TW200809230A - Mechanism for adjusting the parallelness of a probe card - Google Patents

Mechanism for adjusting the parallelness of a probe card Download PDF

Info

Publication number
TW200809230A
TW200809230A TW096127945A TW96127945A TW200809230A TW 200809230 A TW200809230 A TW 200809230A TW 096127945 A TW096127945 A TW 096127945A TW 96127945 A TW96127945 A TW 96127945A TW 200809230 A TW200809230 A TW 200809230A
Authority
TW
Taiwan
Prior art keywords
probe card
probe
card
wiring board
wafer
Prior art date
Application number
TW096127945A
Other languages
English (en)
Chinese (zh)
Other versions
TWI353453B (https=
Inventor
Yoshio Yamada
Hiroshi Nakayama
Mitsuhiro Nagaya
Tsuyoshi Inuma
Takashi Akao
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200809230A publication Critical patent/TW200809230A/zh
Application granted granted Critical
Publication of TWI353453B publication Critical patent/TWI353453B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW096127945A 2006-07-31 2007-07-31 Mechanism for adjusting the parallelness of a probe card TW200809230A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006208911A JP5101060B2 (ja) 2006-07-31 2006-07-31 プローブカードの平行度調整機構
PCT/JP2007/064703 WO2008015962A1 (fr) 2006-07-31 2007-07-26 Mécanisme de réglage du parallélisme d'une carte sonde

Publications (2)

Publication Number Publication Date
TW200809230A true TW200809230A (en) 2008-02-16
TWI353453B TWI353453B (https=) 2011-12-01

Family

ID=38997142

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127945A TW200809230A (en) 2006-07-31 2007-07-31 Mechanism for adjusting the parallelness of a probe card

Country Status (8)

Country Link
US (1) US8049525B2 (https=)
EP (1) EP2051293A1 (https=)
JP (1) JP5101060B2 (https=)
KR (1) KR101115548B1 (https=)
CN (1) CN101496156B (https=)
SG (1) SG173419A1 (https=)
TW (1) TW200809230A (https=)
WO (1) WO2008015962A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8456184B2 (en) * 2007-03-14 2013-06-04 Nhk Spring Co., Ltd. Probe card for a semiconductor wafer
TWI428608B (zh) * 2011-09-16 2014-03-01 Mpi Corp 探針測試裝置與其製造方法
TWI479158B (zh) * 2013-01-28 2015-04-01 Mpi Corp 晶圓測試探針卡
US9435856B2 (en) * 2013-04-16 2016-09-06 Mpi Corporation Position adjustable probing device and probe card assembly using the same
US9470750B2 (en) * 2013-04-16 2016-10-18 Mpi Corporation Alignment adjusting mechanism for probe card, position adjusting module using the same and modularized probing device
CN103267940B (zh) * 2013-05-06 2016-08-10 上海华岭集成电路技术股份有限公司 多模块平行测试系统
JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
KR101415276B1 (ko) * 2013-10-07 2014-07-04 주식회사 쎄믹스 웨이퍼 표면 검사가 가능한 웨이퍼 프로버 시스템
KR102566685B1 (ko) * 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
KR102425309B1 (ko) 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
JP6895772B2 (ja) * 2017-03-07 2021-06-30 東京エレクトロン株式会社 検査装置およびコンタクト方法
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
JP2020009978A (ja) * 2018-07-12 2020-01-16 東京エレクトロン株式会社 回路装置、テスタ、検査装置及び回路基板の反り調整方法
KR102673906B1 (ko) * 2018-11-02 2024-06-10 세메스 주식회사 카드 홀더 및 이를 포함하는 프로브 스테이션
US11933816B2 (en) * 2019-03-20 2024-03-19 Celadon Systems, Inc. Portable probe card assembly
JP7148017B2 (ja) * 2020-03-13 2022-10-05 日本電産リード株式会社 検査治具及びそれを備えた基板検査装置
CN113640557B (zh) * 2021-08-11 2022-12-23 山东大学 一种扎针高度自调整系统及方法
TWM639797U (zh) * 2022-02-10 2023-04-11 旺矽科技股份有限公司 晶圓檢測系統及其環形座
KR102851820B1 (ko) * 2023-08-14 2025-08-29 에이엠티 주식회사 Hbm 테스트용 소켓의 장착장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1610375A3 (en) 1995-05-26 2008-11-05 FormFactor, Inc. Contact carriers for populating substrates with spring contacts
JP2002323538A (ja) * 2001-04-25 2002-11-08 Mitsubishi Materials Corp プローブ装置
WO2002103775A1 (en) * 2001-06-18 2002-12-27 Advantest Corporation Probe contact system having plane adjusting mechanism
JP2003324132A (ja) * 2002-04-30 2003-11-14 Japan Electronic Materials Corp テスト用基板
JP3621938B2 (ja) 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
JP2006010629A (ja) 2004-06-29 2006-01-12 Tokyo Electron Ltd 平行調整機構を備えたプローブカード
JP4395429B2 (ja) * 2004-10-20 2010-01-06 日本発條株式会社 コンタクトユニットおよびコンタクトユニットを用いた検査システム

Also Published As

Publication number Publication date
EP2051293A1 (en) 2009-04-22
JP5101060B2 (ja) 2012-12-19
CN101496156B (zh) 2011-07-20
CN101496156A (zh) 2009-07-29
KR20090033884A (ko) 2009-04-06
JP2008032648A (ja) 2008-02-14
SG173419A1 (en) 2011-08-29
TWI353453B (https=) 2011-12-01
US8049525B2 (en) 2011-11-01
WO2008015962A1 (fr) 2008-02-07
US20100001752A1 (en) 2010-01-07
KR101115548B1 (ko) 2012-03-05

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees