TW200818533A - Solar battery module - Google Patents
Solar battery module Download PDFInfo
- Publication number
- TW200818533A TW200818533A TW096134174A TW96134174A TW200818533A TW 200818533 A TW200818533 A TW 200818533A TW 096134174 A TW096134174 A TW 096134174A TW 96134174 A TW96134174 A TW 96134174A TW 200818533 A TW200818533 A TW 200818533A
- Authority
- TW
- Taiwan
- Prior art keywords
- solar cell
- resin
- electrode
- connecting piece
- solar battery
- Prior art date
Links
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 239000002245 particle Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 33
- 229910052709 silver Inorganic materials 0.000 description 33
- 239000004332 silver Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 24
- 239000000956 alloy Substances 0.000 description 13
- 229910045601 alloy Inorganic materials 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 description 7
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- -1 single-turn Substances 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 108010068370 Glutens Proteins 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- 240000006394 Sorghum bicolor Species 0.000 description 1
- 235000011684 Sorghum saccharatum Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- HHFAWKCIHAUFRX-UHFFFAOYSA-N ethoxide Chemical compound CC[O-] HHFAWKCIHAUFRX-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 210000000744 eyelid Anatomy 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000021312 gluten Nutrition 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000035935 pregnancy Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229940117958 vinyl acetate Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006265941A JP2008085227A (ja) | 2006-09-28 | 2006-09-28 | 太陽電池モジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200818533A true TW200818533A (en) | 2008-04-16 |
Family
ID=39268348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096134174A TW200818533A (en) | 2006-09-28 | 2007-09-13 | Solar battery module |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20090277492A1 (enExample) |
| JP (1) | JP2008085227A (enExample) |
| TW (1) | TW200818533A (enExample) |
| WO (1) | WO2008041486A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010024331B4 (de) * | 2010-06-18 | 2023-06-01 | Polytec Pt Gmbh | Verfahren zur Verklebung eines bandförmigen Leiters mit einer Solarzelle, Anordnung mit der Verklebung und Verwendung eines Piezo-Jet-Dispensers dafür |
| KR101642154B1 (ko) * | 2010-10-26 | 2016-07-22 | 엘지전자 주식회사 | 태양전지 패널 및 이의 제조 방법 |
| JP5960408B2 (ja) * | 2011-10-28 | 2016-08-02 | デクセリアルズ株式会社 | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
| US9536632B2 (en) * | 2013-09-27 | 2017-01-03 | Sunpower Corporation | Mechanically deformed metal particles |
| WO2016147970A1 (ja) * | 2015-03-16 | 2016-09-22 | シャープ株式会社 | 光電変換素子および光電変換素子の製造方法 |
| CN117239004B (zh) * | 2022-06-06 | 2026-06-05 | 理想万里晖半导体设备(上海)股份有限公司 | 用于制造异质结太阳能电池的方法以及异质结太阳能电池 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5180888A (en) * | 1989-08-10 | 1993-01-19 | Casio Computer Co., Ltd. | Conductive bonding agent and a conductive connecting method |
| US5296043A (en) * | 1990-02-16 | 1994-03-22 | Canon Kabushiki Kaisha | Multi-cells integrated solar cell module and process for producing the same |
| JP3119479B2 (ja) * | 1990-05-25 | 2000-12-18 | 株式会社東芝 | 電子装置の製造方法 |
| DE69215176T2 (de) * | 1991-08-30 | 1997-03-27 | Canon Kk | Solarzelle und deren Herstellungsmethode |
| KR100568491B1 (ko) * | 1997-07-04 | 2006-04-07 | 제온 코포레이션 | 반도체부품 접착제 |
| US6091019A (en) * | 1997-09-26 | 2000-07-18 | Sanyo Electric Co., Ltd. | Photovoltaic element and manufacturing method thereof |
| JP3545247B2 (ja) * | 1998-04-27 | 2004-07-21 | シャープ株式会社 | 二次元画像検出器 |
| JP2002124763A (ja) * | 2000-10-16 | 2002-04-26 | Matsushita Electric Ind Co Ltd | 回路形成基板の製造方法、回路形成基板および回路形成基板用材料 |
| US6803513B2 (en) * | 2002-08-20 | 2004-10-12 | United Solar Systems Corporation | Series connected photovoltaic module and method for its manufacture |
| JP2004134653A (ja) * | 2002-10-11 | 2004-04-30 | Sharp Corp | 基板接続構造およびその基板接続構造を有する電子部品の製造方法 |
| JP2005101519A (ja) * | 2003-09-05 | 2005-04-14 | Hitachi Chem Co Ltd | 太陽電池ユニット及び太陽電池モジュール |
| JP3123842U (ja) * | 2006-05-18 | 2006-07-27 | 京セラケミカル株式会社 | 太陽電池モジュール |
-
2006
- 2006-09-28 JP JP2006265941A patent/JP2008085227A/ja active Pending
-
2007
- 2007-09-13 TW TW096134174A patent/TW200818533A/zh unknown
- 2007-09-19 WO PCT/JP2007/068199 patent/WO2008041486A1/ja not_active Ceased
- 2007-09-19 US US12/441,730 patent/US20090277492A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008085227A (ja) | 2008-04-10 |
| WO2008041486A1 (fr) | 2008-04-10 |
| US20090277492A1 (en) | 2009-11-12 |
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