200830627 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種天線裝置，尤指一種能簡化製 程、降低成本，並使平面電路的設置更符合經濟性要求之 天線裝置之製造方法及結構。 【先前技術】 時下行動電話上的天線裝置為避免佔用電路板上的堆 積面積’目冑普遍採平板式天線設置於行動電話的外殼内 壁或RF模組外殼等位置上。習知天線裝置的製程類似一 般撓性印刷電路板（FPC),係利用一軟性銅箱基材㈣X疏 C^perCladedLaminate/FCCL)為基材，進行如第—圖所示 之製程’依包括如下步驟：（1)清洗91，即將該銅箔基材清 潔刷洗乾淨；（2)覆膜92，即將該_基材藉接著劑覆上保 護膜(C〇Verlay) ’用以防止銅線路氧化及保護線路免受環境 PET(p〇Iyeste^ ^oyi^iide)等，（3)曝光93 ,即藉曝光機進行影像轉移， ^緣戶;(4)顯影94，即藉顯影術需要的影像 =6= (5)電鑛％ ’即將基板鍍上-層金屬;⑹ ^的射 餘料；（7)魏_ 97，即進行電路 留下所中14將不需要的基板铜材部分(影像)去除，最後 "的線路，以作為電訊傳輪的媒介；⑻貼絕緣膜 5 200830627 98，即覆上絕緣膜；⑼外】 冲版99，即將該撓性印刷電路 板沖製成所為之尺寸、形狀^ 如前所述習知天線裝置的製程較為繁瑣，致使其製造 成本較南，且’該製兹受+心 i程吊兩利用化學液劑，對於環保之維 護及生產線技術人員之储厣比 、、 貝之健康皆有不利影響，被非理想之製 造方式。 【發明内容】 本發明之目的在提供一種天線褒置之製造方法及結構 ’、其能使平面電路連結元件之製程大為減化，且同時降低 成本，使符合製造經濟效益及提升競爭力。 本發明之再-目的在提供_種天線裝置之製造方法及 …構’其朗聰具製造轉效益對環保之賴及生產線 技術人員之健康具有積極性之改善。 、本發明為了達成上述之目的及功效，其所採行之技術 方法〇括如下步驟：⑴辞貼合步驟，即以—導體薄片為基 材：於體薄片之上、下方分別設—上絕緣層及下絕緣層， hx上絕緣層、導體薄片及下絕緣層進行熱貼合操作而固 、、、口成撓性基板；（2)局部電鑛步驟，即於導體薄片之一導 接部處進行局部鍍金或鍍鎳；（3)線路沖製步驟，即將該撓 性基板進行線路沖製；（4)貼保護膜步驟，即於撓性基板一 方貼設保護膜；（5)貼固定膜步驟，即於撓性基板另一方貼 6 200830627 - 設固定膜，而完成天線裝置之製造。 依據本發明之方法所製造之天線裝置之結構係包括： ‘體薄片，具有電路線路；上絕緣層，係熱貼合於該導體 薄片之該電路線路上方；下絕緣層，係熱貼合於該導體薄 片之該電路線路下方；保護膜，係設於該上絕緣層上方； 貼固定膜，係設於該下絕緣層下方。 【實施方式】 請參閱第二圖，為本發明天線裝置之製造方法之流程 圖，本實施例以一具有天線功能之天線裝置1進行說明，如 圖所示，該天線裝置之製造方法包括以下步驟： 熱貼合11步驟：即以一導體薄片21作為基材，於本實 施例中可採用銅箔或鋁箔作為導體薄片21之材料(如第三 圖所示），於導體薄片21之上方及下方分別設一上絕緣層22 及下絕緣層23，並對上絕緣層22、導體薄片21及下絕緣層 ❿ 23三者進行熱貼合操作，使其固結成-撓性基板2〇，其中 於導體薄片21凸設一導接部211，而該上絕緣層22及下絕緣 層23亦分別對應設置一導接覆部221、231 ; 局部鍍金12步驟:於導體薄片21之導接部211處進行局 部鑛金(或鐘鎳），使該導接部211形成強化接點212，用以 加強其電路導接傳輸效果； 線路沖製13步驟：將熱貼合後之撓性基板2〇進行線路 7 200830627 沖製(如第四圖所示），使導體薄片21形成有接腳213a、213b 及頻率通道區214等，其中接腳213b係呈分離，而頻率通道 區214係為配合天線運作線路之設置；該上絕緣層22係對應 沖設有接腳覆部223a、223b及通道區224，該下絕緣層23 係對應沖設有接腳覆部233a、233b及通道區23 4，其中接腳 覆部223b、233b係對應於接腳213b而呈分離； 貼保護膜14步驟：於撓性基板20上方貼設一保護膜 24(如第五圖所示），保護膜24可為透明或半透光之膠膜， 用以固定接腳213b、接腳覆部223b及保護撓性基板20内部 線路，而且通常保護膜24之大小係約與撓性基板2〇相當； 貼固定膜15步驟：於撓性基板20下方貼設(如利用黏 貼專方式)一固定膜25(如第五圖所示），固定膜25係用以固 定接腳213b、接腳覆部233b及保護撓性基板20内部線路， 固定膜25係具有下方之黏層，用以結合一離型膜26，離型 膜26可藉撕離操作與固定膜25分離(如離型紙作用），使該 天線裝置1之完成品能便利進行黏貼定位之利用；且通常固 疋膜25之大小係約與撓性基板2〇相當，而離型膜26係大於 該固定膜25，用以便利撕離該固定膜25 ;及 外型沖製16步驟：將該天線裝置1沖製成所需之尺寸、 开/狀藉由以上各步驟，以完成一天線裝置。如是，本發 明之天線裝置之結構，由上而下依序為保護膜24、上絕緣 層22、導體薄片21、下絕緣層23及固定膜25所構成。 200830627 由以上說明可知’本發縣大的特色是彻生產天線 裝置之精簡製程，改善習知製程繁璃、成本高之諸瑕疲， 而月匕符合製造經濟效盈及提升電子產品之競爭力；且同時 魏大量化學㈣之使用，對環保之維護及生產線技術人 員之健康皆具有積極性之改善。 综合以上所述，本發明能改善撓性電路連結元件之势 程及降低成本，確實為-相當優異之創思，爱依法提岭 • =利申請；惟上述說明之内容，僅為本發明之較佳實: 例扰明，凡依本發明之技術手段所延伸之變化，皆應落入 本發明之專利申請範圍，特此說明。 ^入 【圖式簡單說明】 第一圖為習知天線裝置之製造方法流程圖。 第二圖為本發明天線裝置之製造方法流程圖。 第三圖為本發明之熱貼合步驟之結構分解立體圖。 第四圖為本發明之線路沖製步驟之結構分解立體圖。 第五圖為本發明天線裝置之結構分解立體圖。 【主要元件符號說明】 清洗 91 覆膜 92 曝光 93 顯影 94 電鍍 95 去墨 96 9 200830627 • 線路蝕刻97 外型沖製99 上絕緣層22 下絕緣層23 導接部 211 強化接點212 頻率通道區214 ¥ 通道區 224 通道區 234 固定膜 25 熱貼合 Π 線路沖製13 貼固定膜15 貼絕緣膜98 天線裝置1 導體薄片21 撓性基板20 導接覆部221、231 接腳 213a、213b 接腳覆部223a、223b 接腳覆部233a、233b 保護膜 24 離型膜 26 局部鍍金12 貼保護膜14 外型沖製16200830627 IX. Description of the Invention: [Technical Field] The present invention relates to an antenna device, and more particularly to a method for manufacturing an antenna device which can simplify the process, reduce the cost, and make the arrangement of the planar circuit more economical. structure. [Prior Art] The antenna device on the current mobile phone is to avoid occupying the stacking area on the circuit board. It is generally known that the planar antenna is disposed at the inner wall of the mobile phone or the outer casing of the RF module. The process of the conventional antenna device is similar to that of a general flexible printed circuit board (FPC), which uses a soft copper box substrate (4) X C C^perCladed Laminate/FCCL) as a substrate, and the process as shown in the first figure is included as follows Step: (1) cleaning 91, that is, cleaning and cleaning the copper foil substrate; (2) coating 92, that is, the substrate is coated with a protective film (C〇Verlay) to prevent oxidation of the copper line and Protect the circuit from environmental PET (p〇Iyeste^^oyi^iide), etc., (3) Exposure 93, that is, image transfer by exposure machine, ^Yuanhu; (4) Development 94, that is, image required by development = 6= (5) % of electric ore 'will be plated with a layer of metal; (6) ^ of the residual material; (7) Wei _ 97, that is, the circuit will leave the 14 parts of the substrate copper that will be unnecessary (image) Remove, last " the line, as the medium of the telecommunication transmission wheel; (8) affixing the insulating film 5 200830627 98, that is, covering the insulating film; (9) outside the rushing plate 99, that is, the flexible printed circuit board is punched into the size , shape ^ As mentioned above, the process of the conventional antenna device is relatively cumbersome, resulting in a relatively low manufacturing cost, and 'the system is affected by + The use of chemical liquids for the two-way cranes has a negative impact on the environmental protection of the maintenance and production line technicians, and the health of the shell, and is not ideally produced. SUMMARY OF THE INVENTION An object of the present invention is to provide a method and structure for manufacturing an antenna device, which can greatly reduce the manufacturing process of a planar circuit connecting component, and at the same time reduce the cost, thereby making it economical and enhancing competitiveness. A further object of the present invention is to provide a method for manufacturing an antenna device and an improvement in the health of the environmental protection and the health of the production line technicians. In order to achieve the above objects and effects, the technical method adopted by the present invention includes the following steps: (1) a step of attaching and splicing, that is, using a conductor sheet as a substrate: respectively, on the upper and lower sides of the body sheet The layer and the lower insulating layer, the hx upper insulating layer, the conductor sheet and the lower insulating layer are subjected to a heat bonding operation to form a flexible substrate, and the port is formed into a flexible substrate; (2) a partial electric ore step, that is, a guiding portion of the conductor sheet Partial gold plating or nickel plating; (3) line punching step, that is, the flexible substrate is line punched; (4) a protective film step, that is, a protective film is attached to one side of the flexible substrate; (5) In the film step, the other side of the flexible substrate is attached 6 200830627 - a fixed film is