TW200838298A - Solid-state imaging device, drive method of solid-state imaging device, and imaging device - Google Patents

Solid-state imaging device, drive method of solid-state imaging device, and imaging device Download PDF

Info

Publication number
TW200838298A
TW200838298A TW96144572A TW96144572A TW200838298A TW 200838298 A TW200838298 A TW 200838298A TW 96144572 A TW96144572 A TW 96144572A TW 96144572 A TW96144572 A TW 96144572A TW 200838298 A TW200838298 A TW 200838298A
Authority
TW
Taiwan
Prior art keywords
pixel
pixels
accumulation time
column
imaging device
Prior art date
Application number
TW96144572A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357761B (enrdf_load_stackoverflow
Inventor
Keiji Mabuchi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200838298A publication Critical patent/TW200838298A/zh
Application granted granted Critical
Publication of TWI357761B publication Critical patent/TWI357761B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/186—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors having arrangements for blooming suppression
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H04N25/441—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by reading contiguous pixels from selected rows or columns of the array, e.g. interlaced scanning
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/53—Control of the integration time
    • H04N25/533—Control of the integration time by using differing integration times for different sensor regions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/58—Control of the dynamic range involving two or more exposures
    • H04N25/587—Control of the dynamic range involving two or more exposures acquired sequentially, e.g. using the combination of odd and even image fields
    • H04N25/589—Control of the dynamic range involving two or more exposures acquired sequentially, e.g. using the combination of odd and even image fields with different integration times, e.g. short and long exposures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
    • H04N25/621—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels for the control of blooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW96144572A 2006-12-07 2007-11-23 Solid-state imaging device, drive method of solid-state imaging device, and imaging device TW200838298A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006330295A JP4961982B2 (ja) 2006-12-07 2006-12-07 固体撮像装置、固体撮像装置の駆動方法および撮像装置

Publications (2)

Publication Number Publication Date
TW200838298A true TW200838298A (en) 2008-09-16
TWI357761B TWI357761B (enrdf_load_stackoverflow) 2012-02-01

Family

ID=39491919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96144572A TW200838298A (en) 2006-12-07 2007-11-23 Solid-state imaging device, drive method of solid-state imaging device, and imaging device

Country Status (7)

Country Link
US (4) US8274588B2 (enrdf_load_stackoverflow)
EP (1) EP2101488A4 (enrdf_load_stackoverflow)
JP (1) JP4961982B2 (enrdf_load_stackoverflow)
KR (1) KR101422875B1 (enrdf_load_stackoverflow)
CN (1) CN101554044A (enrdf_load_stackoverflow)
TW (1) TW200838298A (enrdf_load_stackoverflow)
WO (1) WO2008069015A1 (enrdf_load_stackoverflow)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013509820A (ja) * 2009-10-28 2013-03-14 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 符号化ローリングシャッタの方法およびシステム
JP5726434B2 (ja) * 2010-04-14 2015-06-03 浜松ホトニクス株式会社 半導体光検出素子
WO2012014553A1 (ja) * 2010-07-28 2012-02-02 富士フイルム株式会社 撮像装置及び撮像方法
US8994843B2 (en) 2010-09-01 2015-03-31 Qualcomm Incorporated High dynamic range image sensor
JP5655626B2 (ja) 2011-02-24 2015-01-21 ソニー株式会社 画像処理装置、および画像処理方法、並びにプログラム
JP2013038504A (ja) * 2011-08-04 2013-02-21 Sony Corp 撮像装置、および画像処理方法、並びにプログラム
JP5999750B2 (ja) 2011-08-25 2016-09-28 ソニー株式会社 撮像素子、撮像装置及び生体撮像装置
JP2013050538A (ja) 2011-08-30 2013-03-14 Sony Corp 表示装置および電子機器
US8576979B2 (en) * 2011-10-11 2013-11-05 Omnivision Technologies, Inc. Arithmetic counter circuit, configuration and application for high performance CMOS image sensors
US8786732B2 (en) * 2012-10-31 2014-07-22 Pixon Imaging, Inc. Device and method for extending dynamic range in an image sensor
KR102039464B1 (ko) 2013-05-21 2019-11-01 삼성전자주식회사 전자 센서와, 그의 제어 방법
JP5665932B2 (ja) * 2013-07-31 2015-02-04 キヤノン株式会社 放射線検出器及び制御方法
JP6413235B2 (ja) * 2013-12-06 2018-10-31 株式会社ニコン 撮像素子および撮像装置
KR102170627B1 (ko) 2014-01-08 2020-10-27 삼성전자주식회사 이미지 센서
KR102198853B1 (ko) 2014-11-27 2021-01-05 삼성전자 주식회사 이미지 센서, 및 상기 이미지 센서를 포함하는 이미지 처리 시스템
CN106157902A (zh) * 2015-03-26 2016-11-23 群创光电股份有限公司 显示装置及感测装置
KR102407036B1 (ko) 2015-11-03 2022-06-10 삼성전자주식회사 이미지 센서 및 이미지 센서의 동작 방법
GB2554663B (en) * 2016-09-30 2022-02-23 Apical Ltd Method of video generation
KR102488600B1 (ko) * 2017-09-26 2023-01-13 삼성디스플레이 주식회사 지문 감지 장치 및 그 구동 방법
JP7307534B2 (ja) * 2018-10-04 2023-07-12 浜松ホトニクス株式会社 レーザ加工方法、半導体デバイス製造方法及び検査装置
KR102712154B1 (ko) * 2019-05-22 2024-09-30 삼성전자주식회사 디스플레이 구동 회로 및 이를 포함하는 디스플레이 장치
CN112672070B (zh) * 2020-12-30 2022-07-26 惠州华阳通用电子有限公司 一种摄像头拍摄参数调节方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2986685B2 (ja) * 1994-07-28 1999-12-06 松下電子工業株式会社 固体撮像装置の駆動方法と信号処理方法
WO1997017800A1 (en) * 1995-11-07 1997-05-15 California Institute Of Technology An image sensor with high dynamic range linear output
JP2000078596A (ja) * 1998-08-31 2000-03-14 Mitsubishi Electric Corp ビデオカメラ
KR100344505B1 (ko) * 1998-11-30 2002-07-24 가부시끼가이샤 도시바 고체 이미징 장치
EP1093698B1 (en) 1999-04-09 2012-08-01 Casio Computer Co., Ltd. Drive control method for photosensor system
JP3615454B2 (ja) * 2000-03-27 2005-02-02 三洋電機株式会社 ディジタルカメラ
JP4831892B2 (ja) * 2001-07-30 2011-12-07 株式会社半導体エネルギー研究所 半導体装置
JP2003169259A (ja) * 2001-12-04 2003-06-13 Hitachi Ltd 撮像装置
JP4282262B2 (ja) * 2001-12-13 2009-06-17 オリンパス株式会社 撮像装置
JP4135360B2 (ja) * 2001-12-25 2008-08-20 ソニー株式会社 固体撮像装置
US7382407B2 (en) * 2002-08-29 2008-06-03 Micron Technology, Inc. High intrascene dynamic range NTSC and PAL imager
JP2005175626A (ja) * 2003-12-08 2005-06-30 Micron Technology Inc イメージング用ワイドダイナミックレンジオペレーション
US7446812B2 (en) * 2004-01-13 2008-11-04 Micron Technology, Inc. Wide dynamic range operations for imaging
US20050168589A1 (en) * 2004-01-30 2005-08-04 D. Amnon Silverstein Method and system for processing an image with an image-capturing device
US7880785B2 (en) * 2004-07-21 2011-02-01 Aptina Imaging Corporation Rod and cone response sensor
JP2006253876A (ja) * 2005-03-09 2006-09-21 Sony Corp 物理量分布検知装置および物理量分布検知装置の駆動方法
JP5182555B2 (ja) * 2005-03-15 2013-04-17 オムロン株式会社 画像処理装置および画像処理方法、画像処理システム、プログラム、並びに、記録媒体
JP4756960B2 (ja) * 2005-09-02 2011-08-24 キヤノン株式会社 撮像装置及びその制御方法、コンピュータプログラム及び記憶媒体
US7855740B2 (en) * 2007-07-20 2010-12-21 Eastman Kodak Company Multiple component readout of image sensor
JP4587185B2 (ja) * 2008-02-27 2010-11-24 キヤノン株式会社 撮像システム及び撮像装置の制御方法

Also Published As

Publication number Publication date
US8274588B2 (en) 2012-09-25
US9899447B2 (en) 2018-02-20
JP4961982B2 (ja) 2012-06-27
TWI357761B (enrdf_load_stackoverflow) 2012-02-01
KR20090086091A (ko) 2009-08-10
US20150124141A1 (en) 2015-05-07
KR101422875B1 (ko) 2014-07-23
US20100066878A1 (en) 2010-03-18
WO2008069015A1 (ja) 2008-06-12
US20170062509A1 (en) 2017-03-02
US8964077B2 (en) 2015-02-24
US9531972B2 (en) 2016-12-27
JP2008147818A (ja) 2008-06-26
EP2101488A4 (en) 2013-02-27
CN101554044A (zh) 2009-10-07
EP2101488A1 (en) 2009-09-16
US20120307118A1 (en) 2012-12-06

Similar Documents

Publication Publication Date Title
TW200838298A (en) Solid-state imaging device, drive method of solid-state imaging device, and imaging device
TWI382756B (zh) A solid-state imaging device, a driving method of a solid-state imaging device, and an imaging device
TWI516122B (zh) 固態成像裝置，固態成像裝置之信號處理方法，及電子設備
JP5664175B2 (ja) 固体撮像装置とその駆動方法、及び電子機器
KR101450203B1 (ko) 고체 촬상 장치 및 촬상 장치
TWI446789B (zh) 固態影像感測器件、固態影像感測器件之類比至數位轉換方法、及電子裝置
JP4211849B2 (ja) 物理量検出装置、固体撮像装置及び撮像装置
JP5066996B2 (ja) 固体撮像装置、固体撮像装置の信号処理方法および撮像装置
JP2013005396A (ja) 固体撮像装置、固体撮像装置の駆動方法、及び電子機器
WO2015012098A1 (ja) 固体撮像素子および電子機器
CN104137536A (zh) 固态成像元件及其驱动方法以及电子设备
JP2014239289A (ja) Ａｄ変換器、信号処理方法、固体撮像装置、および電子機器
TW558898B (en) Image sensor and light detecting element with an interlaced alternating pixel scheme, and a method therefor
JP4758318B2 (ja) 固体撮像装置
TWI633790B (zh) Solid-state imaging device and driving method thereof and electronic device
JP5398610B2 (ja) 固体電子撮像装置およびその動作制御方法
US20060152611A1 (en) Image pickup device
TWI429281B (zh) 固態成像裝置，固態成像裝置之信號處理方法，及電子設備
JP2003060991A (ja) 固体撮像装置の駆動方法
JP2006109037A (ja) 固体撮像装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees