200827839 九、發明說明： 【發明所屬之技術領域】 5 Ο 10 15 Ο 20 本發明係關於一種基板與遮罩對位之裝置以及方法， 尤指一種基板對位裝置及方法，其藉由在基板與遮罩對位 之前補償基板的撓曲而改善對位精度。 【先前技術】 近來，隨著資訊及通訊的迅速發展以及市場擴張，平 面顯示器已成為顯示器中被受注目之焦點。平面顯示器具 有代表性的範例包含液晶顯示器（LCD)、電浆顯示器 (PDP)、有機發光二極體（OLED)等。 有機發光二極體（OLED)已被視為是下一代顯示器的 焦點，由於其具有非常有利的優點，如：快速反應時間、 相較於LCD較低的耗電量、輕巧、超薄（不需背光）、高亮 度等。 其OLED的製作係於一基板上依序形成：一陽極、一 工洞注入層、一電洞傳輸層、一發光層、一電子傳輸層、 -電子注人層、及—陰極。爲了將這些膜層沉積於基板上， 基板與遮罩的對位則為基本需求步驟。 傳統之對位步驟請參照圖1作-說明。首先，將-基 #置腔體（圖中未示）並固定於一支樓器（圖中未 字—遮罩12與固定好的基板3作對位。之後， 广2二遮罩12互相接觸而將基板s沉放下來。其遮罩 12亦經由一遮罩支撐器而被固定。 5 200827839 此時’該支撐器通常以基板的邊緣將基板作一支撐， 而基板之中央部位會向下撓曲。隨著基板的尺寸越大，其 撓曲的程度則會越大。 如此’雖然於基板撓曲的狀態下將基板對位於一準確 5位置然而當基板與遮罩完全接觸後仍會與正確位置有所 偏移，因而造成對位精度不佳。 【發明内容】 ^因此本發明係用以解決上述提及之問題，而本發明 10係提# |板對位裝置以及一基板對位方法，其可藉由， 於基板與遮罩對位之前，對於基板挽曲的補償而改善對位 精度。 如本發明之-態樣，係提供一基板對位裝置，其包括 撓曲補彳員工具用以將基板之撓曲部位舉起。 15 〇 20 广撓曲補償:η具係包含—頂針可上下移動以將基板之 挽曲部位舉起。 =平橫桿較佳為可由遮罩下區域移出，以避免沉積 :寺，平横桿的干擾。如此，例如，該驅動單元可 水千料，使得水平橫桿的-端㈣於另―端轉^ 一該遮軍較佳具有-孔洞可使頂針穿過，且該遮罩可為 一開放式遮罩（0pen Mask)或—精細遮罩⑽e Mask)。 之方另一態樣，係提供—種將基板與遮罩對位 之方法’其包括：υ將基板放置及安裝於—琴 2板之撓曲部位舉起以對基板的撓曲作補償^遮 升起，以及4)將經補似曲後之基板與㈣進行對位。 6 25 200827839 詳細地說，步驟2)係使用一配置於基板下方之頂針將 基板之撓曲部位舉起。 較佳地，其方法可更包括，於步驟4)之後，將頂針移 出遮罩下方區域以避免沉積進行時的干擾。 5 【實施方式】 在以下文字中將以實施例並配合附圖詳細解釋本發明 之構成及操作。。 Ο 10 15 Ο 20 如圖2所示，其為本發明之基板對位裝置（其包括一撓 曲補償工具20)之一具體實施例，其於基板與遮罩12對位之 前將基板之撓曲作一補償，以增加對位精度。 更a羊細地’ 5亥挽曲補償工具2〇係包括一頂針22，用以 將基板S之撓曲部位（通常為基板之中央部位）舉起；一水平 橫桿21，其為水平置放且頂針22由其向上突出；以及一驅 動單元23，可將水平橫桿21升起、降下以及旋轉。 如圖3所示，該驅動單元23係包括一空氣筒25用以將水 平橫桿21升起以及降下，以及一驅動馬達24用以旋轉該水 平橫桿21。 該空氣筒25之一活塞25a係連接至一支撐盤26。該支撐 盤26隨著活塞25a的上移與下移而舉起及下降。 該驅動馬達24係裝置於支撐盤26以隨著支撐盤26 —起 上升及下降。驅動馬達24之驅動軸係通過支撐盤26而與水 平橫桿21連接。 如上述配置，水平橫桿21係經由空氣筒25而進行上升 及下降並經由驅動馬達24而進行旋轉。雖然驅動馬達24以 7 25 200827839 及空氣筒25於說明中為該驅動單元23的範例的元件，然而 驅動單元23可具有各種不同結構，只要可以將水平橫桿^ 旋轉並上升及下降即可。 如圖4所示，其水平橫桿21係如上所述，不僅可上升及 5 Ο 10 15 Ο 20 下降，更可旋轉使得一端相對另一端旋轉以一夾角θ的方 向0 在此，水平橫桿21的上下移動係用以將基板（s)之撓曲 部位舉起，且於沉積步驟進行時，水平橫桿21之夾角❽方向 的移動，是為了將水平橫桿21由基板以及遮罩12下方之區 域移出，以避免沉積進行時水平橫桿21的干擾。 以下，將經由圖5說明基板s與遮罩12對位之步驟過程。 如圖所示，遮罩12係經由支撐器u作支撐，且基板8 係置放於遮罩12之上方。同時，基板S的中央部位會向下彎 曲’而接著水平橫桿21以及頂針22向上移動以將基板s彎曲 部位向上抬起。如此，基板S的撓曲則可被補償。當然，頂 針22移動穿過遮罩12。 當基板的撓曲如上述之被作一補償，該遮罩12則上升 而向基板S接近，接著其接近的遮罩12則與基板s互相對位。 此時，遮罩12係配置於基板以及頂針22之間。如此， 頂針22移動穿過遮罩12並將基板之撓曲部位舉起以對基板 的撓曲部位作一補償。 如圖6所示，一遮罩裝置1〇包括遮罩12以及遮罩支撐器 11(用以之稱該遮罩12)。在大型基板的案例中，該遮罩裝置 10可更包括一十字形圖案。具體而言，為了將基板S之撓曲 8 200827839 部位舉起，該頂針22應穿過遮罩12。 以下，將由圖7說明本發明之基板s與遮罩12對位方法 之一實施態樣。 首先，將基板置放於一沈積腔體（圖中未示）中（sl〇)， 5接著將基板3放置於一支撐器（圖中未示）上（S20)。此時，該 支撐器支撐基板S的邊緣，而基板之中央部位為向下撓曲。 隨著基板的尺寸越大，其撓曲的程度則會越大。 若於基板撓曲的狀態下將基板與遮罩對位，並將遮罩 與基板s完全接觸，然而基板s與遮罩12會與正確位置有所 10 偏移，因而造成對位精度不佳。 因此，其頂針22係用以於對位前將基板s之撓曲部位舉 起，而使得基板S之撓曲得到補償（S30)。 接著，其遮罩上升以到達·基板S(S40)，並接著將基板 與遮罩互相對位（S50)。 15 當遮罩12以及基板§如上述對位至正確位置時，頂針22 會降下（S60)。接著，遮罩丨2以及基板s互相接觸，然後進 行沉積步驟。於此，位了避免沉積過程時頂針22所造成的 任何干擾’其頂針22須於沉積步驟前由基板（或遮罩）下方的 區域移出。 20 產業利用性 綜上所述，本發明係提供一經由將基板的撓曲作一補 償’於基板與遮罩對位之前，而增加對位精度之方法。 本發明所描述之實施例應被視為最實際與示範性之實 25 施例，本發明並不侷限於所揭露之實施例及圖示，相反的， 9 200827839 本發明包含隨附的申請專利範圍之精神與範圍下的不同修 改與變化。 5 【圖式簡單說明】 該上述及其他態勢與本發明之特徵及其他優點將由以 下作更詳細之解說並伴隨以下圖示而得到更清楚的理解， 該圖中： () ^ 圖1係為一習知基板與遮罩對位過程之示意圖。 10 圖2係為本發明之一實施態樣之撓曲補償工具之示意圖。 圖3係為圖2所示之撓曲補償工具之驅動單元部位示意圖。 圖4係為圖2所示之撓曲補償工具之作動示意圖。 圖5係為使用圖2所示之撓曲補償工具進行對位之步驟示意 圖。 15 圖6係為圖5所示之遮罩裝置之示意圖。 圖7係為本發明之基板對位方法之一實施態樣流程圖。 