TW200829852A - Loop heat pipe with a flat plate evaporator structure - Google Patents
Loop heat pipe with a flat plate evaporator structure Download PDFInfo
- Publication number
- TW200829852A TW200829852A TW096100804A TW96100804A TW200829852A TW 200829852 A TW200829852 A TW 200829852A TW 096100804 A TW096100804 A TW 096100804A TW 96100804 A TW96100804 A TW 96100804A TW 200829852 A TW200829852 A TW 200829852A
- Authority
- TW
- Taiwan
- Prior art keywords
- channel
- heat
- disposed
- working fluid
- flat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096100804A TW200829852A (en) | 2007-01-09 | 2007-01-09 | Loop heat pipe with a flat plate evaporator structure |
| US11/723,419 US8016024B2 (en) | 2007-01-09 | 2007-03-20 | Loop heat pipe with flat evaportor having a wick with an internal chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096100804A TW200829852A (en) | 2007-01-09 | 2007-01-09 | Loop heat pipe with a flat plate evaporator structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200829852A true TW200829852A (en) | 2008-07-16 |
| TWI317006B TWI317006B (https=) | 2009-11-11 |
Family
ID=39593284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096100804A TW200829852A (en) | 2007-01-09 | 2007-01-09 | Loop heat pipe with a flat plate evaporator structure |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8016024B2 (https=) |
| TW (1) | TW200829852A (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI476360B (zh) * | 2011-04-29 | 2015-03-11 | 奇宏電子(深圳)有限公司 | Loop heat pipe structure |
| TWI490428B (zh) * | 2008-09-19 | 2015-07-01 | Bridgelux Inc | 固態電燈之流體管件式散熱裝置 |
| US9504185B2 (en) | 2011-03-29 | 2016-11-22 | Asia Vital Components (Shen Zhen) Co., Ltd. | Dual chamber loop heat pipe structure with multiple wick layers |
| CN115507683A (zh) * | 2021-06-22 | 2022-12-23 | 中兴通讯股份有限公司 | 一种蒸发器 |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US9157687B2 (en) * | 2007-12-28 | 2015-10-13 | Qcip Holdings, Llc | Heat pipes incorporating microchannel heat exchangers |
| EP2229555B1 (de) * | 2008-01-14 | 2011-11-02 | Osram AG | Anordnung zur kühlung von halbleiterlichtquellen und scheinwerfer mit dieser anordnung |
| TWM347809U (en) * | 2008-05-26 | 2008-12-21 | Xu xiu cang | Fast temperature-averaging heat conductive device |
| US20100101763A1 (en) * | 2008-10-27 | 2010-04-29 | Meng-Cheng Huang | Thin heat dissipating apparatus |
| TW201024648A (en) * | 2008-12-26 | 2010-07-01 | Ji-De Jin | Flat loop heat pipe |
| US20100326627A1 (en) * | 2009-06-30 | 2010-12-30 | Schon Steven G | Microelectronics cooling system |
| FR2949642B1 (fr) * | 2009-08-27 | 2012-05-04 | Alstom Transport Sa | Convertisseur de puissance electrique pour un vehicule ferroviaire |
| JP5644767B2 (ja) * | 2009-09-29 | 2014-12-24 | 日本電気株式会社 | 電子機器装置の熱輸送構造 |
| TWI447340B (zh) * | 2009-12-14 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | 水冷式散熱裝置 |
| US20110214841A1 (en) * | 2010-03-04 | 2011-09-08 | Kunshan Jue-Chung Electronics Co. | Flat heat pipe structure |
| CN102202488A (zh) * | 2010-03-26 | 2011-09-28 | 富准精密工业(深圳)有限公司 | 热管散热装置 |
| CN102297538A (zh) * | 2010-06-23 | 2011-12-28 | 中国科学院理化技术研究所 | 采用液体金属散热的空调制冷系统 |
| CN101900504B (zh) * | 2010-08-19 | 2012-11-14 | 中冶南方工程技术有限公司 | 平板式环路热管 |
| CN102374807A (zh) * | 2010-08-20 | 2012-03-14 | 富准精密工业(深圳)有限公司 | 回路热管 |
| US9252069B2 (en) * | 2010-08-31 | 2016-02-02 | Teledyne Scientific & Imaging, Llc | High power module cooling system |
| TWI407072B (zh) * | 2010-11-12 | 2013-09-01 | Asia Vital Components Co Ltd | A heat exchanger with shunt structure |
| RU2489665C1 (ru) * | 2011-12-15 | 2013-08-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Федеральный Юго-Западный государственный университет" (ФЮЗ ГУ) | Бесшумная теплотрубная система охлаждения |
| WO2013140761A1 (ja) * | 2012-03-22 | 2013-09-26 | 日本電気株式会社 | 電子基板の冷却構造及びそれを用いた電子装置 |
| US20130291555A1 (en) | 2012-05-07 | 2013-11-07 | Phononic Devices, Inc. | Thermoelectric refrigeration system control scheme for high efficiency performance |
| WO2013169774A2 (en) | 2012-05-07 | 2013-11-14 | Phononic Devices, Inc. | Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance |
| CN102709618B (zh) * | 2012-06-21 | 2015-03-11 | 华南理工大学 | 一种用于锂电池散热的微通道冷却均温系统 |
| DE102012108110B4 (de) * | 2012-08-31 | 2014-06-26 | Rittal Gmbh & Co. Kg | Kühlanordnung für in einem Innenraum eines Schaltschranks angeordnete Komponenten |
| JP2014062658A (ja) * | 2012-09-20 | 2014-04-10 | Fujitsu Ltd | 冷却モジュール及びループ型ヒートパイプ |
| CN103151321A (zh) * | 2012-12-28 | 2013-06-12 | 联宝(合肥)电子科技有限公司 | 单热管多路径的散热方法及散热管 |
| USD692842S1 (en) * | 2013-01-11 | 2013-11-05 | Acacia Communications Inc. | Heat sink |
| JP6191181B2 (ja) * | 2013-03-21 | 2017-09-06 | 株式会社豊田中央研究所 | 熱交換器及び吸着式ヒートポンプ |
| US9366484B2 (en) * | 2013-11-19 | 2016-06-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Heat dissipation pipe loop and backlight module using same |
| CN103672814B (zh) * | 2013-12-16 | 2017-10-13 | 深圳市华星光电技术有限公司 | 散热回路管及用该散热回路管的背光模组 |
| WO2015146110A1 (ja) * | 2014-03-26 | 2015-10-01 | 日本電気株式会社 | 相変化冷却器および相変化冷却方法 |
| US9593871B2 (en) | 2014-07-21 | 2017-03-14 | Phononic Devices, Inc. | Systems and methods for operating a thermoelectric module to increase efficiency |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
| CN204408824U (zh) * | 2014-12-18 | 2015-06-17 | 热流动力能源科技股份有限公司 | 热交换装置 |
| US9702635B2 (en) * | 2014-12-31 | 2017-07-11 | Cooler Master Co., Ltd. | Loop heat pipe structure with liquid and vapor separation |
| EP3259546B1 (en) * | 2015-02-19 | 2020-07-08 | JR Thermal LLC | Intermittent thermosyphon |
| JP2016213314A (ja) * | 2015-05-08 | 2016-12-15 | 富士通株式会社 | 冷却モジュール及び電子機器 |
| CN106358420B (zh) * | 2015-07-15 | 2020-05-19 | 宏碁股份有限公司 | 散热模块 |
| CN105246302B (zh) * | 2015-11-04 | 2017-06-30 | 天津商业大学 | 一种热管散热装置 |
| CN105371675B (zh) * | 2015-11-18 | 2017-12-26 | 珠海格力电器股份有限公司 | 一种回路式热管装置及散热器 |
| TWI582924B (zh) * | 2016-02-02 | 2017-05-11 | 宏碁股份有限公司 | 散熱模組與電子裝置 |
| US11022383B2 (en) | 2016-06-16 | 2021-06-01 | Teledyne Scientific & Imaging, Llc | Interface-free thermal management system for high power devices co-fabricated with electronic circuit |
| CN106197103A (zh) * | 2016-07-04 | 2016-12-07 | 中国科学院大学 | 一种环路热管及使用方法 |
| US10859318B2 (en) * | 2017-02-16 | 2020-12-08 | J R Thermal, LLC | Serial thermosyphon |
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| KR102015917B1 (ko) * | 2018-01-02 | 2019-08-29 | 엘지전자 주식회사 | 열전 모듈을 이용하는 냉각 장치 |
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| CN108253829B (zh) * | 2018-01-30 | 2024-03-15 | 中国科学院理化技术研究所 | 微通道阵列辅助驱动的回路热管 |
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| CN110267486B (zh) * | 2019-05-28 | 2023-10-27 | 广东省智能制造研究所 | 一种填充沟槽平板式换热器、系统及成型方法 |
| AT522831B1 (de) * | 2019-08-08 | 2023-05-15 | Dau Gmbh & Co Kg | Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau |
| CN110379974A (zh) * | 2019-08-20 | 2019-10-25 | 福建易动力电子科技股份有限公司 | 一种锂电池液冷箱 |
| CN110530185B (zh) * | 2019-08-20 | 2020-07-28 | 西安交通大学 | 一种带支路的微结构液体自驱动平板式环路热管 |
| FR3103032B1 (fr) * | 2019-11-07 | 2022-02-18 | Valeo Systemes Thermiques | Évaporateur pour système de transfert thermique diphasique à pompage capillaire et procédé de fabrication associé |
| US10959352B1 (en) * | 2020-01-03 | 2021-03-23 | Quanta Computer Inc. | Cooling system with floating cold plate with single pipes |
| CN111238277A (zh) * | 2020-01-09 | 2020-06-05 | 广东工业大学 | 一种具有复合吸液芯结构的平板热管 |
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| CN114727566B (zh) * | 2022-05-17 | 2025-11-07 | 中国科学院工程热物理研究所 | 一种能耗低的超算/数据中心被动式散热系统 |
| CN115915727B (zh) * | 2022-12-05 | 2026-02-24 | 中国船舶集团有限公司第七〇九研究所 | 一种微型液冷回路系统及其控制方法 |
| US20240361083A1 (en) * | 2023-04-26 | 2024-10-31 | Auras Technology Co., Ltd. | Loop heat pipe one-way circulation device |
| TWI890096B (zh) * | 2023-07-24 | 2025-07-11 | 華碩電腦股份有限公司 | 散熱模組 |
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| US5725049A (en) * | 1995-10-31 | 1998-03-10 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Capillary pumped loop body heat exchanger |
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| TW407455B (en) * | 1997-12-09 | 2000-10-01 | Diamond Electric Mfg | Heat pipe and its processing method |
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| JP5117101B2 (ja) * | 2007-05-08 | 2013-01-09 | 株式会社東芝 | 蒸発器およびこれを用いた循環型冷却装置 |
| TWI318679B (en) * | 2007-05-16 | 2009-12-21 | Ind Tech Res Inst | Heat dissipation system with an plate evaporator |
-
2007
- 2007-01-09 TW TW096100804A patent/TW200829852A/zh not_active IP Right Cessation
- 2007-03-20 US US11/723,419 patent/US8016024B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI490428B (zh) * | 2008-09-19 | 2015-07-01 | Bridgelux Inc | 固態電燈之流體管件式散熱裝置 |
| US9504185B2 (en) | 2011-03-29 | 2016-11-22 | Asia Vital Components (Shen Zhen) Co., Ltd. | Dual chamber loop heat pipe structure with multiple wick layers |
| TWI476360B (zh) * | 2011-04-29 | 2015-03-11 | 奇宏電子(深圳)有限公司 | Loop heat pipe structure |
| CN115507683A (zh) * | 2021-06-22 | 2022-12-23 | 中兴通讯股份有限公司 | 一种蒸发器 |
| WO2022267576A1 (zh) * | 2021-06-22 | 2022-12-29 | 中兴通讯股份有限公司 | 一种蒸发器 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8016024B2 (en) | 2011-09-13 |
| TWI317006B (https=) | 2009-11-11 |
| US20080164010A1 (en) | 2008-07-10 |
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