TW200837221A - Metal strip, connector, and method for producing metal strip - Google Patents

Metal strip, connector, and method for producing metal strip Download PDF

Info

Publication number
TW200837221A
TW200837221A TW096148941A TW96148941A TW200837221A TW 200837221 A TW200837221 A TW 200837221A TW 096148941 A TW096148941 A TW 096148941A TW 96148941 A TW96148941 A TW 96148941A TW 200837221 A TW200837221 A TW 200837221A
Authority
TW
Taiwan
Prior art keywords
layer
metal strip
metal
compound
base metal
Prior art date
Application number
TW096148941A
Other languages
English (en)
Chinese (zh)
Inventor
Masahide Okamoto
Osamu Ikeda
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200837221A publication Critical patent/TW200837221A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
TW096148941A 2006-12-20 2007-12-20 Metal strip, connector, and method for producing metal strip TW200837221A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006342073A JP2008150690A (ja) 2006-12-20 2006-12-20 金属条、コネクタ、および金属条の製造方法

Publications (1)

Publication Number Publication Date
TW200837221A true TW200837221A (en) 2008-09-16

Family

ID=39536350

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148941A TW200837221A (en) 2006-12-20 2007-12-20 Metal strip, connector, and method for producing metal strip

Country Status (3)

Country Link
JP (1) JP2008150690A (fr)
TW (1) TW200837221A (fr)
WO (1) WO2008075723A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009097053A (ja) * 2007-10-19 2009-05-07 Hitachi Ltd 金属条、コネクタ、および金属条の製造方法
US8653375B2 (en) 2008-08-21 2014-02-18 Agere Systems, Inc. Mitigation of whiskers in Sn-films
US9748683B2 (en) * 2013-03-29 2017-08-29 Kobe Steel, Ltd. Electroconductive material superior in resistance to fretting corrosion for connection component
JP6365182B2 (ja) * 2014-09-26 2018-08-01 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
CN104453516A (zh) * 2014-12-04 2015-03-25 常熟宝成五金制品有限公司 耐低温的合页
CN104963578A (zh) * 2015-06-17 2015-10-07 苏州市大力电器有限公司 用于摩擦式定位合页的金属材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2851245B2 (ja) * 1994-12-28 1999-01-27 古河電気工業株式会社 Ｓｎ合金めっき材
JPH11350188A (ja) * 1998-06-03 1999-12-21 Furukawa Electric Co Ltd:The 電気・電子部品用材料とその製造方法、およびその材料を用いた電気・電子部品
JP2002226982A (ja) * 2001-01-31 2002-08-14 Dowa Mining Co Ltd 耐熱性皮膜、その製造方法および電気電子部品
JP2004300524A (ja) * 2003-03-31 2004-10-28 Dowa Mining Co Ltd Ｓｎ被覆を施した銅または銅合金部材およびその製造方法
JP2006161127A (ja) * 2004-12-09 2006-06-22 Takamatsu Mekki:Kk 嵌合型接続端子に適した電子材料とその製造方法
JP2006196323A (ja) * 2005-01-14 2006-07-27 Takamatsu Mekki:Kk 接続端子およびその製造方法

Also Published As

Publication number Publication date
WO2008075723A1 (fr) 2008-06-26
JP2008150690A (ja) 2008-07-03

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