preferred to adhere to the acrylic state in the liquid state. The liquid phase is formed into a liquid phase separation. The preparation of the composition of the composition can be carried out by combining the above-mentioned incompatible compounding agent with the above-mentioned acrylic acid-based adhesive. For the solvent, an organic solvent can be used. As an organic solvent, in terms of film stability at the time of film formation, the composition of the composition can be used as a < For example, Dingyuan, cadaveric scorpion*, o-toluene, m-xylene, p-f-benzene, cyclohexanone, ethanol, isopropanol, di-tergin, s pentyl hexanol, 2-methylcyclohexyl, propyl ether, dibutyl M ^ ketone, methyl ethyl net, methyl m - hydrazine, tetra..., bis-butanone, hydrazine, earth " butyl Ketone, 2_heptanone (methyl amyl ketone), bismuth, acid pentane _ (cyclohexyl, A_e), methylcyclohexamine, cyclopentate M, acetic acid, propyl acetate , acetic acid = 120368.doc -29· 200808933 ester, N,N-dimethylformamide (DMF), N,N-dimethylacetamide (DMAc), N-methylpyrrolidone, 2-methoxy Ethyl alcohol, 2. ethoxyethanol, 2-butoxyethanol, etc. The organic solvent is preferably ethyl acetate, toluene or xylene. Further, it is preferably dissolved in the above organic solvent. And methanol and the like It is a mixture of the adhesive-incompatible compounds. The solvent composition is usually adjusted to have a solid content concentration of 5 to 50% by weight, preferably 5 to 3 % by weight, more preferably. It is a solution of 10 to 25% by weight. Examples of the above incompatible compound include, for example, ethylene glycol, ethylene glycol glycol, polyethylene glycol, propylene glycol, dipropylene glycol propanol, and *propanol. And an ethylene glycol-based compound such as a single-terminal or two-terminal methyl block, a single-end or a two-terminal (meth) acrylate block, as an example, one or more of which may be selected. In the case of the addition of the curable acrylic adhesive, it is preferably 3 parts by weight based on 1 part by weight of the total of the acrylic polymer and the polymerizable unsaturated compound. The amount of the above-mentioned preparation is preferably 100 parts by weight or less, more preferably 5 parts by weight or less, in order to optimize the size of the formed concave portion. On the other hand, it is preferable to achieve phase separation to the extent that the concave portion is expressed. Is 5 heavy Applying the above-mentioned adhesive (tetra) compound to the support Zhao to form an adhesive (four) person == the formation method can be carried out by various methods. For example, in the case of using a joint to form an adhesive composition layer, For example, the adhesive composition (solution) can be supplied in the following manner, and the adhesive composition (solution) can be sprayed from the die attached to the front end of the package 120368.doc -30- 200808933, and formed as a ,tf I, to the base. Extrusion into a thin layer on the material. Method 2:::: The method of the layer can be listed on the batch substrate, using a batcher, or a coating agent on the M (solution is in the method) Thus, the thin layered 3-stick is formed by heating the film forming machine to remove the layer on the support, and the above-mentioned incompatible compound is caused by drying the solvent. The acrylic adhesive layer has a very fine concave and non-glutinized phase separation, and the temperature is i UP to dry the mixed solvent, and is particularly limited, and is preferably about 50 to 60 tons. The thickness of the adhesive composition layer is not particularly limited, and is usually preferably about 5 to 100 μmη, more preferably _. Thinner than the above range, the shape of the cleaning adhesive layer (cleaning layer)

降,異物捕集性下降之情形。又,若在該範圍以上,J 在基材過厚而難以操作之情形。 上述基材,亦可用作設置有所獲得之清潔用黏著劑層 潸潔層)的清潔片(清潔用黏著片)之支持體。作為可成為 该支持體之基材,並無特別限定,例如可列舉:聚乙稀、 聚丙稀等聚烯烴系樹脂,聚對苯二曱酸乙二醇酿等聚醋系 樹脂’乙醯纖維素等纖維素系樹脂,聚碳酸醋系樹脂,聚 醯胺系樹脂,聚醯亞胺系樹脂,聚碳化二醯亞胺系樹脂: 氯乙浠系樹脂等之塑膠片等。基材之厚度,通常較好^是 10〜300 μηι左右。就操作方面而言,更好的是3〇〜2〇〇 ^^2 右。再者’於將放射線硬化性黏著劑用於形成黏著劑層之 情形時,選擇使用透過紫外線等光之塑膠片。又,作^基 120368.doc -31- 200808933 材,根據情況亦可使用金屬箱。亦可於該等基材之表面 上’實施各種表面處理。 繼而,於步驟(2)中,對上述黏著劑組合物層進行放射 線照射或加熱,使上述丙烯酸系黏著劑硬化,並且形成黏 著劑層前驅物,該黏著劑層前驅物具有其硬化物與上述不 相谷化合物之相分離結構。Drop, the situation in which the foreign matter is trapped. Moreover, if it is more than this range, J may be too thick and it is difficult to operate. The above substrate may also be used as a support for a cleaning sheet (adhesive sheet for cleaning) in which the obtained cleaning adhesive layer cleaning layer is provided. The base material which can be used as the support is not particularly limited, and examples thereof include a polyolefin resin such as polyethylene or polypropylene, and a polyethylene resin such as polyethylene terephthalate. A cellulose resin such as a cellulose resin, a polycarbonate resin, a polyamide resin, a polyimide resin, a polycarbodiimide resin, a plastic sheet such as a chlorinated resin, or the like. The thickness of the substrate is usually preferably about 10 to 300 μηι. In terms of operation, it is better to be 3〇~2〇〇 ^^2 right. Further, when a radiation curable adhesive is used for forming an adhesive layer, a plastic sheet that transmits light such as ultraviolet rays is used. Also, for the base 120368.doc -31- 200808933, metal boxes can be used depending on the situation. Various surface treatments can also be carried out on the surface of the substrates. Then, in the step (2), the adhesive composition layer is irradiated or heated by radiation to harden the acrylic adhesive, and an adhesive layer precursor is formed, the adhesive layer precursor having the cured product and the above Phase separation structure of non-phase compound.

、'寸製膜於上述基材上之黏著劑組合物層進行放射線照射 或加熱時,為進行丙烯酸系黏著劑之硬化,抑制交聯之氧 ,礙’使形成有凹部之平坦面之更為平滑化,較好的是黏 著劑組合物層之表面於以覆蓋膜覆蓋之狀態下實施硬化處 理。藉此’可抑制丙稀酸系黏著劑之硬化時之氧阻礙所造 成之硬化度、交聯度下降,χ,於藉由使用覆蓋膜而相分 離之表面上產生凸部之情形時’存在使其部位平坦化之效 作為覆蓋膜’並無特別限定’例如可列舉:聚乙烯、聚 丙烯聚對苯一甲酸乙二醇酯、乙醯纖維素、聚碳酸酯、 聚醯胺、聚碳化二醯亞胺等之塑膠膜等。其厚度通常較好 的是10〜1GG μηι左右。於將放射線硬化性黏著劑用於形成 清潔用黏著劑層(清潔層)之情形時,選擇使用透過紫外線 專光之透明性較高之塑膠膜。作為覆蓋膜,亦可於面向1 黏著劑之表面上實施各種卿處理,亦可直制作通^ 使用之剝離膜。 斤 上述丙烯I⑽著劑,根據其硬化性而進行放射線照射 或加熱。作為放射線,可列舉紫外線、電子束等。作為硬 120368.doc -32- 200808933 化方法,就其步驟方面而言,較好的是紫外線硬化。藉 此’將形成於基材上之凹結構固定。又”硬化時,丙烯酸 系黏著劑與不相容化合物亦可進而藉由反應誘發相分離而 進行相分離,擴大凹結構。再者,於丙烯酸系黏著劑之硬 化過程中,不相容化合物即使與丙烯酸系黏著劑(丙烯酸 系聚合物或聚合性不飽和化合物)進行一部分交聯,亦無 問題。When the adhesive composition layer on the substrate is irradiated or heated, the acrylic adhesive is cured to suppress the cross-linked oxygen, and the flat surface on which the concave portion is formed is further prevented. For smoothing, it is preferred that the surface of the adhesive composition layer is subjected to a hardening treatment in a state covered with a cover film. Therefore, it is possible to suppress the degree of hardening caused by the oxygen barrier during curing of the acrylic acid-based adhesive, and the degree of crosslinking is lowered, and when the convex portion is formed on the surface which is separated by using the cover film, The effect of flattening the portion thereof is not particularly limited as a cover film, and examples thereof include polyethylene, polypropylene polyethylene terephthalate, acetonitrile cellulose, polycarbonate, polyamide, and carbonization. Plastic film such as diimine. The thickness is usually preferably about 10 to 1 GG μηι. When a radiation curable adhesive is used to form a cleaning adhesive layer (cleaning layer), a plastic film having a high transparency through ultraviolet light is selected. As the cover film, various treatments can be carried out on the surface facing the adhesive, and the release film can be directly produced. The above propylene I (10) agent is irradiated or heated according to its hardenability. Examples of the radiation include ultraviolet rays, electron beams, and the like. As a method of hardening 120368.doc -32- 200808933, ultraviolet light hardening is preferred in terms of its steps. By this, the concave structure formed on the substrate is fixed. Further, when curing, the acrylic adhesive and the incompatible compound may be phase-separated by reaction-induced phase separation to enlarge the concave structure. Further, in the hardening process of the acrylic adhesive, even incompatible compounds There is no problem in partial crosslinking with an acrylic adhesive (acrylic polymer or polymerizable unsaturated compound).

又,本發明之清潔用黏著劑層(清潔層)之形成方法,可 實施如下步驟作為步驟(1,)來代替上述步驟(1):將於放射 線硬化性或熱硬化性丙烯酸系黏著劑中,進而調配有可溶 解含有與上述丙烯酸系黏著劑不相容之化合物的黏著劑組 a物之有機溶劑的黏著劑組合物溶液,塗佈於基板上,進 而進行乾燥,藉此形成黏著劑組合物層,並且藉由上述有 機溶劑之乾燥,而形成具有上述丙烯酸系黏著劑與上述不 相容化合物之相分離結構的黏著劑層前驅物。於步驟 中,藉由使用有機溶劑,可調整黏著劑組合物溶液之黏 度’可設為易於塗佈於基板上之黏度。 作為上述有機溶劑,例如可列舉:甲苯、二甲苯等芳香 族烴’甲醇、乙醇等醇類,甲基乙基鋼等_,二: 醋、醋酸m旨類’此外可列舉可溶解上述黏著劑組合 物之溶劑。有機溶劑之使用量相對於1〇〇重 …σ 著劑組合物,通常為1〇〇〜1〇〇〇重量 击旦八 ?乂好的是200〜9〇〇 重里伤。若有機溶劑之使用量少於上述範圍,則存在p 情形:黏著劑組合物溶液之黏度上升’無法獲得=二 120368.doc -33- 200808933 =_易於塗佈之效果。又, 於上述範圍,則存在以下情形··黏著劑組合: = 過低,該黏者劑組合物溶液之塗佈厚度變薄,以又 無:獲得所期望厚度之清潔用黏著劑層(二 乂驟⑴)中’藉由黏著劑組合物溶 著劑組合物層,並且且^夜之乾而形成黏 驅物,且體而…Γ 離結構之黏著劑層前 溶液中:去=塗佈於上述基板上之黏著劑組合物Further, in the method for forming the cleaning adhesive layer (cleaning layer) of the present invention, the following step may be carried out as the step (1) instead of the above step (1): in the radiation curable or thermosetting acrylic adhesive Further, an adhesive composition solution capable of dissolving an organic solvent containing an adhesive group a compound which is incompatible with the above-mentioned acrylic adhesive, is applied onto a substrate, and further dried to form an adhesive composition. The material layer is dried by the organic solvent to form an adhesive layer precursor having a phase separation structure of the acrylic adhesive and the incompatible compound. In the step, the viscosity of the adhesive composition solution can be adjusted by using an organic solvent, and the viscosity can be easily applied to the substrate. Examples of the organic solvent include aromatic hydrocarbons such as toluene and xylene, alcohols such as methanol and ethanol, methyl ethyl steel, and the like, and two: vinegar and acetic acid, and the like, and the above-mentioned adhesive can be dissolved. The solvent of the composition. The amount of organic solvent used is relative to 1 〇〇 ... 着 composition, usually 1 〇〇 ~ 1 〇〇〇 weight 八? The good thing is 200~9〇〇. If the amount of the organic solvent used is less than the above range, there is a case where p: the viscosity of the solution of the adhesive composition rises 'cannot be obtained = two 120368.doc -33 - 200808933 =_ the effect of easy coating. Further, in the above range, there are the following cases: • Adhesive combination: = too low, the coating thickness of the adhesive composition solution is thinned, and there is no: obtaining a cleaning adhesive layer having a desired thickness (2) In the step (1)), the adhesive composition layer is formed by the adhesive composition, and the adhesive is formed by drying it overnight, and the body is ... Γ from the solution before the adhesive layer of the structure: go = coating Adhesive composition on the above substrate

應用普通加熱裝置心L:r 劑之方法,可 乾η & 、 ,、、、σ,、、、裝置,例如可列舉熱對流式 :熱循環式乾燥機、真空乾燥機、漂浮式烘箱等。 溫度為有機溶劑易於揮發,而上述不相容化合物並不 揮舍之溫度,通常為20〜戰,較好的是3〇〜6〇。。之範 =據上述不相容化合物來設定。除該方面以外,步驟 (1 )進仃與步驟(1)相同之操作。 於採用上述步驟(η之情形時,作為步驟(2,),藉由對上 述黏:劑組合物層進行放射線照射或加熱,使上‘丙烯酸 系黏者劑硬化,而將具有其硬化物與上述不相容化合物之 相分離結構的黏著劑層前驅物加以固定化。步驟(2,)進行 與步驛(2)相同之操作。以下,實施步驟(3)。 '、於步驟(3)中,自所獲得之黏著劑層前驅物除去 不相谷化合物。例如,作為步驟(3),可藉由加熱,而自黏 著劑層前驅物中除去不相容化合物。又,可藉由溶劑萃 取’而自黏著劑層前驅物中除去不相容化合物。藉此,可 於清潔用黏著劑層(清潔層)表面形成凹部。 120368.doc -34· 200808933 作為藉由加熱而除去不相容化合物之方法,可應用普通 加熱裝置’如’刊舉熱對流式乾燥機、熱循環式乾燥 機、真空乾燥機或漂浮式烘箱、熱風循環式烘箱等。作為 加熱溫度,考慮到不相容化合物之沸點及飛散溫度等,若 基材或產生凹部之清潔用黏著劑層(清潔層)並不因熱而變 形,則並無特別限定,就可有效除去之方面而言,通常較 好的是50〜2〇0。(:左右、更好的是1〇〇〜2〇η:左右之範圍。The method of using the common heating device core L:r agent can dry η & , , , , σ,,,, and the device, for example, heat convection type: thermal cycle dryer, vacuum dryer, floating oven, etc. . The temperature is such that the organic solvent is easily volatilized, and the above incompatible compound does not have a temperature, usually 20 to war, preferably 3 to 6 Torr. . Vanity = set according to the above incompatible compounds. In addition to this aspect, step (1) proceeds to the same operation as step (1). When the above step (n) is employed, as step (2), the above-mentioned adhesive composition layer is irradiated or heated to harden the upper acrylic adhesive, and the hardened material is cured. The adhesive layer precursor of the phase-separated structure of the above incompatible compound is immobilized. Step (2) is carried out in the same manner as in step (2). Hereinafter, step (3) is carried out. ', in step (3) Removing the non-phase compound from the obtained adhesive layer precursor. For example, as step (3), the incompatible compound may be removed from the adhesive layer precursor by heating. Further, the solvent may be removed by the solvent. Extracting and removing incompatible compounds from the adhesive layer precursor. Thereby, a recess can be formed on the surface of the cleaning adhesive layer (cleaning layer). 120368.doc -34· 200808933 As incompatibility is removed by heating The method of the compound can be applied to a common heating device 'such as 'publishing a heat convection dryer, a heat cycle dryer, a vacuum dryer or a floating oven, a hot air circulation oven, etc. As a heating temperature, considering the phase difference When the base material or the cleaning adhesive layer (cleaning layer) which produces a recessed part is not deformed by heat, the boiling point and the scattering temperature of the compound are not particularly limited, and it is usually preferable in terms of effective removal. It is 50~2〇0. (: Left and right, better is 1〇〇~2〇η: the range around.

又,於以溶劑自黏著劑層前驅物中萃取除去不相容化合 物之情形時’用於萃取不相容化合物之溶劑,根據形成: 陣之丙烯酸系清潔用黏著劑層(清潔層)、不相容化合物之 種類而靈活使用’ it常使用可自上述清潔用黏著劑°層(清 潔層)中萃取不相容化合物之有機溶劑。作為該溶劑,例 如可列舉曱苯、醋酸乙酯等。 又,可使用作為無毒、非危險物之液化二氧化碳或處灰 超臨界狀態之二氧化碳,來代替有機溶劑。作為用以利用 二氧化碳來除去不相容化合物之容器,若為可於加壓下这 行萃取除去之容器,則並無特別限^,可為批次式壓力笔 器’具有耐壓性之伸縮片、卷取裝置等中任—種。作為七 :生、流體之上述二氧化碳之供給機構,可由果、配管、❹ 專構成。 Μ你用黏署劑層(清 層”,如圖3所示,可以其非連續性凹部成為表面, 式’設置於支持體2之至少單面上作為清潔片(清潔則 片)。可直接使用上述製造方法中之基材作為支持體2 120368.doc •35· 200808933 者’可於清潔用黏著劑層(清潔層)ι之表面上,預先設置八 離器。 ^刀 士上述清潔片可用作標籤片。於使用上述清潔片之情形 時’如圖4所示’可於設置有具有上述凹部之清潔用黏著 劑層(清潔層)!的支持體2之另一面上,設置固定用黏著劑 运^者,可於黏著劑層3之表面上,預先設置分離器。 所:t用黏者劑層3 ’只要滿足普通黏著功能’則對其材 :、亚無特別限定’可使用普通黏著劑(例如,丙烯酸 糸、橡膠系等)。黏著劑層3亦可使用雙面膠帶。黏著劑層 3可將清潔片貼附於各種基板或其他膠帶·片等搬送構: 上,作為具清潔功能之搬送構件搬送至裝置内 清洗部位接觸而進行清潔。 定/…、破 ^為貼附有清潔片之搬送構件,並無特別限定 半導體晶圓、LCD、PDP等平板顯示器用基板,: 他光碟、磁電阻頭等之基板等❶ - j述點著劑層3,為了再利用上述基板等搬送構件,於 /月冻後自該黏著劑声3 4丨 5 a 4層3剝離基板之情形時,較好的是粦宴 劑層3可易於自基板剝離 疋^耆 於访曰π 黏者劑層3之接者力,若為相對 於矽晶圓(鏡面)之180。剝離 w5N/1〇mm/l 力 GNmmm、尤 可县认 軸左右’則於搬送中未剝離’且清潔後 可易於再剝離,故較佳。 月,糸後 具清潔功能之搬送構件,較好的是 狀小於搬送構件之形狀4片之形 清潔片大於搬送構件Lm 構件端部伸出。於 形狀的6形時,有時於搬送裝置内 120368.doc -36 - 200808933 部清潔片附著於裳置,或者卡在搬送系統,使裳置益法正 常運轉。 對於如上所述之具清潔功能之搬送構件的製造方法,並 無特別限定,例如可將清潔片貼附於基板等搬送構件,來 製造清潔用搬送構件。該愔 mi *於m 列舉以下方式:貼附 大於搬达構件之清潔片後,沿構件形狀切割清 (以下,稱為直接切割方式);或者將預先切割加工處理: 搬l構件幵/狀之清潔用標籤片貼附於搬送構件 二 潔用搬送構件之方式(以下,稱為預先切割方式)。月 ⑺清潔層(平均開口徑:0.1〜3 μηι) 又,本發明之清潔用黏著劑層(清潔層)1之表面S中的凹 部a之比例(存在屮盧、>, w 5甲的凹 主 率,較好的是凹部a之投影面積相對於 表面S之總投影面藉 、對於 是15%〜嫩 例為15%〜90%。上述比例較好的 。更好的是20%〜70%。再者,所神 積,係指以顯微浐έ本二^ 明上述投影面 凹部a的情形時^窥觀察清潔用黏著劑層(清潔層)!之 邙a之浐旦、 作為凹部a之部位的面積比率。於凹 -之面積過小之情形時,存在實 層(清潔層)之接荖六去π政 、月〆糸用黏者劑 情形時所期望法充分表現用作清潔層之 之投影面二 送性的情形。另一方面,於凹部a 之接著力顯著下降,I…用黏者劑層(清潔層) 形。又,〇 …法獲侍所期望之異物捕集性的情 低,破壞凹部之㈣ U你層)表面之财摩擦性過 又… 於搬送時逆污染基板之情形。 ° a之開口部形狀’與上述⑴清潔層(平均開口 120368.doc -37- 200808933 徑:10 μιη以下)之情形相同。 ^述凹部&之開口部,較好的是其平均開口徑為 平:二,為小於平均異物尺寸之微細口。上述開口部之 =開口徑更好的是〇ι〜2 μιη。若上述凹部&之開口部大 下之:物尺寸,X’其數量過多’則有異物之捕集效果 显*如上所述藉由設為微細π’可捕集廣泛尺寸之 經二?如,若上述開口部之開口徑為1〇㈣左右,則可 固凹°P或平面部分來捕集直徑為10 μηι以上之異 難以捕集直徑小㈣μηι之異物。另—方面,如本 發明所不,甚蔣:μ、+、 Λ 1 ^ 夺述凹&之開口部的平均開口徑設為如 _之微細口 ’則可捕集開口徑以上大小之異物,因 /立卞之異物的粒梭範圍變廣。開口部之開口徑意指各 二::最大直徑,平均開口徑如實施例術,係指藉 θ分析而獲得的各開口部之最大直徑的平均值。 、、又’上述開口徑之標準偏差較好的是G.7 _以下,將上 ^ 卩之開口控控制為其大小成為大致相同之大小。上 述開口梭之標準偏I更好的是G.6 μιη以下。 上述清潔用黏著劑層(清潔層)表面之凹部的開口部分 佈’較好的是與相鄰開口部之中心距離的標準偏差為i陣 二更部之分散為均勻。上述中心距離之標準 立 的疋 μΠ1以下。再者,所謂上述「相鄰開口 一」::指中心距離最小之開口部彼此,所謂「中心距 」〜私以直線連接開口部之中心點時之長度。 對於凹部a之剖面形狀並無特別規定,就凹部尺寸 120368.doc -38 - 200808933 之控制性而言,較好的是半球狀,與上述(i)清潔層(平均 開口徑:10 μπι以下)相同。 又,上述凹部a之深度(h)相對於清潔用黏著劑層(清潔 層)1之厚度(H)的比(h/H)較好的是0·01〜0· 1。清潔用黏著劑 層(清潔層)1之厚度(H)及上述凹部a之深度(h)為各自之平 均值。凹部a之大小,於剖面形狀為半球狀之情形時,由 凹部a之深度(h)決定。於上述比(h/H)超過〇1之情形時,存Further, in the case where the solvent is extracted from the adhesive layer precursor to remove the incompatible compound, the solvent for extracting the incompatible compound is formed according to the formation of the acrylic adhesive layer (cleaning layer), Flexible use of compatible compounds. It is often used as an organic solvent which extracts incompatible compounds from the above-mentioned cleaning adhesive layer (cleaning layer). Examples of the solvent include decene, ethyl acetate and the like. Further, instead of the organic solvent, carbon dioxide which is a non-toxic, non-hazardous substance or a carbon dioxide in a supercritical state may be used. As a container for removing incompatible compounds by using carbon dioxide, if it is a container which can be extracted and removed under pressure, there is no particular limitation, and the batch type pressure pen can be stretched with pressure resistance. Any one of a sheet, a winding device, and the like. As a supply mechanism of the above-mentioned carbon dioxide of the raw material and the fluid, it can be composed of a fruit, a pipe, and a concrete. ΜYou use the adhesive layer (clear layer), as shown in Figure 3, the discontinuous recess can be the surface, and the formula can be placed on at least one side of the support 2 as a cleaning sheet (cleaning sheet). The substrate in the above manufacturing method is used as the support 2 120368.doc •35· 200808933 The 'offer can be pre-set on the surface of the cleaning adhesive layer (cleaning layer) ι. It is used as a label sheet. In the case of using the above-mentioned cleaning sheet, 'as shown in Fig. 4', the other side of the support body 2 provided with the cleaning adhesive layer (cleaning layer) having the above-mentioned concave portion can be provided for fixing. For the adhesive agent, a separator may be provided on the surface of the adhesive layer 3. The adhesive layer 3' is used as long as it satisfies the ordinary adhesive function, and the material is: Ordinary adhesive (for example, enamel, rubber, etc.). Double-sided tape can also be used for the adhesive layer 3. The adhesive layer 3 can attach the cleaning sheet to various substrates or other tapes and sheets, etc. The conveying member with the cleaning function is transported into the device The cleaning part is cleaned by contact with the cleaning part. The fixing member is attached to the conveying member to which the cleaning sheet is attached, and the substrate for a flat panel display such as a semiconductor wafer, an LCD, or a PDP is not particularly limited, and the substrate of the optical disk or the magnetoresistive head is used. In the case of the agent layer 3, in order to reuse the transport member such as the above substrate, it is preferable to shed the substrate from the adhesive sound 3 4 丨 5 a 4 layer 3 after/after freezing. The agent layer 3 can be easily peeled off from the substrate, and the contact force of the adhesive layer 3 is 180, which is 180 with respect to the silicon wafer (mirror surface). The peeling w5N/1〇mm/l force GNmmm, especially It is preferable that the left and right sides of the county can not be peeled off during transportation and can be easily peeled off after cleaning. It is preferable that the conveying member having a cleaning function after the month is preferably smaller than the shape of the conveying member. The cleaning sheet is larger than the end portion of the conveying member Lm. When the shape is 6-shaped, sometimes the cleaning sheet 120368.doc -36 - 200808933 is attached to the skirt, or stuck in the conveying system, so that the shelf is beneficial. The normal operation of the method. For the conveying member with the cleaning function as described above The manufacturing method is not particularly limited. For example, the cleaning sheet can be attached to a conveying member such as a substrate to produce a cleaning conveying member. The 愔mi* is m in the following manner: after attaching a cleaning sheet larger than the conveying member, The shape of the member is cut (hereinafter, referred to as a direct cutting method); or the pre-cut processing is performed: the cleaning label sheet of the member member is attached to the conveying member and the cleaning member (hereinafter referred to as a pre-cutting member) Cutting method). month (7) cleaning layer (average opening diameter: 0.1 to 3 μηι) Further, the ratio of the concave portion a in the surface S of the cleaning adhesive layer (cleaning layer) 1 of the present invention (there is a 屮, , , , w 5 A concave main rate, it is preferable that the projected area of the concave portion a is relative to the total projection surface of the surface S, and is 15% to 90% to 15% to 90%. The above ratio is better. More preferably 20% to 70%. In addition, the product is referred to as a cleaning adhesive layer (cleaning layer) when the projection surface concave portion a is formed by a microscopic transcript. The area ratio of the portion which is the concave portion a after 邙a. In the case where the area of the concave-concave is too small, there is a solid layer (cleaning layer) which is required to fully exhibit the projection surface of the clean layer when the adhesive layer is used. The situation. On the other hand, the adhesion force in the concave portion a is remarkably lowered, and I... is formed by an adhesive layer (cleaning layer). In addition, the law of the 获 ... method is limited by the fact that the foreign object is trapped by the servant, and the ruin of the recess (4) U layer) is the friction of the surface. The shape of the opening portion of ° a is the same as the case of the above (1) cleaning layer (average opening 120368.doc -37 - 200808933 diameter: 10 μmη or less). The opening portion of the concave portion & preferably has an average opening diameter of equal to two: a fine opening smaller than the average foreign matter size. The opening portion = the opening diameter is preferably 〇ι 2 2 μιη. If the opening of the recessed portion & is larger than the size of the object and the number of X' is too large, the trapping effect of the foreign matter is remarkable. * As described above, by setting the fine π', it is possible to capture a wide range of sizes. For example, when the opening diameter of the opening is about 1 〇 (four), the concave portion P or the flat portion can be recessed to collect a foreign matter having a diameter of 10 μm or more and it is difficult to trap a small diameter (four) μηι. On the other hand, as in the case of the present invention, the average opening diameter of the opening of the concave & the concave opening & is set to a micro-portion such as _, and the foreign matter of the size larger than the opening diameter can be trapped. The range of the grain shuttle due to the foreign matter of the 卞 变 is widened. The opening diameter of the opening means the maximum diameter, and the average opening diameter is, as in the embodiment, the average value of the maximum diameters of the respective opening portions obtained by the θ analysis. Further, the standard deviation of the above-mentioned opening diameter is preferably G.7 _ or less, and the opening control of the upper 卩 is controlled to have the same size. The standard deviation I of the above-mentioned opening shuttle is preferably G.6 μηη or less. It is preferable that the opening portion of the concave portion of the surface of the cleaning adhesive layer (cleaning layer) is a standard deviation from the center of the adjacent opening portion, and the dispersion of the second portion is uniform. The above-mentioned center distance standard is 疋 μΠ1 or less. Further, the above-mentioned "adjacent opening 1" means the length of the opening portion where the center distance is the smallest, and the "center distance" to the center point of the opening portion. The cross-sectional shape of the concave portion a is not particularly limited, and the controllability of the concave portion size 120368.doc -38 - 200808933 is preferably hemispherical, and the above (i) cleaning layer (average opening diameter: 10 μπι or less) the same. Further, the ratio (h/H) of the depth (h) of the concave portion a to the thickness (H) of the cleaning adhesive layer (cleaning layer) 1 is preferably from 0. 01 to 0.1. The thickness (H) of the cleaning adhesive layer (cleaning layer) 1 and the depth (h) of the above-mentioned concave portion a are their respective average values. The size of the concave portion a is determined by the depth (h) of the concave portion a when the cross-sectional shape is hemispherical. When the above ratio (h/H) exceeds 〇1,

在凹部a過深,凹部壁面之強度不充分之情形。又,若上 述比(h/H)小於〇·01,或小於等於〇〇1,則存在所必需之異 物捕集性不充分的情形。上述比(h/H)較好的是設為 0·01〜0.05之範圍。 ’ 於本發明中,藉由形成如上所述之具有凹部結構之清潔 用黏著劑層(清潔層),可降低清潔用黏著劑層(清潔層)表 面與黏附體之接著面積,另一方面,#由設為微細之凹: 結構,因相對於大於凹部開口徑之異物,接著面積增加, 故可確實地捕集異物。χ,凹部開口徑無不均,將凹部均 勻分散至清潔用黏著劑層(清潔層)表面,藉此可抑 之特性不均。 上述清潔用黏著劑層(清潔層)之抗張彈性模數較好的θ 二Mpa〜500 Mpa。若清潔用黏著劑層(清潔層)之抗張彈: ㈣超過500 Mpa,則清潔用黏著劑層(清潔層)表面之黏 ,力下降’存在即使於該清潔用黏著劑層(清潔層)形成凹 ::亦無法表現異物捕集功能之情形。又,小於MPa之 情形時’即使於清潔用黏著劑層(清潔層)表面形成凹部, 120368.doc -39· 200808933 ^進仃搬祕評價之情形時,亦有表面結構變形,導致接 者於搬送裝置內立[J夕者 ϊ、t> ° *。上述Μ潔用黏著劑層(清潔層)之 抗張彈性模數較好的9 数杈好的疋1〇 MPa〜3⑽MPa,更好的是1〇 服〜200 MPa。該等清潔用黏著劑層(清潔層)之抗張彈性 可根據上述丙烯酸系黏著劑之組成,例如丙烯酸系 聚合物與聚合性不飽和化合物(單體成分、募聚物成幻之 調配量等來適當設定。 _又,本發明之清潔用黏著劑層(清潔層),於將其用作清 凉片之π 4層之情形時相對於矽晶圓之9〇。剝離接著力, 與上述⑴清潔層(平均開口徑:10μηι以下)之情形相同。 ;將本發月之’月潔用黏著劑層(清潔層)用作清潔片 之清潔層之情形時,以2 kg之加重使直徑為5G mm之金屬 片於清潔層上緊貼3分鐘,於室溫23,c下以拉伸速度1〇〇 mm/刀鐘垂直抬起金屬片時所施加之力(垂直剝離力),較 好的是G 4·5 N。若為該範圍,則認為本發明中不僅保持 異物捕集性,並且實質上獲得搬送性。 本發明之清潔用黏著劑層(清潔層),若為具有具上述凹 部之結構且具有黏著性者,則對其材質或結構等並無特別 限定’與上述(1)清潔層(平均開口徑:1〇 以下)之情形 相同。 關於上述放射線硬化性或熱硬化性丙烯酸系黏著劑、重 里平均分子量、外部交聯劑、引發劑、其他添加劑,亦與 上述(1)清潔層(平均開口徑:1〇 μπι以下)之情形相同。 至於本發明之清潔用黏著劑層(清潔層)之形成方法,如 120368.doc 200808933 上所述,若為可形成表面上具有非連續性凹部之清潔用黏 著劑層(清潔層)之方法,則無特別限制,可藉由對含有上 述丙烯酸系聚合物之放射線硬化性或熱硬化性丙烯酸系黏 著劑,實施上述步驟(1)至(3)而進行。 於步驟⑴中,藉由將黏著劑組合物溶液塗佈於基材 上,進行乾燥而形成黏著劑組合物層,該黏著劑組合㈣ 液係將於含有丙烯酸系聚合物之放射線硬化性或熱硬化性 丙烯酸系黏著劑中進而調配與上述丙烯酸系聚合物不相容 之化合物的黏著劑組合物,溶解於包含溶解上述丙稀酸系 聚合物之溶劑⑷以及使上述丙婦酸系聚合物與上述不相 *化合物二者相容之相容溶劑(B)的混合溶劑中而成者。 上述不相各化合物,係用以於清潔用黏著劑層(清潔層 :面形成凹部之對丙稀酸系黏著劑之相容性 添: Γ上述不相容ί合物,若為可與上述丙稀酸系黏著劑混 0且於形成黏者劑組合物層時可進行相分離者 職制。上述黏著劑組合物由於以溶液使用,因此較二寺 疋將黏者劑組合物塗佈於基材後’於溶劑除去過 相分離者。作;^ μ、+、T 4 + ^ θ 、、 …述不相谷化合物之相分離程度,較好的 疋於液體狀態下與丙婦酴糸 、 態者。 ㈣夂系黏者劑G谷液)形成液相分離狀 上述不相谷化合物’可使用對丙烯酸系黏著劑之相 :人:低’且具有於溶劑乾燥時並不揮發之程度 化合物。例如,關於相衮— 點之 •數為7以上,則易Μ 丙豨酸系聚合物之 、易於與丙烯酸系黏著劑進行相分離,易 120368.doc -41- 200808933 於形成相分離結構。若χ參數為7以下,則難以產生相分 離,且組成之微小變化會影響相分離。因此,易於受到溶 劑乾燥條件之影響,難以穩定形成結構。又,上述χ參數 較好的是7·5以上,更好的是8以上。χ參數,可以基於When the concave portion a is too deep, the strength of the wall surface of the concave portion is insufficient. Further, when the above ratio (h/H) is less than 〇·01 or less than or equal to 〇〇1, there is a case where the necessary foreign matter collection property is insufficient. The above ratio (h/H) is preferably in the range of from 0. 01 to 0.05. In the present invention, by forming the cleaning adhesive layer (cleaning layer) having the concave structure as described above, the adhesion area of the surface of the cleaning adhesive layer (cleaning layer) and the adhering body can be reduced, and, on the other hand, #由为细的凹: The structure, because the foreign matter is larger than the opening diameter of the concave portion, and then the area is increased, so that the foreign matter can be reliably collected. χ, the opening diameter of the concave portion is not uneven, and the concave portion is uniformly dispersed to the surface of the cleaning adhesive layer (cleaning layer), whereby unevenness in characteristics can be suppressed. The above-mentioned cleaning adhesive layer (cleaning layer) has a tensile modulus of elasticity of preferably θ 2 Mpa to 500 Mpa. If the anti-tensioning of the cleaning adhesive layer (cleaning layer): (4) exceeds 500 Mpa, the adhesion of the surface of the cleaning adhesive layer (cleaning layer) is reduced, and the force is reduced even in the cleaning adhesive layer (cleaning layer) Forming a concave:: It is also impossible to express the foreign matter trapping function. In addition, when it is less than MPa, even if a concave portion is formed on the surface of the cleaning adhesive layer (cleaning layer), the surface structure is deformed, resulting in the deformation of the surface structure. The transport device is inline [J ϊ ϊ, t > ° *. The above-mentioned adhesive layer (cleaning layer) has a good tensile modulus of 9 杈 〇 MPa 〜 3 (10) MPa, more preferably 1 〜 〜 200 MPa. The tensile elasticity of the cleaning adhesive layer (cleaning layer) may be based on the composition of the above acrylic adhesive, for example, an acrylic polymer and a polymerizable unsaturated compound (monomer component, polymer blending amount, etc.) _ In addition, the cleaning adhesive layer (cleaning layer) of the present invention is used as the π 4 layer of the cooling sheet with respect to the 矽 wafer. The peeling force is the same as (1) above. The same is true for the cleaning layer (average opening diameter: 10 μηι or less). When the monthly cleaning adhesive layer (cleaning layer) is used as the cleaning layer of the cleaning sheet, the diameter is 2 kg. The 5G mm metal piece is placed on the cleaning layer for 3 minutes, and the force (vertical peeling force) is applied when the metal piece is lifted vertically at a stretching speed of 1 〇〇mm/knife at room temperature 23, c. In the present invention, it is considered that not only the foreign matter collecting property but also the transport property is obtained in the present invention. The cleaning adhesive layer (cleaning layer) of the present invention has the above-mentioned If the structure of the recess is sticky and the material is The quality, structure, and the like are not particularly limited to the same as in the case of the above (1) cleaning layer (average opening diameter: 1 Torr or less). The above-mentioned radiation curable or thermosetting acrylic adhesive, weight average molecular weight, and external crosslinking The agent, the initiator, and other additives are also the same as the above (1) cleaning layer (average opening diameter: 1 〇μπι or less). As for the cleaning adhesive layer (cleaning layer) of the present invention, for example, 120368. Doc 200808933, the method for forming a cleaning adhesive layer (cleaning layer) having a discontinuous concave portion on the surface is not particularly limited, and may be performed by radiation hardening containing the above acrylic polymer or The thermosetting acrylic adhesive is carried out by performing the above steps (1) to (3). In the step (1), the adhesive composition solution is applied onto a substrate and dried to form an adhesive composition layer. The adhesive composition (4) liquid system is further blended with the above-mentioned acrylic resin in a radiation curable or thermosetting acrylic adhesive containing an acrylic polymer. An adhesive composition of a compound incompatible compound, dissolved in a solvent (4) containing the above-mentioned acrylic acid-based polymer, and a compatible solvent compatible with both the above-mentioned propylene-based polymer and the above-mentioned non-phase compound The mixed solvent of (B) is the same. The above-mentioned incompatible compounds are used for the adhesive layer for cleaning (cleaning layer: the compatibility of the surface forming concave portion with the acrylic acid adhesive: Γ The compatible composition can be phase-separated if it is miscible with the above-mentioned acrylic adhesive and forms a layer of the adhesive composition. The above adhesive composition is used as a solution, so the two temples涂布 After the adhesive composition is applied to the substrate, the phase separation is removed in the solvent. The ratio of phase separation of the non-phase compound is better than that of ^μ, +, T 4 + ^ θ, In the state of liquid, it is the same as that of women. (4) The bismuth-based adhesive G-liquid) forms a liquid phase separation. The above-mentioned non-phase-valer compound ' can be used as a phase of an acrylic-based adhesive: human: low' and has a degree of non-volatility when the solvent is dried. For example, when the number of dots is 7 or more, the acrylic acid polymer is easily separated from the acrylic adhesive, and the phase separation structure is formed in the form of 120368.doc -41 - 200808933. If the χ parameter is 7 or less, phase separation is difficult to occur, and small changes in composition affect phase separation. Therefore, it is easy to be affected by the drying conditions of the solvent, and it is difficult to form a structure stably. Further, the above enthalpy parameter is preferably at least 7.5, more preferably at least 8. χ parameters can be based on

Flory-Huggins理論之相互作用常數,定義為%參數 ^(νΜΊχδγδΟ2。V!:莫耳容積,R ••氣體常數,τ :絕 對溫度,δ :溶解度參數。又,於5〇〜6(rc附近乾燥上述混The interaction constant of Flory-Huggins theory is defined as % parameter ^(νΜΊχδγδΟ2. V!: molar volume, R • gas constant, τ: absolute temperature, δ: solubility parameter. Also, near 5〇~6(rc Dry the above mix

合溶劑之情形時,若使用沸點為19(rc以上者,作為上述 不相容化合物,則溶劑乾燥時並不揮發,可形成相分離結 構。上述不相容化合物之沸點較好的是2〇〇〇c以上,更好 的是200〜300°C。 、關於上述不相容化合物及其調配量,與上述(丨)清潔層 (平均開口徑:10μΓη以下)之情形相同。 上述黏著劑組合物溶液之製備,可藉由將上述不相容化 口物’經由溶劑,與上述丙烯酸系黏著劑混合而進行。作 為溶劑’可使用包含使上述丙烯酸系黏著劑中所使用之丙 :酸糸聚合物溶解之溶劑(Α)以及使上述丙烯酸系聚合物 二W相谷化σ物一者相容之相容溶劑(Β)的混合溶 劑。 ^溶劑⑷,可根據丙烯酸系聚合物之種類,來適當 二可二句溶解丙稀酸系聚合物者。若以作為溶解性指標 系聚二:示上述溶劑⑷’則較好的是使用相對於丙烯酸 〇物之χ參數為3以者。 在 %參數超過3之情形時,存 、乂〆谷解丙烯酸系聚合物之情形 ㈡屯。上述χ參數更好的是 120368,doc -42- 200808933 〇·34 〜2.8 者。 作為上述溶劑⑷,例如可列舉:丁烧、己燒、庚烧、 甲苯、鄰一甲苯、間二甲苯、對二甲苯、環己炫、二乙 輕異丙㈱—丁醚、二苄醚、四氫呋喃、丙酮、甲基乙 基酮、甲基異丁某酮、,+ Π 2-庚酮(甲基戊基酮)、二異丁酮、 環己_(環己a同,an〇ne)、甲基環己酮、環戊酮、醋酸戍 醋、醋酸甲醋、醋酸乙醋、醋酸丙醋、醋酸丁醋、Ν,Ν-二 曱基甲胺(DMF)、Ν,Ν-二甲基乙醯胺(DMAc)、Ν_曱基吡 Β各烧_等。作為上述有機溶劑,較好的是醋酸乙醋、甲 苯、二甲苯等。 另一方面,相容溶劑(Β)係使上述丙烯酸系聚合物與上 述不相谷化δ物一者相容者,且可使用與溶劑(Α)相容 者。相容溶劑(Β),較好的是使用χ參數相對於丙烯酸系聚 合物較好的是G.5〜3,更好的是G.5〜2 8,相對於不相容化 合物較好的是0.5〜3,更好的是以〜以者。若相容溶劑(b) 之上述χ參數在上述範圍外,則存在作為黏著劑組合物溶 液,無法使丙烯酸系黏著劑與上述不相容化合物於溶液中 均勻分散之情形。 上述相容溶劑(Β) ’根據丙烯酸系'聚合物、不相容化合 物、溶劑(Α)之種類來適當選擇.作為上述相容溶劑 例如較適合的是醇系溶劑。作為醇系溶劑,例如可列舉: 甲醇 '乙醇、異丙醇、1-戍醇、環己醇、2_甲基環己:、 2-甲氧基乙醇、2-乙氧基乙醇、2_ 丁氡基乙醇等。該等之 中,較適合的是曱醇、乙酵^ 120368.doc -43- 200808933 上述溶劑(A)與相容溶劑(B)之混合比,若可均勻混合丙 烯酸系聚合物、聚合性不飽和化合物及不相容化合物,則 並無特別限定,通常較好的是溶劑(A)/相容溶劑 (B)=l/3〜3/1(重量比)。若溶劑(A)/相容溶劑In the case of a solvent, if a boiling point of 19 or more is used as the above-mentioned incompatible compound, the solvent does not volatilize when dried, and a phase separation structure can be formed. The boiling point of the above incompatible compound is preferably 2〇. 〇〇c or more, more preferably 200 to 300 ° C. The above-mentioned incompatible compound and its blending amount are the same as those in the above (丨) clean layer (average opening diameter: 10 μΓη or less). The preparation of the solution can be carried out by mixing the incompatible opening 'with a solvent with the acrylic adhesive. The solvent can be used to contain the C: strontium used in the above acrylic adhesive. a solvent in which the polymer is dissolved (Α) and a mixed solvent of a compatible solvent (Β) which is compatible with one of the above-mentioned acrylic polymer W phase glutenated σ. ^ Solvent (4), depending on the type of the acrylic polymer, It is preferable to dissolve the acrylic polymer in the following two sentences. If the solvent (4) is used as the solubility index, it is preferable to use the ruthenium parameter of 3 with respect to the ruthenium acrylate. % In the case where the number exceeds 3, the case where the acrylic polymer is stored in the solution and the glutinous solution (2) 屯. The above χ parameter is preferably 120368, doc - 42 - 200808933 〇 · 34 ~ 2.8. As the above solvent (4), for example Listed: butadiene, hexane, g-burn, toluene, o-toluene, m-xylene, p-xylene, cyclohexyl, diethylene isopropyl isopropyl ether, dibenzyl ether, tetrahydrofuran, acetone, methyl ethyl Ketone, methyl isobutyl ketone, + Π 2-heptanone (methyl amyl ketone), diisobutyl ketone, cyclohexyl _ (cyclohexa a, an〇ne), methylcyclohexanone, Cyclopentanone, acetic acid vinegar, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, hydrazine, hydrazine-dimercaptomethylamine (DMF), hydrazine, hydrazine-dimethylacetamide (DMAc) And the above-mentioned organic solvent is preferably ethyl acetate, toluene, xylene or the like. On the other hand, the compatible solvent (Β) is the above-mentioned acrylic polymer and the above It is compatible with one of the gluten-free δ materials, and can be used with a solvent (Α). Compatible solvent (Β), preferably using χ parameters relative to acrylic polymer Preferably, G.5~3, more preferably G.5~2, is preferably 0.5~3 relative to the incompatible compound, more preferably it is ~. If compatible solvent (b) When the above enthalpy parameter is out of the above range, there is a case where the acrylic adhesive and the above-mentioned incompatible compound are uniformly dispersed in the solution as the adhesive composition solution. The above compatible solvent (Β) 'according to the acrylic type' The type of the polymer, the incompatible compound, and the solvent are appropriately selected. The above-mentioned compatible solvent is, for example, preferably an alcohol solvent. Examples of the alcohol solvent include methanol 'ethanol, isopropyl alcohol, and 1 - decyl alcohol, cyclohexanol, 2-methylcyclohexane: 2-methoxyethanol, 2-ethoxyethanol, 2-butanylethanol, and the like. Among these, a suitable mixing ratio of the above solvent (A) and the compatible solvent (B) is decyl alcohol and ethylene glycol (120368.doc -43-200808933), and if the acrylic polymer is uniformly mixed, the polymerization property is not The saturated compound and the incompatible compound are not particularly limited, and usually the solvent (A) / compatible solvent (B) = 1 / 3 to 3 / 1 (weight ratio) is preferred. If solvent (A) / compatible solvent

以下㈣以上,則存在無法均勻混合之情形二為在導3 致清潔用黏著劑層(清潔層)無法形成均勻之凹部妹構的情 形。再者’以上述混合溶劑,將黏著劑組合物通常調整為 固形分濃度較好的是5〜50重量% ’更好的是5〜3〇重量%, 更好的是10〜25重量%之溶液。 上述黏著劑組合物溶液,藉由使用溶劑(A)及相容溶劑 ⑻之混合溶劑,而成為均勾狀態,較好的是如於相容溶 劑⑻不存在之狀態下產生相分離之 則於步驟⑺中,就形成丙稀酸系黏著劑=: 化口物之相分離結構而言較佳。 、精由將上述黏著劑組合物溶液塗佈於支持體上,乾燥上 卜而形成黏著劑組合物層。作為該形 =種方法,與上述⑴清潔層(平均心徑:1〜以;; 清黏著劑組合物層之厚度或基材,亦與上述⑴ / (句開口徑:10 μιη以下)之情形相同。 广而’關於步驟(2)’亦與上述⑴清潔層(平 1〇 μιη以下)之情形相同。 或加::於:述基材上之黏著劑組合物層進行放射線照射 戈加熱時,亦與上述⑴清潔層(平均開口徑:1〇卿以下) 120368.doc -44- 200808933 之情形相同。 作為覆蓋膜,並盔縣— 乂 …、特別限疋,與上述(1)清潔層(平均開 口徑:10 _以下)之情形相同。 上述丙烯酸系黏荖南|,β Μ根據其硬化性而進行放射線照射 ::、、、。作為放射線,可列舉紫外線、電子束等。作為硬 方法,就其步驟方面而言,較好的是紫外線硬化。藉 此’將形成於基材上之凹姓 ^ — 凹、、、〇構固疋。又,硬化時,丙烯酸 系黏著劑與不相容化人4 1 ν "物亦可進而藉由反應誘發相分離而 進行相分離,擴大凹結構 、 僻但較佳恶樣為·凹部之開口部 大致為圓形,其平均開口蔣 釭為〇. 1〜3 μχη,上述開口徑之標 準偏差成為0.7 μιη以下 〇 ’將開口部之分佈控制為以與 相鄰開口部之中心距離的桿 +偏差成為1 以下之範圍。 再者’於丙烯酸系黏著劑之硬化過程中,不相容化合物即 使與丙烯酸系黏著劑(丙烯酸系聚合物或聚合性不飽和化 合物)進行一部分交聯’亦無問題。 繼而,於步驟(3、Φ,& &说 自所獲得之黏著劑層前驅物中除 去不相今化合物’該情形時,亦與上述⑴清潔層(平均開 仫10 μπι以下)之情形相同,除去方法亦相同。 又’關於以洛劑自黏著劑層前驅物中萃取除去不相容化 合物之情形’亦與上述(1)清 义U厂月/糸層(千均開口徑:1 〇 μιη以 下)之情形相同。 又,可使用作為叙I、韭产 、、、母非危險物之液化二氧化碳或處於 超臨界狀態之二氧化碳,來 术代替有機溶劑,該情形時,亦 與上述(1)清潔層(平均開 J同口徑· 10陣以下)相同。 120368.doc -45- 200808933 層)ι,盘上主 發明之清潔用#著劑層(清潔 如03所、 層(平均開口徑:10 _以下)同樣,In the following (4) or more, there is a case where the mixture cannot be uniformly mixed, and the second embodiment is that the cleaning adhesive layer (cleaning layer) cannot form a uniform concave portion. Further, with the above mixed solvent, the adhesive composition is usually adjusted to a solid content of preferably 5 to 50% by weight, more preferably 5 to 3 % by weight, still more preferably 10 to 25% by weight. Solution. The above-mentioned adhesive composition solution is in a homogenous state by using a mixed solvent of the solvent (A) and the compatible solvent (8), and it is preferred that the phase separation occurs in the absence of the compatible solvent (8). In the step (7), it is preferred to form an acrylic acid-based adhesive =: a phase-separated structure of a chemical substance. The above adhesive composition solution is applied onto a support and dried to form an adhesive composition layer. As the method of the above-mentioned type, the above (1) cleaning layer (average diameter: 1 to Å;; thickness or substrate of the adhesive composition layer, and the above (1) / (sentence opening diameter: 10 μιη or less) The same is true. The same as in the case of the above (1) cleaning layer (below 1 〇 μηη), or the following: or the following: The adhesive composition layer on the substrate is irradiated with radiation. It is also the same as the above (1) cleaning layer (average opening diameter: 1 〇qing) 120368.doc -44- 200808933. As a cover film, and helmet county - 乂..., especially limited, with the above (1) cleaning layer (The average opening diameter: 10 Å or less) is the same. The above-mentioned acrylic viscous | | , , β β β β 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 放射 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸 丙烯酸In terms of the steps, it is preferred that the ultraviolet curing is carried out, whereby the concave shape formed on the substrate is concave, and the crucible is fixed. Further, when hardened, the acrylic adhesive is not Compatible person 4 1 ν " Phase separation is carried out by reaction-induced phase separation, and the concave structure is enlarged, but it is preferable that the opening of the concave portion is substantially circular, and the average opening is 〇. 1~3 μχη, the standard deviation of the above opening diameter 0.7 μιη or less 〇 'The distribution of the opening is controlled so that the rod + deviation from the center of the adjacent opening becomes 1 or less. In addition, during the hardening of the acrylic adhesive, the incompatible compound is even There is no problem in performing partial crosslinking with an acrylic adhesive (acrylic polymer or polymerizable unsaturated compound). Then, in the step (3, Φ, && said from the obtained adhesive layer precursor In the case of removing the incompatible compound, the same as in the case of the above (1) cleaning layer (average opening of 10 μπι or less), the removal method is also the same. Further, the extraction of the precursor from the adhesive layer is removed. The case of the content of the compound is also the same as the case of the above (1) the Uyue/糸 layer of the Uygur (the average permeation diameter: 1 〇μιη or less). The liquefied carbon dioxide of the mother non-hazardous substance or the carbon dioxide in the supercritical state replaces the organic solvent, and in this case, it is also the same as the above (1) clean layer (average opening J, the same diameter, less than 10 arrays). -45- 200808933 Layer) ι, the cleaning agent used for the main invention on the plate (cleaning as in 03, layer (average opening diameter: 10 _ or less),

H不’可以其非連續性凹部成為表面之方式,設置 j持體2之至少單面上作為清潔片(清潔用黏著片)。可直 用上述製化方法中之基材作為支持體2。再者,可於 絮用黏著劑層(清潔層}1之表面上,預先設置分離器。 以上述方式獲得的本發明之清潔用#著劑層(清潔 运)1與上述(1)清潔層(平均開口徑:1〇哗以下)同樣, 如圖3所不,可以其非連續性凹部成為表面之方式,設置 於支持體2之至少單面上作為清潔片(清潔用黏著片),可直 接使用上述製造方法中之基材作為支持體2。再者,可於 黏著劑層3之表面上,預先設置分離器。 關於固定用黏著劑層3,與上述⑴清潔層(平均開口徑·· μηι以下)相同。 作為貼附有清潔片之搬送構件,並無特別限定,與上述 (1)清潔層(平均開口徑:1 〇 以下)之情形相同。 上述黏著劑層3,於為可再利用上述基板等搬送構件, 而於清潔後自該黏著劑層3剝離基板之情形時,較好的是 黏著劑層3可易於自基板剝離,黏著劑層3之接著力,與上 述(1)清潔層(平均開口徑·· 10 μπι以下)相同。 對具清潔功能之搬送構件及其製造方法,並無特別限 定,與上述(1)清潔層(平均開口徑:10 μπι以下)之情形相 同。 (3)清潔層(Ra ·· 0·01〜0.3 μπι) 120368.doc -46- 200808933 又’本發明之清潔用黏著劍層(清_表面s之凹部a 的比例(存在比率)、或凹部a之開口部形狀,與上述⑴清 潔層(平均開口徑:10μιη以下)相同。 :’上述凹部a之開口部可根據異物尺寸之大小來適當 凋整,將凹部a之開口部大小(平均開口徑)調整為小於平均 異物尺寸。於大於平均異物尺寸之情形時,又,若其數量 過多,則有異物之捕集效果下降之虞。例如,於異物尺= 為1〜_㈣左右之顆粒的情形時,通常凹部⑽口部較 好的是其平均開口徑為〇1〜〜左右、更好的是〜 μιη之微細凹結構 '再者,凹部&之開口部大小(平均開口 徑)’就異物捕集性而言’可使用具有小於作為除去對象 之異物尺寸之直徑(平均開口徑)者。 又’對凹部a之剖面形狀並無特別規定,但京尤凹部尺寸 之控制性而言,較好的是半球狀,與上述⑴清潔層(平均 開口徑:10 μπι以下)相同。 又,上述凹部a之深度(…相對於清潔用黏著劑層(清潔 層)1之厚度(H)的比(h/H),與上述⑴清潔層(平均開^ :: 10 μιη以下)相同。 二 又,於上述表面s中,凹部a以外之平面狀表面b之中心 線平均粗度(Ra)較好的bG1〜G3 _。更好的是 μιη。若上述中心線平均粗度㈣小於〇〇ι陣,則就搬送 性方面而吕欠佳。又,^上述中心線平均粗度(Ra)超過〇 3 μπι,則就異物捕集性方面而言,較不理想。 · 上述清潔用躲著劑層(清潔層)較好的是其抗張彈性模數 120368.doc •47- 200808933 ^ 〇別Mpa〜500 Mpa。若清潔用黏著劑層(清潔層)之抗張 彈ί生权數,過5GG MPa,則存在清潔用黏著劑層(清潔層) 、Ά著力下降’即使於該清潔用黏著劑層(清潔層)形 成凹部二亦無法表現異物捕集功能之情形。又,於小於10 MPa之⑼日守’即使於清潔用黏著劑層(清潔層)表面形成 酋P於進行搬送性評價之情形時,亦有表面結構變形, =致接著於搬运製置内部之虞。上述清潔用黏著劑層(清 糸3)之抗張彈性模數較好的是1〇 〜3〇〇 Mpa,更好的 ^ MPa 200 MPa。該等清潔用黏著劑層(清潔層)之抗張 =數’可根據上述丙稀酸系黏著劑之組成,例如丙稀 S夂系聚合物與聚合性不飽和 <匕合物(單體成分、寡聚物成 分)之調配量等來適當設定。 關於本發明之清潔用黏著劑層(清潔層)於將其用作 /月/’I片之π濾層之情形時的相對於矽晶圓之9〇。剝離接著 力或其材質或結構等,亦與上述(1)清潔層(平均開口 徑:10 μηι以下)相同。 又,關於上述放射線硬化性或熱硬化性丙烯酸系黏著 劑、重量平均分子量、外部交聯劑、引發劑、其他添加 劑’亦與上述⑴清潔層(平均開口徑:10 μηι以下)相同。 本發明之清潔用黏著劑層(清潔層)之形成方法,如上所 述,若為可形成表面上具有非連續性凹部之清潔用黏著劑 層(清潔層)之方法,則無特別限制,可藉由實施上述步驟 (1)至(3)而進行。 於步驟(1)中,將於放射線硬化性或熱硬化性丙烯酸系 120368.doc •48- 200808933 黏著劑中,進而調配與上述丙烯酸系黏著劑不相容之化合 物的黏著劑組合物,塗饰於支持體上,形成黏著劑組合物 層。上述不相容化合物,係用以於清潔用黏著劑層(=潔 層)表面上形成凹部之對丙烯酸系黏著劑之相容性較低的 添加劑。上述不相容化合物,若為可與上述丙婦酸系黏著 劑此合’且於形成黏著劑組合物層時可進行相分離者,則 無特別限制。通常,將黏著劑組合物用作溶液,因此較好 的是將黏著劑組合物塗佈於基材後,於溶劑除去過程中進 行相T離者。作為上述不相容化合物之相分離程度,較適 口的疋於液體狀您下與丙烯酸系黏著劑(溶液)形 離狀態者。 上述黏著劑組合物之製備、上述不相容化合物及其 调配里、上述黏著劑組合物層之厚度、以及上述基材,亦 與域⑴清潔層(平均開口徑:1〇_以下)相同。 ▲而’於步驟(2)中,對上述黏著劑組合物層進行放射 線照射或加熱,使上述丙烯酸系黏著劑硬化,並且形成且 匕物與上述不相容化合物之相分離結構的黏著劑層 月焉£物。 之黏著劑組合物層進行放射線照射 為進行丙烯㈣黏著劑之硬化,抑制交聯之氧 人物屏矣而认、 十-面之更千滑化’而對黏著劑組 二二制;M覆域覆蓋之狀態下’實施硬化處理。藉 产系黏著劑硬化時之氧阻礙所造成之硬化 又乂U之下降。又’作為覆蓋膜,較好的是使用具有 120368.doc •49- 200808933 中〜線平均粗度(Ra)為〇·〇ι〜〇·3 之表面者,以覆蓋膜之 具有上述中心線平均粗度(Ra)之表面成為上述黏著劑組合 物層之表面側的方式覆蓋。藉由使用該覆蓋膜,可將上述 中心線平均粗度(Ra)之表面轉印於清潔用黏著劑層(清潔 層)表面,將相分離之凹部以外之清潔用黏著劑層(清潔層) 表面控制為中心線平均粗度^勾為〇〇1〜〇3 pm。 作為覆蓋膜,並無特別限定,與上述⑴清潔層(平均開 口徑·· 10 μπι以下)之情形相同。 對上述丙烯㈣黏著劑,根據其硬化性進行放射線昭射 或加熱1於放射線及硬化方法,與上述⑴清潔層(平均 開口m _以下)相同,又’硬化時,丙烯酸系黏著劑 與不相容化合物亦可進而藉由反應誘發相分離而進行相分 離’擴大凹結構。再者’於丙烯酸系黏著劑之硬化過程 2,不相容化合物即使與丙烯酸系黏著劑(丙烯酸系聚合 物或聚合性不飽和化合物)進行—部分交聯,亦無問題。 容:,本發明之清潔用黏著劑層(清潔層)之形成方法,可 貝施如下步驟作為步驟(Γ -^ 替上述步驟(1) ··將於放射 ==性或熱硬化性丙_系黏著财,進而調配可溶解 2 ”上述丙烯酸糸黏著劑不相容之化合物的黏著劑板人 進溶劑的黏著劑組合物溶液’塗佈於基板上,進: 溶劑1:燁==劑組合物層’並且藉由上述有機 容化合物之相分離:二逑丙蝉酸系點著劑與上述不相 …“離“籌的黏著劑層前驅物 中,藉由使用有機溶劑 〜驟(1) 了5 周整黏著劑組合物溶液之黏 120368.doc -50- 200808933 度’可設為易於塗佈於基板上之黏度。 闕於上述有機溶劑及其有機溶齊 Γ 之使用旦盘 清潔層(平均—徑:…喊下)相同。里’與上述⑴ 於步驟(r)中,藉由黏著劑 黏著劑組合物層,並且為形=之乾燥,而形成 前驅物,具體而令,若自=有結構之黏著劍層 物溶液中除去有機溶劑即可:著劑組合H does not have a non-continuous concave portion as a surface, and at least one surface of the j holding body 2 is provided as a cleaning sheet (an adhesive sheet for cleaning). The substrate in the above-described chemical conversion method can be used as the support 2 as it is. Further, a separator may be provided in advance on the surface of the adhesive layer (cleaning layer) 1. The cleaning agent layer (cleaning) 1 and the above (1) cleaning layer of the present invention obtained in the above manner are obtained. (Average opening diameter: 1 inch or less) Similarly, as shown in FIG. 3, the discontinuous concave portion may be provided as a surface, and may be provided on at least one surface of the support body 2 as a cleaning sheet (a cleaning adhesive sheet). The substrate in the above-described production method is used as the support 2. The separator can be provided in advance on the surface of the adhesive layer 3. The fixing adhesive layer 3 and the above (1) cleaning layer (average opening diameter· The transfer member to which the cleaning sheet is attached is not particularly limited, and is the same as the case of the above (1) cleaning layer (average opening diameter: 1 〇 or less). The adhesive layer 3 is When the substrate is transported from the adhesive layer 3 after cleaning, it is preferable that the adhesive layer 3 can be easily peeled off from the substrate, and the adhesive force of the adhesive layer 3 is the same as above (1). ) clean layer (average opening The same applies to the conveying member having a cleaning function and the method for producing the same, and is the same as the above (1) cleaning layer (average opening diameter: 10 μπι or less). (3) Cleaning Layer (Ra ··0·01~0.3 μπι) 120368.doc -46- 200808933 Further, the cleaning adhesive layer of the present invention (the ratio of the concave portion a of the surface s (the ratio), or the opening of the concave portion a) The shape is the same as the above-mentioned (1) cleaning layer (average opening diameter: 10 μm or less). : 'The opening of the concave portion a can be appropriately smeared according to the size of the foreign matter, and the opening size (average opening diameter) of the concave portion a is adjusted to When the amount is larger than the average foreign matter size, if the number is too large, the trapping effect of the foreign matter may be reduced. For example, when the foreign matter ruler is a particle of about 1 to _ (four), usually The mouth portion of the concave portion (10) preferably has a mean opening diameter of about 1 to about 1, more preferably a fine concave structure of ~ μηη, and the size of the opening (average opening diameter) of the concave portion & Sexually 'The diameter (average opening diameter) which is smaller than the size of the foreign matter to be removed can be used. Further, the cross-sectional shape of the concave portion a is not particularly limited, but the controllability of the size of the Jingyou concave portion is preferably hemispherical. The same as (1) the cleaning layer (average opening diameter: 10 μπι or less). The ratio of the depth of the concave portion a (... to the thickness (H) of the cleaning adhesive layer (cleaning layer) 1 (h/H) It is the same as the above (1) cleaning layer (average opening: :: 10 μηη or less). Further, in the above surface s, the center line average roughness (Ra) of the planar surface b other than the concave portion a is preferably bG1 to G3. _. More preferably μιη. If the average thickness of the centerline (4) is less than 〇〇ι, then the transportability is not good. Further, when the average center line thickness (Ra) of the center line exceeds 〇 3 μm, it is less desirable in terms of foreign matter collection property. · The above-mentioned cleaning agent layer (cleaning layer) is preferably a tensile modulus of elasticity 120368.doc •47- 200808933 ^ Screening Mpa~500 Mpa. If the adhesion coefficient of the cleaning adhesive layer (cleaning layer) is 5 GG MPa, there is a cleaning adhesive layer (cleaning layer), and the squeezing force is lowered. Even in the cleaning adhesive layer (cleaning layer) The formation of the concave portion 2 also does not indicate the foreign matter trapping function. In addition, when the surface of the cleaning adhesive layer (cleaning layer) is formed on the surface of the cleaning adhesive layer (cleaning layer), the surface structure is deformed when it is less than 10 MPa (9), and the surface structure is deformed. Hey. The above-mentioned cleaning adhesive layer (clearing 3) preferably has a tensile modulus of 1 〇 to 3 〇〇 Mpa, more preferably MPa 200 MPa. The tensile modulus of the cleaning adhesive layer (cleaning layer) may be based on the composition of the above acrylic adhesive, such as an acrylonitrile-based polymer and a polymerizable unsaturated salt. The amount of the component, the oligomer component, and the like are appropriately set. Regarding the cleaning adhesive layer (cleaning layer) of the present invention, it is 9 相对 with respect to the ruthenium wafer when it is used as the π filter layer of the /month/'I sheet. The peeling adhesion force or its material or structure is also the same as the above (1) cleaning layer (average opening diameter: 10 μηι or less). Further, the radiation curable or thermosetting acrylic adhesive, the weight average molecular weight, the external crosslinking agent, the initiator, and the other additives are also the same as the above (1) cleaning layer (average opening diameter: 10 μηι or less). The method for forming the cleaning adhesive layer (cleaning layer) of the present invention is not particularly limited as long as it is a method of forming a cleaning adhesive layer (cleaning layer) having a discontinuous concave portion on the surface as described above. This is carried out by carrying out the above steps (1) to (3). In the step (1), an adhesive composition of a compound which is incompatible with the above-mentioned acrylic adhesive is prepared in a radiation curable or thermosetting acrylic 120368.doc • 48-200808933 adhesive, and is coated. On the support, a layer of the adhesive composition is formed. The above incompatible compound is an additive which is less compatible with an acrylic adhesive which forms a concave portion on the surface of the cleaning adhesive layer (= cleansing layer). The above-mentioned incompatible compound is not particularly limited as long as it can be combined with the above-mentioned propylene glycol-based adhesive and can be phase-separated when the adhesive composition layer is formed. Usually, the adhesive composition is used as a solution, and therefore it is preferred to apply the adhesive composition to the substrate and perform phase separation during solvent removal. As the degree of phase separation of the above incompatible compound, it is more suitable for the liquid form and the state of the acrylic adhesive (solution). The preparation of the above adhesive composition, the above-mentioned incompatible compound and its formulation, the thickness of the above-mentioned adhesive composition layer, and the above-mentioned substrate are also the same as the domain (1) cleaning layer (average opening diameter: 1 Å or less). ▲In the step (2), the above-mentioned adhesive composition layer is irradiated with radiation or heated to harden the acrylic adhesive, and an adhesive layer having a phase separation structure of the above-mentioned incompatible compound is formed. Moon 焉 物. The adhesive composition layer is irradiated with radiation to perform hardening of the propylene (tetra) adhesive, inhibiting the cross-linked oxygen person's screen and recognizing, and the ten-face is more slippery', and the adhesive group is two or two; In the state of covering, 'hardening treatment is performed. The hardening caused by the oxygen barrier during the hardening of the adhesive is reduced. Further, as the cover film, it is preferred to use a surface having a mean thickness (Ra) of 368·〇ι~〇·3 in the range of 120368.doc •49-200808933 to cover the film having the above-mentioned centerline average The surface of the thickness (Ra) is covered by the surface side of the above-mentioned adhesive composition layer. By using the cover film, the surface of the center line average roughness (Ra) can be transferred onto the surface of the cleaning adhesive layer (cleaning layer), and the cleaning adhesive layer (cleaning layer) other than the phase-separated concave portion can be removed. The surface control is the center line average roughness ^ hook is 〇〇1~〇3 pm. The cover film is not particularly limited, and is the same as the case of the above (1) cleaning layer (average opening diameter: 10 μm or less). The propylene (tetra) adhesive is subjected to radiation irradiation or heating 1 according to the curability thereof, and is irradiated and cured in the same manner as in the above (1) cleaning layer (average opening m _ or less), and in the case of hardening, the acrylic adhesive is not in phase. The bulk compound can also be subjected to phase separation by reaction-induced phase separation to expand the concave structure. Further, in the hardening process of the acrylic adhesive 2, the incompatible compound is not problematic even if it is partially crosslinked with an acrylic adhesive (acrylic polymer or polymerizable unsaturated compound). Capacitor: The method for forming the cleaning adhesive layer (cleaning layer) of the present invention can be carried out as a step (Γ-^ for the above step (1) ··will be radiation==sexual or thermosetting _ Adhesively bonding, and then formulating an adhesive composition solution for dissolving 2" of the above-mentioned acrylic acid-based adhesive-incompatible compound, onto the substrate, and applying: Solvent 1: 烨== combination of agents The layer 'and the phase separation by the above organic-capacity compound: the dimercapto-acid-based dot-donating agent does not correspond to the above-mentioned "from the "adhesive layer precursor" by using an organic solvent - (1) The viscosity of the solution of the adhesive composition for 5 weeks is 120368.doc -50-200808933 degree' can be set to be easy to apply on the substrate. The use of the above-mentioned organic solvent and its organic solvent is used to clean the layer ( Average - diameter: ... shouted) the same. In the above (1) in step (r), by the adhesive agent composition layer, and the shape = dry, forming a precursor, specifically, if =The structure of the adhesive sword layer solution can be removed from the organic solvent The agent composition

可應用普通加熱裝置。作為加 ^之方法, 4m & 勹U置,例如可列舉熱對流 式“機、熱循環式乾燥機、真空乾燥 等。加熱溫度係有機㈣易於揮發,而上述㈣容化= 並不揮發之溫度’通常較好的是20〜1〇(rc、更好的是 30〜60C之範圍,根據上述不相容化合物來設定。除該方 面以外步驟(1 ’)進行與步驟(1)相同之操作。 2用上述步驟(1’)之情形時,作為步驟(2,),藉由對上述 黏著劑組合物層進行放射線照射或加熱,使上述丙烯酸系 黏著劑硬化,而將具有其硬化物與上述不相容化合物之相 分離結構的黏著劑層前驅物固定化。步驟(2,)進行與步驟 (2)相同之操作。以下,實施步驟(3)。 繼而,步驟(3)中,自所獲得之黏著劑層前驅物中除去 不相容化合物。例如,作為步驟(3),可藉由加熱而自黏著 劑層前驅物中除去不相容化合物。又,可藉由溶劑萃取, 而自黏著劑層前驅物中除去不相容化合物。藉此,可於清 潔用黏著劑層(清潔層)表面形成凹部。 作為藉由加熱而除去不相容化合物之方法,可應用普通 120368.doc -51- 200808933 加熱裝置,與上述(1)清 >糸層(平均開口徑·· 1 〇 以下)相 同。 又,以溶劑自黏著劑層前驅物中萃取除去不相容化合物 之情形,與上述(1)清潔層(平均開口徑·· 1〇 μπι以下)相 同〇 又,可使用作為無毒、非危險物之液化二氧化碳或處於 超臨界狀態之二氧化碳,來代替有機溶劑,該情形時,亦 與上述(1)清潔層(平均開口徑·· 10μπι以下)相同。A common heating device can be applied. As a method of adding, 4m & U, for example, a heat convection type "machine, a heat cycle dryer, vacuum drying, etc.. The heating temperature is organic (4) is easy to volatilize, and the above (4) capacity = non-volatile The temperature ' is usually preferably from 20 to 1 Torr (r, more preferably from 30 to 60 C, and is set according to the above incompatible compound. Step (1 ') is the same as step (1) except for this aspect. In the case of the above step (1'), as the step (2), the acrylic adhesive is cured by radiation irradiation or heating of the above-mentioned adhesive composition layer, and the cured adhesive is cured. The adhesive layer precursor of the phase separation structure of the above incompatible compound is immobilized. Step (2) is carried out in the same manner as in the step (2). Hereinafter, the step (3) is carried out. Then, in the step (3), The incompatible compound is removed from the obtained adhesive layer precursor. For example, as step (3), the incompatible compound may be removed from the adhesive layer precursor by heating. Further, by solvent extraction, Self-adhesive layer The incompatible compound is removed from the extrudate, whereby a recess can be formed on the surface of the cleaning adhesive layer (cleaning layer). As a method of removing the incompatible compound by heating, ordinary 120368.doc -51-200808933 can be applied. The heating device is the same as the above (1) clearing layer (average opening diameter · 1 〇 or less). Further, the solvent is extracted from the adhesive layer precursor to remove the incompatible compound, and the above (1) The cleaning layer (average opening diameter · 1 〇μπι or less) is the same, and liquefied carbon dioxide as a non-toxic, non-hazardous substance or carbon dioxide in a supercritical state can be used instead of the organic solvent, and in this case, also with the above (1) The cleaning layer (average opening diameter · 10 μm or less) is the same.

以上述方式獲得之本發明之清潔用黏著劑層(清潔 層Η,與上述(1)清潔層(平均開口徑:1〇 μιη以下)同樣= 如圖3所示,可以其非連續性凹部成為表面之方式,設置 於支持體2之至少單面上作為清潔片(清潔用黏著片),可直 接使用上述製造方法中之基材作為支持體2。再者,清潔 用黏著劑層(清潔層口之表面上,可預先設置分離器。“ 又,與上述0)清潔層(平均開口徑:1〇μιη以下)同樣 上述清潔片可用作標籤片。於使用上述清“之情形時| 如圖4所不,可於設置有具有上述凹十 u办層㈣支持體2之另-面上,設置固定用黏著。 再者,可於黏著劑層3之表面上,贱設置分離器。g 關於固定用黏著劑層3,與上述⑴清潔層(平均 . 10 μιη以下)相同。 h · 作為貼附有清潔片之搬送構件,並無特別 、 ⑴清潔層(平均開口徑:10叫以下)之情形相同。、上述 又’為再利用上述基板等搬送構件,上述#著劑層3較 120368.doc -52- 200808933 好的是於清潔後自該黏著劑層3剝離基板之情形時,黏著 劑層3可易於自基板剝離,黏著劑層3之接著力,與上述 清潔層(平均開口徑:10 μπι以下)相同。 對具清潔功能之搬送構件及其製造方法,並無特別限 疋,與上述(1)清潔層(平均開口徑:1〇 μχη以下)之情形相 •同。 - 實施例 以下,根據實施例說明本發明,但本發明並非限定於該 等者。再者,以下,所謂份,係指重量份。%〜表示重量 平均分子量,Μη表示數量平均分子量,Mw/Mn表示聚合 物分子量之分散度。 (1)清潔層(平均開口徑:1 〇 μηχ以下) 實施例1 -1 (紫外線硬化性丙烯酸系黏著劑之製備) 相對於自包含70份之丙烯酸丁酯、30份之丙烯酸乙_、 1份之丙烯酸、5份之丙烯酸2-羥乙酯之單體混合液而獲得 之作為原料聚合物之丙烯酸系聚合物(Mw約為85萬, Mw/Mn為9)100份,添加40份之多官能胺基甲酸酯丙稀酸 酉旨(日本合成化學公司製造,商品名:UV1700B)作為聚合 性不飽和化合物,添加2份之聚異氰酸酯化合物(日本聚胺 酉旨工業公司製造,商品名:Coronate L)及1份之聚環氧化 合物(三菱瓦斯化學公司製造,商品名:Tetrad C)作為交 聯劑,進而添加3份之光聚合引發劑(lrgacure 651,汽巴精 化公司製造),進而使用醋酸乙酯均勻混合,製備濃度調 120368.doc -53- 200808933 正為18重里%之紫外線硬化性丙烯酸系黏著劑之溶液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於上述黏著劑溶液中’相對㈣溶液所含之丙烯酸系聚 合物及聚合性不飽和化合物之合計1〇〇份(固形分),均勻混 合25份之1,3-丙二醇(Kishida化學公司製造)作為用以進行 相分離之不相容化合物,製備紫外線硬化性丙烯酸系黏著 劑組合物之溶液。 (清潔片之製作) 將上述黏著劑組合物溶液,塗佈於寬度為2〇〇瓜瓜、厚 度為50 μιη之支持體用聚酯系膜之單面上,使乾燥後之厚 度成為35 μηι,於室溫乾燥4分鐘,形成以丨,3_丙二醇形成 凹部之黏著劑組合物層。繼而,⑥黏著劑組合物層之表面 貼附厚度為50 μπι之聚酯系剝離膜,繼而進行紫外線照 射,硬化丙烯酸系黏著劑,使凹部之結構固定化,形成具 有相分離結構之黏著劑層前驅物。其後,除去聚咖離 膜,於15CTC下加熱10分鐘,除去形成凹部之匕夂丙二醇, 獲得黏著片。將該黏著片於5〇r下保持72小時,蝕刻清潔 用黏著劑層(清潔層)。 主將上述黏著片作為清潔片。又,將黏著劑溶液塗佈於該 清潔片之支持體膜的未設置上述黏著劑層(清潔層)之側, 使乾燥後之厚度成為20 μιη,設置固定用黏著劑層,製作 於其表面貼附有聚酯系剝離膜之清潔片。進而,將固定用 黏著劑層於50°C加溫72小時,蝕刻黏著劑層。 再者,固定用黏著劑溶液係以下述方法製備者。於具備 120368.doc -54· 200808933 /jiil度什、授拌機、氮氣導入管及回流冷卻管之内容量為 500 ml之三口燒瓶型反應器中,調配投入73份之丙烯酸2_ 乙基己酯、10份之丙烯酸正丁酯、15份之N,n_二曱基丙烯 醯胺及5份之丙烯酸,作為聚合引發劑之〇15份之2,2-偶氮 雙異丁腈、100份之醋酸乙酯,使總體成為2〇〇 g,一面導 入氮氣約1小時,一面攪拌後,以氮氣置換内部之空氣。 其後’將内部温度設為5 8 °C,於該狀態下保持約4小時進 行聚合,獲得丙烯酸系聚合物溶液。相對於i 00份之丙烯 酸系聚合物溶液,均勻混合3份之聚異氰酸酯化合物(日本 聚胺酯工業公司製造’商品名:Coronate L),獲得固定用 黏著劑溶液。 實施例1 - 2 (紫外線硬化性丙烯酸系黏著劑之製備) 相對於自包含70份之丙烯酸丁酯、30份之丙烯酸乙酯、 1份之丙烯酸、5份之丙烯酸2-羥乙酯之單體混合液而獲得 之作為原料聚合物之丙稀酸系聚合物(Mw約為85萬, Mw/Mn為9)100份,添加30份之多官能胺基甲酸酯丙烯酸 酯(曰本合成化學公司製造:商品名:UV1700B)作為聚合 性不飽和化合物,添加2份之聚異氰酸酯化合物(日本聚胺 酯工業公司製造,商品名:Coronate L)及1份之聚環氧化 合物(三菱瓦斯化學公司製造,商品名:Tetrad C),作為 父聯劑,進而添加3份之光聚合引發劑(Irgacure 65 1,汽巴 精化公司製造),進而使用醋酸乙酯均勻混合,製備濃度 調整為18重量%之紫外線硬化性丙烯酸系黏著劑之溶液。 120368.doc -55- 200808933 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於上述黏著劑溶液中,相對於該溶液所含之丙烯酸系聚 合物及聚合性不飽和化合物之合計1〇〇份(固形分),均勻混 合25份之1,3-丙二醇(Kishida化學公司製造),作為用以進 行相分離之不相容化合物,製備紫外線硬化性丙烯酸系黏 著劑組合物之溶液。 以下,除使用上述所製備之黏著劑組合物溶液以外,以 與實施例1-1相同之方式,製作清潔片。The cleaning adhesive layer of the present invention obtained in the above manner (cleaning layer 同样 is the same as the above (1) cleaning layer (average opening diameter: 1 〇 μηη or less) = as shown in Fig. 3, the discontinuous concave portion can be The surface is provided on at least one side of the support 2 as a cleaning sheet (an adhesive sheet for cleaning), and the substrate in the above manufacturing method can be directly used as the support 2. Further, the cleaning adhesive layer (cleaning layer) The separator may be provided in advance on the surface of the mouth. "Also, with the above 0" cleaning layer (average opening diameter: 1 〇 μηη or less), the above cleaning sheet can also be used as a label sheet. 4, a fixing adhesive may be provided on the other surface provided with the above-mentioned concave support layer (four) support body 2. Further, a separator may be provided on the surface of the adhesive layer 3. The fixing adhesive layer 3 is the same as the above-mentioned (1) cleaning layer (average. 10 μm or less). h · There is no special conveying member to which the cleaning sheet is attached. (1) Cleaning layer (average opening diameter: 10 or less) The same situation. 'In order to reuse the above-mentioned substrate or the like, the above-mentioned #-patent layer 3 is better than 120368.doc -52-200808933. When the substrate is peeled off from the adhesive layer 3 after cleaning, the adhesive layer 3 can be easily applied from the substrate. The peeling force of the adhesive layer 3 is the same as that of the above-mentioned cleaning layer (average opening diameter: 10 μπι or less). There is no particular limitation on the conveying member having a cleaning function and the manufacturing method thereof, and the above (1) cleaning layer (The average opening diameter: 1 〇μχη or less) is the same as in the following. - EXAMPLES Hereinafter, the present invention will be described based on examples, but the present invention is not limited thereto. Further, the following is a part by weight. %〜 represents a weight average molecular weight, Μη represents a number average molecular weight, and Mw/Mn represents a dispersion degree of a polymer molecular weight. (1) Cleaning layer (average opening diameter: 1 〇μηχ or less) Example 1-1 (ultraviolet curable acrylic acid) Preparation of an adhesive) as a raw material from a monomer mixture containing 70 parts of butyl acrylate, 30 parts of acrylic acid, 1 part of acrylic acid, and 5 parts of 2-hydroxyethyl acrylate 100 parts of an acrylic polymer (Mw of about 850,000, Mw/Mn of 9), and 40 parts of polyfunctional urethane acrylate (manufactured by Nippon Synthetic Chemical Co., Ltd., trade name: UV1700B) As a polymerizable unsaturated compound, 2 parts of a polyisocyanate compound (manufactured by Nippon Polyamide Co., Ltd., trade name: Coronate L) and 1 part of a polyepoxide (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name: Tetrad) C) As a crosslinking agent, 3 parts of a photopolymerization initiator (lrgacure 651, manufactured by Ciba Specialty Chemicals Co., Ltd.) was further added, and then ethyl acetate was uniformly mixed to prepare a concentration adjustment of 120368.doc -53-200808933. A solution of a UV curable acrylic adhesive. (Preparation of ultraviolet curable acrylic pressure-sensitive adhesive composition) In the above adhesive solution, a total of 1 part (solid content) of the acrylic polymer and the polymerizable unsaturated compound contained in the (four) solution is uniformly mixed. A 1,3-propanediol (manufactured by Kishida Chemical Co., Ltd.) was used as an incompatible compound for phase separation to prepare a solution of an ultraviolet curable acrylic adhesive composition. (Preparation of cleaning sheet) The above-mentioned adhesive composition solution was applied to one side of a polyester film for a support having a width of 2 guaguas and a thickness of 50 μm, and the thickness after drying was 35 μm. It was dried at room temperature for 4 minutes to form a layer of an adhesive composition in which a concave portion was formed with hydrazine and 3-propylene glycol. Then, a polyester-based release film having a thickness of 50 μm is attached to the surface of the 6-adhesive composition layer, followed by ultraviolet irradiation to harden the acrylic adhesive, and the structure of the concave portion is fixed to form an adhesive layer having a phase-separated structure. Precursor. Thereafter, the poly-free film was removed and heated at 15 CTC for 10 minutes to remove the propylene glycol which formed the concave portion, thereby obtaining an adhesive sheet. The adhesive sheet was held at 5 Torr for 72 hours, and an adhesive layer (cleaning layer) for etching was etched. The main adhesive sheet is used as a cleaning sheet. Further, the adhesive solution was applied to the side of the support film of the cleaning sheet on the side where the adhesive layer (cleaning layer) was not provided, and the thickness after drying was 20 μm, and a fixing adhesive layer was provided to be formed on the surface. A cleaning sheet with a polyester release film attached thereto. Further, the fixing adhesive layer was heated at 50 ° C for 72 hours to etch the adhesive layer. Further, the fixing adhesive solution was prepared by the following method. Into a three-necked flask type reactor having a capacity of 120368.doc -54·200808933 /jiil, a mixer, a nitrogen inlet tube and a reflux cooling tube, the content of 73 parts of 2-ethylhexyl acrylate was adjusted. 10 parts of n-butyl acrylate, 15 parts of N,n-didecyl acrylamide and 5 parts of acrylic acid, as a polymerization initiator, 15 parts of 2,2-azobisisobutyronitrile, 100 parts The ethyl acetate was adjusted to 2 〇〇g in total, and nitrogen gas was introduced for about 1 hour while stirring, and the inside air was replaced with nitrogen. Thereafter, the internal temperature was set to 58 ° C, and polymerization was carried out for about 4 hours in this state to obtain an acrylic polymer solution. To the 00 parts of the acrylic acid polymer solution, 3 parts of a polyisocyanate compound (trade name: Coronate L, manufactured by Japan Polyurethane Industry Co., Ltd.) was uniformly mixed to obtain a fixing adhesive solution. Example 1 - 2 (Preparation of ultraviolet curable acrylic adhesive) Relative to self-contained 70 parts of butyl acrylate, 30 parts of ethyl acrylate, 1 part of acrylic acid, and 5 parts of 2-hydroxyethyl acrylate 100 parts of an acrylic polymer (Mw of about 850,000, Mw/Mn of 9) obtained as a raw material polymer, and 30 parts of polyfunctional urethane acrylate (sodium complex) Chemical company: trade name: UV1700B) As a polymerizable unsaturated compound, 2 parts of a polyisocyanate compound (manufactured by Japan Polyurethane Industry Co., Ltd., trade name: Coronate L) and 1 part of a polyepoxide (Mitsubishi Gas Chemical Co., Ltd.) , product name: Tetrad C), as a parent agent, and further added 3 parts of photopolymerization initiator (Irgacure 65 1, manufactured by Ciba Specialty Chemicals Co., Ltd.), and then uniformly mixed with ethyl acetate to prepare a concentration adjusted to 18% by weight. A solution of an ultraviolet curable acrylic adhesive. 120368.doc -55-200808933 (Preparation of ultraviolet curable acrylic adhesive composition) In the above adhesive solution, a total of 1 part of the acrylic polymer and the polymerizable unsaturated compound contained in the solution (Solid form), 25 parts of 1,3-propanediol (manufactured by Kishida Chemical Co., Ltd.) was uniformly mixed, and as an incompatible compound for phase separation, a solution of an ultraviolet curable acrylic pressure-sensitive adhesive composition was prepared. Next, a cleaning sheet was produced in the same manner as in Example 1-1 except that the above-prepared adhesive composition solution was used.

實施例1-3 (紫外線硬化性丙烯酸系黏著劑之製備) 相對於自包含70份之丙烯酸丁醋、3〇份之丙烯酸乙醋、 1伤之丙烯酸、5份之丙烯酸2_羥乙酯之單體混合液而獲得 之作為原料聚合物之丙烯酸系聚合物(Mw約為Μ萬, Mw/Mn為9)1〇〇份,添加4〇份之多官能胺基甲酸醋丙缚酸 西曰(日本合成化學公司製造,商品名:作為聚合 性不飽和化合物’添加2份之聚異氰酸醋化合物(日本聚胺 知工業公司製造’商品名:c〇r〇nate卩及i份之聚環氧化 合物(三菱瓦斯化學公司製造,商品名:Tetrad 〇,作為 交聯劑’進而添加3份之光聚合引發劑(We 651,汽巴 精化公司製造)’冑而使用醋酸乙酯與乙醇之混合溶劑均 句混合,製備濃度調整為18重量%之紫外線硬化性丙婦酸 糸黏著劑之溶液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於上述黏著劑溶液中,相斟 T邗對於邊溶液所含之丙烯酸系聚 120368.doc •56- 200808933 合物及聚合性不飽和化合物之合計100份(固形分),均勻混 合10份之丙二醇(Kishida化學製造),作為用以進行相分離 之不相容化合物,製備紫外線硬化性丙烯酸系黏著劑組合 物之溶液。 以下’除使用上述所製備之黏著劑組合物溶液以外,以 與實施例1 -1相同之方式,製作清潔片。 實施例1 - 4 (紫外線硬化性丙烯酸系黏著劑之製備) 相對於自包含70份之丙烯酸丁酯、3〇份之丙烯酸乙酯、 1份之丙烯酸、5份之丙烯酸2_羥乙酯之單體混合液而獲得 之作為原料聚合物之丙烯酸系聚合物(Mw約為85萬, ]^〜/]^11為9)100份,添加35份之多官能胺基甲酸酯丙烯酸 酯(日本合成化學公司製造,商品名· : UV1700B)作為聚合 性不飽和化合物,添加2份之聚異氰酸酯化合物(日本聚胺 酯工業公司製造,商品名:Coronate L)及1份之聚環氧化 合物(三菱瓦斯化學公司製造,商品名:Tetrad c),作為 交聯劑,進而添加3份之光聚合引發劑(Irgacure 651,汽巴 精化公司製造),進而使用醋酸乙酯均勻混合,製備濃度 調整為18重量%之紫外線硬化性丙烯酸系黏著劑之溶液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 上述黏著劑溶液中,相對於該溶液所含之丙烯酸系聚合 物及聚合性不飽和化合物之合計1〇〇份(固形分),均勻混合 10份之乙二醇(Kishida化學製造),作為用以進行相分離之 不相容化合物,製備紫外線硬化性丙烯酸系黏著劑組合物 120368.doc -57- 200808933 之溶液。 (清潔片之製作) 將上述黏著劑组合物溶液,塗佈於寬度為200随、厚 度為50 μιη之支持體用聚I系膜之單面上,使乾燥後之厚 度成為35 μπι ’於室溫下乾燥4分鐘,形成以乙二醇形成凹 部之黏著劑組合物層。繼而,料著劑組合物層表面貼附 厚度為5〇 μΐΠ2聚醋系剝離膜,繼而進行紫外線照射,硬 :丙烯酸系黏著劑’使將凹部之結構固定化,形成具有相 刀離、、構之黏|劑層前驅物。其後,除去聚醋系剝離膜, :峨下加熱10分鐘,除去形成凹部之乙二醇,獲得黏 著片將》亥黏著片於5〇。。下保持72小時,蝕刻清潔用黏著 劑層(清潔層)。 以下,除使用上述黏著片以外,以與實施例1β1相同之 方式,製作清潔片。 實施例1-5 除了於實施例1-1中,將多官能胺基曱酸酯丙烯酸酯之 使用夏設為10份以外,以與實施例i i相同之方式,製備 紫外線硬化性丙烯酸系黏著劑。以下,以與實施例1· i相 同之方式’製備紫外線硬化性丙烯酸系黏著劑組合物後, 製作清潔片。 比較例1-1 於實施例1-4中製備之紫外線硬化性丙烯酸系黏著劑之 溶液中,並不添加用以進行相分離之不相容化合物,直接 使用該紫外線硬化性丙烯酸系黏著劑,除此以外,以與實 120368.doc -58 - 200808933 施例1-1相同之方式,製作清潔片。 對實施例及比較例中獲得之清潔用黏著劑層(清潔層), 進行下述評價。將結果示於圖5至圖1〇、及表1中。 (凹部投影面積) 利用掃“電子顯微鏡(日立製作所製造,S570)對清潔用 黏著劑層(清潔層)表面進行攝影,藉由圖像分析而算出清 潔用黏著劑層(清潔層)表面之凹部的面積比率。 (凹部之開口部的平均開口徑(平均直徑)) 將利用上述掃描電子顯微鏡觀察之圖像,以圖像分析軟 體進行圖像分析,算出凹部之平均開口徑(平均直徑)。 (凹部之深度) 以液悲氮使清潔用黏著劑層(清潔層)之凹部凍結斷裂, 利用上述知描電子顯微鏡觀察剖面,由剖面之凹部深度h 與剖面之厚度Η算出h/H。 (彈性模數) 使用分析裝置奈米壓痕儀Hysitron Inc.製造之Tribo Indenter,以壓入速度50 nm/s、最大壓入載荷1〇〇〇 μΝ之條 件’以使用壓頭Berkovich之單一壓入方法,測定彈性模 數。 實施例1-1〜1-5中獲得之清潔用黏著劑層(清潔層)之上述 掃描顯微鏡圖像分別對應於圖5至圖9。比較例〗對應於圖 6 °各圖係自清潔層表面之上面觀察之圖像。圖中之黑色 部分為凹部。自圖5至圖9中,可知清潔層表面呈平面狀, 具有凹部。再者,如圖1〇所示,比較例1β1中獲得之清潔 120368.doc •59- 200808933 層’明顯不具有凹部。 又’對實施例及比較例中獲得之清潔片進行下述評價。 將結果示於表1中。 (垂直接著力) 將清潔用黏著劑層(清潔層),以寬度5〇 貼附於石夕晶 圓面’以加重2 kg接著φ50 mm之探頭後,於室溫(23。〇)下 以拉伸速度300 mm/min,測定相對於清潔用黏著劑層(清 潔層)之180。剝離接著力。 (搬送性) 搬送至具有晶圓平臺之基板處理裝置(裝置名:gr_ 3 000 ’日東精機公司製造)内,根據下述標準進行評價。 x ·附者於各部位、平臺,且搬送裝置停止之情形。 △:雖附著於各部位、平臺,但搬送裝置未停止之情 形。 〇:未附著於各部位、平臺,且搬送裝置亦未停止之情 形。 (異物捕集性) 使用模擬異物。模擬異物之平均異物尺寸為8 μηι,異物 尺寸10 μιη以下之異物個數之比例占異物總體之9〇%。異 物尺寸及平均異物尺寸,以雷射粒子計數器(TENCOR公司 製造,SURFSCAN 6200)進行測定。 剥離β /糸片之固疋用黏著劑層側之剝離膜,以手動輥將 該黏著劑層貼附於8吋之矽晶圓之背面(鏡面),製作具清潔 力月b之搬送用清潔晶圓。繼而,於具有晶圓平臺之基板處 120368.doc 200808933 理裝置(裝置名:GR-3000,日東精機公司製造)之平臺上 數次放置晶圓,使模擬異物附著。初始之污染狀態評價用 時,將8吋矽晶圓以鏡面朝下搬送至基板處理裝置,以用 於初始之污染狀態評價後,藉由雷射式異物測定裝置測定 鏡面,測定初始異物量(8吋晶圓尺寸之區域内)。將該具清 潔功能之搬送用清潔晶圓,以清潔面朝下搬送至基板處二 裝置3次。將搬送後之異物數量,以上述雷射式異物測定 裝置(雷射粒子計數器)測定鏡面,算出(初始異物量-搬送 後捕集異物量)/初始異物量。若該比率為3〇%以上,則判 定為「〇」。將小於30%之情形判定為「X」。 [表1] 凹部之投 影面積 (%) 清潔用黏^ 凹部之開口部 之平均開口徑 (μιη) [:劑層 凹部之 深度比 (h/H) 彈性模數 (MPa) 垂直接 著力 (N) 評僧 搬送性 異物 捕集性 實施例Μ 4 1.72 0.105 20.8 0 〇 〇 實施例1-2 3.6 1.61 0.111 0.027 13.1 26.1 10 0 實施例1-3 41 076^^ ——_ 〇 〇 ~~〇~ 實施例1-4 20 2.16 0.100 20.5 0.1 〇 〇 實施例1-5 24 2.2 0.119 1.35 8 Δ 〇 比較例Μ - - - 28.0 12.6 X 〇 (2)清潔層(平均開口徑:〇1〜3 μπ1) 實施例2-1 (紫外線硬化性丙烯酸系黏著劑之製備) 相對於自包含70份之丙烯酸丁酯、3 〇份之丙烯酸乙酯、 1伤之丙烯酸、5份之丙烯酸2-羥乙酯之單體混合液而獲得 之作為原料聚合物之丙烯酸系聚合物(Μλγ約為85萬, 120368.doc -61 - 200808933Example 1-3 (Preparation of ultraviolet curable acrylic adhesive) Relative to self-containing 70 parts of butyl acrylate, 3 parts of ethyl acrylate, 1 acryl, and 5 parts of 2-hydroxyethyl acrylate An acrylic polymer (Mw of about 10,000, Mw/Mn of 9) obtained as a raw material polymer obtained by mixing a monomer, and a mixture of 4 parts of polyfunctional urethane acetate (manufactured by Nippon Synthetic Chemical Co., Ltd., trade name: as a polymerizable unsaturated compound' 2 parts of polyisocyanate compound (manufactured by Japan Polyamine Industrial Co., Ltd.), trade name: c〇r〇nate卩 and i parts Epoxy compound (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name: Tetrad®, as a crosslinking agent' and further added 3 parts of photopolymerization initiator (We 651, manufactured by Ciba Specialty Chemicals Co., Ltd.), using ethyl acetate and ethanol The mixed solvent is uniformly mixed to prepare a solution of the ultraviolet curable galena guar gum adhesive having a concentration adjusted to 18% by weight. (Preparation of ultraviolet curable acrylic adhesive composition) In the above adhesive solution, phase 斟T邗 for the side 100 parts of the acrylic acid-containing polycondensate 120368.doc • 56- 200808933 and a polymerizable unsaturated compound (solid content), uniformly mixed 10 parts of propylene glycol (manufactured by Kishida Chemical Co., Ltd.) for phase separation A solution of the ultraviolet curable acrylic pressure-sensitive adhesive composition was prepared as an incompatible compound. In the following, a cleaning sheet was produced in the same manner as in Example 1-1 except that the above-described adhesive composition solution was used. 1 - 4 (Preparation of ultraviolet curable acrylic adhesive) with respect to monomer containing 70 parts of butyl acrylate, 3 parts of ethyl acrylate, 1 part of acrylic acid, and 5 parts of 2-hydroxyethyl acrylate Acrylic polymer (Mw of about 850,000, ]^~/]^11 of 9) 100 parts obtained by mixing liquid, adding 35 parts of polyfunctional urethane acrylate (Japanese synthesis) Manufactured by a chemical company, trade name: UV1700B) As a polymerizable unsaturated compound, 2 parts of a polyisocyanate compound (manufactured by Japan Polyurethane Industry Co., Ltd., trade name: Coronate L) and 1 part of a polymer are added. Oxygen compound (trade name: Tetrad c, manufactured by Mitsubishi Gas Chemical Co., Ltd.), as a crosslinking agent, further added 3 parts of a photopolymerization initiator (Irgacure 651, manufactured by Ciba Specialty Chemicals Co., Ltd.), and further uniformly mixed with ethyl acetate. A solution of an ultraviolet curable acrylic adhesive having a concentration adjusted to 18% by weight is prepared. (Preparation of ultraviolet curable acrylic adhesive composition) Acrylic polymer and polymerization contained in the above adhesive solution A total of 1 part by weight of the unsaturated compound (solid content), uniformly mixed 10 parts of ethylene glycol (manufactured by Kishida Chemical Co., Ltd.), and used as an incompatible compound for phase separation to prepare an ultraviolet curable acrylic adhesive combination A solution of 120368.doc -57- 200808933. (Production of cleaning sheet) The above-mentioned adhesive composition solution was applied to one side of a poly-I film for a support having a width of 200 Å and a thickness of 50 μm, and the thickness after drying was 35 μm. It was dried under warm conditions for 4 minutes to form a layer of an adhesive composition in which a concave portion was formed with ethylene glycol. Then, the surface of the material composition layer is attached with a thickness of 5 μm 2 of a polyester peeling film, followed by ultraviolet irradiation, and the hard: acrylic adhesive fixes the structure of the concave portion to form a phase separation and structure. Sticky | agent layer precursor. Thereafter, the polyacetal release film was removed, and the undergarment was heated for 10 minutes to remove the ethylene glycol which formed the concave portion, and the adhesive sheet was obtained to adhere the sheet to 5 Å. . The adhesive layer (cleaning layer) for cleaning was etched for 72 hours. Hereinafter, a cleaning sheet was produced in the same manner as in Example 1 β1 except that the above-mentioned pressure-sensitive adhesive sheet was used. Example 1-5 An ultraviolet curable acrylic adhesive was prepared in the same manner as in Example ii except that in the Example 1-1, the polyfunctional amino phthalic acid ester acrylate was used in an amount of 10 parts in summer. . Thereafter, an ultraviolet curable acrylic pressure-sensitive adhesive composition was prepared in the same manner as in Example 1 and i, and then a cleaning sheet was prepared. Comparative Example 1-1 In the solution of the ultraviolet curable acrylic adhesive prepared in Example 1-4, the incompatible compound for phase separation was not added, and the ultraviolet curable acrylic adhesive was directly used. Except for this, a cleaning sheet was produced in the same manner as in Example 1-1 of 120368.doc -58 - 200808933. The cleaning adhesive layer (cleaning layer) obtained in the examples and the comparative examples was subjected to the following evaluation. The results are shown in Fig. 5 to Fig. 1 and Table 1. (Concave area of the concave portion) The surface of the cleaning adhesive layer (cleaning layer) was photographed by a scanning electron microscope (manufactured by Hitachi, Ltd., S570), and the concave portion of the surface of the cleaning adhesive layer (cleaning layer) was calculated by image analysis. (Average opening diameter (average diameter) of the opening of the concave portion) The image observed by the scanning electron microscope was subjected to image analysis by the image analysis software, and the average opening diameter (average diameter) of the concave portion was calculated. (Deep Depth) The concave portion of the cleaning adhesive layer (cleaning layer) was freeze-fractured by liquid sad nitrogen, and the cross section was observed by the above-described electron microscope to calculate h/H from the depth h of the concave portion of the cross section and the thickness of the cross section. Elastic modulus) Tribo Indenter manufactured by Hysitron Inc., an indenter of the analytical device, was used with a press-in speed of 50 nm/s and a maximum indentation load of 1 μμΝ to use a single press of the indenter Berkovich. Method, the elastic modulus is measured. The above-mentioned scanning microscope images of the cleaning adhesive layer (cleaning layer) obtained in Examples 1-1 to 1-5 correspond to FIG. 5, respectively. Fig. 9. Comparative Example corresponds to the image of the top surface of the self-cleaning layer in Fig. 6°. The black portion in the figure is a concave portion. From Fig. 5 to Fig. 9, it is known that the surface of the cleaning layer is planar, Further, as shown in Fig. 1A, the cleaning obtained in Comparative Example 1β1 120368.doc • 59- 200808933 layer 'apparently has no concave portion. 'The following evaluations were performed on the cleaning sheets obtained in the examples and comparative examples. The results are shown in Table 1. (Vertical adhesion force) After attaching the cleaning adhesive layer (cleaning layer) to the surface of the stone substrate with a width of 5 以 to increase the probe of 2 kg and then φ 50 mm, The tensile strength was measured at room temperature (23. Torr) at a tensile speed of 300 mm/min. The adhesion to the cleaning adhesive layer (cleaning layer) was 180. The peeling force was applied. (Transportability) Transfer to a substrate processing apparatus having a wafer platform (The name of the device: gr_3 000 'manufactured by Nitto Seiki Co., Ltd.) is evaluated according to the following criteria: x The case is attached to each part and platform, and the conveying device is stopped. △: Although it is attached to each part or platform, The case where the transport device has not stopped. It is attached to each part and platform, and the conveying device is not stopped. (Foreign material collection property) The foreign matter is simulated. The average foreign matter size of the simulated foreign matter is 8 μηι, and the foreign matter size is less than 10 μιη. The foreign matter size and the average foreign matter size were measured by a laser particle counter (manufactured by TENCOR, SURFSCAN 6200). The peeling film on the adhesive layer side of the β/ruthenium sheet was peeled off, and the hand roll was used. The adhesive layer is attached to the back surface (mirror surface) of the wafer of 8 ,, and the cleaning wafer for cleaning with a cleaning force b is prepared. Then, at the substrate with the wafer platform, 120368.doc 200808933 device (device name) : GR-3000, manufactured by Nitto Seiki Co., Ltd.) The wafer was placed several times on the platform to allow the simulation of foreign matter to adhere. In the initial contamination state evaluation, the 8 吋矽 wafer was transferred mirror-down to the substrate processing apparatus for initial contamination state evaluation, and the mirror surface was measured by a laser type foreign matter measuring device to measure the initial amount of foreign matter ( 8 吋 wafer size area). The cleaning wafer for cleaning is transferred to the substrate at the cleaning device with the cleaning surface facing down three times. The amount of the foreign matter after the transfer was measured by the above-described laser type foreign matter measuring device (laser particle counter), and the amount of the initial foreign matter amount - the amount of the foreign matter collected after the transfer was calculated. If the ratio is 3〇% or more, it is judged as "〇". The case of less than 30% is judged as "X". [Table 1] Projection area of the concave portion (%) Average opening diameter (μιη) of the opening portion of the cleaning adhesive portion [: depth ratio of the concave portion of the agent layer (h/H) elastic modulus (MPa) vertical adhesion force (N ) Evaluation of transporting foreign matter trapping examples Μ 4 1.72 0.105 20.8 0 〇〇Example 1-2 3.6 1.61 0.111 0.027 13.1 26.1 10 0 Example 1-3 41 076^^ —— _ 〇〇~~〇~ Example 1-4 20 2.16 0.100 20.5 0.1 〇〇 Example 1-5 24 2.2 0.119 1.35 8 Δ 〇 Comparative Example - - - - 28.0 12.6 X 〇 (2) Cleaning layer (average opening diameter: 〇1 to 3 μπ1) Example 2-1 (Preparation of ultraviolet curable acrylic adhesive) Relative to self-containing 70 parts of butyl acrylate, 3 parts of ethyl acrylate, 1 acryl, and 5 parts of 2-hydroxyethyl acrylate Acrylic polymer obtained as a raw material polymer obtained from a monomer mixture (Μλγ is about 850,000, 120368.doc -61 - 200808933

Mw/Mn為9)100份,添加40份之多官能胺基甲酸酯丙烯酸 酯(日本合成化學公司製造,商品名:UV1700B)作為聚合 性不飽和化合物,添加2份之聚異氰酸酯化合物(日本聚胺 酯工業公司製造,商品名:Coronate L)及1份之聚環氧化 合物(三菱瓦斯化學公司製造,商品名:Tetrad C),作為 交聯劑,進而添加3份之光聚合引發劑(Irgacure 65 1,汽巴 精化公司製造)’進而均勻混合於將作為溶劑(A)之酷酸乙 酯(相對於上述丙烯酸系聚合物之χ參數:〇·53,相對於聚 合性不飽和化合物之χ參數:8.7)及作為相容溶劑(Β)之甲 醇(相對於上述丙烯酸系聚合物之χ參數·· 2·0,對於聚合性 不飽和化合物之χ參數:2.7),按溶劑(Α)/溶劑(Β)==ΐ2/7之 比例進行調配之混合溶劑中,製備濃度調整為18重量%之 紫外線硬化性丙浠酸系黏著劑之溶液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 上述黏著劑溶液中,相對於該溶液所含之丙烯酸系聚合 物及聚合性不飽和化合物之合計100份(固形分),均勻混合 10份之丙三醇(相對於上述丙烯酸系聚合物八之乂參數: 10,沸點290 C),作為用以進行相分離之不相容化合物, 製備紫外線硬化性丙烯酸系黏著劑組合物之溶液。 (清潔片之製作) ,―队至抑於見度為2〇〇 mm、厚 度為50 μΐη之支持體用聚醋系膜之單面上,使乾燥後之厚 度成為35 μΐη,於55t:下乾燥4分鐘,形成以丙三醇形成凹 部之黏著劑組合物層。繼而’於黏著劑組合物層表面貼附 120368.doc -62- 200808933 厚度50 μπι之聚酯系剝離膜,繼而進行紫外線照射,硬化 丙烯酸系黏著劑,使凹部之結構固定化,形成具有相分離 結構之黏著劑層前驅物。其後,除去聚酯系剝離膜,於 150C下加熱1〇分鐘,除去形成凹部之丙三醇,獲得黏著 片。將上述黏著片於5(rc下保持72小時,蝕刻清潔用黏著 劑層(清潔層)。Mw/Mn was 9) 100 parts, and 40 parts of polyfunctional urethane acrylate (manufactured by Nippon Synthetic Chemical Co., Ltd., trade name: UV1700B) was added as a polymerizable unsaturated compound, and 2 parts of a polyisocyanate compound was added (Japan) Manufactured by Polyurethane Industry Co., Ltd., trade name: Coronate L) and 1 part of polyepoxide (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name: Tetrad C), as a crosslinking agent, and further added 3 parts of photopolymerization initiator (Irgacure 65) 1, manufactured by Ciba Specialty Chemicals Co., Ltd.) and then uniformly mixed with ethyl acrylate as solvent (A) (relative to the enthalpy parameter of the above acrylic polymer: 〇·53, relative to the polymerizable unsaturated compound) Parameters: 8.7) and methanol as a compatible solvent (Β) (relative to the above-mentioned acrylic polymer χ parameter ························ A solution of a UV-curable propionic acid-based adhesive having a concentration adjusted to 18% by weight was prepared in a mixed solvent in which the ratio of the solvent (Β) ==ΐ2/7 was adjusted. (Preparation of ultraviolet curable acrylic pressure-sensitive adhesive composition) In the above adhesive solution, 10 parts (solid content) of the acrylic polymer and the polymerizable unsaturated compound contained in the solution are uniformly mixed in 10 parts. Glycerol (parameter: 10, boiling point: 290 C with respect to the above acrylic polymer), as an incompatible compound for phase separation, a solution of an ultraviolet curable acrylic adhesive composition was prepared. (The production of cleaning tablets), the team to the side of the polyester film with a thickness of 50 μΐη and a thickness of 50 μΐη, so that the thickness after drying becomes 35 μΐη, at 55t: After drying for 4 minutes, a layer of an adhesive composition in which a concave portion was formed with glycerin was formed. Then, a polyester release film having a thickness of 50 μm was attached to the surface of the adhesive composition layer, followed by ultraviolet irradiation, and the acrylic adhesive was hardened to fix the structure of the concave portion to form a phase separation. Adhesive layer precursor of the structure. Thereafter, the polyester release film was removed, and the mixture was heated at 150 °C for 1 minute to remove the glycerin forming the concave portion to obtain an adhesive sheet. The above adhesive sheet was held at 5 (rc for 72 hours), and the cleaning adhesive layer (cleaning layer) was etched.

主將上述黏著片作為清潔片。又,將黏著劑溶液塗佈於該 清潔片之支持體膜的未設置有上述清潔用黏著劑層(清潔 層)之側,使乾燥後之厚度成為2〇 μιη,設置固定用黏著劑 層,製作於其表面上貼附有聚酯系剝離膜之清潔片。進 而,將固定用黏著劑層於5{rc下加溫72小時,#刻黏著劑 層。 再者,固定用黏著劑溶液,係以與上述⑴清潔層(平均 開口徑.10 μπι以下)之情形相同之方法製備。 實施例2-2 (紫外線硬化性丙烯酸系黏著劑之製備) /於實施例2-W,使用按溶劑(Α)/溶劑(Β)=7/ΐ2之比例進 行調配者作為混合溶劑’除此以外’以與實施例2-i相同 之方式’製備紫外線硬化性㈣酸系黏著劑之溶液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於上述黏著劑溶液中,相料該溶液所含之丙稀酸系聚 合物及聚合性不飽和化合物之合計⑽份(固形分),均句混 合1 〇份之丙三醇(相對於μ、+、工a a / 、上述丙烯I糸聚合物之χ參數: 10’海點卿作為用以進行相分離之不相容化合物, 120368.doc -63- 200808933 製備紫外線硬化性丙烯酸系黏著劑組合物之溶液。 以下’除使用上述中製備之黏著劑組合物溶液以外,以 與實施例2 -1相同之方式,製作清潔片。 實施例2-3 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於實施例2_1中製備之黏著劑溶液中’相料該溶液所 含之丙稀酸系聚合物及聚合性不飽和化合物之合計⑽份 (固形分),均勻混合25份之H3.丁三醇(相對於上述丙: # 酸系聚合物之%參數:8.8),作為用以進行相分離之不相容 化合物,製備紫外線硬化性丙烯酸系黏著劑組合 液。 〆 以下’除使用上述中製備之黏著劑組合物溶液以外,以 與實施例2-1相同之方式,製作清潔片。 比較例2-1 (紫外線硬化性丙烯酸系黏著劑之製備) _ 於貝%例1中,僅使用作為溶劑(Α)之醋酸乙酯來代替混 纟溶劑,將濃度調整為18重量%,除此以外,以與實施例 2 1相同之方式,製備紫外線硬化性丙稀酸系黏著劑之溶 液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於上述黏著劑,谷液中,相對於該溶液所含之丙稀酸系聚 口、物及聚合性不飽和化合物之合計⑽份(固形分),添加U 伤之丙一醇(相對於上述丙烯酸系聚合物之乂參數:1〇,沸 點290 〇,作為用以進行相分離之不相容化合物時,產生 12036B.doc -64 - 200808933 相分離,無法製備均勻之溶液。其結果為無法製作清潔 片。 比較例2-2 (紫外線硬化性丙烯酸系黏著劑之製備) 於實施例2-1中,將作為聚合性不飽和化合物之多官能 胺基甲酸酯丙烯酸酯(日本合成化學公司製造,商品名·· UV1700B)之使用量改變為8〇份,且僅使用作為溶劑(A)之 醋酸乙酯來代替混合溶劑,將濃度調整為! 8重量%,除此 以外,以與實施例2-1相同之方式,製備紫外線硬化性丙 烯酸系黏著劑之溶液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於上述黏著劑溶液中,相對於該溶液所含之丙烯酸系聚 合物及聚合性不飽和化合物之合計丨〇〇份(固形分),均勻混 合10份之1,3-丙二醇(相對於上述丙烯酸系聚合物之乂參 數:5·6,沸點214。〇,作為用以進行相分離之不相容化合 物,製備紫外線硬化性丙烯酸系黏著劑組合物之溶液。 以下,除使用上述中製備之黏著劑組合物溶液以外,以 與實施例2-1相同之方式,製作清潔片。 對貝施例及比杈例中獲得之清潔用黏著劑層(清潔層)進 行下述評價。將實施例2-^2-3及比較例2_2之結果示於圖 11至圖14、及表2中。 (凹部之開口部之平均開口徑及標準偏差) 將利用上述掃描電子顯微鏡觀察之圖像,以圖像分析軟 體進行圖像分析,算出凹部之平均開口徑(平均直徑)。將 120368.doc -65. 200808933 异出開口徑之標準偏 該平均開口徑作為平均開口徑。又 差。 (均勻性) ; 述掃撝電子顯微鏡觀察之圖像,以圖像分析軟 體進行圖像分析,算出與相鄰開口部之中心距離,且算出 其標準偏差。 對凹部投影面積及凹邦 領汉凹。卩之/木度,以與上述相同之方式進 行評價。The main adhesive sheet is used as a cleaning sheet. Further, the adhesive solution is applied to the side of the support film of the cleaning sheet which is not provided with the cleaning adhesive layer (cleaning layer), and the thickness after drying is 2 μm, and the fixing adhesive layer is provided. A cleaning sheet having a polyester release film attached to its surface was prepared. Further, the fixing adhesive layer was heated at 5 {rc for 72 hours, and the adhesive layer was engraved. Further, the fixing adhesive solution was prepared in the same manner as in the case of the above (1) cleaning layer (average opening diameter: 10 μπι or less). Example 2-2 (Preparation of ultraviolet curable acrylic adhesive) / In the case of Example 2-W, a solvent (Α) / solvent (Β) = 7 / ΐ 2 ratio was used as a mixed solvent' A solution of an ultraviolet curable (tetra) acid-based adhesive was prepared in the same manner as in Example 2-i. (Preparation of ultraviolet curable acrylic adhesive composition) In the above adhesive solution, the total amount of the acrylic acid polymer and the polymerizable unsaturated compound contained in the solution (10) parts (solid content), Mix 1 part of glycerol (relative to μ, +, work aa /, the above propylene I 糸 polymer χ parameters: 10 'Hai Dianqing as an incompatible compound for phase separation, 120368.doc - 63-200808933 A solution of an ultraviolet curable acrylic adhesive composition was prepared. Hereinafter, a cleaning sheet was produced in the same manner as in Example 2-1 except that the above-described adhesive composition solution was used. 3 (Preparation of ultraviolet curable acrylic adhesive composition) In the adhesive solution prepared in Example 2_1, the total amount (10) parts of the acrylic polymer and the polymerizable unsaturated compound contained in the solution was Solid content), uniformly mixing 25 parts of H3. butyl triol (relative to the above-mentioned C: #% acid parameter: 8.8), as an incompatible compound for phase separation, preparing ultraviolet curable propylene The adhesive composition liquid was prepared in the same manner as in Example 2-1 except that the above-described adhesive composition solution was used. Comparative Example 2-1 (Ultraviolet curable acrylic adhesive) (Preparation) _ In the same manner as in Example 21, except that ethyl acetate was used as the solvent (Α) instead of the mixed solvent, and the concentration was adjusted to 18% by weight. A solution of an ultraviolet curable acrylic acid-based adhesive is prepared. (Preparation of an ultraviolet curable acrylic pressure-sensitive adhesive composition) In the above-mentioned adhesive, a solution of an acrylic acid-containing substance contained in the solution And a total of (10) parts of the polymerizable unsaturated compound (solid content), adding U-injured propanol (relative to the above-mentioned acrylic polymer: 〇 parameter: 1 〇, boiling point 290 〇, as phase separation for phase separation) In the case of a compound, 12036B.doc -64 - 200808933 phase separation was produced, and a homogeneous solution could not be prepared. As a result, a cleaning sheet could not be produced. Comparative Example 2-2 (Preparation of ultraviolet curable acrylic adhesive) In Example 2-1, the amount of the polyfunctional urethane acrylate (manufactured by Nippon Synthetic Chemical Co., Ltd., trade name: UV1700B) as a polymerizable unsaturated compound was changed to 8 parts, and only used as A solution of an ultraviolet curable acrylic adhesive was prepared in the same manner as in Example 2-1 except that the ethyl acetate of the solvent (A) was used instead of the mixed solvent, and the concentration was adjusted to 8% by weight. Preparation of Curable Acrylic Adhesive Composition) In the above adhesive solution, 10 parts are uniformly mixed with respect to the total amount of the acrylic polymer and the polymerizable unsaturated compound contained in the solution (solid content) The 1,3-propanediol (the enthalpy parameter relative to the above acrylic polymer: 5.6, the boiling point 214). Further, as an incompatible compound for phase separation, a solution of an ultraviolet curable acrylic adhesive composition is prepared. Next, a cleaning sheet was produced in the same manner as in Example 2-1, except that the above-described adhesive composition solution was used. The following evaluations were made for the shelling agent and the cleaning adhesive layer (cleaning layer) obtained in the example. The results of Example 2-^2-3 and Comparative Example 2-2 are shown in Figs. 11 to 14 and Table 2. (Average opening diameter and standard deviation of the opening of the concave portion) The image observed by the scanning electron microscope was subjected to image analysis by an image analysis software, and the average opening diameter (average diameter) of the concave portion was calculated. The standard of the opening diameter of 120368.doc -65. 200808933 is used as the average opening diameter. Poor. (Uniformity); The image observed by the bronzing electron microscope is image-analyzed by the image analysis software, and the distance from the center of the adjacent opening is calculated, and the standard deviation is calculated. The projected area of the concave portion and the concave collar. The 卩/木度 was evaluated in the same manner as described above.

實施例2-1〜2-3中獲得之清潔用黏著劑層(清潔層)之上述 掃描顯微鏡圖像分別對應於圖11至圖14。圖U至圖14之各 (A)係自清潔用黏著劑層(清潔層)表面之上面觀察之圖像, 各(B)係剖面圖像。圖中之黑色部分為凹部。自圖u至圖 14 ’可知清潔用黏著劑層(清潔層)表面呈平面狀,且具有 凹部。 又,對實施例及比較例中獲得之清潔片進行下述評價。 將結果示於表2中。 (垂直剝離力) 以2 kg之加重使直徑為5〇 mm之金屬片於清潔用黏著劑 層上緊貼3分鐘,測定於室溫23°C下以拉伸速度1〇〇 mm/min垂直抬起金屬片時所施加之剝離力。 對搬送性及異物捕集性,以與上述相同之方式評價。 120368.doc • 66· 200808933 [表2] 清潔用黏著劑層 評價 凹部之開口部 凹部之 凹部之 垂直剝 離力(Ν) 異物 捕集性 平均開口徑 (μπι) 標準偏差 (μπι) 均勻性 投影面 積(%) 深度比 _ 隞送性 實施例2-1 1.75 0.49 0.586 66.7 0.014 0 〇 〇 實施例2-2 1.0 0.15 0.645 36 0.019 1.7 〇 〇 實施例2-3 1.3 0.42 0.343 20 0.017 1.5 〇 〇 比較例24 - - - - - 8.5 Δ 〇 比較例2-2 3.6 0.95 4.016 14 0.11 5 Δ 〇 (3)清潔層(Ra : 0·01〜0.3 μπι) 實施例3-1 (紫外線硬化性丙烯酸系黏著劑之製備) 相對於自包含30份之丙烯酸2-乙基己酯、70份之丙烯酸 曱酯及10份之丙烯酸之單體混合液而獲得之作為原料聚合 物之丙烯酸系聚合物(Mw :約83萬至89萬,Mw/Mn : 7〜9)100份,添加35份之聚乙二醇200二甲基丙烯酸酯(新 中村化學公司製造,商品名:NK Ester 4G)作為聚合性不 飽和化合物,添加3份之聚異氰酸酯化合物(日本聚胺i旨工 業公司製造,商品名·· Coronate L)及2份之聚環氧化合物 (三菱瓦斯化學公司製造,商品名:Tetrad C),作為交聯 劑,進而添加3份之光聚合引發劑(Irgacure 651,汽巴精化 公司製造),進而使用醋酸乙酯均勻混合,製備濃度調整 為2 3重量%之紫外線硬化性丙烯酸系黏著劑之溶液。 (紫外線硬化性丙烯酸系黏著劑組合物之製備) 於上述黏著劑溶液中,相對於該溶液所含之丙烯酸系聚 合物及聚合性不飽和化合物之合計100份(固形分),均勻混 120368.doc -67- 200808933 合10份之乙二醇(Kishida化學公司製造),作為用以進行相 分離之不相容化合物,製備紫外線硬化性丙烯酸系黏著劑 組合物之溶液。 (支持基材) 使用寬度為200 mm、厚度為75 μιη之支持體用聚酯系 膜。將黏著劑溶液塗佈於該支持體用聚酯系膜之單面上, 使乾燥後之厚度成為20 μιη,設置固定用黏著劑層,於其 表面上貼附聚醋系剝離膜,進而,將固定用黏著劑層^ 5 0 C下加溫7 2小時,餘刻黏著劑層。 再者,固定用黏著劑溶液,係以與上述(1)清潔層(平均 開口徑:10 μιη以下)之情形相同之方法製備。 (清潔片之製作) 將上述紫外線硬化性丙烯酸系黏著劑組合物塗佈於上述 支持基材中之未設置固定用黏著劑層之單面上,使乾燥後 之厚度成為35 μπι,於室溫下乾燥4分鐘,形成以乙二醇形 成凹部之黏著劑組合物層。繼而,於黏著劑組合物層之表 面上’貼附具有中心線平均粗度為〇 〇2 μηι之表面粗度的 厚度為60叫之聚烯烴系剝離膜作為覆蓋膜。覆蓋膜係將 具有上述表面粗度之側作為黏著劑組合物層之侧。繼而, 2行紫外線照射,硬化丙稀酸系黏著劑,使凹部之結構固 疋化,形成具有相分離結構之黏著劑層前驅物。其後,剝 離覆蓋膜,於讀下加熱10分鐘,除去形成凹部之乙二 醇。再次貼附聚醋系剝離膜,於5(rc下保持72小時,蝕刻 清潔用黏著劑層(清潔層),獲得黏著片。將該黏著片作為 120368.doc -68- 200808933 清潔片。 實施例3-2 於實施例3-1中,製備紫外線硬化性丙烯酸系黏著劑 時’將聚合性不飽和化合物之使用量設為70份,且於製作 清潔片時’使用具有中心線平均粗度為〇 〇2 μηι之表面粗 度的厚度為60 μπι之聚烯烴系剝離膜作為覆蓋膜,除此以 外’以與實施例相同之方式,製作清潔片。 比較例3-1 於實施例3-1中製備之紫外線硬化性丙烯酸系黏著劑之 /谷液中’並不添加用以進行相分離之不相容化合物,直接 使用該紫外線硬化性丙烯酸系黏著劑,除此以外,以與實 施例3· 1相同之方式,製作清潔片。 比較例3-2 於實施例3-1中,製備紫外線硬化性丙烯酸系黏著劑 時’將聚合性不飽和化合物之使用量設為7〇份,且於製作 清潔片時,使用具有中心線平均粗度為〇 〇〇6 μηΐ2表面粗 度的厚度為60 μηι之聚烯烴系剝離膜作為覆蓋膜,除此以 外,以與實施例3-1相同之方式,製作清潔片。 對實施例及比較例中獲得之清潔用黏著劑層(清潔層), 進行下述評價。將結果示於圖15及表3中。實施例弘丨中獲 得之清潔用黏著劑層(清潔層)之上述掃描顯微鏡圖像分: 為圖15。圖中之黑色部分為凹部。 對凹部投影面積及凹部之開口部之平均開口徑(平均直 徑)、凹部之深度,以與上述相同之方法進行評價。 120368.doc -69- 200808933 (凹部以外之表面的中心線平均粗度(Ra)) 測定裝置:掃描型雷射顯微鏡LEXT-OLS3 000(奥林巴司 股份有限公司製造) 顯微鏡視角:128x96 [μιη] 透鏡倍率:1〇〇倍 備考:校正X軸、Υ軸之傾角後,以0.125 μιη間距實施粗 .度分析。 (抗張彈性模數) φ 將黏著劑組合物塗佈於寬度為200 mm、厚度為50 μπι之 經矽氧烷脫模處理之PET膜上,進行乾燥、紫外線硬化 後,自PET膜剝離,以樣品寬度10 mm、夾頭距離110 mm、拉伸速度50 mm/min進行抗張試驗,由測定時之應力 算出抗張彈性模數。測定依據JIS K7127。 又,對實施例及比較例中獲得之清潔片進行下述評價。 將結果示於表3中。 對垂直接著力及搬送性、異物捕集性,以與上述相同之 方法進行評價。 [表 3] . 清潔用黏荖劑層 評價 凹部之投 凹部之開 口部之平 凹部之 深度比 _ 凹部以外 之表面平 抗張彈 性模數 (MPa) 垂直剝 搬 送 性 異物 影面積(%) 均開口徑 (μιη) 均粗度 (Ra) : (μιη) 離力(N) 捕集性 實施例3-1 27 2.3 0.05 0.023 70 2 〇 75%以上 實施例3-2 25 2.5 0.06 0.25 300 0.5 〇 75%以上 比較例3-1 - - 70 15 X 無法 評價 比較例3-2 24 2.5 0.06 0.006 300 2 〇 60 〜70% 120368.doc -70- 200808933 於比較例3·1中’無法搬送,因此無法評俨 【圖式簡單說明】 胃 圖1係本發明之清潔用黏著劑 圖2係本發明之清潔用黏著劑 圖3係使用有本發明之清潔用 黏著片)之剖面圖之一例。 層之立體圖之一例 層之剖面圖之一例 黏著劑層的清潔片 (清潔用 圖4係使用有本發明之清潔用黏著 黏著片)之剖面圖之一例。 劑層的清潔片(清潔用The above-described scanning microscope images of the cleaning adhesive layers (cleaning layers) obtained in Examples 2-1 to 2-3 correspond to Figs. 11 to 14, respectively. Each of Figs. U to 14 (A) is an image observed from the upper surface of the surface of the self-cleaning adhesive layer (cleaning layer), and each (B) is a cross-sectional image. The black portion in the figure is a recess. It is understood from Fig. 14 to Fig. 14 that the surface of the cleaning adhesive layer (cleaning layer) is flat and has a concave portion. Further, the cleaning sheets obtained in the examples and the comparative examples were subjected to the following evaluations. The results are shown in Table 2. (Vertical peeling force) A metal piece having a diameter of 5 mm was adhered to the cleaning adhesive layer for 3 minutes with a weight of 2 kg, and measured at a stretching speed of 1 mm/min at room temperature of 23 ° C. The peeling force applied when lifting the metal sheet. The transportability and foreign matter trapping property were evaluated in the same manner as described above. 120368.doc • 66· 200808933 [Table 2] Evaluation of the vertical peeling force (Ν) of the concave portion of the concave portion of the recessed portion of the recessed portion of the recessed portion (μπι) Standard deviation (μπι) Standard deviation (μπι) Uniform projection area (%) Depth ratio _ 性 实施 Example 2-1 1.75 0.49 0.586 66.7 0.014 0 〇〇 Example 2-2 1.0 0.15 0.645 36 0.019 1.7 〇〇 Example 2-3 1.3 0.42 0.343 20 0.017 1.5 〇〇 Comparative Example 24 - - - - - 8.5 Δ 〇 Comparative Example 2-2 3.6 0.95 4.016 14 0.11 5 Δ 〇 (3) Cleaning layer (Ra: 0·01 to 0.3 μπι) Example 3-1 (Ultraviolet curable acrylic adhesive) Preparation of acrylic polymer as a base polymer obtained from a monomer mixture containing 30 parts of 2-ethylhexyl acrylate, 70 parts of decyl acrylate and 10 parts of acrylic acid (Mw: about 100,000 to 890,000, Mw/Mn: 7 to 9) 100 parts, 35 parts of polyethylene glycol 200 dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: NK Ester 4G) is added as a polymerizable unsaturated Compound, adding 3 parts of polyisocyanate compound (Japan Poly i manufactured by Industrial Co., Ltd., trade name · Coronate L) and 2 parts of polyepoxide (Mitsubishi Gas Chemical Co., Ltd., trade name: Tetrad C), as a crosslinking agent, and further added 3 parts of photopolymerization initiator ( Irgacure 651 (manufactured by Ciba Specialty Chemicals Co., Ltd.) was further uniformly mixed with ethyl acetate to prepare a solution of an ultraviolet curable acrylic adhesive having a concentration adjusted to 23% by weight. (Preparation of ultraviolet curable acrylic pressure-sensitive adhesive composition) In the above adhesive solution, 100 parts (solid content) of the acrylic polymer and the polymerizable unsaturated compound contained in the solution are uniformly mixed, and 120368 is uniformly mixed. Doc-67-200808933 A 10 part ethylene glycol (manufactured by Kishida Chemical Co., Ltd.) is used as a solution for preparing an ultraviolet curable acrylic pressure-sensitive adhesive composition as an incompatible compound for phase separation. (Support substrate) A polyester film for a support having a width of 200 mm and a thickness of 75 μm was used. The adhesive solution is applied to one surface of the polyester film for the support to have a thickness of 20 μm after drying, and a fixing adhesive layer is provided, and a polyester-based release film is attached to the surface thereof. The fixing adhesive layer was heated at 50 ° C for 7 hours, and the adhesive layer was left. Further, the fixing adhesive solution was prepared in the same manner as in the case of the above (1) cleaning layer (average opening diameter: 10 μm or less). (Production of Cleaning Sheet) The ultraviolet curable acrylic pressure-sensitive adhesive composition is applied to one surface of the support substrate on which the fixing adhesive layer is not provided, and the thickness after drying is 35 μm at room temperature. It was dried for 4 minutes to form a layer of an adhesive composition in which a concave portion was formed with ethylene glycol. Then, a polyolefin-based release film having a thickness of 60 Å 2 μηι having a center line average roughness of 〇 2 μηι was attached as a cover film on the surface of the adhesive composition layer. The cover film has the side having the above surface roughness as the side of the adhesive composition layer. Then, two rows of ultraviolet rays are irradiated, and the acrylic acid-based adhesive is hardened to solidify the structure of the concave portion to form an adhesive layer precursor having a phase-separated structure. Thereafter, the cover film was peeled off and heated under reading for 10 minutes to remove the ethylene glycol forming the concave portion. The polyacetal release film was attached again, and the adhesive layer (cleaning layer) for cleaning was etched at 5 (rc for 72 hours) to obtain an adhesive sheet. The adhesive sheet was used as a cleaning sheet of 120368.doc-68-200808933. 3-2 In the case of preparing the ultraviolet curable acrylic pressure-sensitive adhesive in Example 3-1, 'the amount of the polymerizable unsaturated compound used was 70 parts, and when the cleaning sheet was produced, the center line average roughness was used. A cleaning sheet was produced in the same manner as in the example except that a polyolefin-based release film having a thickness of 60 μm was used as a cover film of 〇〇2 μηι. Comparative Example 3-1 was carried out in Example 3-1. In the ultraviolet curable acrylic adhesive prepared in the solution, the incompatible compound for phase separation is not added, and the ultraviolet curable acrylic adhesive is used as it is, and in addition to Example 3 In the same manner as in the first embodiment, the cleaning sheet was produced. Comparative Example 3-2 In the case of preparing the ultraviolet curable acrylic pressure-sensitive adhesive in Example 3-1, the amount of the polymerizable unsaturated compound used was set to 7 parts, and Making cleaning In the same manner as in Example 3-1, except that a polyolefin-based release film having a thickness of 60 μηη with a center line average roughness of 〇〇〇6 μηΐ2 was used as a cover film. Cleaning sheet. The cleaning adhesive layer (cleaning layer) obtained in the examples and the comparative examples was subjected to the following evaluation. The results are shown in Fig. 15 and Table 3. The cleaning adhesive layer obtained in Example Hongsheng The scanning microscope image of the (cleaning layer) is as shown in Fig. 15. The black portion in the drawing is a concave portion. The projected area of the concave portion and the average opening diameter (average diameter) of the opening portion of the concave portion and the depth of the concave portion are the same as described above. The method is evaluated. 120368.doc -69- 200808933 (Center line average roughness (Ra) of the surface other than the concave portion) Measuring device: Scanning laser microscope LEXT-OLS3 000 (manufactured by Olympus Co., Ltd.) Viewing angle: 128x96 [μιη] Lens magnification: 1〇〇 Remarks: After correcting the inclination of the X-axis and the Υ axis, perform the coarseness analysis at 0.125 μηη. (Tensile elastic modulus) φ Apply the adhesive composition The PET film with a width of 200 mm and a thickness of 50 μm was subjected to drying and ultraviolet curing, and then peeled off from the PET film to a sample width of 10 mm, a chuck distance of 110 mm, and a tensile speed of 50. The tensile test was performed in mm/min, and the tensile modulus of elasticity was calculated from the stress at the time of measurement. The measurement was based on JIS K7127. Further, the cleaning sheets obtained in the examples and the comparative examples were subjected to the following evaluations. The vertical adhesion force, the conveyance property, and the foreign matter collection property were evaluated in the same manner as described above. [Table 3] The cleaning adhesive layer evaluated the depth ratio of the flat concave portion of the opening portion of the concave portion of the concave portion _ concave portion Surface flat tensile modulus (MPa), vertical stripping, foreign object area (%), average opening diameter (μιη), uniformity (Ra): (μιη), separation force (N), trapping example 3 1 27 2.3 0.05 0.023 70 2 〇75% or more Example 3-2 25 2.5 0.06 0.25 300 0.5 〇75% or more Comparative Example 3-1 - - 70 15 X Cannot be evaluated Comparative Example 3-2 24 2.5 0.06 0.006 300 2 〇 60 to 70% 120368.doc -70- 200808933 in Comparative Example 3·1 'Cannot be transported, so it cannot be evaluated. [Simplified description of the drawings] The stomach 1 is the cleaning adhesive of the present invention. FIG. 2 is the cleaning adhesive of the present invention. FIG. 3 is a section using the cleaning adhesive sheet of the present invention. An example of a diagram. An example of a cross-sectional view of a layer is an example of a cross-sectional view of a layer of a cleaning agent (a cleaning sheet is used in Fig. 4, which is a cleaning adhesive sheet of the present invention). Cleaning layer for the agent layer (for cleaning)

圖5係實施例1 -1中所獲得之清潔 像0 用黎著劑層之剖面圖 圖6係實施例1 _2中所獲得之清潔 像0 用黏著劑層之剖面 圖 用黏著劑層之剖面圖 圖7係實施例1 -3中所獲得之清潔 像0 圖8係實施例丨-4中所獲得之清潔用黏著劑層之剖面圖 像。Figure 5 is a cross-sectional view of the cleaning image obtained in Example 1-1 with a coating layer. Figure 6 is a cleaning image obtained in Example 1 _2. The profile of the adhesive layer is a cross-sectional view of the adhesive layer. Figure 7 is a cleaning image obtained in Example 1-3. Figure 8 is a cross-sectional image of the cleaning adhesive layer obtained in Example 丨-4.