provided to complete the manufacture of the antenna device. The structure of the antenna device manufactured by the method of the present invention comprises: 'a body sheet having a circuit line; an upper insulating layer which is heat-bonded to the circuit line of the conductor sheet; and a lower insulating layer which is heat-bonded to The conductive film is disposed under the circuit line; the protective film is disposed above the upper insulating layer; and the fixed film is disposed under the lower insulating layer. [Embodiment] Please refer to the second figure, which is a flowchart of a method for manufacturing an antenna device according to the present invention. This embodiment is described by an antenna device 1 having an antenna function. As shown in the figure, the method for manufacturing the antenna device includes the following Step: The step of heat bonding 11 is to use a conductor sheet 21 as a substrate. In this embodiment, a copper foil or an aluminum foil can be used as the material of the conductor sheet 21 (as shown in the third figure) above the conductor sheet 21. And an upper insulating layer 22 and a lower insulating layer 23 are respectively disposed on the lower side, and the upper insulating layer 22, the conductor sheet 21 and the lower insulating layer 23 are thermally bonded to each other to be consolidated into a flexible substrate 2? A conductive portion 211 is protruded from the conductor sheet 21, and the upper insulating layer 22 and the lower insulating layer 23 are respectively provided with a guiding portion 221, 231; a partial gold plating step 12: a guiding portion of the conductor sheet 21 At 211, a local gold (or nickel) is formed, so that the guiding portion 211 forms a reinforcing joint 212 for enhancing the circuit guiding transmission effect; the line punching step 13: the heat-bonded flexible substrate 2 〇 proceed line 7 200830627 stamping (such as the first As shown in the figure, the conductor sheet 21 is formed with pins 213a, 213b and a frequency channel region 214, etc., wherein the pins 213b are separated, and the frequency channel region 214 is arranged to match the antenna operation circuit; the upper insulating layer 22 Correspondingly, the pin covering portions 223a and 223b and the channel region 224 are correspondingly punched, and the lower insulating layer 23 is correspondingly provided with the pin covering portions 233a and 233b and the channel region 23 4, wherein the pin covering portions 223b and 233b correspond to each other. Separating from the pin 213b; attaching the protective film 14: a protective film 24 is attached on the flexible substrate 20 (as shown in FIG. 5), and the protective film 24 can be a transparent or semi-transparent film. The fixing pin 213b, the pin covering portion 223b, and the inner circuit of the protective flexible substrate 20 are protected, and generally the size of the protective film 24 is approximately the same as that of the flexible substrate 2; the fixing film 15 is attached: the lower surface of the flexible substrate 20 is attached. A fixing film 25 (as shown in FIG. 5) is provided (for example, by using a bonding method), and the fixing film 25 is used for