TW200829726A - Method and device for electrolytic coating - Google Patents
Method and device for electrolytic coating Download PDFInfo
- Publication number
- TW200829726A TW200829726A TW096139950A TW96139950A TW200829726A TW 200829726 A TW200829726 A TW 200829726A TW 096139950 A TW096139950 A TW 096139950A TW 96139950 A TW96139950 A TW 96139950A TW 200829726 A TW200829726 A TW 200829726A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- cathode
- base layer
- roller
- drum
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06124862 | 2006-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200829726A true TW200829726A (en) | 2008-07-16 |
Family
ID=39047993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096139950A TW200829726A (en) | 2006-11-28 | 2007-10-24 | Method and device for electrolytic coating |
Country Status (10)
Country | Link |
---|---|
US (1) | US20090301891A1 (de) |
EP (1) | EP2099954A1 (de) |
JP (1) | JP2010511103A (de) |
KR (1) | KR20090083489A (de) |
CN (1) | CN101542022A (de) |
BR (1) | BRPI0719665A2 (de) |
IL (1) | IL198594A0 (de) |
RU (1) | RU2009124293A (de) |
TW (1) | TW200829726A (de) |
WO (1) | WO2008065069A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2265746A2 (de) * | 2008-03-13 | 2010-12-29 | Basf Se | Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse |
US9700249B2 (en) * | 2008-04-15 | 2017-07-11 | Nonin Medical, Inc. | Non-invasive optical sensor |
WO2009135780A1 (en) * | 2008-05-08 | 2009-11-12 | Basf Se | Layered structures comprising silicon carbide layers, a process for their manufacture and their use |
KR20120023832A (ko) * | 2009-05-26 | 2012-03-13 | 우시 썬테크 파워 컴퍼니 리미티드 | 물품 이송용 이송 롤러 |
DE102010000211A1 (de) * | 2010-01-26 | 2011-07-28 | Atotech Deutschland GmbH, 90537 | Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung |
CN101827444B (zh) * | 2010-03-31 | 2015-03-25 | 中兴通讯股份有限公司 | 一种测量参考信号的信令配置系统及方法 |
DE102010042642B4 (de) | 2010-10-19 | 2013-12-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten und Solarzellen |
US20130255858A1 (en) * | 2012-04-03 | 2013-10-03 | Jun-Chung Hsu | Method of manufacturing a laminate circuit board |
US9970297B2 (en) * | 2014-08-29 | 2018-05-15 | Rolls-Royce Corporation | Composite fan slider with nano-coating |
KR20160140241A (ko) | 2015-05-29 | 2016-12-07 | 전자부품연구원 | 플라즈마 전해 기반의 시료 코팅 방법 |
KR101578640B1 (ko) * | 2015-08-25 | 2015-12-17 | 선호경 | 부분 강화된 이송롤러를 구비한 pcb 도금장치 |
CN110168145B (zh) | 2016-07-13 | 2021-08-06 | 英奥创公司 | 电化学方法、组件和组成 |
CN108430170A (zh) * | 2018-01-29 | 2018-08-21 | 昆山群安电子贸易有限公司 | 一种电路板基板的制作方法 |
US20220181666A1 (en) * | 2019-03-20 | 2022-06-09 | Scott Waters | Electrochemical storage devices comprising chelated metals |
MX2023002015A (es) | 2020-08-18 | 2023-04-11 | Enviro Metals Llc | Refinamiento metálico. |
CN114481244B (zh) * | 2022-02-24 | 2022-08-23 | 广东盈华电子科技有限公司 | 一种电解铜箔耐高温抗氧化的表面处理工艺 |
DE102022120646A1 (de) | 2022-08-16 | 2024-02-22 | Audi Aktiengesellschaft | Verfahren zur Herstellung einer flexiblen gedruckten Schaltung (FPC) mittels Auftragen von Metallleiterbahnen, gedruckte Schaltung und Batteriesystem mit gedruckter Schaltung |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4019877A (en) * | 1975-10-21 | 1977-04-26 | Westinghouse Electric Corporation | Method for coating of polyimide by electrodeposition |
DE59004422D1 (de) * | 1989-12-23 | 1994-03-10 | Heraeus Elektrochemie | Verfahren und Vorrichtung zur kontinuierlichen elektrolytischen Ausbringung von Metall in Form eines Bandes aus einer Lösung sowie Verwendung der Vorrichtung. |
ATE125001T1 (de) * | 1991-04-12 | 1995-07-15 | Siemens Ag | Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten. |
US5705219A (en) * | 1991-04-22 | 1998-01-06 | Atotech Deutschland Gmbh | Method for coating surfaces with finely particulate materials |
