TW200816884A - Epoxy resin composition for printed circuit board, resin composition varnish, prepreg, metal clad laminate, printed circuit board and multilayer printed circuit board - Google Patents

Epoxy resin composition for printed circuit board, resin composition varnish, prepreg, metal clad laminate, printed circuit board and multilayer printed circuit board Download PDF

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Publication number
TW200816884A
TW200816884A TW95134546A TW95134546A TW200816884A TW 200816884 A TW200816884 A TW 200816884A TW 95134546 A TW95134546 A TW 95134546A TW 95134546 A TW95134546 A TW 95134546A TW 200816884 A TW200816884 A TW 200816884A
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TW
Taiwan
Prior art keywords
printed circuit
epoxy resin
circuit board
resin composition
component
Prior art date
Application number
TW95134546A
Other languages
English (en)
Chinese (zh)
Other versions
TWI307255B (enExample
Inventor
Hiroki Tamiya
Yoshihiko Nakamura
Shunji Araki
Eiji Imamizumi
Kentarou Fujino
Sawada Tomoaki
Shinpo Takashi
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to TW95134546A priority Critical patent/TW200816884A/zh
Publication of TW200816884A publication Critical patent/TW200816884A/zh
Application granted granted Critical
Publication of TWI307255B publication Critical patent/TWI307255B/zh

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  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
TW95134546A 2006-09-19 2006-09-19 Epoxy resin composition for printed circuit board, resin composition varnish, prepreg, metal clad laminate, printed circuit board and multilayer printed circuit board TW200816884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95134546A TW200816884A (en) 2006-09-19 2006-09-19 Epoxy resin composition for printed circuit board, resin composition varnish, prepreg, metal clad laminate, printed circuit board and multilayer printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95134546A TW200816884A (en) 2006-09-19 2006-09-19 Epoxy resin composition for printed circuit board, resin composition varnish, prepreg, metal clad laminate, printed circuit board and multilayer printed circuit board

Publications (2)

Publication Number Publication Date
TW200816884A true TW200816884A (en) 2008-04-01
TWI307255B TWI307255B (enExample) 2009-03-01

Family

ID=44769208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95134546A TW200816884A (en) 2006-09-19 2006-09-19 Epoxy resin composition for printed circuit board, resin composition varnish, prepreg, metal clad laminate, printed circuit board and multilayer printed circuit board

Country Status (1)

Country Link
TW (1) TW200816884A (enExample)

Also Published As

Publication number Publication date
TWI307255B (enExample) 2009-03-01

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