〇 【主要元件符號說明】 10遮罩裝置 12遮罩 21水平橫桿 23 驅動單元 25空氣筒 26 支撐盤 11支撐器 20撓曲補償工具 22 頂針 24 驅動馬達 25a活塞 S基板200827839 IX. Description of the invention: [Technical field of the invention] 5 Ο 10 15 Ο 20 The present invention relates to a device and a method for aligning a substrate and a mask, and more particularly to a substrate aligning device and method, which are provided on a substrate Compensating the deflection of the substrate before alignment with the mask improves alignment accuracy. [Prior Art] Recently, with the rapid development of information and communication and market expansion, flat-panel displays have become the focus of attention in displays. Flat Display Devices Representative examples include liquid crystal displays (LCDs), plasma display devices (PDPs), organic light emitting diodes (OLEDs), and the like. Organic light-emitting diodes (OLEDs) have been regarded as the focus of next-generation displays due to their very advantageous advantages, such as: fast response time, lower power consumption than LCD, light weight, ultra-thin (not Need backlight), high brightness, etc. The fabrication of the OLED is sequentially formed on a substrate: an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode. In order to deposit these layers on the substrate, the alignment of the substrate with the mask is a basic requirement step. The traditional alignment procedure is described with reference to Figure 1. First, a cavity is placed in the cavity (not shown) and fixed to a floor (the word is not shown in the figure - the mask 12 is aligned with the fixed substrate 3. Thereafter, the cover 2 is in contact with each other. The substrate s is sunk. The mask 12 is also fixed via a mask holder. 5 200827839 At this time, the supporter usually supports the substrate with the edge of the substrate, and the central portion of the substrate is downward. Flexing. As the size of the substrate is larger, the degree of deflection will be greater. Thus, although the substrate is placed in an accurate 5 position in the state where the substrate is deflected, the substrate will still be in full contact with the mask. The present invention is directed to solving the above-mentioned problems, and the present invention is directed to a board alignment device and a substrate pair. a method for improving alignment accuracy by compensating for substrate buckling before the substrate is aligned with the mask. According to the invention, a substrate alignment device including flexing compensation is provided The employee tool is used to lift the flexure of the substrate. 15 〇20 Wide deflection compensation: η system includes—the thimble can move up and down to lift the curved part of the substrate. = The horizontal bar is preferably removed from the lower area of the mask to avoid deposition: temple, horizontal bar So, for example, the driving unit can be watered such that the end of the horizontal crossbar rotates at the other end. The shield preferably has a hole that allows the thimble to pass through, and the mask can be An open mask (0pen Mask) or a fine mask (10) e Mask). In another aspect, a method for aligning a substrate and a mask is provided, which includes: placing and mounting the substrate on a flexing portion of the piano 2 to compensate for deflection of the substrate. The cover is raised, and 4) the substrate after the complement is aligned with (4). 6 25 200827839 In detail, step 2) uses a ejector pin disposed under the substrate to lift the flexure of the substrate. Preferably, the method may further comprise, after step 4), moving the thimble out of the area under the mask to avoid interference during deposition. [Embodiment] In the following text, the constitution and operation of the present invention will be explained in detail by way of embodiments with reference to the accompanying drawings. . Ο 10 15 Ο 20 As shown in FIG. 2, it is a specific embodiment of the substrate alignment device (including a deflection compensation tool 20) of the present invention, which is used to scratch the substrate before the substrate is aligned with the mask 12. The song is compensated to increase the alignment accuracy. The 亥 细 ' 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 The ejector pin 22 is protruded upward therefrom; and a driving unit 23 that raises, lowers, and rotates the horizontal crossbar 21. As shown in Fig. 3, the drive unit 23 includes an air cylinder 25 for raising and lowering the horizontal rail 21, and a drive motor 24 for rotating the horizontal rail 21. One of the pistons 25a of the air cylinder 25 is coupled to a support disk 26. The support disk 26 is raised and lowered as the piston 25a moves up and down. The drive motor 24 is mounted to the support plate 26 to ascend and descend with the support plate 26. The drive shaft of the drive motor 24 is coupled to the horizontal crossbar 21 via a support disk 26. As described above, the horizontal crossbar 21 is raised and lowered via the air cylinder 25, and is rotated by the drive motor 24. Although the drive motor 24 is an example of the drive unit 23 in the description with the 7 25 200827839 and the air cylinder 25, the drive unit 23 can have various different configurations as long as the horizontal crossbar can be rotated and raised and lowered. As shown in FIG. 4, the horizontal crossbar 21 is as described above, and can be not only raised and lowered by 5 Ο 10 15 Ο 20, but also rotated so that one end rotates relative to the other end at an angle θ of 0. Here, the horizontal crossbar The up and down movement of 21 is used to lift the flexure of the substrate (s), and the movement of the horizontal crossbar 21 in the direction of the angle ❽ is performed in order to separate the horizontal crossbar 21 from the substrate and the mask 12 during the deposition step. The area below is removed to avoid interference from the horizontal crossbar 21 during deposition. Hereinafter, the procedure of the alignment of the substrate s with the mask 12 will be described via FIG. As shown, the mask 12 is supported by a support u and the substrate 8 is placed over the mask 12. At the same time, the central portion of the substrate S is bent downward' and then the horizontal rail 21 and the thimble 22 are moved upward to lift the bent portion of the substrate s upward. Thus, the deflection of the substrate S can be compensated. Of course, the thimble 22 moves through the mask 12. When the deflection of the substrate is compensated as described above, the mask 12 is raised to approach the substrate S, and then the approaching mask 12 is aligned with the substrate s. At this time, the mask 12 is disposed between the substrate and the ejector pin 22. Thus, the thimble 22 moves through the mask 12 and lifts the flexure of the substrate to compensate for the flexure of the substrate. As shown in Fig. 6, a masking device 1 includes a mask 12 and a mask holder 11 (referred to as the mask 12). In the case of a large substrate, the masking device 10 may further include a cross-shaped pattern. Specifically, in order to lift the portion of the deflection of the substrate S 200827839, the thimble 22 should pass through the mask 12. Hereinafter, an embodiment of the method of aligning the substrate s of the present invention with the mask 12 will be described with reference to FIG. First, the substrate is placed in a deposition chamber (not shown), and then the substrate 3 is placed on a support (not shown) (S20). At this time, the holder supports the edge of the substrate S, and the central portion of the substrate is deflected downward. As the size of the substrate increases, the degree of deflection will increase. If the substrate is aligned with the mask in a state where the substrate is deflected, and the mask is completely in contact with the substrate s, the substrate s and the mask 12 are offset from the correct position by 10, thereby causing poor alignment accuracy. . Therefore, the ejector pin 22 is used to lift the flexure portion of the substrate s before the alignment, so that the deflection of the substrate S is compensated (S30). Then, the mask is raised to reach the substrate S (S40), and then the substrate and the mask are aligned with each other (S50). 15 When the mask 12 and the substrate § are aligned to the correct position as described above, the thimble 22 is lowered (S60). Next, the mask 丨 2 and the substrate s are brought into contact with each other, and then a deposition step is performed. Here, any interference caused by the thimble 22 during the deposition process is avoided. The thimble 22 must be removed from the area under the substrate (or mask) prior to the deposition step. 20 Industrial Applicability In summary, the present invention provides a method of increasing the alignment accuracy by aligning the deflection of the substrate with respect to the alignment of the substrate and the mask. The embodiments of the present invention are to be considered as the most practical and exemplary embodiments. The present invention is not limited to the disclosed embodiments and illustrations. In contrast, 9 200827839 The present invention contains the accompanying patent application. Different modifications and changes in the spirit and scope of the scope. BRIEF DESCRIPTION OF THE DRAWINGS [0009] The above and other aspects and features and other advantages of the present invention will be more fully understood from the following description in the <RTIgt; A schematic diagram of a conventional substrate and mask alignment process. 10 is a schematic view of a flexure compensation tool according to an embodiment of the present invention. 3 is a schematic view of a drive unit portion of the flex compensation tool shown in FIG. 2. FIG. 4 is a schematic view showing the operation of the deflection compensation tool shown in FIG. 2. Fig. 5 is a schematic view showing the steps of aligning using the deflection compensation tool shown in Fig. 2. 15 is a schematic view of the masking device shown in FIG. 5. FIG. 7 is a flow chart of an embodiment of a substrate alignment method of the present invention. 〇 [Main component symbol description] 10 mask device 12 mask 21 horizontal rail 23 drive unit 25 air cylinder 26 support plate 11 support 20 flex compensation tool 22 thimble 24 drive motor 25a piston S substrate