DE4212567A1 (de) * | 1992-03-14 | 1993-09-16 | Schmid Gmbh & Co Geb | Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten |
US6599412B1 (en) * | 1997-09-30 | 2003-07-29 | Semitool, Inc. | In-situ cleaning processes for semiconductor electroplating electrodes |
DE19633796B4 (de) * | 1996-08-22 | 2012-02-02 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten |
DE05075545T1 (de) * | 1998-05-20 | 2006-08-31 | Process Automation International Ltd., Tai Po | Vorrichtung zur Elektroplattierung |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
DE10043817C2 (de) * | 2000-09-06 | 2002-07-18 | Egon Huebel | Anordnung und Verfahren für elektrochemisch zu behandelndes Gut |
DE10248965A1 (de) * | 2002-10-15 | 2004-04-29 | Simmerlein, Ewald Wilhelm | Galvanisierungseinrichtung zum freien Beschichten von leitfähigen Strukturen und Flächen, mit und ohne Versorgungsbahnen |
DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
NL1025446C2 (nl) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager. |
DE102005033784A1 (de) * | 2005-07-20 | 2007-01-25 | Viktoria Händlmeier | System zur galvanischen Abscheidung einer leitfähigen Schicht auf einem nichtleitfähigen Trägermaterial |
DE102005038450A1 (de) * | 2005-08-03 | 2007-02-08 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten |
DE102005038449B4 (de) * | 2005-08-03 | 2010-03-25 | Gebr. Schmid Gmbh & Co. | Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Leiterplatten, und Verfahren |
RU2008145105A (ru) * | 2006-04-18 | 2010-05-27 | Басф Се (De) | Способ и устройство для гальванического покрытия |
US20090101511A1 (en) * | 2006-04-18 | 2009-04-23 | Rene Lochtman | Electroplating device and method |
-
2007
- 2007-10-24 TW TW096139950A patent/TW200829726A/zh unknown
- 2007-11-26 US US12/515,289 patent/US20090301891A1/en not_active Abandoned
- 2007-11-26 JP JP2009538691A patent/JP2010511103A/ja not_active Withdrawn
- 2007-11-26 RU RU2009124293/02A patent/RU2009124293A/ru not_active Application Discontinuation
- 2007-11-26 CN CNA2007800439981A patent/CN101542022A/zh active Pending
- 2007-11-26 WO PCT/EP2007/062805 patent/WO2008065069A1/de active Application Filing
- 2007-11-26 EP EP07847339A patent/EP2099954A1/de not_active Withdrawn
- 2007-11-26 KR KR1020097013503A patent/KR20090083489A/ko not_active Application Discontinuation
- 2007-11-26 BR BRPI0719665-2A patent/BRPI0719665A2/pt not_active IP Right Cessation
-
2009
- 2009-05-06 IL IL198594A patent/IL198594A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
BRPI0719665A2 (pt) | 2013-12-17 |
RU2009124293A (ru) | 2011-01-10 |
CN101542022A (zh) | 2009-09-23 |
US20090301891A1 (en) | 2009-12-10 |
EP2099954A1 (de) | 2009-09-16 |
JP2010511103A (ja) | 2010-04-08 |
IL198594A0 (en) | 2010-02-17 |
KR20090083489A (ko) | 2009-08-03 |
WO2008065069A1 (de) | 2008-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200829726A (en) | Method and device for electrolytic coating | |
RU2394402C1 (ru) | Способ изготовления структурированных, проводящих электрический ток поверхностей | |
RU2436266C2 (ru) | Способ изготовления электропроводящих поверхностей на носителе | |
RU2405222C2 (ru) | Дисперсия для нанесения металлического слоя | |
TWI311162B (en) | Catalyst composition and deposition method | |
TW200836601A (en) | Method for producing electrically conductive surfaces | |
TW200845845A (en) | Method for producing structured electrically conductive surfaces | |
CN101682995A (zh) | 生产被金属涂覆的基底层压材料的方法 | |
TW201810298A (zh) | 積層體、金屬網格及觸控面板 | |
KR101721966B1 (ko) | 적층체, 도전성 패턴 및 전기회로 | |
TW201335297A (zh) | 電鍍用底漆組成物、鍍敷物之製造方法及鍍敷物 | |
TW200833187A (en) | Method for producing structured electrically conductive surfaces | |
Akin et al. | Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition | |
JP5692501B2 (ja) | 導電性塗膜の製造方法 | |
Kim et al. | Study of palladium catalyzation for electroless copper plating on polyimide film | |
JP2012174375A (ja) | 導電性塗膜の製造方法及び導電性塗膜 |