1364872 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種天線裝置，尤指一種能簡化製 程、降低成本，並使平面電路的設置更符合經濟性要求之 天線裝置之製造方法及結構。 【先前技術】1364872 IX. Description of the Invention: [Technical Field] The present invention relates to an antenna device, and more particularly to a method for manufacturing an antenna device which can simplify the process, reduce the cost, and make the arrangement of the planar circuit more economical. structure. [Prior Art]
時下行動電話上的天線裝置為避免佔用電路板上的堆 積面積，目前普遍採平板式天線設置於行動電話的外殼内In order to avoid occupying the stacking area on the circuit board, the antenna device on the mobile phone is generally installed in the outer casing of the mobile phone.
壁或RF模組外殼等位置上。習知天線裝置的製程類似一 般撓性印刷電路板（FPC ),係利用一軟性銅箔基材(Fiexible C.er Claded Laminate/FCCL)為基材，進行如第一圖所示 之製程，依包括如下步驟：⑴清洗9卜即將該銅结基材清 潔刷洗乾淨；（2)覆膜92，即將該銅錄材藉接著劑覆上保 蒦膜(coveday) ’用以防止銅線路氧化及保護線路免受環境 溫濕度變㈣料，該健般為ρΕτ^㈣及 ^P〇lyimide)等；（3)曝光93 ’即藉曝光機進行影像轉移 (物94，即藉顯影機將不需要的影像 ==上5)電鍍95，即將基板鍵上-層金屬;⑹ 矛、殘餘油墨；⑺線路蝕刻97 ,即進行電路 線路的钱刻，將不需 留下所需的線路，_ _去除，最後 作為電訊傳輸的媒介；（8)貼絕緣膜 5 98，即覆上絕緣臈；（9)外型沖 板沖製成所需之尺寸、形狀。9 ’即將該撓性印刷電路 較為繁靖，致使其製造 學液劑，對於環保之維 利影響，被非理想之製 如前所述習知天線裝置的製程 成本較高；且，該製程常需利用化 護及生產線技術人員之健康皆有不 造方式。 【發明内容】 本發明之目的在提供一種天線裝置之製造方法及結構 ，其能使平面電路連^件之製程大域化，且同時降低 成本’使符合製造轉效益及提升競爭力。 本發明之再-目的在提供一種天線裝置之製造方法及 結構’其㈣緣具製造轉效益對環狀賴及生產線 技術人員之健康具有積極性之改善。 本發明為了達成上述之目的及功效，其所採行之技術 方法包括如下步驟··熱貼合步驟，即以一導體薄片為基 材’於導體溥片之上、下方分別設一上絕緣層及下絕緣層， 對該上絕緣層、導體薄片及下絕緣層進行熱貼合操作而固 結成一撓性基板；（2)局部電鍍步驟’即於導體薄片之一導 接部處進行局部鍍金或鍍鎳；（3)線路沖製步驟，即將該撓 性基板進行線路沖製；（4)貼保護膜步驟，即於撓性基板一 方貼設保護膜；（5)貼固定膜步驟，即於撓性基板另一方貼 1364872 設固定膜’而完成天線裝置之製造。 依據本發明之方法所製造之天線裝置之結構係包括： 導體薄片’具有電路線路；上絕緣層，係熱貼合於該導體 薄月之該電路線路上方；下絕緣層，係熱貼合於該導體薄 片之該電路線路下方；保護膜，係設於該上絕緣層上方； 貼固疋膜，係設於該下絕緣層下方。 【實施方式】 請參閱第二圖，為本發明天線裝置之製造方法之流程 圖’本實施例以一具有天線功能之天線裝置1進行說明，如 圖所示，該天線裝置之製造方法包括以下步驟： 熱貼合11步驟：即以一導體薄片21作為基材，於本實 施例中可採用銅箔或銘箔作為導體薄片21之材料(如第三 圖所示），於導體薄片21之上方及下方分別設一上絕緣層22 及下絕緣層23 ’並對上絕緣層22、導體薄片21及下絕緣層 23三者進行熱貼合操作’使其固結成一撓性基板2〇 ’其中 於導體薄片21凸設一導接部211，而該上絕緣層22及下絕緣 層23亦分別對應設置一導接覆部221、231 ; 局部鍍金12步驟：於導體薄片21之導接部211處進行局 部鍍金(或鍍鎳）’使該導接部211形成強化接點212，用以 加強其電路導接傳輸效果； 線路沖製13步驟：將熱貼合後之撓性基板20進行線路 1364872 沖製(如第四圖所示），使導體薄片21形成有接腳213a、213b 及頻率通道區214等，其中接腳213b係呈分離，而頻率通道. £214係為配合天線運作線路之設置；該上絕緣層22係對應 沖ό又有接腳覆部223a、223b及通道區224，該下絕緣層23 係對應沖設有接腳覆部233a、233b及通道區234，其中接腳 覆部223b、233b係對應於接腳213b而呈分離； 貼保護膜14步驟：於撓性基板20上方貼設一保護膜 24(如弟五圖所示）’保護膜24可為透明或半透光之膠膜， 用以固定接腳213b、接腳覆部223b及保護撓性基板2〇内部 線路，而且通常保護膜24之大小係約與撓性基板2〇相當； 貼固定膜15步驟：於撓性基板20下方貼設(如利用黏 貼等方式）一固定膜25(如第五圖所示），固定膜25係用以固 定接腳213b、接腳覆部233b及保護撓性基板20内部線路， 固定膜25係具有下方之黏層，用以結合一離型膜％，離型 臈26可藉撕離操作與固定膜25分離(如離型紙作用），使該 天線裝置1之完成品能便利進行黏貼定位之利用；且通常固 定膜25之大小係約與撓性基板20相當，而離型膜26係大於 該固定膜25，用以便利撕離該固定臈25 ;及 外型沖製16步驟：將該天線裝置1沖製成所需之尺寸、 形狀。藉由以上各步驟’以完成一天線裝置。如是，本發 明之天線裝置之結構，由上而下依序為保護膜24、上絕緣 層22、導體薄片21、下絕緣層23及固定膜25所構成。 8 1364872 妒置之二=可知’本發明最大的特色是利用生產天線 2=精卩技程，改善習知製程” '成本高之諸瑕庇， 而此付合製造轉效益及提升電子產品域爭力；且同時 ，免大里化學㈣之使用，對環紅維護及生產線技術人 員之健康皆具有積極性之改善。Position on the wall or RF module housing. The conventional antenna device is similar to a general flexible printed circuit board (FPC), and uses a soft copper foil substrate (Fiexible C. er Claded Laminate/FCCL) as a substrate to perform the process as shown in the first figure. The method includes the following steps: (1) cleaning 9 is to clean and clean the copper substrate; (2) coating 92, that is, the copper recording material is coated with a protective film (coveday) to prevent oxidation and protection of the copper line The line is protected from ambient temperature and humidity (four) materials, the health is generally ρΕτ^(4) and ^P〇lyimide); (3) Exposure 93' is the image transfer by the exposure machine (object 94, which is not required by the developing machine) Image == Top 5) Electroplating 95, ie, substrate-on-layer metal; (6) spear, residual ink; (7) line etching 97, that is, the circuit circuit of the money engraving, will not need to leave the required line, _ _ remove, Finally, as a medium for telecommunication transmission; (8) an insulating film 5 98 is attached, that is, an insulating crucible is covered; and (9) an external punching plate is punched into a desired size and shape. 9 'The flexible printed circuit is more versatile, resulting in the manufacture of liquid materials, the impact on the environmental protection of the Willy, is not ideal system as described above, the conventional antenna device has a higher process cost; and, the process is often There is no way to make use of the health care and technical personnel of the production line. SUMMARY OF THE INVENTION An object of the present invention is to provide a method and a structure for manufacturing an antenna device which can widen the process of a planar circuit component and at the same time reduce the cost to make it conform to manufacturing efficiency and enhance competitiveness. A further object of the present invention is to provide a method and structure for manufacturing an antenna device. [4] The manufacturing benefit of the edge device is enthusiasm for the health of the ring-shaped and production line technicians. In order to achieve the above objects and effects, the technical method adopted by the present invention includes the following steps: a thermal bonding step, that is, using a conductor sheet as a substrate, and an upper insulating layer is disposed above and below the conductor cymbal sheet. And the lower insulating layer, the upper insulating layer, the conductor sheet and the lower insulating layer are heat-bonded to be consolidated into a flexible substrate; and (2) the partial plating step is to perform partial gold plating at a guiding portion of the conductor sheet Or nickel plating; (3) the line punching step, that is, the flexible substrate is line punched; (4) the protective film step, that is, the protective film is attached to one side of the flexible substrate; (5) the step of fixing the film, that is, The mounting of the antenna device is completed by attaching a fixed film '1,364,872 to the other side of the flexible substrate. The structure of the antenna device manufactured by the method of the present invention comprises: the conductor sheet 'having a circuit line; the upper insulating layer is heat-bonded to the circuit line of the conductor thin month; and the lower insulating layer is heat-bonded to The conductive film is disposed under the circuit line; the protective film is disposed above the upper insulating layer; and the adhesive film is disposed under the lower insulating layer. [Embodiment] Please refer to the second figure, which is a flowchart of a method for manufacturing an antenna device according to the present invention. This embodiment is described by an antenna device 1 having an antenna function. As shown in the figure, the method for manufacturing the antenna device includes the following Step: The step of heat bonding 11 is to use a conductor sheet 21 as a substrate. In this embodiment, a copper foil or a foil may be used as the material of the conductor sheet 21 (as shown in the third figure), and the conductor sheet 21 is An upper insulating layer 22 and a lower insulating layer 23' are respectively disposed above and below, and the upper insulating layer 22, the conductor sheet 21 and the lower insulating layer 23 are thermally bonded together to be consolidated into a flexible substrate 2' A conductive portion 211 is protruded from the conductor sheet 21, and the upper insulating layer 22 and the lower insulating layer 23 are respectively provided with a guiding portion 221, 231; a partial gold plating step 12: a guiding portion of the conductor sheet 21 The partial plating (or nickel plating) is performed at 211 to make the guiding portion 211 form the reinforcing contact 212 for enhancing the circuit guiding transmission effect; the line punching step 13: the heat-bonded flexible substrate 20 is performed. Line 1364872 punched (as shown in the fourth figure As shown, the conductor sheet 21 is formed with pins 213a, 213b and a frequency channel region 214, etc., wherein the pins 213b are separated, and the frequency channel. £214 is arranged to match the antenna operation line; the upper insulating layer 22 Corresponding to the punching and the foot covering portions 223a, 223b and the channel region 224, the lower insulating layer 23 is correspondingly provided with the pin covering portions 233a, 233b and the channel region 234, wherein the pin covering portions 223b, 233b correspond to Separating from the pin 213b; attaching the