TW200826198A - Combination method and structure of heating plate of substrate - Google Patents
Combination method and structure of heating plate of substrate Download PDFInfo
- Publication number
- TW200826198A TW200826198A TW095146766A TW95146766A TW200826198A TW 200826198 A TW200826198 A TW 200826198A TW 095146766 A TW095146766 A TW 095146766A TW 95146766 A TW95146766 A TW 95146766A TW 200826198 A TW200826198 A TW 200826198A
- Authority
- TW
- Taiwan
- Prior art keywords
- heating plate
- heating
- plate body
- substrate
- wire
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 168
- 238000000034 method Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 title claims abstract description 40
- 238000003756 stirring Methods 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims description 29
- 238000005304 joining Methods 0.000 claims description 20
- 239000011324 bead Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- 229910000861 Mg alloy Inorganic materials 0.000 claims 1
- 229910001069 Ti alloy Inorganic materials 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 230000005484 gravity Effects 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 230000007547 defect Effects 0.000 description 8
- 238000010894 electron beam technology Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000005242 forging Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013019 agitation Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000004023 plastic welding Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 230000003442 weekly effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095146766A TW200826198A (en) | 2006-12-13 | 2006-12-13 | Combination method and structure of heating plate of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095146766A TW200826198A (en) | 2006-12-13 | 2006-12-13 | Combination method and structure of heating plate of substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200826198A true TW200826198A (en) | 2008-06-16 |
| TWI321339B TWI321339B (enrdf_load_stackoverflow) | 2010-03-01 |
Family
ID=44772325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095146766A TW200826198A (en) | 2006-12-13 | 2006-12-13 | Combination method and structure of heating plate of substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200826198A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI449109B (enrdf_load_stackoverflow) * | 2011-12-13 | 2014-08-11 | ||
| CN107322848A (zh) * | 2017-06-23 | 2017-11-07 | 宁国徽厦新能源节能服务有限责任公司 | 一种用于电磁加热机的加热板 |
| CN113614902A (zh) * | 2019-03-15 | 2021-11-05 | 朗姆研究公司 | 半导体制造应用中的摩擦搅拌焊接 |
-
2006
- 2006-12-13 TW TW095146766A patent/TW200826198A/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI449109B (enrdf_load_stackoverflow) * | 2011-12-13 | 2014-08-11 | ||
| CN107322848A (zh) * | 2017-06-23 | 2017-11-07 | 宁国徽厦新能源节能服务有限责任公司 | 一种用于电磁加热机的加热板 |
| CN113614902A (zh) * | 2019-03-15 | 2021-11-05 | 朗姆研究公司 | 半导体制造应用中的摩擦搅拌焊接 |
| US12272591B2 (en) | 2019-03-15 | 2025-04-08 | Lam Research Corporation | Friction stir welding in semiconductor manufacturing applications |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI321339B (enrdf_load_stackoverflow) | 2010-03-01 |
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