圖9係實施例1-5中所獲得之清潔用黏著劑層之剖面圖 像。 圖10係比較例1-1中所獲得之清潔用黏著劑層之剖面圖 像0 圖11A係實施例2-1中所獲得之清潔用黏著劑層之俯視圖 像。 圖11B係實施例2-1中所獲得之清潔用黏著劑層之剖面圖 像0 120368.doc -71- 200808933 圖12A係實施例2-2中所獲得之清潔用黏著劑層之偏^見胃 圖12B係實施例2-2中所獲得之清潔用黏著劑之 曰a l|面圖 像。 圖13 A係實施例2-3中所獲得之清潔用黏著劑層之俯視@ 像。 曰”圖 圖13B係實施例2-3中所獲得之清潔用黏著劑層之剖面圖 像0Figure 9 is a cross-sectional view of the cleaning adhesive layer obtained in Example 1-5. Fig. 10 is a cross-sectional view of the cleaning adhesive layer obtained in Comparative Example 1-1. Fig. 11A is a plan view of the cleaning adhesive layer obtained in Example 2-1. Figure 11B is a cross-sectional image of the cleaning adhesive layer obtained in Example 2-1. 0 120368.doc -71- 200808933 Figure 12A is a partial view of the cleaning adhesive layer obtained in Example 2-2. Fig. 12B is a 曰al|face image of the cleaning adhesive obtained in Example 2-2. Figure 13A is a top view of the cleaning adhesive layer obtained in Example 2-3. Figure 13B is a cross-sectional view of the cleaning adhesive layer obtained in Example 2-3.

圖 圖 像0 圖 14A係比較例2-2中所獲得之清 14B係比較例2_2中所獲得之清 15係實施例3-1中所獲得之清 像。 >糸用黏著劑層之俯視圖 潔用黏著劑層之剖面圖 /系用黏著劑層之剖面圖 【主要元件符號說明】Fig. 14A is a clear image obtained in the clear example of Example 2-2 obtained in Comparative Example 2-2 obtained in Comparative Example 2-2. >Top view of the adhesive layer. Cross-sectional view of the adhesive layer / Cross-sectional view of the adhesive layer [Main component symbol description]

2 具有凹部之清潔用黏著劑層 支持體 (清潔層) 3 固定用黏著劑層 S 表面 a b 凹部 凹部以外之清潔用 黏著齊丨層(清潔層)表面 120368.doc -72-2 Adhesive layer for cleaning with recesses Support (cleaning layer) 3 Adhesive layer for fixing S Surface a b Concave Cleaning for adhesions other than recesses Adhesive layer (cleaning layer) surface 120368.doc -72-

Claims (1)

200808933 、申請專利範圍: 一種清潔用黏著劑層,其特徵在於:其係包括含有丙烯 酸系聚合物之放射線硬化性或熱硬化性丙烯酸系黏著劑 之硬化物,且具有平面狀之表面,用以將異物自處理對 象體除去者, 該黏著劑層之表面具有非連續性開口部之凹部,且開 口 °卩之平均開口徑小於平均異物尺寸。 2. 如請求項1之清潔用黏著劑層’其中異物包含異物尺寸 為1 〇 μιη以下者。 月求項1或2之清潔用黏著劑層,丨中上述開口部之平 均開口徑小於異物尺寸為10 μ喊下之異物的平均显物 尺寸。 八切 j項1之〆月^用黏著劑層,其中上述非連續性凹部 例:二面積相對於上述黏著劑層表面之總投影面積的比 例為3%〜8〇〇/〇。 5·如請求項1之清潔用黏著 ( 其+以㈣劑層表面 卩以外)之弹性模數為10 MPa以上。 6.,求項1之清潔用黏著劑層’纟中上 .大=1之清潔用黏著劑層,其中上述凹部之開口部 大致為圓形,其平均開1為0.1〜3叫, 述開口仫之標準偏差為0.7 μιη以下, 上述開口部之分佈係 偏差為1μϊη以下。、相相口款中心距離之標準 120368.doc 200808933 l = ^ 7之清潔用黏著劑層’其中上述非連續性凹部 &amp; ® %相對於上述黏著劑層表面之總投影面積的比 例為15〜8〇%。 9·如喷求項7或8之清潔用黏著劑層,其中上述凹部之深度 (h)相對&amp;上述黏著劑^之厚|⑻的 〇·〇1 〜0·1。 ’ 10·如睛求項1之清潔用黏著劑層,其中上述凹部以外之平200808933, Patent Application Range: A cleaning adhesive layer, which comprises a cured product of a radiation curable or thermosetting acrylic adhesive containing an acrylic polymer, and has a planar surface for When the foreign matter is removed from the object to be processed, the surface of the adhesive layer has a concave portion of the discontinuous opening portion, and the average opening diameter of the opening 卩 is smaller than the average foreign matter size. 2. The cleaning adhesive layer of claim 1 wherein the foreign matter contains a foreign matter having a size of 1 〇 μιη or less. In the cleaning adhesive layer of the first or second aspect, the average opening diameter of the opening in the crucible is smaller than the average apparent size of the foreign matter shouted by the foreign matter size of 10 μ. In the case of the above-mentioned discontinuous concave portion, the ratio of the two areas to the total projected area of the surface of the above adhesive layer is 3% to 8 Å/〇. 5. The elastic modulus of the cleaning of claim 1 (other than + on the surface of the (four) agent layer) is 10 MPa or more. 6. The cleaning adhesive layer of the cleaning adhesive of claim 1, wherein the opening of the concave portion is substantially circular, and the average opening 1 is 0.1 to 3, and the opening is The standard deviation of 仫 is 0.7 μm or less, and the variation of the distribution of the openings is 1 μϊη or less. The standard of the center distance of the phase mouth 120368.doc 200808933 l = ^ 7 of the cleaning adhesive layer 'the ratio of the above-mentioned discontinuous recess &amp; ® % relative to the total projected area of the surface of the above adhesive layer is 15~ 8〇%. 9. The cleaning adhesive layer according to Item 7 or 8, wherein the depth (h) of the concave portion is 〇·〇1 to 0·1 with respect to the thickness of the adhesive agent (8). </ RTI> 10] The cleaning adhesive layer of claim 1, wherein the recess is not flat 面狀表面之中心線平均粗度(Ra)為0.01〜0.3 μηι。 11·如:求項10之清潔用黏著劑層,其中上述非連續性凹部 之杈〜面積相對於上述黏著劑層表面之總投影面積的比 例為3%〜8〇%。 12_如請求項10或11之清潔用黏著劑層,其中上述凹部之開 口部大致為圓形,其平均開口徑為〇 U0 μιη。 13 ·如明求項1 〇之清潔用黏著劑層,其中上述凹部之深度(匕) 相對於上述黏著劑層之厚度(H)的比(h/H)為〇. 〇丨〜〇.9。 14·如請求項10之清潔用黏著劑層,其中上述黏著劑層之抗 張彈性模數為0.98 MPa〜500 MPa。 15·如請求項丨之清潔用黏著劑層,其中放射線硬化性或熱 硬化性丙烯酸糸黏著劑含有丙烯酸系聚合物及聚合性不 飽和化合物。 16· —種清潔片,其特徵在於將如請求項1至15中任一項之 清潔用黏著劑層,以其非連續性凹部成為表面之方式, 設置於支持體之至少單面上作為清潔層。 17_ —種清潔片,其特徵在於將如請求項1至15中任一項之 120368.doc 200808933 清潔用黏著劑層’以其非連續性凹部成為表面之方 設置於支持體之單面上作為清潔層,於另—面具/ 用黏著劑層。 ^ 18· -種具清潔功能之搬送構件,其特徵在於將如請求項Μ 或17之清潔片,經由固定用黏著劑層而設置於搬送 件。 再 19· -種清潔用黏著劑層之製造方法,其特徵在於:其係製 造如請求項7至9中任一項之清潔用黏著劑層者,其包括、 步驟⑴,藉由將黏著劑組合物溶液塗佈於基材上進行 ㈣’而形成黏著劑組合物層,上述黏著劑組合物溶液 係將於含有丙烯酸系聚合物之放射線硬化性或熱硬化性 丙烯酸系黏著劑中進而調配與上述丙烯酸系聚合物不相 奋之化合物的黏著劑組合物,溶解於包含溶解上述丙烯 酉文系聚合物之溶劑(A)及使上述丙烯酸系聚合物與上述不 相谷化合物二者相容之相容溶劑(B)的混合溶劑中而成; 步驟(2) ’對上述黏著劑組合物層進行放射線照射或加 熱,使上述丙烯酸系黏著劑硬化,並且形成具有該硬化 物與上述不相容化合物之相分離結構的黏著劑層前驅 物;以及 步驟(3),自所獲得之黏著劑層前驅物中,除去不相容 化合物。 2〇·如印求項19之清潔用黏著劑層之製造方法,其中使上述 2稀^系聚合物與上述不相容化合物二者相容之相容溶 ^ (B) ’其相容性參數%參數相對於丙烯酸系聚合物為 120368.doc 200808933 0·5〜3,相對於不相容化合物為〇·5〜3。 21·如請求項19或20之清潔用黏著劑層之製造方法,其中上 述不相容化合物相對於丙烯酸系聚合物之X參數為7以 上’且沸點為190°C以上。 之製造方法,其中上述黏 以於相容溶劑(B)不存在之 選擇溶劑(A)及相容溶劑 22.如請求項19之清潔用黏著劑層 著劑組合物溶液為均勻狀態, 狀態下產生相分離之方式, (B)。The center line average roughness (Ra) of the planar surface is 0.01 to 0.3 μη. 11. The cleaning adhesive layer of claim 10, wherein a ratio of the area of the discontinuous concave portion to the total projected area of the surface of the adhesive layer is 3% to 8%. The cleaning adhesive layer according to claim 10 or 11, wherein the opening portion of the concave portion is substantially circular, and an average opening diameter is 〇 U0 μιη. 13· The cleaning adhesive layer according to claim 1, wherein the ratio (h/H) of the depth (匕) of the concave portion to the thickness (H) of the adhesive layer is 〇. 〇丨~〇.9 . The cleaning adhesive layer according to claim 10, wherein the adhesive layer has a tensile modulus of 0.98 MPa to 500 MPa. 15. The cleaning adhesive layer according to claim 1, wherein the radiation curable or thermosetting acrylic ruthenium adhesive contains an acrylic polymer and a polymerizable unsaturated compound. A cleaning sheet characterized in that the cleaning adhesive layer according to any one of claims 1 to 15 is provided on at least one side of the support as a surface in such a manner that the discontinuous concave portion thereof becomes a surface. Floor. A cleaning sheet characterized in that the cleaning adhesive layer '120368.doc 200808933 according to any one of claims 1 to 15 is provided on one side of the support with the discontinuous concave portion as a surface thereof. Clean the layer on the other mask/adhesive layer. A transporting member having a cleaning function, characterized in that the cleaning sheet of the request item 或 or 17 is placed on the conveying member via a fixing adhesive layer. Further, a method for producing a cleaning adhesive layer, which is characterized in that it is a cleaning adhesive layer according to any one of claims 7 to 9, which comprises, step (1), by using an adhesive The composition solution is applied to the substrate to carry out (4)' to form an adhesive composition layer, and the adhesive composition solution is further blended in a radiation curable or thermosetting acrylic adhesive containing an acrylic polymer. The adhesive composition of the compound in which the acrylic polymer is incompatible is dissolved in a solvent (A) containing the above-mentioned acrylic polymer, and a phase compatible with the above-mentioned non-phase compound a solvent (B) mixed solvent; step (2) 'radiating or heating the above-mentioned adhesive composition layer to harden the acrylic adhesive, and forming the cured product and the above incompatible compound The adhesive layer precursor of the phase separation structure; and the step (3), the incompatible compound is removed from the obtained adhesive layer precursor. 2. The method for producing a cleaning adhesive layer according to the item 19, wherein the compatibility of the above-mentioned two-dimensional polymer with the above-mentioned incompatible compound is compatible (B)' compatibility The parameter % parameter is 120368.doc 200808933 0·5~3 with respect to the acrylic polymer, and 〇·5~3 with respect to the incompatible compound. The method for producing a cleaning adhesive layer according to claim 19 or 20, wherein the X parameter of the above-mentioned incompatible compound with respect to the acrylic polymer is 7 or more and the boiling point is 190 ° C or higher. The manufacturing method, wherein the above-mentioned selective solvent (A) and the compatible solvent which are not present in the compatible solvent (B) are 22. The cleaning adhesive layer composition solution of claim 19 is in a uniform state. The way in which phase separation occurs, (B). 23. 如請求項19之清潔用黏著劑層之製造方法,其中上述相 容溶劑(B)為醇系溶劑。 〃 24. -種清潔用黏著劑層之製造方法,其特徵在於··其係製 造如請求項10至15之清潔用黏著劑層者,其包括 步驟⑴’將於放射線硬化性或熱硬化性丙稀酸系黏著 劑中進而調配與上述丙烯酸系黏著劑不相容之化合物的 黏著劑組合物塗佈於基材上,形絲著劑組合物層; ⑺’藉由具有中心線平均粗度⑽)為, 之表面之覆蓋膜,以覆蓋膜之具有上述中心線平均粗度 (R:)之表面成為上述黏著劑組合物層之表面侧之方式, 復孤上述黏著劑組合物層之表面,於該狀態下進行放射 線…、射或加熱,使上述丙烯酸系黏著劑硬化,並且形成 具有其硬化物與上述不相容化合物之相分離結構的黏著 劑層前驅物;以及 步”驟(3),自所獲得之黏著劑層前驅物中除去不相容化 合物。 120368.doc 200808933 25_如請求項24之清潔用黏著劑層之製造方法,其中上述步 驟(1)中,作為黏著劑組合物,將調配可溶解黏著劑組合 物之有機溶劑的黏著劑組合物溶液塗佈於基板上,進而 進行乾燥,藉此形成黏著劑組合物層。 26·如請求項19之清潔用黏著劑層之製造方法,其中上述步 驟(3)係藉由加熱,而自黏著劑層前驅物中除去不相容化 合物。 27. 如請求項19之清潔用黏著劑層之製造方法,其中上述步 驟(3)係藉由溶劑萃取,而自黏著劑層前驅物中除去不相 各化合物。 μ 28. 如請求項27之清潔用黏著劑層之製造方法,其中上述溶 背1萃取所用之溶劑為液化二氧化礙或處於超臨界狀態之 二氧化碳。 29·如請求項19之清潔用黏著劑層之製造方法,其中上述步 驟(2)中,於以覆蓋膜覆蓋黏著劑組合物層表面之狀熊 下’進行放射線照射或加熱。 3〇· 一種異物清潔方法,其特徵在於將包含如請求項〗至15 之清潔用黏著劑層之清潔層,應用於附著有異物之處理 對象體,自處理對象體除去異物。 種π漂方法’其特徵在於使用如請求項16或17之清潔 片。 、 32· 一種清潔方法,其特徵在於使用如請求項18之具清潔功 月匕之搬送構件。 , 33. -種基板處理裝置之清潔方法,其特徵在於:其係如請 120368.doc 200808933 求項30至32之清潔方法,其係將如請求項16或17之清潔 片或如請求項18之具清潔功能之搬送構件,搬送至基板 處理裝置内。23. The method of producing a cleaning adhesive layer according to claim 19, wherein the above-mentioned compatible solvent (B) is an alcohol solvent. 〃 24. A method of producing a cleaning adhesive layer, characterized in that it comprises a cleaning adhesive layer according to claims 10 to 15, which comprises the step (1) 'to be radioactive or thermosetting. An adhesive composition in which an acrylic-based adhesive is further compounded with a compound which is incompatible with the above-mentioned acrylic adhesive, is applied to a substrate, and a coating composition layer is formed; (7) 'by having a center line average roughness (10)) a coating film on the surface of the surface of the adhesive composition layer in such a manner that the surface of the cover film having the average thickness (R:) of the center line becomes the surface side of the adhesive composition layer And performing radiation, radiation or heating in the state to harden the acrylic adhesive, and forming an adhesive layer precursor having a phase separation structure of the cured product and the incompatible compound; and step (3) And removing the incompatible compound from the obtained adhesive layer precursor. The method for producing the cleaning adhesive layer according to claim 24, wherein in the above step (1), In the adhesive composition, a solution of an adhesive composition prepared by dissolving an organic solvent capable of dissolving the adhesive composition is applied onto a substrate, followed by drying to form an adhesive composition layer. A method of producing an adhesive layer, wherein the step (3) removes an incompatible compound from the adhesive layer precursor by heating. 27. The method for producing a cleaning adhesive layer according to claim 19, wherein the above The step (3) removes the phase-incompatible compound from the adhesive layer precursor by solvent extraction. μ 28. The method for producing a cleaning adhesive layer according to claim 27, wherein the solvent used for the above-mentioned solvent extraction 1 is used The method for producing a cleaning adhesive layer according to claim 19, wherein in the step (2), the surface of the adhesive composition layer is covered with a cover film. Under the bear's radiation exposure or heating. 3〇· A method of cleaning foreign matter, characterized in that a cleaning layer containing a cleaning adhesive layer as claimed in claims -15 to 15 is applied. The processing target body to which the foreign matter adheres is removed, and the foreign matter is removed from the processing target body. The π-bleave method is characterized in that the cleaning sheet of claim 16 or 17 is used. 32. A cleaning method characterized by using the item 18 The cleaning method of the cleaning power. 33. - A cleaning method for a substrate processing apparatus, characterized in that it is a cleaning method of the method of claim 30368.doc 200808933, which is as claimed in claim 16 Or the cleaning sheet of 17 or the conveying member having the cleaning function of claim 18 is transported into the substrate processing apparatus. 120368.doc 200808933 七、指定代表圖: (一) 本案指定代表圖為:第(1)圖。 (二) 本代表圖之元件符號簡單說明: 1 具有凹部之清潔用黏著劑層(清潔層) a 凹部 % S 表面 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式·· (無)120368.doc 200808933 VII. Designated representative map: (1) The representative representative of the case is: (1). (2) The symbol of the symbol of the representative figure is briefly described as follows: 1 The adhesive layer with a recess (cleaning layer) a The concave part % S Surface 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention. no) 120368.doc120368.doc
TW096113841A 2006-04-19 2007-04-19 Pressure sensitive adhesive layer for cleaning, process for producing the same, cleaning sheet, delivery member with cleaning function, and method of cleaning off foreign matter TW200808933A (en)

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TWI487730B (en) * 2009-04-14 2015-06-11 Ube Industries Polyimide film for metallizing, method for producing thereof and metal laminated polyimide film
US11638938B2 (en) 2019-06-10 2023-05-02 Kla Corporation In situ process chamber chuck cleaning by cleaning substrate
JP7315439B2 (en) * 2019-11-26 2023-07-26 日東電工株式会社 Cleaning sheet and conveying member with cleaning function

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