fixing the pin 213b, the pin covering portion 233b, and protecting the internal circuit of the flexible substrate 20, and fixing the film 25 The adhesive layer has a lower layer for bonding a release film 26, and the release film 26 can be peeled off. Separating from the fixed film 25 (such as a release paper), the finished product of the antenna device 1 can be conveniently utilized for the adhesive positioning; and generally the size of the solid film 25 is about the same as that of the flexible substrate 2, and the release film is The 26 series is larger than the fixing film 25 for facilitating the tearing off of the fixing film 25; and the external molding 16 step: the antenna device 1 is punched into a desired size, opened/shaped by the above steps to complete An antenna device. In the structure of the antenna device of the present invention, the protective film 24, the upper insulating layer 22, the conductor sheet 21, the lower insulating layer 23, and the fixed film 25 are sequentially formed from top to bottom. 200830627 It can be seen from the above description that 'the characteristics of this county are the streamlining process for the production of antenna devices, the improvement of the conventional process and the high cost, and the monthly compliance with the manufacturing economy and the competitiveness of electronic products. At the same time, the use of Wei Chemical (4) has positively improved the environmental protection and the health of the production line technicians. In summary, the present invention can improve the potential range of the flexible circuit connecting component and reduce the cost, and is indeed a rather excellent idea, and is suitable for the application of the law; but the above description is only the present invention. Preferably, the variation of the technical means according to the present invention is intended to fall within the scope of the patent application of the present invention. ^入 [Simplified description of the drawings] The first figure is a flow chart of the manufacturing method of the conventional antenna device. The second figure is a flow chart of a method of manufacturing an antenna device of the present invention. The third figure is a structural exploded perspective view of the heat bonding step of the present invention. The fourth figure is a structural exploded perspective view of the line punching step of the present invention. Fig. 5 is an exploded perspective view showing the structure of the antenna device of the present invention. [Main component symbol description] Cleaning 91 Coating 92 Exposure 93 Development 94 Plating 95 Deinking 96 9 200830627 • Line etching 97 External stamping 99 Upper insulating layer 22 Lower insulating layer 23 Conducting portion 211 Strengthening contact 212 Frequency channel area 214 ¥ Channel area 224 Channel area 234 Fixed film 25 Heat-bonded 线路 Line punched 13 Attached film 15 Attached insulating film 98 Antenna device 1 Conductor sheet 21 Flexible board 20 Conductor cover 221, 231 Pins 213a, 213b Foot covering portions 223a, 223b Foot covering portions 233a, 233b Protective film 24 Release film 26 Partial gold plating 12 Sticking protective film 14 External molding 16