200823929 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於被使用在如液晶面板基板、半導體晶圓 . 、磁碟基板、光碟基板等般地，對玻璃、半導體、樹脂、 陶瓷、金屬等、或這些的複合基板表面照射紫外光，進行 * 洗淨、蝕刻等的基板處理之準分子燈裝置。 # 【先前技術】 搭載了在專利文獻1等已知之準分子燈的準分子燈裝 置，係將從準分子燈放射之200nm以下lOOnm以上的範 圍之紫外光，在氧微量存在的氛圍下照射被處理物的表面 ，藉由產生的活性氧和透過的紫外光之相乘效果而使被處 理物的表面之有機物分解飛散而進行洗淨之物。 也就是，從準分子燈例如將波長1 72nm的紫外光照射 於基板表面，藉由分解構成有機物的化學鍵結而使其低分 i 子化、同時使有機污染物活性化。同時，對浮遊於基板表 面的氧照射紫外光，由產生的活性氧，藉由有機污染物與 ~ 活性氧的氧化反應而變換爲揮發物質，放出至空氣中而除 • 去。 使用如此的準分子燈之乾洗淨，係因爲在分解氧時消 耗紫外光，而因存在於準分子燈與基板之間的氧量而到達 基板表面的紫外光產生變化，所以在超過對有機污染物的 氧化必要之量而存在高濃度的氧分子的情況，變得無益地 消耗紫外光而不能到達基板表面。因此，從先前在準分子 -4- 200823929 (2) 燈裝置重覆改良，開發關於有效利用紫外光的技術。 例如：（1 )已知：將複數的棒狀的準分子燈配置於 作爲大略密閉的狀態之矩形箱狀的框體內部’將如此的框 體內部變換爲紫外光透過性的氛圍，也就是塡充了氮氣等 的惰性氣體之氛圍，經由設置於框體的一面之紫外光透過 窗構件而放射紫外光之準分子燈裝置。 而且，亦已知：（2 )爲了作到通過了紫外光透過窗 構件之紫外光不無益地消耗，所以藉由在窗構件與基板之 間流動氮氣等的惰性氣體而變低氧氣分壓’而提局紫外光 透過性之物。 另外，在最近，爲被處理物之液晶面板基板係進行大 面積化，對應於此的紫外光透過窗構件的製造變得越困難 。因此亦開發：不使用窗構件，將來自準分子燈的紫外光 直接照射於基板之準分子燈裝置。在如此之物’係（3 ) 在準分子燈與基板之間流動的惰性氣體及將氧控制於所期 待處，可抑制來自準分子燈的紫外光之衰減’有效率地對 基板照射紫外光。 在最近，作爲基板表面的洗淨時的反應性氣體’代替 氧而使用水蒸氣的技術在專利文獻1 (日本特開200 1 -137800號公報）、專利文獻2 (日本特開2001-162240號 公報）等被提案出來。如此的技術’係爲了維持紫外光透 過性而對被供給的氮氣氣體施加濕度而作爲加濕化氮，將 水吸收紫外光、進行分解而產生的OH自由基或Η自由基 利用在基板的洗淨處理之物。 -5- 200823929 (3) 第1 1圖係將有關記載於專利文獻1的技術之基板處 理裝置，對燈的管軸在垂直面切斷之準分子燈裝置的說明 用剖面圖。 此準分子燈裝置，係於紙面下方開口的燈室72內部 例如具備3支棒狀的準分子燈7，以包含燈室72的下部以 及用以搬運基板70的滾子輸送帶71的方式設置處理室76 〇 於燈室72的內部係作爲惰性氣體之氮氣氣體從氣體 供給用配管73供給而置於內部不含有氧之氛圍下，由此 變得可抑制來自準分子燈7的紫外光衰減。 另外，於處理室76的下方係連接加濕化惰性氣體的 供給管75，由此變得可供給水蒸氣與氮氣氣體之混合流體 。另外，於處理室76的上方係設置排氣管78，藉由強制 排氣而加快處理室76的入口的流速，防止臭氧的洩漏。 在基板70的表面係照射從準分子燈7之紫外光而清 淨化、同時存在於基板70表面的水蒸氣亦被照射紫外光 而產生氧化性的OH自由基和還原性的Η自由基。藉由如 此的ΟΗ自由基和Η自由基的作用而將附著於基板70表 面之由有機物質所構成之污染物質變換、分解爲揮發物質 ，可從排氣管放出至外部，進行基板的乾洗淨。 〔專利文獻1〕日本特開200 1 - 1 3 7800號公報 〔專利文獻2〕日本特開2001-162240號公報 【發明內容】 -6- 200823929 (4) 〔發明所欲解決的課題〕 然而，在記載於專利文獻1的裝置，係有將燈室72 內以惰性氣體塡充之必要。在有關於上述構成的裝置，有 因爲於光照射用而開口燈室72所以有供給多量的惰性氣 體之必要，有運轉成本變爲高價的問題。有鑑於此，在將 燈室7 2的開口以紫外光透過性的石英玻璃製的窗等覆蓋 的情況，難以追隨在最近液晶面板基板的大面積化、同時 因爲窗構件非常高價，所以裝置也成爲高價之物。 另外’在搬運基板7 0之處理室7 6，係有將內部保持 在高濕度氛圍之必要，不可避免構造變得複雜之情事。而 且，因爲藉由來自加濕化惰性氣體的供給管75的供給氣 體量和藉由排氣管78的排氣而管理控制處理室76內的氛 圍，所以將基板70表面的氛圍維持於一定爲非常困難， 有洗淨處理不安定的問題。 在專利文獻2，記載有關於與上述技術相同，藉由將 加濕化惰性氣體供給於基板表面、同時照射來自準分子燈 的紫外光，分解由基板表面的有機物質所構成之污染物質 ，變換爲揮發物質，進行除去之乾洗淨方法。在此方法係 搬入基板至處理室內，注入加濕反應氣體而作爲特定的氛 圍後，將來自準分子燈的紫外光照射於基板表面而進行乾 洗淨。然後排氣被放出的揮發物質，搬出基板。 然而在藉由如此的方法之情況，因爲在搬出基板前一 旦除去揮發氣體，所以有提高處理室的氣密性之必要，有 裝置構造變得複雜、高價之問題。 200823929 (5) 另外，藉由在處理室內設置加濕化氣體供給用配管而 濕度檢測器，而應該控制氛圍的相對濕度，但因爲顯現出 氛圍濕度不均，所以加濕器的控制變難，難以作出安定的 處理氛圍。 而且在此技術係因爲控制相對濕度，所以即使相同％ ，亦因溫度而被含有的含有水份的絕對量亦變化。如含有 水分量變多，則紫外光的吸收量增加而激發活性種增加， 但因爲紫外光不達到工作所以變得得不到洗淨效果。因爲 如含有水份量變少則紫外光照射量增加但激發活性種少， 所以變得得不到洗淨效果。 也就是，在作爲先前周知的技術，係基板處理空間的 水份絕對量變化，有不能進行基板的安定處理之問題。 在如此的實情之外，再加上伴隨燈的高輸出化而燈溫 度亦有變高的傾向，由燈的溫度變化之基板附近氛圍的溫 度係有受到數十度的影響。在如此進行的情況，在相對濕 度的控制係更難進行安定的基板處理。 於是本發明打算解決的課題，係可良好地對應基板的 大型化、同時可降低運轉成本，可確實地進行基板表面的 處理，提供準分子燈裝置。 〔用以解決課題的手段〕 爲了解決上述課題，有關於本發明的準分子燈裝置， 以具備：準分子燈、和收納準分子燈，具有取出從該準分 子燈放射的紫外光之光照射口的燈室、和配置於燈室內， -8- 200823929 (6) 對準分子燈平行而且交互地配設之，設置了氣體噴出口而 形成之氣體供給用配管、和對氣體供給用配管導入含有水 蒸氣之惰性氣體之氣體供給手段；藉由前述氣體供給手段 k 而絕對濕度被控制在特定之惰性氣體，被供給於前述氣體 供給用配管作爲其特徵。 % 另外，前述絕對濕度係換算爲重量絕對濕度爲0 · 5〜 6.5 g / k g 爲佳。 另外，含有前述水蒸氣的惰性氣體，係具備：流過準 分子燈與氣體供給用配管之間而從燈室的開口流出之構成 爲佳。 另外，於前述準分子燈的周圍，係具備：將來自準分 子燈放射的紫外光之中放射至與光照射口的方向相異之方 向的光，進行遮光的遮光手段爲佳。 另外，前述準分子燈，係具備：至少一部分爲由使紫 外光透過的介電質材料所構成，於內部封入放電氣體的放 I 電容器、和配置於此放電容器的外面之第一電極、與該第 一電極至少經由1片介電質，配置於放電容器的內部或外 ‘ 部之第二電極而構成，在配置於放電空間的外部之電極的 v 表面形成耐氧化性的保護膜或是對於紫外光具有透過性的 保護管，於保護管的內部收納準分子燈者爲佳。 〔發明的效果〕 (1 )可對爲被處理物的基板表面均勻的供給含有水 蒸氣的惰性氣體，而且因爲控制水蒸氣量’所以在形成於 -9 - 200823929 (7) 準分子燈與基板之間的空間產生溫度變化的情況’也可將 Η自由基和Ο Η自由基的生產量維持於一定、同時可抑制 紫外光之過剩的衰減’可實現安定的洗淨效果。 (2 )將惰性氣體中的水蒸氣量作爲重量絕對濕度 0.5〜6.5 g/kg，可確實的得到藉由將水蒸氣使用於自由基 源之洗淨效果。 (3 )以使含有水蒸氣的惰性氣體流過準分子燈和氣 體供給用配管之間而從燈室的開口使其流出，可均勻地控 制供給於基板表面的水蒸氣量。 (4 )藉由在準分子燈的周圍，具備將從準分子燈放 射的紫外光之中放射至與光照射口的方向係相異的方向之 光，進行遮光之遮光手段，在以基板與準分子燈形成的空 間以外的部份不產生、消耗Η自由基或OH自由基般地解 決，可有效率地使這些自由基作用於基板，可得高的洗淨 效果。 (5 )於準分子燈的電極的表面形成耐氧化性的保護 膜、或是藉由準分子燈被收納於保護管的內部，可避免電 極氧化，可維特安定的點燈狀態。 【實施方式】 以下’關於本發明參照圖面而詳細地說明。 第1圖進行具備準分子燈的被處理物之的乾洗淨之準 分子燈裝置，同圖係在垂直於準分子燈的管軸的剖面而表 示之說明用部分剖面圖。 -10- 200823929 (8) 此準分子燈裝置1 〇係按照必要配置基底構件1 2，與 其內周形成光照射口 1 2 A、同時全體配置長方體的箱狀之 外裝蓋體1 3，構成燈室1 1。在此燈室1 1的內部，在對光 照射口 1 2 A平行的面上，爲紫外光光源之複數的準分子燈 20以相互平行地延伸的方式配置。在本實施形態係具備4 支準分子燈。 準分子燈裝置1 〇，係以在工廠內的滾子輸送帶等的基 板搬運用機構16的上部設置光照射口 12A的方式設置， 在形成於光照射口 1 2 A的下方之空間S搬運液晶面板基板 等的被處理物之基板W。 第2圖係說明第1圖中的準分子燈（a )爲管軸方向 剖面圖、（b )爲在垂直於管軸的方向切斷的剖面圖。 準分子燈20的放電容器21藉由透過紫外光的石英玻 璃而構成。在放電容器21的內部係爲準分子產成氣體， 爲放電氣體之氙氣氣體以6 OkPa的封入壓力而封入。 於放電容器2 1的內部係由金屬製的線圈所構成之一 方的電極2 2，沿著該放電容器2 1的軸而配置，連接在埋 設於形成在放電容器2 1的兩端之箍縮密封（p i n c h s e a 1 ) 部21A、21B之金屬箔24A、24B而被保持。 於放電容器2 1的外表面上’係由金屬板所構成而成 形至剖面半圓形之槽狀的另一方電極23 ’密接配置於該放 電容器21的上部位置。在本實施形態’另一方的電極2 3 係由對於紫外光具有反射性的材質，理想爲由鋁所構成， 兼作爲將從放電容器21的上方出射之紫外光朝向在準分 -11 - 200823929 (9) 子燈裝置（1 0 )的光照射口（ 1 2 A )而反射之反射鏡。而 且，在如此的另一方的電極23，係亦可爲於其上橫亙放電 容器2 1全周而舖蓋網狀電極。在此情況放電區域擴大， t 可期待更高的光輸出。 另外，此另一方的電極2 3，係亦有作爲將從準分子燈 2 0放射於光照射口（ 1 2 A )以外的方向的紫外光進行遮光 的遮光手段之機能。 藉由具備如此的遮光手段，在第1圖，放射至形成於 基板W與準分子燈20之間之空間S以外的部分的紫外光 被遮光，對基板W的污染物質應進行作用之Η自由基及 ΟΗ自由基，成爲可避免在空間S的前方被產生、消耗， 可提高基板W的洗淨效果。如此的遮光手段，係使構成 準分子燈20的構件具備遮光機能以外，亦可對燈使用別 的構成而附加地設置。 再次參照第2圖而說明燈構成。在同圖，符號2 5係 …由介電質所構成的管材，藉由覆蓋一方的電極22的全長 ，可使產生在一方與另一方的電極22、23之間的放電及 ^ 於燈的長度方向之全體而安定化。另外於放電容器2 1的 - 兩端部附近係於放電空間內部配置中空圓板狀的支撐構件 26A、26Β，於該中心貫穿管材25而支撐。 在第1圖，於準分子燈2 0的上方，係配置：與該準 分子燈20隔開特定距離，冷卻用的流體流通之配管1 4 A 係被設置於內部之冷卻用塊狀體1 4。於冷卻用塊狀體1 4 的上方，係安裝省略圖示之準分子燈20點燈用的電源裝 -12- 200823929 (10) 置，將在點燈中，由電源裝置產生的熱及由準分子燈2〇 所產生的熱以有關的冷卻用塊狀體1 4吸收，謀求兩空間 的絕熱、同時抑制準分子燈裝置1 〇的過熱。 於冷卻用塊狀體1 4的下方係配置氣體供給用配管i 5 。氣體供給用配管1 5係由鋁、不銹鋼等所構成，例如： 藉由於冷卻用塊狀體14的底面具備省略圖示的夾具而固 疋’保ί寸爲中空。在本實施形態氣體供給用配管1 5係全 部具有5支，對於準分子燈2 0的軸，管的軸爲平行而且 從基板W的搬運方向（箭頭）來看燈與配管係成爲交替 般地排列。而且，此氣體供給用配管1 5與準分子燈2 0係 不限定於每隔1支交替地配置之構成，亦可每隔複數支交 替地配置。 第3圖爲取出氣體供給用配管（1 5 )和準分子燈（20 )的一部分而表示、說明用之立體圖。如同圖所示，於氣 體供給用配管的側面係朝向準分子燈的上方的空間設置開 口，構成氣體噴出口 15a。氣體噴出口 15a係於氣體供給 用配管1 5的長度方向及於準分子燈20的全長多數地設置 ，若對氣體供給用配管1 5供給控制了含有水蒸氣量之惰 性氣體，則從氣體噴出口 1 5 a噴出已加濕化之惰性氣體， 於各準分子燈20的上部空間成爲可到處供給加濕化惰性 氣體。而且在本實施形態係藉由多數的孔而構成氣體噴出 口 1 5 a，但不限於此，狹縫狀、噴嘴狀等爲合適。 從氣體噴出口 1 5 a放出之加濕化惰性氣體’係如在第 1圖所示般地滯留於準分子燈20的上部空間之後，沿著準 -13- 200823929 (11) 分子燈20的管壁，通過氣體供給用配管15與準分子燈20 的間隙而朝向燈室1 1的光照射口 1 2 A噴出。如此，因爲 使從氣體噴出口 1 5 a供給的氣體滯留一下之後，再朝向空 .間S放出，所以加濕化惰性氣體的流速變慢、同時於燈的 軸方向變得均勻，H20的濃度變爲均勻。 而且，在準分子燈20的上部空間，係因爲配置另一 方的電極2 3所以紫外光被遮光，沒有被照射紫外光。因 而H20在放出至形成於準分子燈20與基板W之間的空間 S以前，H20不被激發，不產生、消耗無益的Η自由基或 ΟΗ自由基，可確實地防止電極23的氧化。 接著，參照第4、5圖而詳細地說明關於本發明的氣 體供給手段之一例。而且，關於之前在第1〜3圖已說明的 構成係以相同符號表示，省略有關詳細說明。 第4圖係簡略圖示在第1圖的準分子燈裝置有關氣體 供給手段的構成之說明用圖、第5圖爲表示加濕裝置的構 、 成之一例的說明用圖。而且，在此係表示作爲惰性氣體而 使用氮氣氣體（Ν 2 )之例子，但當然也可能使用其他的惰 ^ 性氣體。 • 在第 4圖，氮氣氣體供給源 40係由氣瓶（gas canister)等所構成，由此氮氣氣體供給源40而供給氮氣 氣體於加濕裝置5 0。一方面，加濕用的水源4 1係由供給 水槽等所構成，去離子水（DIW )與前述相同，供給於加 濕裝置5 0。然後，將這些作爲基礎，在加濕裝置5 0產生 絕對濕度被調整至特定之加濕化氮氣氣體，通過可預防凝 -14- 200823929 (12) 結之配管5 1及分歧配管5 2，成爲可供給於在準分子 置1 〇的各氣體供給用配管1 5。 使用第5圖而詳細地說明加濕裝置之一例。在第 ，水源4 1係經由閥5 3及止回閥5 4而連接於加濕槽 如同圖所示於加濕槽5 5係導入供給水（去離子水（ ))。液面控制器5 6係藉由設置於加濕槽5 5側面之 開關5 7而監視加濕槽5 5中的去離子水的水位，一測 過液位開關5 7的下限而水面變低之情事，則經由連 液面控制器5 6與閥5 3之間的配線，從該液面控制| 對閥5 3發出促使供水於加濕槽5 5的指示。 於此加濕槽5 5的內部供給氮氣氣體，氮氣氣體 濕化處理。以下，詳細說明有關於此之情事。 從氮氣氣體供給源4 0，經由流量計5 8及針閥5 9 配管60對加濕槽5 5供給乾燥氮氣氣體。另外，分歧 管61的前頭係經由針閥62而與連通於加濕槽55內 管63合流，連接於濕度控制裝置64。 濕度控制裝置64係具備：檢測包含於惰性氣體 水量而檢測絕對濕度（一般亦稱爲「混合比」（單 g/kg ))之濕度感測器641、與將來自此濕度感測器 之類比輸出電壓値變換爲數位輸出電壓値之A/D變 642、與記憶部643、與使用來自A/D變換部642的 以及記憶於記憶部6 4 3的資料等而進行演算之演算部 、與將來自演算部6 4 4的結果作爲基礎發出控制針R 的開閉狀態的訊號之控制部6 4 5 ° 燈裝 5圖 55， DIW 液位 出超 接於 I 56 被加 而從 的配 的配 中的 位： 641 換部 資訊 644 3 6 2 -15- 200823929 (13) 然後，監視供給之氮氣氣體中的絕對濕度，在加濕化 氮氣氣體中的絕對濕度比特定的範圍低的情況，促使針閥 6 2的閉鎖而使已進行加濕化的氮氣氣體量增大。在絕對濕 度超過特定的範圍而高的情況，係打開針閥62而使乾燥 氮氣氣體量增大，使絕對濕度下降。 而且，如在同圖所示地，於加濕槽5 5係設置監視容 器內部的壓力之壓力計66、及安全閥67。另外，符號68 爲用以排出加濕槽5 5內的水之排浅閥。 如此進行，出自加濕裝置5 0的氣體，通過配管（5 1 )及分歧管（5 2 )而供給於在準分子燈裝置（i 〇 )的氣體 供給用配管（1 5 )。 接著’參照第6圖而說明關於與上述係相異的構成之 加濕裝置。而且，關於與之前藉由第4圖、第5圖而說明 的構成相同之構成係以相同符號表示而省略詳細說明。 於加濕槽5 5係導入供給水（去離子水（DIw ))， 在本例係藉由浮球閥（ball tap ) 70而監視水量。浮球閥 7 0的位置若低於特定則從水源4 1經由配管6 9而自動供給 供給水。 關於來自氮氣氣體供給源4 0的氣體供給經路及來自 加濕槽5 5的加濕惰性氣體的經路，係與上述例爲相同。 也就是’在導入供給水之加濕槽5 5，已加濕化的氮氣氣體 係經由配管63而被送至濕度控制裝置64而在濕度感測器 64 1測定絕對濕度，在絕對濕度未滿特定之情況係閉鎖針 閥62而fcn局濕度，一方面，在絕對濕度比特定高的情況 -16- 200823929 (14) 係打開針閥62而增加乾燥氮氣氣體的比例而降下濕度， 可進行絕對濕度的調整。如此進行而含有已調整之水蒸氣 的氮氣氣體，係成爲可流過配管5 1而供給於在準分子燈 裝置（1 〇 )的氣體供給用配管（1 5 )。 如以上般地，藉由具備乾燥惰性氣體的供給源、水源 、加濕裝置及配管而構成而成之氣體供給手段，而水蒸氣 量被控制於特定之惰性氣體被供給於氣體供給用配管。 藉由具備上述的加濕裝置，從氣體供給裝置供給將絕 對濕度、也就是含有之水蒸氣量控制在特定之惰性氣體。 因而，即使在燈室內的溫度變化的情況，浮遊於基板表面 附近的水分子量亦不增減，可實現安定的乾洗淨處理。若 浮遊於基板表面附近的H20分子的數過多，則紫外光的衰 減變大而照射於基板表面的紫外光不足，不能充分地進行 污染物質的活性化。一方面，若H20的數過少，則雖然向 基板的紫外光照射被確實地進行’但是Η自由基及Ο Η自 由基不足，活性化之污染物質的分解變得困難。 在基板的乾洗淨作爲必要的水蒸氣量，重量絕對濕度 爲 0.5〜6.5g/kg、較理想爲 1·〇〜6.0g/kg、更理想爲 1.5〜4.5g/kg。以將重量絕對濕度作爲〇·5〜6.5g/kg的範圍 ，即使與作爲自由基源使用氧（不使用水）之基板洗淨比 較，亦變爲可提昇大的洗淨效果。而且，若將重量絕對濕 度作爲1 ·〇〜6.0g/kg的範圍，則純水的接觸角成爲可更變 小5。以上，可確實地得到洗淨效果。然後再加上，若將重 量絕對濕度作爲1 .5〜4.5 g/kg ’則基板的純水的接觸角能 -17- (15) 200823929 變小至於洗淨被要求的1 〇 °附近，變爲可得大的 。一方面，若重量絕對濕度成爲7.0g/kg以上， 爲自由基源僅使用氧（不使用水）之基板洗淨， 下降。 在此，將有關以上的構成之準分子燈裝置的 照第1圖同時說明。在第1圖，若在形成於光照 的下方之空間S搬運由液晶面板基板等所構成的 的基板W，則從氣體噴出口 1 5 a被放出的加濕化 經由準分子燈20的上部空間，通過準分子燈20 給用配管1 5之間而流出至基板W表面。與此同 準分子燈20的紫外光（UV光）照射於基板W 水蒸氣。 而且，一對藉由附著於基板表面的有機物質 污染物質照射紫外光，則污染物質活性化、同時 外光（UV光）的水蒸氣（H20 )被激發而分解 基和OH自由基而成爲活性種（seed )，這些作 性化之污染物質而變換爲揮發物質。於空間S係 分子燈裝置1 〇連續流出加濕化惰性氣體，所以 發物質係從基板表面飛散，通過排氣口（不圖示 至準分子燈裝置1 0的外部。 如藉由此的準分子燈裝置1 〇，因爲加濕化惰 勻地供給於形成在光照射口 1 2 A的下方之空間S 板間的空間），所以可一定化浮遊於基板（W ) Η自由基及OH自由基量、同時被照射的紫外光 洗淨效果 則比起作 洗淨效果 處理，參 射口 1 2 A 被處理用 惰性氣體 與氣體供 時，來自 的表面及 所構成之 吸收了紫 V Η自由 用於被活 因爲從準 產生的揮 )而放出 性氣體均 (燈與基 的表面之 量亦一定 -18- 200823929 (16) 化，可確實地進行基板（W )表面的處理。 特別是，以將惰性氣體的重量絕對濕度作爲0.5〜 6.5 g/kg的範圍，可抑制從準分子燈放射的紫外光之衰減 .，對於基板亦可照射適當量的紫外光、同時由Η2 Ο分子產 生的Η自由基及OH自由基量，均亦產生對基板無過與不 及的量，成爲可提昇高的洗淨效果。 另外，在上述裝置，關於惰性氣體，係因爲如供給於 ' 光照射口 12Α的下方的空間S則足夠，所以亦無塡充於大 的裝置全體之必要’可節約使用的惰性氣體量而可降低運 轉成本。而且，亦無將準分子燈裝置1 0的光照射口 1 2 A 以石英玻璃氣密地覆蓋的必要，可自由地進行準分子燈裝 置10之大型化，亦可降低裝置本體的成本。 再加上，在有關本發明的準分子燈裝置，係如設置於 基板處理裝置中的搬運線之一區劃爲佳，可省空間而且簡 單地構成裝置，可作爲泛用性高的裝置。 、 接著，第7圖，係說明本發明的第2實施形態之準分 子燈裝置的說明用剖面圖。而且，關於之前在第1圖〜第6 圖已說明的構成係以相同符號表不，省略詳細說明。 " 此實施形態與上述實施形態不同之點係準分子燈的形 態，在此使用具備了成形至矩形箱狀的放電容器之物。 首先，參照第8圖而說明準分子燈構成。第8 ( a )圖 爲放大準分子燈而表示之以一部分虛線顯示的透過立體圖 、（b )爲以（a )中的A-A切斷之說明用剖面圖。放電容 器3 1的材質與上述相同，由透過紫外光的石英玻璃所構 -19- 200823929 (17) 成，於放電容器3 1的內部，係封入氙氣氣體。在放電容 器3 1的外表面之光取出側的一面（在紙面下方的面）係 形成已形成至網狀的一方的電極3 2，相對於此面之外表面 形成另一方的電極33。由一方的電極32，係藉由從網的 間隙透過紫外光，如在第7圖所示地，朝向配置於相對面 的基板而照射紫外光。 在本實施形態，於一方與另一方的電極32、33的表 面，形成耐氧化性的保護膜3 4。而且作爲保護膜，由之前 亦敘述之si〇2、ai2o3、Ti02或這些的複合物等所構成之 膜爲合適。而且形成於一方的電極3 2上之保護膜3 4係選 擇對紫外光具有透過性之物。 如第7圖所示地，若由配置於燈室1 1上部之氣體供 給用配管，供給水蒸氣量被調整至特定之惰性氣體，則通 過準分子燈3 0和氣體供給管1 5的間隙，朝向基板W的 表面上流過。在與此同時，來自準分子燈3 0的紫外光照 射於基板W表面，將由附著的有機物質所構成之污染物 質活性化、同時吸收了紫外光（UV光）的水蒸氣（H20 ) 被激發而分解爲Η自由基和OH自由基而成爲活性種（ seed )，這些作用於被活性化之污染物質而變換爲揮發物 質。 如此，如藉由關於本發明的準分子燈裝置，則不問準 分子燈的形態而可確實地發揮洗淨處理機能。 而且，尤其如本實施形態般地，在準分子燈的光取出 面對於基板的被處理面爲平面的構成之情況，氣體的流動 -20- 200823929 (18) 容易安定化’可更圓滑地進行自由基群的回收而爲合適。 以上’關於有關本發明的實施形態之準分子燈裝置已 詳細地說明’但本案發明當然不限定於此實施形態，可適 宜變更。 例如：作爲準分子燈，提示出表示在第2圖、第8圖 之物但不限定於這些構成。具體而言，即使使用作爲放電 容器形狀如記載於從先前已知的專利文獻1之將直徑小的 內管部與直徑大的外管部配置於同軸，熔接其兩端部而密 封，形成中空圓筒狀的放電空間之物也沒有關係。另外， 在上述實施形態於第2圖所示之準分子燈，係另一方的電 極應該作爲反射板而發揮機能，但不被限定於此態樣，在 放電容器的上部外表面形成反射膜亦佳。另外，對於另一 方的電極不使其具備反射性，安裝另外的反射鏡亦佳。 另外，在配置於放電容器的外表面之電極係如第8圖 所示，形成耐氧化性的保護膜，或藉由以外的手段而防止 電極的氧化爲最佳。在本實施形態未採用’但如使用對紫 外光具有透過性的保護管，收納燈全體於此’將電極等從 Η自由基或Ο Η自由基加以保護般構成亦佳。 以如此採用耐氧化性的保護膜或保護管’即使在另一 方的電極的周圍浮遊Η自由基或ΟΗ自由基的情況亦無電 極被氧化之情事，可實現安定的放電。 接著，爲了確認發明的效果而進行實驗例1〜2。而且 ，在下述實驗例1〜2使用的裝置規格爲一例，不限定於此 -21 - 200823929 (19) [實施例1] 根據第1圖的構成而製作準分子燈裝置（1 〇 )的實驗 機。此準分子燈裝置（1 0 )之具體的構成按照以下所述。 準分子燈（20)係具有表示於第2圖的構成，具備： 外徑爲18.5mm、內徑爲16.5mm、全長爲2470mm之石英 玻璃製的圓筒狀的放電容器（2 1 )，於管的中心配置一方 的電極（22 )、同時於放電容器（2 1 )的外表面上配置半 圓筒形的另一方的電極（23 )而構成。另外，於此放電容 器（21)的內部封入壓力爲60 kP a的準分子產生氣體，製 作額定消耗電力600W之準分子燈。 使用4支如此製作的準分子燈（20 )，安裝於有關第 1圖的構成之準分子燈裝置。 鄰接於準分子燈（20 )而配置之氣體供給用配管爲鋁 製，在相對於準分子燈的上部空間的位置，將內徑〇. 7mm 的小孔所構成之氣體噴出口，以間距1 〇mm形成之物。 在具有以上的構成之準分子燈裝置（1 0 )，於基板搬 運用機構（1 6 )上載置了作爲被處理物之基板（W )。將 基板以厚度 0.7mm、寬度2200mm、長度2400mm之無鹼 玻璃構成，而且使用將其表面進行污染處理’將純水的接 觸角作爲約4 0 °之物。 以基板（W )的被處理面與準分子燈（2 0 )之最接近 距離成爲3 mm的方式進行調節而設置燈室（1 1 )。此距 離，係應該接近於一般上使用之準分子燈裝置的配置條件 -22- 200823929 (20) 另外，基板（W)的搬運速度作爲5m/min。在燈室的 照射區爲約2 5 0 m m的情況，根據此條件，由準分子燈（ 20 )之紫外光照射時間成爲約3秒鐘。 使用有關上述構成之實驗裝置，使導入至氣體供給管 之惰性氣體的濕度各式各樣地變化而硏究基板表面之純粹 的接觸角。第9圖係表示以以下的條件1〜進行了洗淨處理 的結果之圖，縱軸爲純水的接觸角（° )、橫軸爲相對濕 度（％RH ) 〇 [條件1] 由氣瓶直接將不含水蒸氣之乾燥氮氣氣體導入氣體供 給管。在不進行水蒸氣導入之情況，由準分子燈的光照射 於浮遊在基板表面的氧而產生臭氧，而且藉由在臭氧分解 時產生之活性氧的作用，進行基板的乾洗淨。此結果，了 解：基板表面的純水的接觸角係在紫外光照射前爲40°之 物下降至20°。此條件係在第9圖對應於相對濕度0%。 接著，於氣體供給用配管附設加濕裝置而構成：可將 已加濕化的惰性氣體供給於燈室內之實驗裝置。 [條件2] 將供給的氣體溫度強制冷卻至5 °C同時保持於一定， 使相對濕度從〇%〜1〇〇 %變化而供給氮氣，確認洗淨效果。 將此結果於第9圖中以X符號表示。 -23- 200823929 (21) [條件3] 將供給的氣體溫度保持在1 〇 °C ，使相對濕度從 0 %〜1 0 0 %變化而供給氮氣，確認洗淨效果。將此結果於第 9圖中以菱形符號表示。 [條件4] 將供給的氣體溫度保持在20 °C ，使相對濕度從 0%〜100%變化而供給氮氣，確認洗淨效果。將此結果於第 9圖中以正方形符號表示。 [條件5] 將供給的氣體溫度保持在3 0 °C ，使相對濕度從 0%〜100%變化而供給氮氣，確認洗淨效果。將此結果於第 9圖中以三角形符號表示。 [條件6] 將供給的氣體溫度保持在4 5 °C ，使相對濕度從 0%〜100%變化而供給氮氣，確認洗淨效果。將此結果於第 9圖中以圓形付號表不。 如從第9圖的結果了解地’在各溫度接觸角變爲最低 的相對濕度係相異。此係意味著，換言之在即使控制相對 濕度而不控制氣體的溫度的情況，係不能得到有效的洗淨 效果。 •24- 200823929 (22) 例如：在相對濕度爲約5%，供給之惰性氣體溫度爲 3 0〜4 5 °C的情況，可下降至在此種玻璃之洗淨被要求之接 觸角1〇°±1°以下。但即使維持相同的相對濕度5%，若氣 體的溫度變爲20°C以下則純水的接觸角變得比15。大，變 爲得不到作爲所希望之效果。 另外，在相對濕度20%的情況，最合適的溫度爲2(TC ，在此情況係可下降至接觸角1〇°±1°以下。但是，在比溫 度2 0 °C有進行變化的情況，係不能下降至接觸角1〇°±Γ以 下。而且，在氣體的溫度爲4 5 °C的情況係接觸角超過3 5 ° 而變爲比不導入水蒸氣的情況還差的結果，了解到不能得 到洗淨效果。 [實施例2] 在上述實驗例1使用的準分子燈裝置附設在第4、5 圖所示之氣體供給裝置而構成實驗裝置。作爲被處理物使 用與在上述實驗例1使用之物相同構成之基板，使惰性氣 體中的絕對濕度（重量絕對濕度）在0〜8.Og/kg之間變化 ，進行洗淨，測定基板表面的純水之接觸角。而且，裝置 的驅動條件亦作爲與上述實驗例相同。 將實驗例2的結果表示於第1 0圖。 隨著使水蒸氣從重量絕對濕度〇g/kg開始增大，基板 的純水的接觸角變小，在3.0〜3.5g/kg附近變得可得到最 低的接觸角。由此重量絕對濕度一變大則接觸角徐徐地變 大，若超過重量絕對濕度7. 〇g/kg，則變得比不含有水蒸 -25- 200823929 (23) 氣的情況還差。因而，作爲必要的水蒸氣量，係重量絕對 濕度爲0.5〜6.5g/kg，由此，與在不使用水蒸氣而洗淨的 情況比較下可實現高的效果。而且，在重量絕對濕度爲 1.0〜6.0 g/kg的情況係可達成未滿接觸角15° ’而且若作爲 1.5〜4.5g/kg，則可下降至在玻璃洗淨被要求之接觸角1〇°土 Γ以下。 如由以上的實驗例的結果明暸般地，在準分子燈裝置 以相對濕度控制、管理含有水分量的情況，因爲由供給氣 體的溫度而基板的洗淨效果係不同，所以難以維持安定的 洗淨條件。在以相對濕度管理的情況，以亦管理進行供給 的氣體之溫度，成爲可得到所期待之洗淨效果，但若思索 實際使用則不實際。也就是說，假設實際上係因爲準分子 燈本體變爲高溫，所以在處理基板的空間氛圍溫度亦產生 不少影響，氣體的溫度亦產生變動。伴隨惰性氣體的溫度 變化而必須使相對濕度變化，但在處理室內設置濕度感測 、 器的情況，係除了難以控制、再加上回應良好地調整相對 濕度亦對實現性非常地缺乏。 ^ 一方面，在管理絕對濕度的情況係可將洗淨效果控制 _ 所期望的範圍，而且因爲幾乎不相依於溫度，所以可不考 慮準分子燈的溫度上昇等，可確實地提高洗淨效果。 如此，在基板的表面處理，係意味著存在於處理基板 的空間之水分子的絕對量之控制爲不可欠缺。因此，控制 惰性氣體中的絕對濕度爲必要。 -26- 200823929 (24) 【圖式簡單說明】 〔第1圖〕表示本發明的第1實施形態，在垂直於準 分子燈的管軸的剖面顯示之說明用部分剖面圖。 〔第2圖〕係說明關於本發明的第1實施形態的準分 子燈，（a )爲管軸方向剖面圖、（b )爲在垂直於管軸的 方向切斷的剖面圖。 〔第3圖〕取出有關本發明的第1實施形態之氣體供 給用配管和準分子燈的一部分而圖示、說明用的立體圖。 〔第4圖〕簡略圖示有關關於本發明的實施形態之氣 體供給手段的構成之說明用圖。 〔第5圖〕顯示有關本發明的實施形態之加濕裝置的 構成之一例的說明用圖。 〔第6圖〕簡略圖示有關關於本發明的其他實施形態 之氣體供給手段的構成之說明用圖。 〔第7圖〕係說明本發明的第2實施形態之準分子燈 裝置的說明用剖面圖。 〔第8圖〕爲有關於本發明的第2實施形態之（a ) 圖爲放大準分子燈而表示之以一部分虛線顯示的透視立體 圖、（b)爲以（a)中的A-A切斷之說明用剖面圖。 〔第9圖〕顯示實驗例1的結果，表示惰性氣體的相 對濕度與純水的接觸角之關係之圖。 〔第1 〇圖〕顯示實驗例2的結果，表示惰性氣體的 絕對濕度與純水的接觸角之關係之圖。 〔第1 1圖〕將有關先前技術的基板處理裝置，對燈 -27- 200823929 (25) 的管軸在垂直的面切斷之準分子燈裝置的說明用剖面圖。 【主要元件符號說明】 S :空間 W :基板 7 :準分子燈 1 〇 :準分子燈裝置 1 1 :燈室 1 2 :基底構件 12A :光照射口 1 3 :外裝蓋體 14A :配管 1 4 :冷卻用塊狀體 1 5 :氣體供給用配管 15a :氣體噴出口 1 6 :基板搬運用機構 2 0 :準分子燈 2 1 :放電容器 2 1 A :箍縮密封部 2 1 B :箍縮密封部 22 :電極 23 :電極 24A :金屬箔 24B :金屬箔 -28- 200823929 (26) 2 5 :管材 2 6 A :支撐構件 2 6 B :支撐構件 3 〇 :準分子燈 3 1 :放電容器 32 :電極 33 :電極 34 :保護膜 4 0 ·氮氣氣體供給源 41 :加濕用的水源 5 〇 :加濕裝置 5 1 :配管 52 :分歧配管 53 :閥 5 4 :止回閥 5 5 :加濕槽 5 6 :液面控制器 57 :液位開關 5 8 :流量計 5 9 :針閥 60 :配管 61 :配管 62 :針閥 63 :配管 -29- 200823929 (27) 64 :濕度控制裝置 66 :壓力計 6 7 :安全閥 68 :排洩閥 69 :配管 70 :基板 7 0 :浮球閥 7 1 :滾子輸送帶 7 2 :燈室 73 :氣體供給用配管 75 :加濕化惰性氣體的供給管 7 6 :處理室 641 :濕度感測器 642 : A/D變換部 643 :記憶部 644 :演算部 645 :控制部 6 5 :加熱器 -30-200823929 (1) Description of the Invention [Technical Field of the Invention] The present invention relates to use in, for example, a liquid crystal panel substrate or a semiconductor wafer. In the case of a disk substrate, a disk substrate, or the like, an excimer lamp device that irradiates ultraviolet light on a surface of a composite substrate such as glass, a semiconductor, a resin, a ceramic, a metal, or the like, and performs substrate processing such as cleaning or etching. [Prior Art] An excimer lamp device equipped with an excimer lamp known in Patent Document 1 and the like, which emits ultraviolet light in a range of 100 nm or more and 100 nm or more emitted from an excimer lamp in an atmosphere in which oxygen is present in a minute amount. On the surface of the treated material, the organic matter on the surface of the object to be treated is decomposed and scattered by the synergistic effect of the generated active oxygen and the transmitted ultraviolet light to be washed. That is, from the excimer lamp, for example, ultraviolet light having a wavelength of 1 72 nm is irradiated onto the surface of the substrate, and the chemical bond of the organic substance is decomposed to lower the ionization of the organic substance while activating the organic contaminant. At the same time, the ultraviolet light which is floating on the surface of the substrate is irradiated with ultraviolet light, and the generated active oxygen is converted into a volatile substance by oxidation reaction of the organic pollutant and the active oxygen, and is released into the air to be removed. The dry cleaning using such an excimer lamp is because the ultraviolet light is consumed when the oxygen is decomposed, and the ultraviolet light that reaches the surface of the substrate due to the amount of oxygen existing between the excimer lamp and the substrate changes, so In the case where the concentration of the contaminant is necessary and the presence of a high concentration of oxygen molecules, the ultraviolet light is unnecessarily consumed and cannot reach the surface of the substrate. Therefore, from the previous improvement in the excimer -4- 200823929 (2) lamp device, a technique for effectively utilizing ultraviolet light was developed. For example, (1) it is known that a plurality of rod-shaped excimer lamps are disposed in a rectangular box-shaped casing which is a substantially sealed state, and the interior of such a frame is converted into an ultraviolet light-transmitting atmosphere, that is, An excimer lamp device that emits ultraviolet light through an atmosphere of an inert gas such as nitrogen gas through a window member provided on one side of the frame. Further, it is also known that: (2) in order to obtain ultraviolet light that has passed through the ultraviolet light transmission window member, the oxygen partial pressure is lowered by flowing an inert gas such as nitrogen between the window member and the substrate. And mention the UV light permeability. In addition, recently, the liquid crystal panel substrate system of the object to be processed has been increased in size, and it has become difficult to manufacture the ultraviolet light transmission window member corresponding thereto. Therefore, it has also been developed to irradiate ultraviolet light from an excimer lamp directly to an excimer lamp device of a substrate without using a window member. In such a thing, the inert gas flowing between the excimer lamp and the substrate and controlling the oxygen to the desired position can suppress the attenuation of the ultraviolet light from the excimer lamp, and efficiently irradiate the substrate with ultraviolet light. . Recently, a technique of using water vapor as a reactive gas during cleaning of a substrate surface in place of oxygen is disclosed in Patent Document 1 (JP-A-200-137800) and Patent Document 2 (JP-A-2001-162240). The bulletin) was proposed. In such a technique, in order to maintain ultraviolet light transmittance, humidity is applied to the supplied nitrogen gas to humidify nitrogen, and OH radicals or ruthenium radicals generated by decomposing the water by ultraviolet light are used for washing on the substrate. Net treatment. -5-200823929 (3) Fig. 1 is a cross-sectional view for explaining the excimer lamp device in which the tube axis of the lamp is cut in the vertical plane in the substrate processing apparatus of the technique described in Patent Document 1. The excimer lamp device is provided with, for example, three rod-shaped excimer lamps 7 inside the lamp chamber 72 that is open below the paper surface, and is provided to include a lower portion of the lamp chamber 72 and a roller conveyor belt 71 for transporting the substrate 70. The processing chamber 76 is supplied with a nitrogen gas as an inert gas inside the lamp chamber 72 from the gas supply pipe 73 and placed in an atmosphere containing no oxygen therein, whereby the ultraviolet light attenuation from the excimer lamp 7 can be suppressed. . Further, a supply pipe 75 for humidifying the inert gas is connected to the lower side of the processing chamber 76, whereby a mixed fluid of steam and nitrogen gas can be supplied. Further, an exhaust pipe 78 is provided above the processing chamber 76, and the flow rate of the inlet of the processing chamber 76 is accelerated by forced exhaust to prevent leakage of ozone. The surface of the substrate 70 is irradiated with ultraviolet light from the excimer lamp 7 to be cleaned, and the water vapor present on the surface of the substrate 70 is also irradiated with ultraviolet light to generate oxidizing OH radicals and reducing ruthenium radicals. By the action of such ruthenium radicals and ruthenium radicals, the pollutants composed of organic substances adhering to the surface of the substrate 70 are converted and decomposed into volatile substances, and can be discharged from the exhaust pipe to the outside to perform dry cleaning of the substrate. net. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-162240 (Patent Document 2) Japanese Laid-Open Patent Publication No. 2001-162240 (Convention) -6-200823929 (4) [Problems to be Solved by the Invention] However, In the apparatus described in Patent Document 1, it is necessary to charge the inside of the lamp chamber 72 with an inert gas. In the device having the above configuration, there is a problem that a large amount of inert gas is supplied because the lamp chamber 72 is opened for light irradiation, and the running cost becomes high. In view of the above, when the opening of the lamp chamber 7.2 is covered with a window made of ultraviolet light-transmitting quartz glass or the like, it is difficult to follow the recent increase in the area of the liquid crystal panel substrate, and since the window member is very expensive, the device is also Become a high price. Further, in the processing chamber 76 of the substrate 70, it is necessary to maintain the inside in a high-humidity atmosphere, and the structure is inevitably complicated. Further, since the amount of the supplied gas from the supply pipe 75 for humidifying the inert gas and the exhaust gas from the exhaust pipe 78 are managed to control the atmosphere in the processing chamber 76, the atmosphere on the surface of the substrate 70 is maintained constant. Very difficult, there are problems with washing and unsettled. Patent Document 2 discloses that, similarly to the above-described technique, the humidified inert gas is supplied to the surface of the substrate while irradiating the ultraviolet light from the excimer lamp to decompose the pollutants composed of the organic substances on the surface of the substrate. It is a dry cleaning method for removing volatile substances. In this method, the substrate is carried into the processing chamber, and the humidified reaction gas is injected to form a specific atmosphere, and then ultraviolet light from the excimer lamp is irradiated onto the surface of the substrate to be dry-washed. Then, the volatile matter released by the exhaust gas is taken out of the substrate. However, in the case of such a method, since the volatile gas is removed once the substrate is carried out, it is necessary to improve the airtightness of the processing chamber, and the device structure is complicated and expensive. 200823929 (5) In addition, the humidity of the humidifying gas supply pipe is provided in the processing chamber, and the relative humidity of the atmosphere should be controlled. However, since the humidity of the atmosphere is uneven, the control of the humidifier becomes difficult. It is difficult to make a stable atmosphere. Moreover, in this technique, since the relative humidity is controlled, even if the same %, the absolute amount of moisture contained by the temperature also changes. If the amount of water contained is increased, the amount of absorption of ultraviolet light increases to excite the active species, but since the ultraviolet light does not reach the operation, the cleaning effect is not obtained. When the amount of water contained is small, the amount of ultraviolet light irradiation increases, but the amount of active species is small, so that the cleaning effect is not obtained. That is, as a technique known in the prior art, the absolute amount of moisture in the substrate processing space is changed, and there is a problem that the substrate cannot be stably handled. In addition to such a fact, the lamp temperature tends to increase as the lamp is increased in output, and the temperature of the atmosphere near the substrate which is changed by the temperature of the lamp is affected by tens of degrees. In the case of doing so, it is more difficult to perform stable substrate processing in the control system of relative humidity. Therefore, the object of the present invention is to provide an excimer lamp device that can satisfactorily increase the size of the substrate and reduce the running cost, and can reliably perform the surface treatment of the substrate. [Means for Solving the Problems] In order to solve the above-described problems, the excimer lamp device of the present invention includes an excimer lamp and an excimer lamp, and has an ultraviolet light emitted from the excimer lamp. The light chamber of the port and the light supply chamber are arranged in the lamp chamber, -8-200823929 (6) The gas supply pipe formed by the gas discharge port and the gas supply pipe are introduced in parallel with the molecular lamps. A gas supply means for supplying an inert gas containing water vapor, and the absolute humidity is controlled to a specific inert gas by the gas supply means k, and is supplied to the gas supply pipe. %, the absolute humidity is converted to a weight absolute humidity of 0 · 5~ 6. 5 g / k g is preferred. In addition, it is preferable that the inert gas containing the water vapor flows between the quasi-molecular lamp and the gas supply pipe and flows out from the opening of the lamp chamber. Further, it is preferable that the periphery of the excimer lamp is provided with light that is emitted from the ultraviolet light emitted from the quasi-molecular lamp to a direction different from the direction of the light irradiation port, and is shielded from light. Further, the excimer lamp includes at least a part of a discharge capacitor made of a dielectric material that transmits ultraviolet light, a discharge capacitor sealed therein, and a first electrode disposed outside the discharge vessel, and The first electrode is formed of at least one dielectric layer disposed on the inner electrode of the inside or outside of the discharge vessel, and forms an oxidation-resistant protective film on the surface of the electrode disposed outside the discharge space. For a protective tube that is transparent to ultraviolet light, it is preferable to store an excimer lamp inside the protective tube. [Effects of the Invention] (1) An inert gas containing water vapor can be uniformly supplied to the surface of the substrate to be processed, and the amount of water vapor is controlled to be formed in the -9 - 200823929 (7) excimer lamp and substrate The temperature change between the spaces can also maintain the production of ruthenium free radicals and ruthenium free radicals while suppressing the excessive attenuation of ultraviolet light, which can achieve a stable cleaning effect. (2) The amount of water vapor in the inert gas is taken as the weight absolute humidity. 5~6. 5 g/kg, it is possible to surely obtain a washing effect by using water vapor for a radical source. (3) The inert gas containing water vapor is allowed to flow between the excimer lamp and the gas supply pipe to flow out from the opening of the lamp chamber, whereby the amount of water vapor supplied to the surface of the substrate can be uniformly controlled. (4) A light-shielding means for shielding light from the ultraviolet light emitted from the excimer lamp to a direction different from the direction of the light-irradiating opening is provided around the excimer lamp, and the substrate is shielded by light The portion other than the space formed by the excimer lamp is not generated, and the radicals or OH radicals are consumed, and these radicals can be efficiently applied to the substrate, and a high cleaning effect can be obtained. (5) A protective film for forming an oxidation resistance on the surface of the electrode of the excimer lamp or an inside of the protective tube by the excimer lamp can avoid oxidation of the electrode and can be stabilized in a lighting state. [Embodiment] Hereinafter, the present invention will be described in detail with reference to the drawings. Fig. 1 is a view showing a partial cross-sectional view for explaining the dry cleaning of the object to be treated with the excimer lamp, and the same drawing as the cross section perpendicular to the tube axis of the excimer lamp. -10- 200823929 (8) This excimer lamp device 1 is configured such that the base member 1 2 is disposed as necessary, and a light-emitting port 1 2 A is formed on the inner circumference thereof, and a box-shaped outer cover body 1 3 in which a rectangular parallelepiped is entirely disposed is formed. Lamp chamber 1 1. Inside the lamp chamber 1 1 , a plurality of excimer lamps 20 which are ultraviolet light sources are arranged to extend in parallel with each other on a surface parallel to the light irradiation port 1 2 A. In the present embodiment, four excimer lamps are provided. The excimer lamp device 1 is provided so as to be provided with a light irradiation port 12A at the upper portion of the substrate transporting mechanism 16 such as a roller conveyor belt in the factory, and is transported in a space S formed below the light irradiation port 1 2 A. A substrate W of a workpiece such as a liquid crystal panel substrate. Fig. 2 is a cross-sectional view showing the excimer lamp (a) in Fig. 1 in the tube axis direction and (b) in the direction perpendicular to the tube axis. The discharge vessel 21 of the excimer lamp 20 is constructed by a quartz glass that transmits ultraviolet light. The inside of the discharge vessel 21 is an excimer gas, and the helium gas of the discharge gas is sealed at a sealing pressure of 6 OkPa. An electrode 2 2 composed of a metal coil is disposed inside the discharge vessel 21, and is disposed along the axis of the discharge vessel 21, and is connected to a pinch which is buried at both ends of the discharge vessel 2 1 The metal foils 24A and 24B of the pinchsea 1 portions 21A and 21B are held. On the outer surface of the discharge vessel 2, the other electrode 23' formed by a metal plate and formed into a groove having a semicircular cross section is disposed in close contact with the upper portion of the discharge vessel 21. In the present embodiment, the other electrode 2 3 is made of a material that is reflective to ultraviolet light, and is preferably made of aluminum, and also serves as an ultraviolet light that is emitted from above the discharge vessel 21 toward the standard score - 11 - 200823929. (9) A mirror that reflects the light of the sub-light device (10) and reflects it (1 2 A). Further, in such another electrode 23, a mesh electrode may be laid over the entire circumference of the discharge vessel 21. In this case, the discharge area is enlarged, and t can expect a higher light output. Further, the other electrode 2 3 also functions as a light blocking means for blocking ultraviolet light emitted from the excimer lamp 20 in a direction other than the light irradiation port (1 2 A ). By providing such a light-shielding means, in the first drawing, ultraviolet light emitted to a portion other than the space S formed between the substrate W and the excimer lamp 20 is shielded from light, and the contamination of the substrate W should be free. The radicals and the radicals are prevented from being generated and consumed in front of the space S, and the cleaning effect of the substrate W can be improved. Such a light-shielding means may be provided in addition to the light-shielding function of the member constituting the excimer lamp 20, or may be additionally provided to the lamp using another configuration. The lamp configuration will be described with reference to Fig. 2 again. In the same figure, the symbol 2 5 is a tube made of a dielectric material, and by covering the entire length of one of the electrodes 22, the discharge between the one and the other electrodes 22, 23 and the lamp can be generated. It is stable in the whole length direction. Further, in the vicinity of both end portions of the discharge vessel 2 1 , hollow disk-shaped support members 26A and 26 are disposed inside the discharge space, and are supported by the pipe 25 at the center. In the first diagram, above the excimer lamp 20, a cooling block 1 is disposed in the interior of the excimer lamp 20 at a specific distance from the excimer lamp 20, and the cooling fluid flows through the pipe 1 4A. 4. On the upper side of the cooling block 1 4, a power supply -12-200823929 (10) for lighting the excimer lamp 20 (not shown) is attached, and the heat generated by the power supply device during lighting is used. The heat generated by the excimer lamp 2 is absorbed by the relevant cooling block body 14 to achieve heat insulation in both spaces and to suppress overheating of the excimer lamp device 1 . The gas supply pipe i 5 is disposed below the cooling block 1 4 . The gas supply pipe 15 is made of aluminum, stainless steel, or the like. For example, the bottom surface of the cooling block body 14 is provided with a jig (not shown) to be solid. In the present embodiment, the gas supply pipe 15 has five branches, and the axis of the excimer lamp 20 is parallel to the axis of the substrate, and the lamp and the piping are alternately viewed from the conveyance direction (arrow) of the substrate W. arrangement. Further, the gas supply pipe 15 and the excimer lamp 20 are not limited to being arranged alternately every other branch, and may be alternately arranged every other number. Fig. 3 is a perspective view showing and explaining a part of the gas supply pipe (15) and the excimer lamp (20). As shown in the figure, the side surface of the gas supply pipe is provided with an opening toward the space above the excimer lamp to constitute a gas discharge port 15a. The gas discharge port 15a is provided in a plurality of directions in the longitudinal direction of the gas supply pipe 15 and the entire length of the excimer lamp 20. When the gas supply pipe 15 is supplied with an inert gas containing a water vapor amount, the gas is sprayed from the gas. The humidified inert gas is ejected at the outlet 15 a, and the humidified inert gas is supplied everywhere in the upper space of each excimer lamp 20. Further, in the present embodiment, the gas discharge port 15a is constituted by a plurality of holes, but the present invention is not limited thereto, and a slit shape, a nozzle shape, or the like is suitable. The humidified inert gas discharged from the gas discharge port 15 a is retained in the upper space of the excimer lamp 20 as shown in Fig. 1, along the quasi--13-200823929 (11) molecular lamp 20 The pipe wall is ejected toward the light irradiation port 1 2 A of the lamp chamber 1 1 through the gap between the gas supply pipe 15 and the excimer lamp 20. In this way, since the gas supplied from the gas discharge port 1 5 a is retained, it is directed to the air. Since the interval S is released, the flow rate of the humidifying inert gas becomes slow, and becomes uniform in the axial direction of the lamp, and the concentration of H20 becomes uniform. Further, in the upper space of the excimer lamp 20, since the other electrode 2 3 is disposed, the ultraviolet light is blocked and the ultraviolet light is not irradiated. Therefore, H20 is not excited until it is released into the space S formed between the excimer lamp 20 and the substrate W, and does not generate or consume undesired ruthenium radicals or ruthenium radicals, and the oxidation of the electrode 23 can be surely prevented. Next, an example of the gas supply means of the present invention will be described in detail with reference to Figs. 4 and 5. Further, the configurations that have been described above in the first to third embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted. Fig. 4 is a view for explaining the configuration of the gas supply means of the excimer lamp device of Fig. 1 and Fig. 5 is a view for explaining an example of the structure of the humidifying device. Further, here, an example in which a nitrogen gas (?2) is used as an inert gas is shown, but of course, other inert gas may be used. • In Fig. 4, the nitrogen gas supply source 40 is constituted by a gas canister or the like, whereby the nitrogen gas supply source 40 supplies nitrogen gas to the humidifying device 50. On the other hand, the water source for humidification 41 is composed of a water supply tank or the like, and the deionized water (DIW) is supplied to the humidification device 50 in the same manner as described above. Then, based on these, the absolute humidity is adjusted to a specific humidified nitrogen gas in the humidifying device 50, and the piping 5 1 and the branching pipe 5 2 which can prevent the condensation of the condensation--14-200823929 (12) become Each of the gas supply pipes 15 that are placed in the excimer can be supplied. An example of the humidifying device will be described in detail using Fig. 5. In the first, the water source 41 is connected to the humidification tank via the valve 53 and the check valve 54. As shown in the figure, the supply water (deionized water ( )) is introduced into the humidification tank 55. The liquid level controller 56 monitors the water level of the deionized water in the humidification tank 55 by the switch 57 provided on the side of the humidification tank 5 5, and measures the lower limit of the liquid level switch 57 to lower the water surface. On the other hand, an instruction to cause the water supply to the humidification tank 55 is issued from the liquid level control | through the wiring between the liquid level controller 56 and the valve 53. Nitrogen gas is supplied to the inside of the humidifying tank 55, and the nitrogen gas is humidified. The following is a detailed description of the situation. The humidified nitrogen gas is supplied to the humidifying tank 55 from the nitrogen gas supply source 40 via the flow meter 58 and the needle valve 59 pipe 60. Further, the front end of the branch pipe 61 is connected to the inner pipe 63 communicating with the humidifying tank 55 via the needle valve 62, and is connected to the humidity control device 64. The humidity control device 64 includes a humidity sensor 641 that detects the amount of inert gas and detects absolute humidity (generally referred to as "mixing ratio" (single g/kg)), and an analogy from the humidity sensor. The output voltage 値 is converted into an A/D change 642 of the digital output voltage 、, and a calculation unit that performs calculations using the data from the A/D conversion unit 642 and the data stored in the memory unit 641, and The control unit 6 4 5 that emits the signal for controlling the opening and closing state of the needle R based on the result of the calculation unit 64 4 4 5 ° light installation 5 Fig. 55, the DIW liquid level is super-connected to the I 56 Position: 641 Change Information 644 3 6 2 -15- 200823929 (13) Then, monitor the absolute humidity in the supplied nitrogen gas, and the absolute humidity in the humidified nitrogen gas is lower than the specific range, prompting The amount of nitrogen gas that has been humidified is increased by the closing of the needle valve 6 2 . When the absolute humidity exceeds a certain range and is high, the needle valve 62 is opened to increase the amount of dry nitrogen gas and to lower the absolute humidity. Further, as shown in the same figure, a pressure gauge 66 for monitoring the pressure inside the container and a safety valve 67 are provided in the humidifying tank 55. Further, reference numeral 68 is a shallow valve for discharging water in the humidifying tank 55. In this way, the gas from the humidifying device 50 is supplied to the gas supply pipe (15) in the excimer lamp device (i 〇 ) through the pipe (5 1 ) and the branch pipe (52). Next, a humidifying device having a configuration different from the above-described system will be described with reference to Fig. 6. The same components as those described above with reference to FIGS. 4 and 5 are denoted by the same reference numerals and will not be described in detail. The supply water (deionized water (DIw)) is introduced into the humidification tank 55, and in this example, the amount of water is monitored by a ball tap 70. When the position of the float valve 70 is lower than the specific value, the supply water is automatically supplied from the water source 4 1 via the pipe 6 9 . The path of the gas supply path from the nitrogen gas supply source 40 and the humidified inert gas from the humidification tank 55 is the same as in the above-described example. That is, 'the humidification tank 55 that introduces the supply water, the humidified nitrogen gas system is sent to the humidity control device 64 via the pipe 63, and the absolute humidity is measured in the humidity sensor 64 1 , and the absolute humidity is not satisfied. The specific situation is to lock the needle valve 62 and fcn local humidity. On the one hand, when the absolute humidity is higher than the specific height -16-200823929 (14), the needle valve 62 is opened to increase the ratio of the dry nitrogen gas to lower the humidity, and the absolute humidity can be made. Humidity adjustment. The nitrogen gas containing the adjusted water vapor is supplied to the gas supply pipe (15) which can be supplied to the excimer lamp device (1) through the pipe 51. As described above, the gas supply means is provided by a supply source for drying the inert gas, a water source, a humidifier, and a pipe, and the amount of water vapor is controlled to supply a specific inert gas to the gas supply pipe. By providing the above-described humidifying device, the inert gas is controlled from the gas supply device to control the absolute humidity, that is, the amount of water vapor contained therein. Therefore, even when the temperature in the lamp chamber changes, the molecular weight of water floating near the surface of the substrate does not increase or decrease, and a stable dry cleaning process can be realized. When the number of H20 molecules floating in the vicinity of the surface of the substrate is too large, the attenuation of ultraviolet light is increased, and the ultraviolet light irradiated on the surface of the substrate is insufficient, and the activation of the contaminant cannot be sufficiently performed. On the other hand, when the number of H20 is too small, the ultraviolet light irradiation to the substrate is reliably performed. However, the free radicals and the free radicals are insufficient, and decomposition of the activated pollutants becomes difficult. Dry cleaning on the substrate as the necessary amount of water vapor, the absolute humidity of the weight is 0. 5~6. 5g / kg, more ideally 1 · 〇 ~ 6. 0g/kg, more ideally 1. 5~4. 5g/kg. Take the absolute weight of the weight as 〇·5~6. In the range of 5 g/kg, even when it is washed with a substrate which uses oxygen as a radical source (no water is used), it is possible to improve the cleaning effect. Moreover, if the absolute weight of the weight is taken as 1 · 〇 ~ 6. In the range of 0 g/kg, the contact angle of pure water becomes smaller and smaller. As described above, the cleaning effect can be surely obtained. Then add, if the absolute weight is 1 . 5~4. 5 g/kg ’ The contact angle of the pure water of the substrate -17- (15) 200823929 becomes smaller than the required 1 〇 ° of the cleaning, and becomes large. On the one hand, if the absolute weight of the weight becomes 7. 0g/kg or more, the substrate is cleaned and reduced by using only a substrate of oxygen (no water). Here, the first embodiment of the excimer lamp device having the above configuration will be described simultaneously. In the first embodiment, when the substrate W composed of a liquid crystal panel substrate or the like is transported in the space S formed under the light, the humidification discharged from the gas ejection port 15 a is passed through the upper space of the excimer lamp 20 It flows out between the pipes 15 through the excimer lamp 20 and flows out to the surface of the substrate W. The ultraviolet light (UV light) of the collimator lamp 20 is irradiated onto the substrate W water vapor. Further, when a pair of ultraviolet light is irradiated by an organic substance contaminating substance attached to the surface of the substrate, the pollutant is activated, and the water vapor (H20) of the external light (UV light) is excited to decompose the group and the OH radical to become active. Seeds, these functional pollutants are converted into volatile substances. In the space S-system molecular lamp device 1 , the humidified inert gas continuously flows out, so that the hair is scattered from the surface of the substrate and passes through the exhaust port (not shown to the outside of the excimer lamp device 10). Since the molecular lamp device 1 〇 is supplied to the space between the plates S formed under the light irradiation port 1 2 A by the humidification, it can be floated on the substrate (W), free radicals and OH free. The base amount and the ultraviolet light washing effect at the same time are treated as compared with the washing effect. When the inlet port 1 2 A is supplied with inert gas and gas, the surface and the constituents absorb the purple V Η freely. It is used to release the gas from the quasi-generated wave (the amount of the surface of the lamp and the base is also -18-200823929 (16), and the surface of the substrate (W) can be surely processed. In particular, Taking the absolute humidity of the inert gas as 0. 5~ 6. The range of 5 g/kg can suppress the attenuation of ultraviolet light emitted from the excimer lamp. The substrate can also be irradiated with an appropriate amount of ultraviolet light, and the amount of ruthenium radicals and OH radicals generated by the ruthenium ruthenium molecule also produces an amount which is inconspicuous to the substrate, and can be improved in cleaning performance. Further, in the above-mentioned apparatus, the inert gas is sufficient because it is supplied to the space S below the 'light-irradiating port 12', so that it is not necessary to be used for the entire apparatus. Reduce operating costs. Further, the light irradiation port 1 2 A of the excimer lamp device 10 is not required to be hermetically covered with quartz glass, and the excimer lamp device 10 can be freely increased in size, and the cost of the device body can be reduced. Further, in the excimer lamp apparatus according to the present invention, it is preferable that one of the transport lines provided in the substrate processing apparatus is partitioned, the space can be saved, and the apparatus can be simply constructed, and it can be used as a highly versatile apparatus. Next, Fig. 7 is a cross-sectional view for explaining the alignment of the collimator lamp device of the second embodiment of the present invention. Further, the configurations that have been described above in the first to sixth figures are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. " This embodiment differs from the above-described embodiment in the form of an excimer lamp. Here, a material having a discharge vessel formed into a rectangular box shape is used. First, the configuration of the excimer lamp will be described with reference to Fig. 8. Fig. 8(a) is a transmission perspective view showing a part of a broken line in an enlarged excimer lamp, and (b) is a cross-sectional view for explaining the cutting in A-A in (a). The material of the discharge capacitor 3 1 is the same as described above, and is made of quartz glass that transmits ultraviolet light, -19-200823929 (17), and a helium gas is sealed inside the discharge vessel 31. On one surface (the surface below the paper surface) on the light extraction side of the outer surface of the discharge capacitor 31, one electrode 32 which has been formed into a mesh shape is formed, and the other electrode 33 is formed on the outer surface. The one electrode 32 transmits ultraviolet light by transmitting ultraviolet light from the gap of the mesh, as shown in Fig. 7, toward the substrate disposed on the opposite surface. In the present embodiment, the oxidation-resistant protective film 34 is formed on the surface of one of the other electrodes 32 and 33. Further, as the protective film, a film composed of si 〇 2, ai 2 o 3 , TiO 2 or a composite of these, which is also described above, is suitable. Further, the protective film 34 formed on one of the electrodes 3 2 is selected to be permeable to ultraviolet light. As shown in Fig. 7, when the amount of supplied steam is adjusted to a specific inert gas by the gas supply pipe disposed in the upper portion of the lamp chamber 1, the gap between the excimer lamp 30 and the gas supply pipe 15 is passed. Flowing toward the surface of the substrate W. At the same time, ultraviolet light from the excimer lamp 30 is irradiated onto the surface of the substrate W, and the pollutants composed of the adhered organic substances are activated, and the water vapor (H20) absorbing the ultraviolet light (UV light) is excited. It is decomposed into an anthraquinone radical and an OH radical to become an active species, which acts on the activated pollutant to be converted into a volatile substance. As described above, according to the excimer lamp device of the present invention, the cleaning process can be reliably exhibited regardless of the form of the quasi-molecular lamp. Further, in particular, in the case where the light extraction surface of the excimer lamp is planar to the surface to be processed of the substrate, the flow of the gas -20-200823929 (18) is easily stabilized and can be performed more smoothly. It is suitable to recover the radical group. The above excimer lamp device according to the embodiment of the present invention has been described in detail. However, the present invention is of course not limited to the embodiment, and can be appropriately changed. For example, as the excimer lamp, the objects shown in Figs. 2 and 8 are presented, but are not limited to these configurations. Specifically, even if the shape of the discharge vessel is used, the inner tube portion having a small diameter and the outer tube portion having a large diameter are disposed coaxially from the previously known Patent Document 1, and the both end portions are welded and sealed to form a hollow. It does not matter what the cylindrical discharge space is. Further, in the excimer lamp shown in Fig. 2 of the above embodiment, the other electrode should function as a reflecting plate. However, the present invention is not limited to this aspect, and a reflective film is formed on the outer surface of the upper portion of the discharge vessel. good. Further, it is preferable that the other electrode is not reflective, and it is preferable to mount another mirror. Further, as shown in Fig. 8, the electrode disposed on the outer surface of the discharge vessel forms an oxidation-resistant protective film or prevents oxidation of the electrode by other means. In the present embodiment, it is not preferable to use a protective tube that is transparent to ultraviolet light, and it is preferable that the storage lamp is entirely protected from ruthenium radicals or ruthenium radicals. In the case where the oxidation-resistant protective film or the protective tube is used, even if the radicals or the ruthenium radicals are floated around the other electrode, no electrode is oxidized, and stable discharge can be achieved. Next, Experimental Examples 1 to 2 were carried out in order to confirm the effects of the invention. In addition, the apparatus specifications used in the following Experimental Examples 1 to 2 are not limited to this - 21 - 200823929 (19) [Example 1] An experiment for preparing an excimer lamp device (1 〇) according to the configuration of Fig. 1 machine. The specific constitution of the excimer lamp device (10) is as follows. The excimer lamp (20) has the structure shown in Fig. 2, and has an outer diameter of 18. 5mm, inner diameter is 16. A cylindrical discharge vessel (2 1 ) made of quartz glass of 5 mm and having a total length of 2470 mm is provided with one electrode (22) at the center of the tube and a semi-cylindrical shape on the outer surface of the discharge vessel (2 1 ). The other electrode (23) is formed. Further, the discharge capacitor (21) was sealed with an excimer gas having a pressure of 60 kPa, and an excimer lamp having a rated power consumption of 600 W was produced. Four excimer lamps (20) thus produced were used and mounted on the excimer lamp device of the configuration of Fig. 1. The gas supply pipe disposed adjacent to the excimer lamp (20) is made of aluminum, and the inner diameter is 〇 at a position relative to the upper space of the excimer lamp. A gas discharge port composed of a small hole of 7 mm is formed at a pitch of 1 〇 mm. In the excimer lamp device (10) having the above configuration, a substrate (W) as a workpiece is placed on the substrate transfer mechanism (16). The substrate is made to have a thickness of 0. An alkali-free glass of 7 mm, a width of 2,200 mm, and a length of 2,400 mm was used, and the surface was subjected to contamination treatment. The contact angle of pure water was taken as about 40 °. The lamp chamber (1 1 ) is set so that the closest distance between the processed surface of the substrate (W) and the excimer lamp (20) is 3 mm. This distance should be close to the configuration conditions of the excimer lamp unit generally used. -22- 200823929 (20) In addition, the conveyance speed of the substrate (W) is 5 m/min. In the case where the irradiation area of the lamp chamber is about 205 m, according to this condition, the ultraviolet light irradiation time by the excimer lamp (20) becomes about 3 seconds. Using the experimental apparatus having the above configuration, the humidity of the inert gas introduced into the gas supply pipe was varied in various ways to examine the pure contact angle of the substrate surface. Fig. 9 is a view showing the results of the cleaning treatment under the following conditions 1 to 1, wherein the vertical axis is the contact angle (°) of pure water and the horizontal axis is the relative humidity (%RH) 〇 [Condition 1] by the gas cylinder The dry nitrogen gas without water vapor is directly introduced into the gas supply pipe. When water vapor is not introduced, the light emitted from the excimer lamp is irradiated with oxygen floating on the surface of the substrate to generate ozone, and the substrate is cleaned by the action of active oxygen generated during the decomposition of ozone. As a result, it was found that the contact angle of pure water on the surface of the substrate was lowered to 20° by 40° before ultraviolet light irradiation. This condition corresponds to a relative humidity of 0% in Figure 9. Next, a humidifying device is attached to the gas supply pipe, and the humidified inert gas can be supplied to the experimental apparatus in the lamp chamber. [Condition 2] The temperature of the supplied gas was forcibly cooled to 5 ° C while being kept constant, and the relative humidity was changed from 〇% to 1% to supply nitrogen gas, and the washing effect was confirmed. This result is indicated by an X symbol in Fig. 9. -23- 200823929 (21) [Condition 3] The temperature of the supplied gas was maintained at 1 〇 °C, and the relative humidity was changed from 0% to 100% to supply nitrogen gas, and the washing effect was confirmed. This result is indicated by a diamond symbol in Fig. 9. [Condition 4] The temperature of the supplied gas was kept at 20 ° C, and the relative humidity was changed from 0% to 100% to supply nitrogen gas, and the washing effect was confirmed. This result is represented by a square symbol in Fig. 9. [Condition 5] The temperature of the supplied gas was maintained at 30 ° C, and the relative humidity was changed from 0% to 100% to supply nitrogen gas, and the washing effect was confirmed. This result is indicated by a triangular symbol in Fig. 9. [Condition 6] The temperature of the supplied gas was kept at 45 ° C, and the relative humidity was changed from 0% to 100% to supply nitrogen gas, and the washing effect was confirmed. This result is shown in Figure 9 as a circular payout. As is apparent from the results of Fig. 9, the relative humidity at which the contact angles at the respective temperatures become the lowest is different. This means that, in other words, even if the relative humidity is controlled without controlling the temperature of the gas, an effective washing effect cannot be obtained. • 24-200823929 (22) For example, in the case where the relative humidity is about 5% and the temperature of the inert gas supplied is 30 to 4 5 °C, it can be lowered to the required contact angle of the glass. °±1° or less. However, even if the same relative humidity is maintained at 5%, the contact angle of pure water becomes 15 if the temperature of the gas becomes 20 °C or lower. Big, it becomes impossible to get the desired effect. In addition, in the case of a relative humidity of 20%, the most suitable temperature is 2 (TC, in which case it can be lowered to a contact angle of 1 〇 ° ± 1 ° or less. However, there is a change in the specific temperature of 20 ° C. , the system cannot be lowered to a contact angle of 1 〇 ° ± 。. Moreover, when the temperature of the gas is 45 ° C, the contact angle exceeds 3 5 °, which is worse than the case where water vapor is not introduced. [Example 2] The excimer lamp device used in the above-mentioned Experimental Example 1 was attached to the gas supply device shown in Figs. 4 and 5 to constitute an experimental device. The use as the object to be treated and the above experiment were carried out. Example 1 uses the same composition of the substrate, so that the absolute humidity (weight absolute humidity) in the inert gas is 0~8. The Og/kg was changed, washed, and the contact angle of pure water on the surface of the substrate was measured. Further, the driving conditions of the apparatus were also the same as those in the above experimental example. The results of Experimental Example 2 are shown in Figure 10. As the water vapor is increased from the absolute weight 〇g/kg, the contact angle of the pure water of the substrate becomes small, at 3. 0~3. The lowest contact angle is obtained near 5 g/kg. As a result, as the absolute weight of the weight becomes larger, the contact angle gradually becomes larger, if the absolute humidity exceeds 7. 〇g/kg is worse than the case of steam containing no water -25- 200823929 (23). Therefore, as the amount of water vapor necessary, the absolute weight of the system is 0. 5~6. 5 g/kg, whereby a high effect can be achieved as compared with the case of washing without using water vapor. Moreover, the absolute humidity in the weight is 1. 0~6. In the case of 0 g/kg, the contact angle of less than 15° can be achieved and if 5~4. 5g/kg can be lowered to the required contact angle of 1〇° soil 在 in glass washing. As is clear from the results of the above experimental examples, in the case where the excimer lamp device controls and controls the moisture content by the relative humidity, since the cleaning effect of the substrate differs depending on the temperature of the supplied gas, it is difficult to maintain the stable washing. Net condition. In the case of management with relative humidity, it is possible to obtain the desired cleaning effect by managing the temperature of the supplied gas, but it is not practical if it is actually used. That is to say, it is assumed that the temperature of the space temperature of the substrate is also greatly affected by the fact that the body of the excimer lamp becomes high temperature, and the temperature of the gas also fluctuates. The relative humidity must be changed in accordance with the temperature change of the inert gas. However, in the case where the humidity sensor is disposed in the processing chamber, it is difficult to control, and the response is well adjusted to the relative humidity. On the one hand, in the case of managing the absolute humidity, the cleaning effect can be controlled to a desired range, and since the temperature is hardly dependent on the temperature, the cleaning effect can be surely improved without considering the temperature rise of the excimer lamp or the like. Thus, the surface treatment of the substrate means that the absolute amount of water molecules present in the space in which the substrate is processed is indispensable. Therefore, it is necessary to control the absolute humidity in the inert gas. [Brief Description of the Drawings] [Fig. 1] is a partial cross-sectional view for explaining a cross section of a tube axis perpendicular to a quasi-molecular lamp, showing a first embodiment of the present invention. [Fig. 2] A cross-sectional view of the quasi-molecular lamp according to the first embodiment of the present invention, wherein (a) is a cross-sectional view in the tube axis direction, and (b) is a cross-sectional view taken in a direction perpendicular to the tube axis. [Fig. 3] A perspective view for illustrating and explaining a part of the gas supply pipe and the excimer lamp according to the first embodiment of the present invention. [Fig. 4] A diagram for explaining the configuration of a gas supply means according to an embodiment of the present invention. [Fig. 5] A diagram for explaining an example of a configuration of a humidifier according to an embodiment of the present invention. [Fig. 6] A diagram for explaining the configuration of a gas supply means according to another embodiment of the present invention. [Fig. 7] is a cross-sectional view for explaining the excimer lamp device of the second embodiment of the present invention. [Fig. 8] Fig. 8(a) is a perspective perspective view showing a part of a broken line in an enlarged excimer lamp, and (b) is cut in AA in (a). Explain the profile. [Fig. 9] shows the results of Experimental Example 1, showing the relationship between the relative humidity of the inert gas and the contact angle of pure water. [Fig. 1] shows the results of Experimental Example 2, which shows the relationship between the absolute humidity of the inert gas and the contact angle of pure water. [Fig. 1] A cross-sectional view for explaining the excimer lamp device in which the tube axis of the lamp -27-200823929 (25) is cut perpendicularly with respect to the substrate processing apparatus of the prior art. [Description of main component symbols] S : Space W : Substrate 7 : Excimer lamp 1 〇 : Excimer lamp device 1 1 : Lamp chamber 1 2 : Base member 12A : Light irradiation port 1 3 : Exterior cover 14A : Pipe 1 4: cooling block 1 5 : gas supply pipe 15a : gas discharge port 1 6 : substrate transfer mechanism 2 0 : excimer lamp 2 1 : discharge vessel 2 1 A : pinch seal 2 1 B : hoop Shrinkage seal 22: Electrode 23: Electrode 24A: Metal foil 24B: Metal foil -28- 200823929 (26) 2 5: Pipe 2 6 A: Support member 2 6 B: Support member 3 〇: Excimer lamp 3 1 : Discharge Container 32: Electrode 33: Electrode 34: Protective film 40 • Nitrogen gas supply source 41: Water source for humidification 5 〇: Humidification device 5 1 : Pipe 52: Branch pipe 53: Valve 5 4: Check valve 5 5 : Humidification tank 5 6 : Liquid level controller 57 : Level switch 5 8 : Flow meter 5 9 : Needle valve 60 : Piping 61 : Piping 62 : Needle valve 63 : Piping -29 - 200823929 (27) 64 : Humidity control Device 66: Pressure gauge 6 7 : Safety valve 68 : Drain valve 69 : Pipe 70 : Substrate 7 0 : Float valve 7 1 : Roller conveyor 7 2 : Lamp chamber 73 : Gas supply pipe 75 : Humidification inertia Feeding tubular body 76: treatment chamber 641: humidity sensor 642: A / D converting portion 643: Memory portion 644: calculation unit 645: control section 65: heater -30-