protective film 14: attaching a protective film 24 over the flexible substrate 20 (as shown in the fifth figure), the protective film 24 can be a transparent or semi-transparent film, The fixing pin 213b, the pin covering portion 223b, and the inner circuit of the protective flexible substrate 2 are fixed, and generally, the size of the protective film 24 is approximately the same as that of the flexible substrate 2; the step of attaching the fixing film 15 is: under the flexible substrate 20 A fixing film 25 (as shown in FIG. 5) is attached (for example, by means of pasting or the like), and the fixing film 25 is used for fixing the pin 213b, the pin covering portion 233b, and protecting the internal wiring of the flexible substrate 20, and fixing the film 25 The adhesive layer has a lower layer for bonding a release film, and the release liner 26 can be peeled off. Separating from the fixed film 25 (such as a release paper) allows the finished product of the antenna device 1 to facilitate the use of the adhesive positioning; and generally the size of the fixed film 25 is approximately equivalent to that of the flexible substrate 20, and the release film 26 It is larger than the fixing film 25 for facilitating tearing off of the fixing cymbal 25; and the outer molding 16 step: the antenna device 1 is punched into a desired size and shape. An antenna device is completed by the above steps. In the structure of the antenna device of the present invention, the protective film 24, the upper insulating layer 22, the conductor sheet 21, the lower insulating layer 23, and the fixed film 25 are sequentially formed from top to bottom. 8 1364872 妒 之 = = = "The most distinctive feature of the invention is the use of the production of antenna 2 = fine technology, improve the conventional process" "high cost of the refuge, and this pay-for-turn manufacturing benefits and enhance the electronic product domain At the same time, the use of Dali Chemical (4) has been motivated to improve the health of the ring red maintenance and production line technicians.
综合以上所述，本發明能改善撓性電路連結元件之製 程及降低成本’確實為一相當優異之創思，爰依法提出發 明專利申請；惟上述說明之内容，僅為本發明之較佳實施 例說明’凡依本發明之技術手段所延伸之變化，皆應落人 本發明之專利申請範圍，特此說明。 【圖式簡單說明】 第一圖為習知天線裝置之製造方法流程圖。 第二圖為本發明天線裝置之製造方法流程圖。 第二圖為本發明之熱貼合步雜之結構刀解立體圖。 第四圖為本發明之線路沖製梦·驟之結構分解立體圖。 第五圖為本發明天線裝置之結構分解立體圖。 【主要元件符號說明】 清洗 91 覆膜 92 曝光 93 顯影 94 電鍍 95 去墨 96 1364872 線路蝕刻 97 貼絕緣膜 98 外型沖製 99 天線裝置 1 上絕緣層 22 導體薄片 21 下絕緣層 23 撓性基板 20 導接部 211 導接覆部 221 ' 231 強化接點 212 接腳 213a、213b 頻率通道區214 接腳覆部 223a ' 223b 通道區 224 接腳覆部 233a ' 233b 通道區 234 保護膜 24 固定膜 25 離型膜 26 熱貼合 11 局部鑛金 12 線路沖製 13 貼保護膜 14 貼固定膜 15 外型沖製 16In summary, the present invention can improve the process of manufacturing flexible circuit connecting components and reduce the cost. It is indeed a rather excellent idea, and the invention patent application is filed according to law; however, the above description is only a preferred implementation of the present invention. The description of the present invention is based on the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of a method of manufacturing a conventional antenna device. The second figure is a flow chart of a method of manufacturing an antenna device of the present invention. The second figure is a perspective view of the structure of the heat-bonding step of the present invention. The fourth figure is a structural exploded view of the line punching dream of the present invention. Fig. 5 is an exploded perspective view showing the structure of the antenna device of the present invention. [Main component symbol description] Cleaning 91 Coating 92 Exposure 93 Development 94 Plating 95 Deinking 96 1364872 Line etching 97 Post insulation film 98 External stamping 99 Antenna device 1 Upper insulating layer 22 Conductor sheet 21 Lower insulating layer 23 Flexible substrate 20 lead portion 211 guide cover portion 221 '231 strengthen contact 212 pin 213a, 213b frequency channel region 214 pin cover portion 223a ' 223b channel region 224 pin cover portion 233a ' 233b channel region 234 protective film 24 fixed film 25 Release film 26 Heat-bonding 11 Partial gold 12 Line punching 13 Sticking protective film 14 Sticking film 15 Shaped 16